Directional arrangement device of chip-type three-terminal multilayer ceramic filter

Abstract

The utility model relates to a directional arrangement device for sheet-type three-terminal multilayer ceramic filters with consistent width and thickness, which comprises a feeding mechanism and an implanting mechanism, and is characterized in that the feeding mechanism forwards conveys the sheet-type three-terminal multilayer ceramic filters which are transversely arranged; the feeding mechanism is provided with a screening position, and the screening position is provided with a moving-out mechanism. The implanting mechanism is arranged at the tail end of the feeding mechanism; the screening position is arranged on the feeding mechanism for conveying the transversely arranged MLCF chips, the MLCF chips with the non-electrode faces facing upwards are moved out through the moving-out mechanism, the CDs of the MLCF chips entering the implanting mechanism face the cutting inner electrode faces in the vertical direction, directional arrangement of the sheet type three-terminal multi-layer ceramic filter chips with the consistent width and thickness is achieved, and the yield of the chip type three-terminal multi-layer ceramic filter chips is improved. And the arrangement efficiency, the production efficiency and the end sealing accuracy are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of slice three-terminal multi-layer ceramic filter slurry, in particular to a directional arrangement device of slice three-terminal multi-layer ceramic filter. BACKGROUND

[0002] With the rapid development of electronic information technology, as one of the three electronic components, slice multi-layer ceramic capacitor (MLCC) is constantly developing towards miniaturization, high capacitance, high frequency, etc. In various electronic circuit applications, various slice multi-layer ceramic filters (MLCF) with three-terminal structure have been rapidly developed, including T-shaped slice multi-layer LC filter, π-shaped slice multi-layer LC filter, and C-shaped slice multi-layer filter (i.e. slice three-terminal capacitor filter). Among them, the slice three-terminal capacitor filter gradually replaces some high-capacity MLCC in some applications due to its superior high-frequency characteristics, lower equivalent series inductance (ESL), and smaller mounting area.

[0003] MLCF and MLCC are both composed of multiple layers of dielectric film interleaved and stacked. In addition to leading out the internal electrode in the length direction of the chip, the internal electrode is also led out in the width direction. By setting the ground electrode, current can flow into the two ends of the MLCF and flow out from the middle ground electrode, thereby shortening the current path by half. At the same time, due to the existence of current flowing out from four electrode directions and self-induction, the equivalent series inductance (ESL) of the MLCF can be greatly reduced.

[0004] The slurry operation of the MLCF ground electrode is usually carried out by loading the ceramic body chip of the MLCF in an array arrangement of SUS carrier plate, JIG carrier plate, thin rubber plate, carrier tape, etc. work tool, so that the electrode surface of the waist part to be slurry is exposed. After a specific slurry process, the ground electrode is coated on the electrode surface of the chip, and after drying and surface changing, the other side of the ground electrode is slurry coated with silver and dried, thereby obtaining the MLCF chip coated with the ground external electrode.

[0005] Generally, for some MLCF with inconsistent width and thickness, the ground electrode is usually made by physical method, that is, by processing high-precision tooling, using the size difference of the chip in the width and thickness direction to identify and control the placement direction of the chip. After the directional identification and array arrangement of the chip width and thickness direction, it can be ensured that when the chip is loaded by the tooling such as SUS carrier plate, JIG carrier plate, thin rubber plate, carrier tape, etc., the waist part exposes the electrode surface in the thickness direction. For some MLCF with consistent width and thickness, there is no size deviation in the width and thickness direction, and it is impossible to identify and arrange the width and thickness direction by simple physical method. Only manual visual identification and arrangement can ensure that the electrode surface is exposed when the chip is loaded by the tooling, which makes the arrangement time long, the efficiency low, the production cost high, and it is difficult to realize batch production. Practical new type content

[0006] Based on this, the application provides a directional arrangement device for chip type three-terminal multilayer ceramic filter, which can arrange the MLCF chip with consistent width and thickness, improve production efficiency and reduce production cost.

[0007] The above-mentioned purpose of the application is realized by the following technical scheme:

[0008] The application provides a directional arrangement device for chip type three-terminal multilayer ceramic filter, the width and thickness of the chip type three-terminal multilayer ceramic filter are the same, and the two side surfaces in the thickness direction expose the internal electrode; the device comprises:

[0009] A feeding mechanism is arranged on the feeding mechanism, and the feeding mechanism is used for feeding the chip type three-terminal multilayer ceramic filter arranged in the transverse direction forward; a screening position is arranged on the feeding mechanism, and a moving-out mechanism is arranged on the screening position, the moving-out mechanism is used for moving out the chip type three-terminal multilayer ceramic filter arranged in the second state in the transverse direction from the feeding mechanism; wherein the second state is that the two sides of the chip type three-terminal multilayer ceramic filter along the width surface are upward and downward.

[0010] An implanting mechanism is arranged at the end of the feeding mechanism, and the implanting mechanism is used for implanting the chip type three-terminal multilayer ceramic filter arranged in the first state in the transverse direction into the carrier plate; wherein the first state is that the two sides of the chip type three-terminal multilayer ceramic filter along the thickness surface are upward and downward.

[0011] In an optional embodiment, a first CCD camera is arranged above the screening position, the first CCD camera acquires an image of the chip-type three-terminal multilayer ceramic filter at the screening position and sends the image to a control terminal, the control terminal determines whether the chip-type three-terminal multilayer ceramic filter is in a first state or a second state according to the image, and controls the removal mechanism to remove the chip-type three-terminal multilayer ceramic filter horizontally placed in the second state from the feeding mechanism.

[0012] In an optional embodiment, the device further comprises a recovery track arranged at a side of the feeding mechanism, the recovery track is used to receive the chip-type three-terminal multilayer ceramic filter removed by the removal mechanism and recover the chip-type three-terminal multilayer ceramic filter.

[0013] In an optional embodiment, the feeding mechanism comprises a vibrating member and a straight vibrating track arranged on the vibrating member.

[0014] The removal mechanism comprises a blowing hole arranged at a side of the straight vibrating track opposite to the recovery track, a connecting channel corresponding to the blowing hole is further arranged at a side of the straight vibrating track adjacent to the recovery track, the connecting channel connects the straight vibrating track and the recovery track, and the blowing hole is used to blow gas to blow the chip-type three-terminal multilayer ceramic filter from the straight vibrating track to the recovery track along the connecting channel.

[0015] In an optional embodiment, a magnetic member is arranged below the connecting channel, the magnetic member extends to below the feeding mechanism and below the recovery track along the direction of the connecting channel.

[0016] In an optional embodiment, the implanting mechanism comprises an implanting assembly, a horizontal moving platform and a second CCD camera.

[0017] The horizontal moving platform is arranged with a bearing plate fixing position, and the second CCD camera is used to shoot and position a bearing plate fixed on the bearing plate fixing position.

[0018] The horizontal moving platform moves the bearing plate to a predetermined position according to the positioning information of the second CCD camera.

[0019] The implanting assembly is connected with an outlet of the feeding mechanism, the implanting assembly comprises an implanting element, and the implanting element implants the chip-type three-terminal multilayer ceramic filter into a bearing hole of the bearing plate in sequence.

[0020] In an alternative embodiment, the implanting element is a punch, and the implanting assembly further comprises an implanting port below the punch, the implanting port having a size greater than that of the chip-type three-terminal multilayer ceramic filter; the punch is capable of adsorbing the chip-type three-terminal multilayer ceramic filter moving from the outlet of the feeding mechanism to above the implanting port;

[0021] The horizontal moving platform moves the bearing plate to below the implanting port according to the positioning information of the second CCD camera, so that the bearing hole not loaded on the bearing plate is aligned with the implanting port and the punch;

[0022] The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate through the implanting port.

[0023] In an alternative embodiment, the implanting element is a magnetic suction head, an implanting suction nozzle or an implanting manipulator, which is used to adsorb or grab the chip-type three-terminal multilayer ceramic filter and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing hole on the bearing plate.

[0024] In an alternative embodiment, the horizontal moving platform comprises an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module and a positioning clamping assembly, the X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the bearing plate fixed position to move horizontally in X direction and Y direction; the positioning clamping assembly is arranged on the bearing plate fixed position and is used to fix the bearing plate.

[0025] In an alternative embodiment, the device further comprises a bearing plate loading position, a bearing plate unloading position and an up-and-down loading manipulator;

[0026] The up-and-down loading manipulator is used to grab the empty bearing plate at the bearing plate loading position to the bearing plate fixed position, and is also used to grab the bearing plate bearing the chip-type three-terminal multilayer ceramic filter from the bearing plate fixed position to the bearing plate unloading position.

[0027] The present application has the following beneficial effects:

[0028] The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to the embodiment of the present application realizes directional arrangement of the chip-type three-terminal multilayer ceramic filter with uniform width and thickness, and improves arrangement efficiency, production efficiency and end sealing accuracy, by arranging a screening position on the feeding mechanism conveying the transversely arranged MLCF chip and moving the second state transversely placed MLCF chip out of the moving-out mechanism, so that the CD of the MLCF chip entering the implanting mechanism is perpendicular to the cutting inner electrode surface and faces upward and downward. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 Structure diagram of a chip-type three-terminal multilayer ceramic filter in an exemplary embodiment;

[0030] Figure 2 Structure diagram of a directional arrangement device of a chip-type three-terminal multilayer ceramic filter in an exemplary embodiment;

[0031] Figure 3 Structure diagram of a vibrating disc and a feeding mechanism in an exemplary embodiment;

[0032] Figure 4 Structure diagram of a vibrating disc, a feeding mechanism, and an implanting mechanism in an exemplary embodiment;

[0033] Figure 5 Structure diagram of a loading and unloading position of a carrier plate in an exemplary embodiment;

[0034] Figure 6 Structure diagram of a carrier plate in an exemplary embodiment;

[0035] Figure 7 Structure diagram of an MLCF chip in an exemplary embodiment.

[0036] Explanation of reference numerals:

[0037] 100, directional arrangement device of a chip-type three-terminal multilayer ceramic filter; 110, workbench;

[0038] 120, vibrating disc; 121, vibrating base; 122, hopper;

[0039] 130, feeding mechanism; 131, vibrating member; 132, straight vibrating track; 1321, air blowing hole; 1322, air blowing device; 133, first CCD camera; 134, connecting channel; 135, screening position;

[0040] 140, implanting mechanism; 141, implanting assembly; 1412, punch; 142, horizontal moving platform; 1422, X-axis high-precision servo linear module; 1423, Y-axis high-precision servo linear module; 143, second CCD camera;

[0041] 150, carrier plate;

[0042] 160, recycling track;

[0043] 170, loading position of a carrier plate;

[0044] 180, unloading position of a carrier plate;

[0045] 190, loading and unloading manipulator;

[0046] 200. Chip-type three-terminal multilayer ceramic filter. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] Furthermore, the terms "first" and "first" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "first" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0050] To address the technical problems in the background art, this application provides a directional arrangement device for a uniform width and thickness chip three-terminal multilayer ceramic filter. This device can directionally arrange uniform width and thickness chip three-terminal multilayer ceramic filters in batches according to a specified width and thickness direction. This enables the rapid application of paste to the exposed waist grounding electrode after loading the uniform width and thickness chip three-terminal multilayer ceramic filter (hereinafter referred to as MLCF chip), thereby improving production efficiency and reducing production costs.

[0051] like Figure 1 The diagram shows the structure of an MLCF chip 200 with uniform width and thickness. Its length, width, and thickness (height) are a1, b1, and c1, respectively, where a1 > b1 = c1. Here, b1 = c1 does not mean absolute equality, but rather that the values ​​are nearly equal or have a very small difference, such as a difference ≤ 0.05mm. Using precision machining tools, it is impossible to achieve width and thickness orientation using physical methods based on the difference in chip width and thickness; therefore, the values ​​can be approximated as equal. The manufacturing process of an MLCF chip typically includes processes such as material preparation, casting, printing, stacking, lamination, cutting, glue removal, sintering, and end capping. Figure 1The product form shown is a ceramic semi-finished product formed after sintering and chamfering, the two ends in the length direction are AB opposite the inner electrode surface, exposing the inner electrode, and the input electrode is formed at this position; the two ends in the thickness direction are CD opposite the cut inner electrode surface, exposing the inner electrode of the waist part, and the ground electrode is formed at this position; the two ends in the width direction are EF opposite the cover surface, not exposing the inner electrode, and the inner electrode inside is arranged in the height direction. Figure 1

[0052] The end sealing is a process of dipping slurry on the ceramic semi-finished product AB opposite the inner electrode surface and CD opposite the cut inner electrode surface after sintering and chamfering, thereby connecting the electrodes exposed on the same side in parallel to form an external electrode. Before the end sealing process of the waist ground electrode, the MLCF chip 200 needs to be arrayed in a unified arrangement manner so that the side with the exposed inner electrode of the waist part is uniformly oriented, for example, downward, to avoid the simultaneous existence of EF opposite the cover surface and CD opposite the cut surface, which affects the accuracy of end sealing.

[0053] In the conventional technology such as patent No. CN117116676A, the through holes for loading MLCF chips are provided on the carrier plate, and the MLCF chips are arrayed in the direction of Figure 1 , and then loaded into the through holes in batches, so that the CD opposite the cut inner electrode surface faces the outside of the through hole, and the slurry dipping operation on the CD opposite the cut inner electrode surface can be realized.

[0054] The conventional technology adjusts the MLCF chips with inconsistent width and thickness to the arrangement manner of Figure 1 . The width and thickness of the chips are used to identify and control the placement direction of the chips by high-precision tooling, and the width and thickness of the chips are identified and arrayed. However, for MLCF chips with consistent width and thickness, the conventional technology cannot arrange them.

[0055] To solve the above technical problems, the embodiment of the present application provides a directional arrangement device 100 for MLCF chips with consistent width and thickness, as shown in Figures 2-6 , in an embodiment, the directional arrangement device 100 for MLCF chips with consistent width and thickness includes a workbench 110, a vibrating disc 120, a feeding mechanism 130, and an implantation mechanism 140 arranged on the workbench 110. The vibrating disc 120 is used to arrange the MLCF chips inside in a transverse direction to the discharge port of the vibrating disc 120 through vibration. The inlet of the feeding mechanism 130 is connected with the discharge port of the vibrating disc 120, and is used to forwardly convey the MLCF chips arranged in a transverse direction. The implantation mechanism is arranged at the end of the feeding mechanism, and is used to implant the MLCF chips arranged in a transverse direction into the carrier plate for subsequent slurry dipping operation.

[0056] In an optional embodiment, as shown in Figures 3-4 ​As shown, the vibration disc 120 comprises a vibration base 121 fixed on the workbench 110 and a hopper 122 fixed on the upper end of the vibration base 121, the bottom of the hopper 122 is a material containing pool, a spiral ascending material discharging track is arranged along the inner wall of the hopper 122, the vibration base 121 drives the hopper 122 to do a torsional vibration around the vertical axis, and the MLCF chips in the material containing pool of the hopper 122 move along the spiral material discharging track one by one under the torsional vibration and then are arranged in order in the horizontal direction at the discharging port of the vibration disc 120.

[0057] Preferably, the feeding mechanism 130 can feed the MLCF chips forward by vibration. As shown in the embodiment, the feeding mechanism 130 comprises a vibration member 131 and a straight vibration track 132 arranged on the vibration member 131, the straight vibration track 132 is arranged obliquely downward, and the vibration member 131 drives the MLCF chips on the straight vibration track 132 to vibrate and move forward. Figures 3-4

[0058] In the embodiment, after the MLCF chips enter the feeding mechanism 130 in the horizontal direction, the MLCF chips are in the first state or the second state, the first state is that the MLCF chips are along the two sides of the thickness surface and face the upward and downward directions, for example Figure 1 that is, the MLCF chips are placed in the first state, and the ground electrodes of the waist of the MLCF chips are exposed in the upward and downward directions; the second state is that the MLCF chips are along the two sides of the width surface and face the upward and downward directions, that is Figure 1 that is, the MLCF chips are placed in the second state, and the ground electrodes of the waist of the MLCF chips are exposed in the left and right directions.

[0059] In the embodiment, the MLCF chips placed in the second state need to be removed from the feeding mechanism 130, as shown in the figure, the feeding mechanism 130 is provided with a screening position 135, the screening position 135 is provided with a removing mechanism, and the removing mechanism is used to remove the MLCF chips placed in the second state from the feeding mechanism 130. Specifically, when the removing mechanism acts, the feeding mechanism 130 can pause the feeding or continue the feeding process according to the feeding speed. Figure 3 Specifically, the removing mechanism can be a mechanical hand, a blowing mechanism or other related mechanisms that can remove the MLCF chips from the feeding mechanism 130, and the removing mechanism can specifically move the MLCF chips from the feeding mechanism 130 to the vibration disc 110 for re-screening or to the recycling device for recycling, so as to wait for the next round of screening.

[0060]

[0061] ​​In the embodiment, the MLCF chip placed in the screening position 135 of the feeding mechanism 130 can be determined as the first state or the second state by artificial visual inspection or machine vision inspection. In order to realize the state detection of the MLCF chip, if an upper cover is arranged above the feeding mechanism 130, a window for observation is arranged above the screening position 135.

[0062] The implanting mechanism 140 is used for implanting the second state transversely placed chip multilayer ceramic filter delivered by the feeding mechanism 130 into the carrier plate 150. Figure 6 As shown in the embodiment, a plurality of carrier holes for loading the MLCF chip are arranged on the carrier plate 150 in an array, and the size of each carrier hole is slightly smaller than the transversely placed MLCF chip, so that the MLCF chip can be more stably implanted into the carrier hole for the next slurry dipping operation after being transversely implanted into the carrier hole by the implanting mechanism 140.

[0063] The working process of the directional arrangement device 100 of the chip multilayer ceramic filter in the embodiment is as follows:

[0064] First step: the MLCF chip is placed into the vibrating disc 120, and the MLCF chip is spirally raised in the vibrating disc and arranged into the feeding mechanism 130 in a transverse manner by the vibration of the vibrating disc.

[0065] Second step: the feeding mechanism 130 delivers the MLCF chip forward, and when the MLCF chip is delivered to the screening position 135, it is determined by visual inspection or machine vision inspection whether the MLCF chip passing through the screening position 135 is in the first state or the second state transverse placement, and if it is in the second state, the removing mechanism removes it from the feeding mechanism 130.

[0066] Third step: the feeding mechanism 130 continues to deliver the first state transversely placed MLCF chip forward to the implanting mechanism 140, and the implanting mechanism 140 implants the MLCF chip into the carrier hole of the carrier plate 150, so that the MLCF chip arranged in the width-thickness direction is obtained, and then the MLCF chip is dipped and coated with the external electrode at the ground electrode of the waist part by a specific slurry dipping process, and after drying and surface changing, the other ground electrode is dipped and coated and dried, and after high-temperature sintering, the MLCF chip coated with the ground external electrode is obtained.

[0067] The directional arrangement device of the chip type three-terminal multilayer ceramic filter of the embodiment of the present application arranges the MLCF chips through the vibration disc, sets the screening position on the feeding mechanism conveying the laterally arranged MLCF chips, and removes the MLCF chips laterally placed in the second state through the removing mechanism, so that the CD of the MLCF chips entering the implantation mechanism is opposite to the cutting inner electrode surface and faces the upward and downward directions, thereby realizing the directional arrangement of the wide and thick consistent chip type three-terminal multilayer ceramic filter chip and improving the arrangement efficiency, production efficiency and end sealing accuracy.

[0068] In an optional embodiment, as shown in Figure 3 and Figure 4 , the first CCD camera 133 is arranged above the screening position 135, the first CCD camera 133 acquires the image of the MLCF chip located at the screening position 135 and sends it to the control terminal, the control terminal determines whether the MLCF chip is in the first state or the second state according to the image, and controls the removing mechanism to remove the MLCF chip laterally placed in the second state from the feeding mechanism 130.

[0069] Referring to Figure 7 , which is a schematic view of the MLCF chips of inconsistent width and thickness Figure 7 , the sizes of the plurality of MLCF chips are not the same), wherein A is placed in the first state and B is placed in the second state, as can be seen from the figure, A exposes a relatively obvious inner electrode pattern.

[0070] Based on this, in a preferred embodiment, the control terminal performs the following steps:

[0071] S301: Acquire the original image of the chip type three-terminal multilayer ceramic filter located at the screening position;

[0072] S302: Convert the original image into a grayscale image to remove the color information in the original color image, so as to simplify the subsequent image processing;

[0073] S303: Use an edge detection algorithm to extract all edges in the grayscale image; preferably, use the Canny edge detection algorithm to extract all edges in the image to ensure that the chip includes the external contour and any possible inner electrode.

[0074] S304: Detect all contours in the image, filter out irrelevant contours according to the preset position or size, and obtain the chip contour; preferably, detect all contours in the image through the findContours function.

[0075] S305: Extract the chip region according to the chip contour;

[0076] S306: In the chip region, perform secondary contour detection to determine whether there is a contour of a preset size at a preset position.

[0077] Preferably, step S306 includes the following sub-steps:

[0078] S3061: Binarize the extracted chip area to distinguish the internal electrode pattern from other areas;

[0079] S3062: To remove potential small noises or interference, morphological operations (such as opening operations) are used to further clean up debris in the chip area while preserving possible electrode patterns;

[0080] S3063: In the cleaned chip area, the contour detection method is used to find the inner electrode stripes. Since the inner electrode pattern is a thin stripe, it can be identified by its shape characteristics (such as aspect ratio).

[0081] S307: If present, determine that the chip three-terminal multilayer ceramic filter in the original image is in the first state of horizontal placement;

[0082] S308: If not, determine that the chip three-terminal multilayer ceramic filter in the original image is in the second state of horizontal placement, and control the removal mechanism to remove the chip three-terminal multilayer ceramic filter from the feeding mechanism.

[0083] like Figures 3-4 As shown, in one embodiment, the orientation arrangement device 100 of the chip three-terminal multilayer ceramic filter further includes a recovery track 160, which is located on the side of the feeding mechanism 130. The recovery track 160 is used to receive the MLCF chip removed by the removal mechanism and feed it into the vibratory feeder 120.

[0084] Preferably, the recycling track 160 also uses vibration to move the MLCF chip on it upwards towards the hopper 122 so that it can be recycled into the hopper 122.

[0085] like Figures 3-4 As shown, in a preferred embodiment, the removal mechanism includes an air blowing device 1322 and an air blowing hole 1321. The air blowing hole 1321 is disposed on the side of the vertical vibration track 132 opposite to the recovery track. A connecting channel 134 corresponding to the air blowing hole is also provided on the side of the vertical vibration track 132 adjacent to the recovery track, connecting the vertical vibration track 132 and the recovery track 160. The air blowing hole 1321 is connected to the air blowing device 1322, and the air blowing device 1322 blows gas through the air blowing hole 1321 to blow the MLCF chip from the vertical vibration track 132 along the connecting channel 134 into the recovery track 160. In a specific embodiment, the air blowing device 1322 can be a nozzle or a controllable air source pipe.

[0086] In a preferred embodiment, the recovery track 160 can be located on the side of the vertical vibration track 132. The connecting channel can be a through hole penetrating the recovery track 160 and the vertical vibration track 132. The air blowing hole 1321 is connected to the air blowing device 1322. The air blowing device 1322 blows gas through the air blowing hole 1321 to blow the MLCF chip from the connecting through hole 134 into the recovery track 160. Then, through vibration, the MLCF chip on it is recovered into the hopper 122.

[0087] To prevent the blown gas from blowing the MLCF chip outside the recovery track 160, in a preferred embodiment, the side wall of the recovery track 160 away from the direct vibration track 132 is set higher to block the MLCF chip. More preferably, the recovery track is set as a semi-enclosed type, which only leaves an opening on the side facing the direct vibration track 132, and this opening communicates with the connection channel 134.

[0088] To mitigate the impact force when the MLCF chip is blown out, in a preferred embodiment, a magnetic element (not shown) is provided below the connecting channel 134, extending along the direction of the connecting channel to below the feeding mechanism and below the recycling track, respectively.

[0089] In traditional multilayer ceramic chip capacitors, the internal electrodes are generally made of metal, and external magnets have a relatively small magnetic attraction to them. In this embodiment, to increase the magnetic attraction, nickel can be used as the internal electrode material, or magnetic materials such as nickel can be added to the internal electrodes, making the internal electrodes more magnetic. Furthermore, an internal electrode is exposed opposite the CD, further increasing the magnetic attraction to the magnet. Therefore, in this embodiment, whether the CD faces the cut internal electrode surface or the EF faces the cover plate surface, both have a certain degree of magnetism. The magnetic component below the connection channel can mitigate and control the movement speed of the MLCF chip blown to the recovery track, preventing damage caused by excessive impact.

[0090] In one embodiment, an air valve (not shown) can be installed at the air blowing device 1322 to control the amount of air blown out, so as to ensure that the chip is not blown out.

[0091] In one embodiment, such as Figures 3-4 As shown, the implantation mechanism 140 includes an implantation component 141, a horizontal moving platform 142, and a second CCD camera 143. The implantation component 141 is connected to the outlet of the feeding mechanism 130. The implantation component includes an implantation element for sequentially implanting MLCF chips into the carrier holes on the carrier plate 150.

[0092] The horizontal moving platform 142 is provided with a carrier plate fixing position. The second CCD camera 143 is used to photograph the carrier plate 150 fixed at the carrier plate fixing position and to position it.

[0093] The horizontal moving platform 142 moves the supporting plate 150 to a predetermined position according to the positioning information of the second CCD camera 143, so that the implanting element can implant the MLCF chip outputted by the feeding mechanism 130 into the supporting hole on the supporting plate 150.

[0094] In the preferred embodiment, as shown in Figure 4 The implanting element includes a punch 1412, and the implanting assembly 141 further includes an implanting port (not shown) below the punch 1412, the implanting port has a size larger than that of the MLCF chip, after the MLCF chip enters the implanting mechanism 140 from the straight vibrating track 132, it continues to move forward in the current arrangement order, so that the MLCF chip at the front moves to the top of the implanting port, and the punch 1412 can adsorb the MLCF chip moving to the top of the implanting port from the outlet of the feeding mechanism 130.

[0095] In the embodiment, the horizontal moving platform 142 moves the supporting plate 150 to the bottom of the implanting assembly 141 according to the positioning information of the second CCD camera 143, so that the supporting hole without loading MLCF chip on the supporting plate 150 is aligned with the implanting port and the punch 1412, and the punch 1412 moves downward to implant the MLCF chip above the implanting port into the corresponding supporting hole on the supporting plate 150. Specifically, the punch 1412 is a high-speed electromagnet implanting mechanism, which drives the punch 1412 to move up and down. During the implanting process, the horizontal moving platform 142 continuously moves the supporting plate 150 according to the positioning information of the second CCD camera 143, so that the supporting hole without loading MLCF chip on the supporting plate 150 is moved to the bottom of the implanting port in turn, until all the supporting holes are loaded with MLCF chips.

[0096] In the embodiment, the punch 1412 has magnetism to adsorb the MLCF chip, so that it does not fall to the bottom of the implanting port, or the implanting mechanism 140 further includes a vacuum adsorption assembly (not shown), which is in communication with the adsorption port opened at the bottom of the punch 1412, and adsorbs the MLCF chip through the adsorption port. After the MLCF chip is implanted into the supporting hole, since the size of the supporting hole is slightly smaller than that of the MLCF chip, when the punch 1412 rises, the adsorption force of the punch 1412 to the MLCF chip is smaller than the clamping force of the supporting hole to the MLCF chip, so that the MLCF chip is firmly fixed in the supporting hole. In other embodiments, the punch can also stop vacuum adsorption after implanting the MLCF chip.

[0097] In a specific embodiment, to ensure that the MLCF chip is just moved to the top of the implantation port, the implantation mechanism forms a product flow channel between the outlet of the straight vibration track 132 and the top of the implantation port, and the product flow channel ends at the top of the implantation port. Therefore, the MLCF chip continuously entering the product flow channel can push the frontmost MLCF chip to the top of the implantation port, so as to facilitate the punch to implant it directly. This pushing force can also overcome the adsorption force of the punch 1412 on the MLCF chip, so that when the punch 1412 adsorbs the MLCF chip, the position of the MLCF chip can still move to the top of the implantation port, so as to be moved to the top of the implantation port completely.

[0098] In other embodiments, the implantation element can also be a magnetic suction head, an implantation suction nozzle or an implantation manipulator. The magnetic suction head and the implantation suction nozzle can adsorb the MLCF chip, and the implantation manipulator can grasp the MLCF chip. After the carrier plate 150 moves to the predetermined position, the magnetic suction head and the implantation suction nozzle or the implantation manipulator can implant the MLCF chip into the carrier hole of the carrier plate 150.

[0099] In the present embodiment, the implantation suction nozzle or the implantation manipulator can move more flexibly. The implantation suction nozzle or the implantation manipulator sucks or grasps the MLCF chip output by the feeding mechanism 130 at the set position, and then implants it into the carrier hole. In the process of implantation, the horizontal moving platform 142 can continuously move the carrier plate 150 according to the positioning information of the second CCD camera 143, so that the carrier holes of the carrier plate 150 which are not loaded with the MLCF chip move to the implantation position of the implantation suction nozzle or the implantation manipulator in turn, until all the carrier holes are loaded with the MLCF chip. In other examples, the implantation suction nozzle or the implantation manipulator can implant the MLCF chip into all the carrier holes of the carrier plate according to the positioning information of the second CCD camera 143 after the carrier plate moves to the predetermined position.

[0100] Preferably, the implantation suction nozzle or the implantation manipulator is driven by a driving assembly, and the carrier plate 150 moves to the predetermined position below the implantation suction nozzle or the implantation manipulator, so that the implantation suction nozzle or the implantation manipulator can realize the sucking or grasping and implantation of the MLCF chip through the horizontal movement and the vertical movement.

[0101] In the present embodiment, the implantation suction nozzle or the implantation manipulator can suck or grasp the MLCF chip through visual auxiliary means, or the feeding mechanism 130 can output the MLCF chip to the specified position, and the implantation suction nozzle or the implantation manipulator can suck or grasp by default at the set position.

[0102] In a preferred embodiment, as shown in FIG. 1, the implantation mechanism comprises a horizontal moving platform 142, a carrier plate 150 and an implantation suction nozzle or an implantation manipulator. Figure 4As shown, the horizontal moving platform 142 comprises an X-axis high-precision servo linear module 1422, a Y-axis high-precision servo linear module 1423 and a positioning and clamping assembly (not shown), the X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 drive the carrier plate fixed position to move horizontally in the X direction and the Y direction; the positioning and clamping assembly is arranged on the carrier plate fixed position and used for fixing the carrier plate.

[0103] Specifically, the X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 can be mutually driven and driven, and the positioning and clamping assembly can be a buckle or a vacuum suction accessory.

[0104] In an embodiment, as shown in Figure 2 and Figure 5 The directional arrangement device 100 of the chip type three-terminal multilayer ceramic filter further comprises a carrier plate loading position 170, a carrier plate unloading position 180 and an unloading and loading manipulator 190.

[0105] The unloading and loading manipulator 190 is used for grabbing the empty carrier plate 150 at the carrier plate loading position 170 to the carrier plate fixed position, and the unloading and loading manipulator 190 is also used for grabbing the carrier plate 150 carrying the MLCC chip from the carrier plate fixed position to the carrier plate unloading position 180.

[0106] In an embodiment, according to the actual production efficiency, a plurality of sets of vibration discs 120 and other spare parts can be combined to realize the mode of multiple vibration discs, multiple tracks and multiple implantation units running synchronously, so as to improve the production efficiency.

[0107] The technical features of the above-mentioned embodiments can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the description.

[0108] The above-mentioned embodiments only express several embodiments of the present application, the description is more specific and detailed, but it cannot be understood as the limitation of the scope of the utility model patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims, and the description can be used to explain the content of the claims.

Claims

1. An alignment device for a chip-type three-terminal multilayer ceramic filter, the chip-type three-terminal multilayer ceramic filter having the same width and thickness, and both side surfaces in the thickness direction thereof exposing internal electrodes; characterized by, The device comprises: a feeding mechanism for feeding the sheet-type three-terminal multilayer ceramic filters arranged in a transverse direction; a screening position is arranged on the feeding mechanism, and a removal mechanism is arranged on the screening position for removing the sheet-type three-terminal multilayer ceramic filters arranged in a transverse direction in a second state from the feeding mechanism; wherein the second state is that the sheet-type three-terminal multilayer ceramic filters are arranged in a transverse direction with two sides of a width surface facing upward and downward; an implanting mechanism arranged at the end of the feeding mechanism, for implanting the sheet-type three-terminal multilayer ceramic filters arranged in a transverse direction in a first state fed by the feeding mechanism into a carrier plate; wherein the first state is that the sheet-type three-terminal multilayer ceramic filters are arranged in a transverse direction with two sides of a thickness surface facing upward and downward.

2. The device for arranging the sheet-type three-terminal multilayer ceramic filters according to claim 1, wherein: a first CCD camera is arranged above the screening position, and the first CCD camera is used to acquire the image of the sheet-type three-terminal multilayer ceramic filters arranged in a transverse direction on the screening position and send the image to a control terminal; the control terminal is used to determine whether the sheet-type three-terminal multilayer ceramic filters are in a first state or a second state according to the image, and control the removal mechanism to remove the sheet-type three-terminal multilayer ceramic filters arranged in a transverse direction in a second state from the feeding mechanism.

3. The device for arranging the sheet-type three-terminal multilayer ceramic filters according to claim 1, wherein: the device further comprises a recovery track arranged on the side of the feeding mechanism, and the recovery track is used to receive the sheet-type three-terminal multilayer ceramic filters removed by the removal mechanism and recover the sheet-type three-terminal multilayer ceramic filters.

4. The device for arranging the sheet-type three-terminal multilayer ceramic filters according to claim 3, wherein: the feeding mechanism comprises a vibrating member and a straight vibrating track arranged on the vibrating member; the removal mechanism comprises a blowing hole arranged on the side of the straight vibrating track opposite to the recovery track, and the side of the straight vibrating track adjacent to the recovery track is further provided with a connecting channel corresponding to the blowing hole, and the connecting channel connects the straight vibrating track and the recovery track; the blowing hole is used to blow gas to blow the sheet-type three-terminal multilayer ceramic filters from the straight vibrating track along the connecting channel into the recovery track.

5. The device for arranging the sheet-type three-terminal multilayer ceramic filters according to claim 4, wherein: magnetic members are arranged below the connecting channel, and the magnetic members respectively extend to below the feeding mechanism and below the recovery track along the direction of the connecting channel.

6. The device for arranging the sheet-type three-terminal multilayer ceramic filters according to claim 1, wherein: the implanting mechanism comprises an implanting assembly, a horizontal moving platform and a second CCD camera; the horizontal moving platform is provided with a carrier plate fixing position, and the second CCD camera is used to shoot the carrier plate fixed on the carrier plate fixing position and position the carrier plate. The horizontal moving platform moves the bearing plate to a predetermined position according to the positioning information of the second CCD camera; The implanting assembly is connected with the outlet of the feeding mechanism, and the implanting assembly comprises an implanting element which implants the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate in sequence.

7. The device for directional arrangement of chip-type three-terminal multilayer ceramic filters according to claim 6, characterized in that: The implanting element is a punch, and the implanting assembly further comprises an implanting port below the punch, the size of the implanting port being greater than that of the chip-type three-terminal multilayer ceramic filter; the punch can adsorb the chip-type three-terminal multilayer ceramic filter which moves from the outlet of the feeding mechanism to above the implanting port; The horizontal moving platform moves the bearing plate to below the implanting port according to the positioning information of the second CCD camera, so that the bearing hole not loaded on the bearing plate is aligned with the implanting port and the punch; The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate through the implanting port.

8. The device for directional arrangement of chip-type three-terminal multilayer ceramic filters according to claim 6, characterized in that: The implanting element is a magnetic suction head, an implanting suction nozzle or an implanting mechanical hand, which is used to adsorb or grab the chip-type three-terminal multilayer ceramic filter and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing hole on the bearing plate.

9. The device for directional arrangement of chip-type three-terminal multilayer ceramic filters according to claim 6, characterized in that: The horizontal moving platform comprises an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module and a positioning and clamping assembly, the X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the bearing plate fixed position to move horizontally in X direction and Y direction; the positioning and clamping assembly is arranged on the bearing plate fixed position and is used to fix the bearing plate.

10. The device for directional arrangement of chip-type three-terminal multilayer ceramic filters according to claim 6, characterized in that: The device further comprises a bearing plate loading position, a bearing plate unloading position and a loading and unloading mechanical hand; The loading and unloading mechanical hand is used to grab the empty bearing plate at the bearing plate loading position to the bearing plate fixed position, and the loading and unloading mechanical hand is also used to grab the bearing plate bearing the chip-type three-terminal multilayer ceramic filter from the bearing plate fixed position to the bearing plate unloading position.

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