High-torque and anti-tin-overflow SMT (Surface Mount Technology) patch nut and connecting piece

Abstract

The utility model relates to a circuit board fastener, in particular to a high-torque and anti-tin-overflow SMT (Surface Mount Technology) patch nut, which comprises a flange part used for being attached to a first surface of a substrate; the handle part is coaxially connected with the flange part, the handle part is used for being arranged in the through hole in a penetrating mode, and when the handle part is arranged in the through hole in a penetrating mode, a gap used for containing solder paste possibly overflowing from one side of the gap is formed between the outer wall of the handle part and the inner wall of the through hole; the end, deviating from the flange part, of the handle part further comprises a flower tooth part, the flower tooth part is coaxially connected with the handle part, the flower tooth part is used for being arranged in the through hole in a penetrating mode, and tooth grooves of the flower tooth part are used for containing flowing solder paste. According to the structure of the utility model, the tooth part is arranged at one end of the handle part, so that tin paste flowing after being heated is accommodated in tooth grooves of the teeth in the reflow soldering (especially secondary reflow soldering) process, and the tin paste is prevented from penetrating through the SMT patch nut to flow to the second surface of the substrate to influence the quality of the substrate.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board fastener, especially to a high-torque SMT patch nut and connecting piece capable of preventing tin overflow. BACKGROUND

[0002] The description in this section is only provided for background information related to the utility model disclosure and does not constitute prior art.

[0003] SMT (Surface Mount Technology) is a technology for electronic component assembly, which directly mounts electronic components on the surface of a substrate for welding. Reflow soldering is a common step in this process, which involves applying solder paste on the surface of the substrate, mounting electronic components, and then heating the solder paste to melt it and form reliable solder joints between the substrate and components or fasteners.

[0004] In the existing reflow soldering of SMT patch nuts, the SMT patch nut is pre-installed in the hole position of the substrate, and then the solder paste is heated and melted. During the process of heating and melting the solder paste, especially during the second reflow soldering of the substrate, part of the solder paste will flow into the gap between the SMT patch nut and the substrate due to capillary action, and in severe cases, it will drip along the gap and cause pollution, resulting in difficulty in meeting product quality standards.

[0005] At the same time, the existing substrate has insufficient anti-torque performance for fixing the SMT patch nut, which is prone to loosening during use, relying solely on the welding between smooth walls.

[0006] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely describing the technical scheme of the utility model, and for the convenience of understanding by the person skilled in the art. The above technical scheme cannot be considered as known by the person skilled in the art only because it is described in the background section of the utility model. CONTENT OF THE UTILITY MODEL

[0007] The utility model aims to provide a high-torque SMT patch nut and connecting piece capable of preventing tin overflow, which can accommodate the flowing solder paste in the tooth groove of the toothed portion after heating during reflow soldering (especially the second reflow soldering), thereby preventing the solder paste from flowing through the SMT patch nut to the second surface of the substrate and affecting the quality of the substrate.

[0008] In order to achieve the above object, the utility model discloses a high torque, prevent spilling tin's SMT paster nut for being connected with the substrate, wherein, the substrate has oppositely arranged first face and second face, the substrate includes through -hole, the through -hole has first aperture, the first face of the substrate is coated with the tin cream that can flow after being heated at the through -hole, high torque, prevent spilling tin's SMT paster nut includes:

[0009] Flange portion, the radial dimension of the flange portion is greater than the first aperture, the flange portion is used for being attached with the first face of the substrate;

[0010] Handle portion, the handle portion is coaxially connected with the flange portion, the handle portion is used for being arranged in the through -hole, the radial dimension of the handle portion is matched with the first aperture, and the gap between the outer wall of the handle portion and the inner wall of the through -hole;

[0011] Wherein, the end of the handle portion away from the flange portion still includes the petal tooth portion, the petal tooth portion is coaxially connected with the handle portion, and the petal tooth portion is used for being arranged in the through -hole, and the tooth groove of the petal tooth portion is used to accommodate the tin cream possibly spilled from the gap side.

[0012] As the further description of the above technical scheme, the radial dimension of the tooth top of the petal tooth portion is same with the radial dimension of the handle portion.

[0013] As the further description of the above technical scheme, the petal tooth portion has enough deep axial thickness, so that the tin cream does not separate from the tooth groove of the petal tooth portion to the second face of the substrate.

[0014] As the further description of the above technical scheme, the tooth groove of the petal tooth portion has enough small radial depth, so that the tin cream is attached and arranged in the tooth groove of the petal tooth portion.

[0015] As the further description of the above technical scheme, the SMT paster nut has axially extending internal screw hole.

[0016] The utility model discloses still a kind of connecting pieces, the connecting pieces include as above SMT paster nut and substrate, the SMT paster nut is connected between the substrate by tin cream, at least part of the tin cream is filled in the tooth groove of the petal tooth portion of the SMT paster nut.

[0017] By the above technical scheme, the beneficial effects of the utility model are as follows:

[0018] The utility model discloses a high torque, SMT paster nut of tin spill -proof, can set up the tooth portion to the one end of handle portion, make in the reflow soldering (especially the secondary reflow soldering) process, the tin paste flowing after heating is accommodated in the tooth groove of tooth portion in addition to filling the gap in the handle portion and the inner wall of through -hole, gather the tin paste of extra with the help of the tooth groove of having greater space, avoid the tin paste to flow to the second face of substrate on SMT paster nut, the quality of substrate is influenced.

[0019] To further understand the features and technical contents of the utility model, please refer to the following detailed description and drawings of the utility model, however the drawings provided are only used for providing reference and illustration, and are not used to limit the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiment or prior art of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, obviously, the drawings in the following description are only some embodiments recorded in the present specification, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0021] Figure 1 It is the reflow soldering schematic view of the SMT paster nut of high torque, tin spill -proof provided by the embodiment of the present specification.

[0022] Figure 2 It is the secondary reflow soldering schematic view of the SMT paster nut of high torque, tin spill -proof provided by the embodiment of the present specification.

[0023] Figure 3 It is the schematic diagram of the no tooth portion comparative example of the SMT paster nut of high torque, tin spill -proof provided by the embodiment of the present specification.

[0024] Figure 4 It is the three -dimensional schematic view of the SMT paster nut of high torque, tin spill -proof provided by the embodiment of the present specification.

[0025] In the drawing: 100, substrate;101, through -hole;200, tin paste;1, flange portion;2, handle portion;3, tooth portion;31, tooth groove;32, tooth top;4, internal thread hole. DETAILED DESCRIPTION

[0026] In order to make the person skilled in the art better understand the technical solutions in the specification, the technical solutions in the specification will be clearly and completely described below in combination with the drawings in the specification. Obviously, the described embodiments are only part of the embodiments of the specification, not all. Based on the embodiments in the specification, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the specification.

[0027] The following is to illustrate the embodiments of the utility model by specific specific embodiments, and the person skilled in the art can understand the advantages and effects of the utility model from the disclosed content of the specification. The utility model can be implemented or applied by other different specific embodiments, and each detail in the specification can be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the utility model. In addition, the drawings of the utility model are only simple schematic illustrations, not the depiction of actual size, and the prior declaration is made. The following embodiments will further illustrate the related technical content of the utility model in detail, but the disclosed content is not used to limit the protection scope of the utility model.

[0028] It should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items.

[0029] Please refer to Figures 1-4 A high-torque anti-overflow tin SMT patch nut for connecting with a substrate 100 is provided in the embodiment, wherein the substrate 100 has a first surface and a second surface arranged oppositely, the substrate 100 includes a through hole 101 having a first hole diameter, and the first surface of the substrate 100 is coated with a tin paste 200 that can flow after being heated at the through hole 101. The high-torque anti-overflow tin SMT patch nut includes:

[0030] A flange part 1, the radial dimension of the flange part 1 is greater than the first hole diameter, and the flange part 1 is used to be attached to the first surface of the substrate 100;

[0031] A handle part 2, the handle part 2 is coaxially connected with the flange part 1, the handle part 2 is used to be arranged in the through hole 101, the radial dimension of the handle part 2 matches the first hole diameter, and the outer wall of the handle part 2 has a gap with the inner wall of the through hole 101;

[0032] The handle 2 further comprises a petal portion 3 at the end away from the flange portion 1, the petal portion 3 is coaxially connected with the handle 2, the petal portion 3 is arranged in the through hole 101, and the tooth groove 31 of the petal portion 3 is used to accommodate the tin paste 200 that may overflow from the gap side.

[0033] Through the above structure, during installation, the operator only needs to coat the tin paste 200 on the surface of the substrate 100, specifically, the coating position is mainly on the first surface of the substrate 100 near the through hole 101 of the mounting position of the SMT patch nut, then the petal portion 3 of the SMT patch nut is inserted into the through hole 101 along the axial direction towards the through hole 101 of the substrate 100, and the handle 2 and the petal portion 3 are completely inserted into the through hole 101, and the flange portion 1 abuts against the first surface of the substrate 100 coated with the tin paste 200, then the heating operation is performed on the whole, as shown in Figure 1 The tin paste 200 at the first surface of the substrate 100 melts and flows into the gap between the handle 2 and the through hole 101, and the gap between the handle 2 and the through hole 101 is filled with the flowing tin paste 200, then in this embodiment, the tin paste 200 continues to flow and flows from the gap position between the handle 2 and the through hole 101 to the petal portion 3, so that the concave tooth groove 31 in the petal portion 3 is filled with the tin paste 200, until the tin paste 200 condenses, and finally the fixation between the substrate 100 and the SMT patch nut is realized. In the secondary reflow soldering operation, the substrate 100 is turned over and continues to be heated, so that the tin paste 200 further flows in the direction of the petal portion 3 in the molten state, and more tin paste 200 is filled in the tooth groove 31.

[0034] In the above embodiment, due to the presence of the petal portion 3, more space for accommodating the tin paste 200 that may overflow from the gap side is formed in the plurality of tooth grooves 31 of the petal portion 3 which are radially concave, therefore, a large amount of tin paste 200 will flow into the tooth groove 31 under capillary action, and will not further flow into the second surface of the substrate 100 from the petal portion 3, thus avoiding the phenomenon that a large amount of tin paste 200 flows from the handle 2 through the SMT patch nut to form a gap drop and pollute the substrate 100, as shown in Figure 3

[0035] At the same time, while preventing the tin paste 200 from flowing out and causing pollution, due to the fact that a large amount of tin paste 200 is filled in the tooth groove 31 of the petal portion 3, the anti-torsion performance between the SMT patch nut and the substrate 100 is better, further avoiding the SMT patch nut from falling off the substrate 100, and having high fixing strength. Specifically, that is to say, as shown in Figure 3 ​The structure without the tooth portion 3 is shown, and because the surface of the shank portion 2 is smooth, a large torsional resistance between the through hole 101 of the substrate 100 cannot be formed, and the large amount of solidified tin paste 200 in the embodiment is actually clamped between the tooth grooves 31 of the plurality of tooth portions 3, and the inner wall of the tooth gives the tooth portion 3 a large resistance to rotation.

[0036] Further, as shown in the tooth portion 3, Figure 4 The radial dimension of the tooth top 32 of the tooth portion 3 is the same as the radial dimension of the shank portion 2. Through the above structure, the tooth edges of the tooth portion 3 are parallel to the outer wall of the shank portion 2, so that the SMT patch nut production process in the embodiment is simpler, and only the tooth grooves 31, tooth tops 32 and other structures need to be cut, and at the same time, a stable tin paste 200 flow trajectory can be formed, and the fixing stability is better.

[0037] Further, the tooth groove 31 of the tooth portion 3 has a small enough radial depth, so that the tin paste 200 is arranged in the tooth groove 31 of the tooth portion 3. Through the above structure, in the process of tin paste 200 flowing, the tin paste 200 can always be in contact with the inner wall of the through hole 101 on one side and the tooth portion 3 on the other side by means of capillary effect, avoiding forming a hollow towards the tooth portion 3, and affecting the accommodation effect of the tin paste 200 by the tooth portion 3.

[0038] Further, as shown in the tooth portion 3, Figure 4 The SMT patch nut has an axially extending internal screw hole 4, and after the SMT patch nut is installed, the external component can be fixed by screwing into the SMT patch nut through the threaded rod on the external component.

[0039] The above disclosure is only a preferred and feasible embodiment of the present application, and does not limit the patent application range of the present application, so any equivalent technical changes made by referring to the content of the present application and drawings are included in the patent application range of the present application.

[0040] Each embodiment in the specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment mainly describes the difference from other embodiments.

[0041] Although the present application is described by the embodiments, those skilled in the art know that the present application has many modifications and changes without departing from the spirit of the present application, and it is hoped that the attached embodiments include these modifications and changes without departing from the present application.

Claims

1. A high torque, anti-overflow solder SMT paster nut for connection to a substrate, wherein, The substrate has a first surface and a second surface disposed opposite to each other, the substrate includes a through hole having a first hole diameter, the first surface of the substrate is coated with a solder paste flowable upon heating at the through hole, and the SMT paster nut with high torque and anti-overflow tin includes: a flange portion having a radial dimension greater than the first hole diameter, the flange portion is configured to be attached to the first surface of the substrate; a shank portion coaxially connected to the flange portion, the shank portion is configured to be disposed in the through hole, the shank portion has a radial dimension matching the first hole diameter, and a gap is formed between an outer wall of the shank portion and an inner wall of the through hole; wherein an end of the shank portion away from the flange portion further includes a petal portion coaxially connected to the shank portion, the petal portion is configured to be disposed in the through hole, and a tooth groove of the petal portion is configured to accommodate the solder paste possibly overflowing from the gap.

2. The high torque, spill-proof solder paste SMT paster nut of claim 1, wherein: A radial dimension of a tooth top of the petal portion is the same as a radial dimension of the shank portion.

3. The high torque, spill-proof solder paste SMT paster nut of claim 1, wherein: The petal portion has an axial thickness deep enough to prevent the solder paste from escaping from the tooth groove of the petal portion to the second surface of the substrate.

4. The high torque, spill-proof solder paste SMT paster nut of claim 1, wherein: The tooth groove of the petal portion has a radial depth small enough to allow the solder paste to be disposed in the tooth groove of the petal portion.

5. The high torque, spill-proof solder paste SMT paster nut of claim 1, wherein: The SMT paster nut has an axially extending internal screw hole.

6. A connection piece, characterized in that The connector includes the SMT paster nut and the substrate as claimed in claims 1-5, and the SMT paster nut and the substrate are connected through the solder paste, and at least part of the solder paste is filled in the tooth groove of the petal portion of the SMT paster nut.

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