Diode with pin protection

Abstract

The utility model provides a diode with pin protection, and belongs to the technical field of diodes. Comprising an upper protective shell; the lower protective shell is arranged at one end of the upper protective shell; the two protective sleeves are arranged in the lower protective shell; the diode main body is arranged in the lower protective shell; and the mounting plate is arranged at the bottom of the diode main body. According to the utility model, through the arrangement of the upper protection shell, the lower protection shell and the magnetic attraction block, the upper protection shell and the lower protection shell are tightly closed to form a closed space through the magnetic attraction of the magnetic attraction block in the transportation process, the diode is wrapped in the closed space, the displacement of internal elements is limited, the shaking amplitude is reduced, and the pins are protected through the protection sleeve. Double protection is formed, collision and friction between the pins and the inner wall of the packaging box or other elements are avoided, and damage to the pins is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to diode technical field, especially a diode with pin protection. BACKGROUND

[0002] Diode is with semiconductor material (silicon, selenium, germanium etc.) make a kind of electronic device.Diode has two electrodes, anode, also called anode;Cathode, also called cathode, when applying forward voltage between the two electrodes of diode, diode is on, applies reverse voltage, diode is cut off.Diode's on and cut off, it is equivalent to the turn-on and turn-off of switch.

[0003] At present, existing diode in the transportation process, due to poor road conditions, vehicle frequent vibration, jolt, the components in the packaging box bearing diode will be violently shaken, leading to diode pin and packaging box inner wall or other components collision and friction, leading to diode pin bending, breakage and other damage, affect subsequent use, therefore, the present application provides a kind of diode with pin protection to meet the needs. UTILITARIAN CONTENT

[0004] The technical problem to be solved by the utility model is to provide a diode with pin protection to solve the problem of diode pin damage in the transportation process of existing diode.

[0005] To solve the above technical problems, the utility model provides the following technical scheme.

[0006] A diode with pin protection, comprising: upper protective shell;Lower protective shell, arranged at one end of the upper protective shell;Two protective sleeves, arranged in the lower protective shell;Diode main body, arranged in the lower protective shell;Mounting plate, arranged at the bottom of the diode main body;Two pin bodies, arranged on the mounting plate and matched with the protective sleeve;The protective sleeve includes inner layer, middle layer and outer layer.

[0007] The inner layer is made of silica gel material, the middle layer is provided with a plurality of elastic strips, and the plurality of elastic strips are in honeycomb shape.

[0008] It further comprises: two circular arc blocks arranged between the mounting plate and the pin body, and graphite sheets or boron nitride sheets are filled in the circular arc blocks.

[0009] It further comprises: two magnetic blocks respectively arranged on the upper protective shell and the lower protective shell, for magnetic connection between the upper protective shell and the lower protective shell.

[0010] It further comprises: a plurality of cooling fins arranged at the center of the bottom of the mounting plate;The mounting plate is hollow.

[0011] The edge of the mounting plate is provided with a plurality of heat dissipation holes.

[0012] The heat conduction column is mainly concentrated in the corresponding area of the heat dissipation fin.

[0013] The lower protective shell comprises a soft layer and a protective layer, and the upper protective shell is the same as the lower protective shell.

[0014] Compared with the prior art, the utility model has at least the following beneficial effects.

[0015] In the scheme, the upper protective shell, the lower protective shell and the magnetic block are arranged, in the transportation process, the magnetic adsorption of the magnetic block makes the upper protective shell and the lower protective shell tightly close to form a closed space, the diode is wrapped inside, the displacement of internal components is limited, the shaking amplitude is reduced, the protective sleeve is used for protecting the pin, double protection is formed, the pin is prevented from colliding and rubbing with the inner wall of the packaging box or other components, and the pin damage is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a diode schematic diagram with a pin protection.

[0017] Figure 2 It is a magnetic block structure schematic diagram.

[0018] Figure 3 It is a diode main body structure schematic diagram.

[0019] Figure 4 It is a heat dissipation fin structure schematic diagram.

[0020] Figure 5 It is a heat conduction column structure schematic diagram.

[0021] Figure 6 It is a protective sleeve structure partial sectional view.

[0022] [REFERENCE SIGNS]

[0023] 1, lower protective shell, 2, upper protective shell, 3, magnetic block, 4, protective sleeve, 5, diode main body, 6, arc block, 7, pin body, 8, mounting plate, 9, heat dissipation fin, 11, soft layer, 12, protective layer, 41, inner layer, 42, middle layer, 43, outer layer, 81, heat dissipation hole, 82, heat conduction column.

[0024] As shown in the figure, in order to clearly realize the structure of the embodiment of the utility model, specific structures and devices are marked in the figure, but this is only for the need of illustration, and is not intended to limit the utility model in the specific structure, device and environment, according to the specific need, the ordinary skilled in the art can adjust or modify these devices and environment, and the adjustment or modification still includes in the range of the appended claims. DETAILED DESCRIPTION

[0025] The utility model provides a diode with pin protection with specific embodiments and accompanying drawings. It is noted that the following embodiments are the best and preferred embodiments, and other alternative ways can also be used by those skilled in the art to implement some known technologies. The accompanying drawings are provided to describe the embodiments in more detail, but are not intended to limit the utility model.

[0026] As shown in the figure, in order to clearly realize the structure of the embodiment of the utility model, specific structures and devices are marked in the figure, but this is only for the need of illustration, and is not intended to limit the utility model in the specific structure, device and environment, according to the specific need, the ordinary skilled in the art can adjust or modify these devices and environment, and the adjustment or modification still includes in the range of the appended claims. Figure 1 Figure 6 The utility model discloses an embodiment provides a diode with pin protection, including: upper protection shell 2, lower protection shell 1 is arranged in one end of upper protection shell 2, two protective sheaths 4 are arranged in lower protection shell 1, diode main part 5 is arranged in lower protection shell 1, mounting plate 8 is arranged in the bottom of diode main part 5, two pin bodies 7 are arranged on mounting plate 8 and are adapted with protective sheath 4, and protective sheath 4 includes inner layer 41, middle layer 42 and outer layer 43. Through the setting outer layer 43, adopt the material with high wear resistance, such as hard plastic or wear-resistant rubber coating etc.

[0027] The inner layer 41 adopts silica gel material, the middle layer 42 is provided with a plurality of elastic strips, and the plurality of elastic strips are in honeycomb shape. Through the setting inner layer 41, when the vibration is generated in the transportation process, the inner layer 41 is directly contacted with the pin body 7, the silica gel absorbs the collision energy by the deformation of itself, and the silica gel has excellent insulation performance, which can isolate the static electricity or stray current that may exist in the complex electronic component environment. Through the setting elastic strip, when the middle layer 42 is impacted by external force, the impact force is evenly dispersed through the elastic strip, so that stress concentration is avoided.

[0028] It also includes: two circular blocks 6 are arranged between the mounting plate 8 and the pin body 7, and graphite sheets or boron nitride sheets are filled in the circular blocks 6. The graphite sheets and the boron nitride sheets are both excellent heat-conducting materials with ultra-high thermal conductivity. After the diode works and generates heat, the heat will be quickly conducted to the pin part in close contact with it. The heat-conducting material in the circular block 6 can capture the heat in the first time and spread it to the surrounding at an extremely fast speed, so as to avoid the accumulation of heat in the pin part and effectively reduce the risk of performance degradation or damage of the pin due to overheating. ​

[0029] Further comprising: two magnetic blocks 3, respectively arranged on the upper protective shell 2 and the lower protective shell 1, for magnetic connection between the upper protective shell 2 and the lower protective shell 1. By arranging the magnetic blocks 3, the upper protective shell 2 and the lower protective shell 1 can be quickly closed or opened, so as to install or take out the diode.

[0030] Further comprising: a plurality of heat dissipation fins 9 arranged at the center of the bottom of the mounting plate 8; the mounting plate 8 is hollow. By arranging the heat dissipation fins 9, the heat generated by the diode can be transmitted, and then the heat dissipation fins 9 increase the contact with the surrounding air to dissipate heat to the surroundings.

[0031] Further comprising: the edge of the mounting plate 8 is provided with a plurality of heat dissipation holes 81. By arranging the heat dissipation holes 81, the external air enters the mounting plate 8 through the heat dissipation holes 81, and the heat of the heat conduction column 82 in the mounting plate 8 is taken away, so as to accelerate the heat dissipation effect.

[0032] Further comprising: a plurality of heat conduction columns 82 arranged in the mounting plate 8, and the heat conduction columns 82 are mainly concentrated in the corresponding area of the heat dissipation fin 9. By arranging the heat conduction columns 82, the heat generated by the diode main body 5 is absorbed, and then the heat is conducted to the heat dissipation fin 9, so as to avoid the accumulation of heat in the diode main body 5.

[0033] The lower protective shell 1 comprises a soft layer 12 and a protective layer 11, and the upper protective shell 2 is the same as the lower protective shell 1. By arranging the soft layer 12, which is usually made of materials such as rubber, silica gel sponge and the like, which are soft and elastic, directly contacts the diode main body 5, so as to avoid the diode main body 5 from contacting the hard surface; the protective layer 11 is made of hard plastic, metal sheet and the like materials with certain strength.

[0034] The technical scheme provided by the utility model, the pin main body 7 is inserted into the protective sleeve 4, then the upper protective shell 2 and the lower protective shell 1 are magnetically connected through the magnetic blocks 3, a closed protection space is formed, when vibration occurs in the transportation process, the inner layer 41 contacts the pin main body 7 first, buffering is carried out, then the elastic strips in the middle layer 42 can disperse impact force from multiple directions; when the diode is installed into the electronic equipment and put into use, the heat generated by the diode is absorbed by the heat conduction column 82, is conducted to the heat dissipation fin 9, then the heat dissipation holes 81 promote air flow, heat dissipation convection is formed, and heat discharge is accelerated.

[0035] The utility model covers any alternative, modification, equivalent method and scheme which are made on the essence and range of the utility model. In order to make the public have the thorough understanding of the utility model, the specific details are explained in the above preferred embodiment of the utility model, and the utility model can also be completely understood without the description of these details for the person skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the utility model, the well-known method, process, flow, element and circuit etc. are not explained in detail.

[0036] The above is only the preferred embodiment of the utility model, and it should be pointed out that, for ordinary skilled person in the art, under the premise of not departing from the principle of the utility model, a plurality of improvements and refinements can also be made, and these improvements and refinements should also be regarded as the protection range of the utility model.

Claims

1. A diode with pin protection, characterized in that, The utility model relates to a diode protection shell, including: Upper protective shell (2); Lower protective shell (1) is arranged at one end of upper protective shell (2); Two protective sleeves (4) are arranged in lower protective shell (1); Diode body (5) is arranged in lower protective shell (1); Mounting plate (8) is arranged at the bottom of diode body (5); Two pin substrates (7) are arranged on mounting plate (8) and are matched with protective sleeve (4); Protective sleeve (4) includes inner layer (41), middle layer (42) and outer layer (43).

2. The diode with pin protection according to claim 1, characterized in that, Inner layer (41) adopts silica gel material, and a plurality of elastic strips are arranged in middle layer (42), and a plurality of elastic strips are in honeycomb shape.

3. The diode with pin protection of claim 1, wherein, Further including: Two circular arc blocks (6) are arranged between mounting plate (8) and pin substrate (7), and graphite sheet or boron nitride sheet is filled in circular arc block (6).

4. The diode with pin protection of claim 1, wherein, Further including: Two magnetic attraction blocks (3) are arranged on upper protective shell (2) and lower protective shell (1) respectively, and are used for the magnetic connection between upper protective shell (2) and lower protective shell (1).

5. The diode with pin protection of claim 1, wherein, Further including: A plurality of cooling fins (9) are arranged at the center of the bottom of mounting plate (8); Mounting plate (8) is hollow.

6. The diode with pin protection of claim 5, wherein, Further including: A plurality of heat dissipation holes (81) are arranged on the edge of mounting plate (8).

7. The diode with pin protection of claim 5, wherein, Further including: A plurality of heat conduction columns (82) are arranged in mounting plate (8), and heat conduction columns (82) are mainly concentrated in the corresponding area of cooling fin (9).

8. The diode with pin protection of claim 1, wherein, Lower protective shell (1) includes soft layer (12) and protective layer (11), and upper protective shell (2) is same with lower protective shell (1).

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