Ellipsoidal LED light source, backlight module and electronic equipment

Abstract

The utility model relates to the technical field of LED light sources, and provides an ellipsoid LED light source, a backlight module and electronic equipment, the ellipsoid LED light source comprises a substrate, a plurality of light-emitting chips and a transparent shell, the substrate is provided with a light-emitting circuit, and all the light-emitting chips are arranged on the substrate according to corresponding light scattering angles and electrically connected with the light-emitting circuit; the transparent shell is a semi-ellipsoid shell manufactured through an injection molding process, and the semi-ellipsoid shell is connected with the substrate and covers the light-emitting chip. The light emitted by the light-emitting chips diffuses and controls the light-emitting angle through the transparent shell, reasonable arrangement of the light-emitting chips is achieved, the requirement for the light-emitting chips is reduced under the same illumination condition, and control over the cost of the LED light source is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED light source, more particularly to an ellipsoidal LED light source, a backlight module and an electronic device. BACKGROUND

[0002] Under the background of rapid development of semiconductor lighting technology, LED light source is increasingly widely used as an advanced backlight source, involving many fields such as daily lighting, display screen technology and automobile industry.

[0003] When the LED light source is used as a backlight source, due to the high cost of the light-emitting chip, the strategy of using multiple chips to meet the requirements of high brightness and uniformity directly leads to a significant increase in the total cost. The root cause of this problem lies in the complex production process of the light-emitting chip, which involves high-purity materials, precision manufacturing technology and strict quality control, all of which have pushed up the production cost of a single chip. With the continuous improvement of the requirements of backlight on brightness, color consistency and energy efficiency, it has become a common practice to integrate multiple light-emitting chips, but this also means that cost control has become an important bottleneck restricting its widespread application.

[0004] Therefore, the prior art still needs to be improved and developed. CONTENT OF THE INVENTION

[0005] The purpose of the present application is to provide an ellipsoidal LED light source, a backlight module and an electronic device to solve the technical problem of high cost of LED light source in the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present application is to provide an ellipsoidal LED light source, comprising:

[0007] a substrate, the substrate being provided with a light-emitting circuit;

[0008] a plurality of light-emitting chips, the plurality of light-emitting chips being arranged on the substrate according to corresponding light scattering angles and being electrically connected to the light-emitting circuit;

[0009] a transparent shell, the transparent shell being a semi-ellipsoidal shell, the semi-ellipsoidal shell being connected to the substrate and covering the light-emitting chips.

[0010] Further, the substrate further comprises a light-guiding groove, so that the light-emitting chips are arranged inside the light-guiding groove.

[0011] Further, the light-guiding groove comprises a quadrangular prism, and the four sides of the quadrangular prism are inverted trapezoids.

[0012] Further, the shape of the light-guiding groove comprises an inverted semi-ellipsoidal groove, and the long axis and the short axis of the inverted semi-ellipsoidal groove are equal to the length of the transparent shell.

[0013] Further, a light-reflecting layer is attached to the light-guiding groove.

[0014] Further, the uniform light plate is arranged outside the transparent shell and is spaced apart from the transparent shell by a preset distance.

[0015] Further, the transparent adhesive layer is arranged between the light emitting chip and the transparent shell.

[0016] Further, the transparent adhesive layer has a refractive index greater than that of the transparent shell.

[0017] According to the second aspect of the embodiments of the present disclosure, a backlight module is also provided, which comprises the LED light source of the above technical solution.

[0018] According to the second aspect of the embodiments of the present disclosure, an electronic device is also provided, which comprises the backlight module of the above technical solution.

[0019] The ellipsoidal LED light source provided by the present application has at least the following beneficial effects: the ellipsoidal LED light source comprises a substrate, a plurality of light emitting chips, and a transparent shell, wherein the substrate is provided with a light emitting circuit; all the light emitting chips are arranged on the substrate according to corresponding light scattering angles and are electrically connected to the light emitting circuit; and the transparent shell is a semi-ellipsoidal shell made by injection molding process, which is connected to the substrate and covers the light emitting chips.

[0020] By arranging the plurality of light emitting chips according to the light scattering angles of the semi-ellipsoidal shell, the natural curved surface characteristics of the semi-ellipsoidal shell are utilized to enhance the light emission, the light generated by the light emitting chips is fully utilized, the light extraction efficiency is improved, the dependence on the number of chips is reduced, and the raw material cost and the assembly cost are directly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0022] Figure 1 A structure schematic view of the ellipsoidal LED light source provided by the embodiments of the present application when placed horizontally;

[0023] Figure 2 A top view of the ellipsoidal LED light source provided by the embodiments of the present application when placed horizontally.

[0024] Figure 3 A side view of the ellipsoidal LED light source provided by the embodiments of the present application when placed horizontally.

[0025] 101, substrate;

[0026] 102. light emitting chip;

[0027] 103. transparent shell;

[0028] 104. transparent glue layer;

[0029] 105. light homogenizing plate;

[0030] 106. light reflecting layer;

[0031] 107. light guiding groove. DETAILED DESCRIPTION

[0032] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0033] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for the convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0034] The ellipsoidal LED light source of the embodiments of the present application will be described below in combination with the drawings.

[0035] Please refer to Figure 1 , Figure 1 The structure schematic diagram of the ellipsoidal LED light source of the present application is shown.

[0036] The ellipsoidal LED light source comprises: a substrate 101, the substrate 101 is provided with a light emitting circuit; a plurality of light emitting chips 102, the plurality of light emitting chips 102 are arranged on the substrate 101 according to corresponding light scattering angles and are electrically connected with the light emitting circuit; a transparent shell, the transparent shell is a half-ellipsoidal shell made by injection molding process, the half-ellipsoidal shell is connected with the substrate 101 and covers the light emitting chips 102.

[0037] The substrate 101 plays a role of bearing the light-emitting chip 102 and various electronic components, not only providing necessary physical support for these elements, but also building an installation infrastructure to ensure that all components can be stably assembled and integrated. The light-emitting circuit is a key electronic system inside the LED light source, responsible for activating the light-emitting chip 102 and adjusting its operation mode. The light-emitting chip 102 is inside a transparent shell 103, which is a semi-ellipsoidal shell made by injection molding process. The injection molding process realizes strict control and accurate calculation of the light diffusion angle based on its high precision, and based on the management of the light diffusion angle, the position of each light-emitting chip can be accurately determined, thereby optimizing the cost control of the LED light source.

[0038] Specifically, the transparent shell 103 is a semi-ellipsoidal shell made by injection molding process. Since the semi-ellipsoidal shell can make the light reflected by the light-emitting chip 102 scattered along the long axis of the semi-ellipsoidal shell in three-dimensional space, the uniform specification of the injection shell can accurately control the light emitted by the light-emitting chip 102, so that when the LED light source is fixed at the preset position, the light spots generated by the lamp beads formed by each light-emitting chip 102 and the transparent lens are consistent, thereby completing the arrangement of the light-emitting chip 102 based on the highly consistent light spots, and achieving the purpose of reducing the use of light-emitting chips 102.

[0039] The light rays emitted from the light-emitting chip 102 pass through the transparent shell 103. Since the transparent shell 103 is a semi-elliptical shell with different curvatures of the long axis and the short axis, the long axis of the semi-elliptical lens has a relatively gentle curvature, which makes the light rays emitted from the light-emitting chip 102 widely dispersed after refraction, thereby expanding the illumination or backlight area in the long axis direction. The curvature of the short axis is relatively steep, which limits the scattering range of the light rays in the short axis direction and helps to maintain the concentration of light energy in the vertical or horizontal direction, avoiding excessive divergence of light energy, thereby maintaining the spot width while achieving the required illumination intensity in the vertical direction and ensuring the uniformity of the spot. Due to the asymmetric curvature design of the long axis and the short axis, the light rays can form a wide and deep spot distribution in three-dimensional space after refraction inside the transparent lens, which expands the spot in the horizontal plane and extends it appropriately in the vertical direction, achieving efficient use of space. In addition, since the transparent shell 103 is made by injection molding process, the injection molding process can mass-produce high-precision, uniform-specification transparent shells 103, ensuring the consistency of each product. Based on the standardized production of the injection molding process, the spot control of the LED light source is completed. When the optical properties of each lens are highly consistent, by accurately controlling the relative position and angle of each light-emitting chip 102 and the lens, the position, shape, and brightness of the spot emitted by each lamp bead in space can be highly consistent. Based on the highly consistent spot, the positions and quantities of the light-emitting chips 102 are arranged according to the illumination range of the spot. Through simulation and calculation, the optimal LED layout scheme can be found, which can reduce the use of light-emitting chips 102 as much as possible while ensuring the overall brightness and uniformity of the backlight source, thereby directly reducing the material cost, and reducing the energy consumption and heat dissipation burden of the system, and reducing the overall cost of the LED light source.

[0040] The substrate 101 serves as a carrier for the light emitting chip 102 and other electronic components, provides necessary physical support and mounting interface for the components, and also bears the function of heat dissipation for the electronic components, thereby achieving the heat management function of the LED light source. In some embodiments, the substrate 101 further comprises reinforcing ribs, wherein the reinforcing rib structure includes rectangular, T-shaped, L-shaped and I-shaped, the reinforcing ribs are attached to the outer surface of the substrate 101, and the reinforcing ribs are used to improve the mechanical strength and stability of the substrate 101, so that the LED light source can reduce deformation when subjected to a larger external force or thermal expansion, thereby protecting the electronic components from damage. Specifically, the cross section of the rectangular reinforcing rib is rectangular, which can improve the bearing capacity by increasing the cross-sectional area of the structure, and can effectively prevent the structure from twisting and deforming when the LED light source is subjected to bending load; the cross section of the T-shaped reinforcing rib is similar to the letter "T", the T-shaped reinforcing rib is composed of a horizontal plate and a vertical plate, thereby providing strong support in the vertical direction, and the horizontal plate can also disperse the load, thereby further increasing the stability of the structure; the cross section of the L-shaped reinforcing rib is similar to the letter "L", which is composed of two mutually perpendicular parts, thereby increasing the rigidity of the edge without increasing the thickness too much, thereby effectively increasing the lateral and longitudinal strength of the structure, while reducing the amount of material used; the I-shaped design combines wide flanges with narrow webs, such a structural layout makes the reinforcing rib exhibit excellent strength and rigidity when subjected to compression, tension and bending load, the wide flanges provide a larger cross-sectional area, thereby enhancing the resistance to bending, and the web can effectively transfer shear force even if it is relatively thin.

[0041] In addition, the arrangement of the reinforcing ribs on the substrate 101 includes a grid and a honeycomb; specifically, the grid arrangement refers to the reinforcing ribs arranged according to a regular rectangular or square grid, maintaining a certain distance between each reinforcing rib, which can evenly distribute the load, reduce local stress concentration, and improve the stability and bending resistance of the overall structure. The specific size and size are adjusted according to the actual needs to achieve the best strength and weight balance, and this embodiment does not make any restrictions. The honeycomb arrangement simulates the hexagonal structure of the honeycomb in nature, and the reinforcing ribs are arranged in the form of a hexagonal grid. The hexagonal structure provides the maximum number of cells within a given surface area, and can achieve similar or better strength and stability with less material. The honeycomb structure has high stiffness in all directions, and has significantly improved bending, compression and torsion resistance, thereby providing the best lightweight and strength balance. In addition, the mounting method of the reinforcing ribs on the substrate 101 includes integrated molding and adhesion. Integrated molding refers to the reinforcing ribs and the substrate 101 being formed simultaneously during the manufacturing process to become an indivisible whole, and the reinforcing ribs and the substrate 101 are made of the same or compatible materials to form a continuous physical structure. The adhesion method is to fix the pre-made reinforcing ribs on the substrate 101 through adhesive, allowing the reinforcing ribs and the substrate 101 to be different in material, providing more design flexibility; the reinforcing ribs can be designed and produced separately according to needs, and then adjusted in position or increased or decreased according to actual conditions, facilitating later modification. The reinforcing ribs can be made of better materials than the substrate 101, such as higher strength or better thermal conductivity, to meet specific performance requirements. The mounting method of the reinforcing ribs on the substrate 101 can be selected according to the structure of the reinforcing ribs, and this embodiment does not make any restrictions, for example, when the structure of the reinforcing ribs is rectangular, the structure is relatively simple, and therefore the substrate 101 as an integrated molding can ensure that the rectangular reinforcing ribs are tightly combined with the substrate 101 to improve the overall rigidity and durability.

[0042] Further, the substrate 101 further comprises a heat dissipation channel, wherein the heat dissipation channel comprises a pre-set shape groove and a heat pipe; wherein the pre-set shape groove can be a through groove structure with a rectangular cross section, by providing a path or channel, the hot air or fluid can effectively take away the heat generated by the LED light source, preventing the light emitting chip 102 from being damaged due to overheating. The light emitting chip 102 is mainly composed of a semiconductor material which is extremely sensitive to temperature changes. As the working temperature rises, the proliferation and diffusion of internal defects in the material may intensify. These defects invading the light emitting area will promote the formation of non-radiative recombination centers, directly weakening the light emitting efficiency of the LED light source. In addition, as the temperature rises, the light output of the light emitting chip 102 will often decrease accordingly, causing light decay. The root cause of this phenomenon is that high temperature promotes the increase of non-radiative recombination probability, and more energy is converted into heat energy rather than the desired light energy. Long-term light decay will significantly reduce the effective service life of the LED light source, i.e. the continuous use time before reaching a certain brightness attenuation standard. Therefore, the additional heat dissipation channel can immediately dissipate the heat generated by the light emitting chip 102, effectively control the temperature rise of the light emitting chip 102, and prolong the service life of the chip, thereby indirectly reducing the maintenance cost of the LED light source. When a heat pipe is used as a heat dissipation channel, the heat pipe can also serve as a reinforcing rib of the substrate 101, combining the functions of heat dissipation performance improvement and structural strength enhancement. The light emitting circuit is an electronic circuit system responsible for driving the light emitting chip 102 to emit light and controlling its working state in the LED light source.

[0043] According to the technical scheme provided by the embodiment of the present application, the ellipsoidal LED light source comprises a substrate 101, a plurality of light emitting chips 102 and a transparent lens, wherein the substrate 101 is provided with a light emitting circuit, all the light emitting chips 102 are arranged on the substrate 101 according to the corresponding light scattering angle and are electrically connected with the light emitting circuit, and the transparent shell 103 is a semi-ellipsoidal shell made by injection molding process, and the transparent shell 103 is connected with the substrate 101 and covers the light emitting chip 102. Through the precise regulation and control of the semi-ellipsoidal transparent shell 103 on the light emitted by the light emitting chip 102, the diffusion angle of the light in the long axis direction of the semi-ellipsoidal transparent shell 103 is increased, and at the same time, the light spots generated by each light emitting chip 102 at a predetermined distance are ensured to be consistent. With the consistency of the light spots, the layout design of the chips is optimized, thereby effectively reducing the number of light emitting chips 102 used and realizing effective control of the cost of the LED light source.

[0044] In some embodiments, the substrate 101 of the ellipsoidal LED light source further comprises a light guide groove 106, so that the light emitting chip 102 is arranged inside the light guide groove 106.

[0045] Specifically, the light guide groove 106 can serve as a transition area between the chip and the external lens or housing, facilitating more efficient transmission of light energy from the chip to the outside world. The geometry of the groove helps to preliminarily diffuse or guide the light before it enters the lens, reducing light reflection or loss at the interface, improving light coupling efficiency, and increasing the diffusion range of the light. This reduces the use of light-emitting chips 102 while maintaining the same lighting effect, directly reducing the dependence of LED light sources on light-emitting chips 102 and the corresponding cost.

[0046] Further, the light guide groove 106 includes a quadrangular frustum-shaped groove, and the side quadrilateral of the quadrangular frustum-shaped groove is an inverted trapezoid.

[0047] Light rays emitted from the light-emitting chip 102 will be reflected according to the bevel of the light guide groove 106 after passing through the side wall of the light guide groove 106, as the light-emitting chip 102 is in the light guide groove 106. The bevel design of the light guide groove 106 side wall greatly improves the propagation path of the light, ensuring more accurate and flexible control of the angle at which the light is emitted from the transparent housing 103. This improves the adaptability of the design, thereby widening the coverage of the illumination. The high-precision characteristics of the injection molding process enable the semi-ellipsoidal transparent housing 103 to be accurately shaped, working in synergy with the precisely designed light guide groove 106 structure to not only optimize the light gathering and diffusion process but also ensure strict regulation of the spot size and shape, preventing unnecessary loss of light energy and improving the efficiency of the illumination. Therefore, the light output of each light-emitting chip 102 is more fully utilized, reducing light overlap and loss while achieving the desired lighting effect. Through careful calculation and layout arrangement, the number of necessary light-emitting chips 102 is reduced, fundamentally reducing costs and reducing the total amount of material consumption and energy use.

[0048] According to the technical solutions provided in the present application, the light guide groove 106 adopts a quadrangular frustum design, with its sides forming an inverted trapezoid. The light rays of the light-emitting chip 102 are reflected by the inverted trapezoidal bevel of the quadrangular frustum side wall, effectively improving the angle at which the light rays are emitted from the transparent lens while reducing the number of necessary light-emitting chips 102, thereby achieving the purpose of controlling the cost of LED light sources.

[0049] In addition, in some embodiments, the light guide groove shape includes an inverted semi-ellipsoidal groove, and the major axis and minor axis of the inverted semi-ellipsoidal groove are equal to the length of the transparent housing 103.

[0050] Specifically, the inverted semi-ellipsoidal groove can more naturally realize light diffusion, and according to the curved surface structure, the light emitted by the light-emitting chip 102 can be more uniformly dispersed to a wider area, ensuring that the light contribution of each light-emitting point is balanced. Therefore, under the premise of meeting the same illumination standard, it is not necessary to rely on increasing the light-emitting chip 102 to enhance the overall light output, thereby reducing the dependence on the light-emitting chip 102. At the same time, the inverted semi-ellipsoidal groove design also reduces the use of the light-emitting chip 102 while ensuring the uniformity of the illumination area and eliminating the sharp contrast between high-intensity illumination and shadow areas.

[0051] The major axis and minor axis of the groove are matched with the transparent shell 103, so that the light guide groove 106 and the external lens together constitute a coherent and coordinated optical system. The transition process of the light from the light guide plate to the shell maintains the continuity of the light path and the transmission efficiency, effectively reduces the loss of light, and further improves the illumination effect. In addition, the precise matching of the size simplifies the manufacturing process, ensures the accurate installation of the light guide plate and the shell, reduces the assembly difficulty, speeds up the production speed, controls the manufacturing cost, and maintains the consistency of product quality.

[0052] According to the technical scheme provided in the present application, the light guide groove shape includes an inverted semi-ellipsoidal groove, and the major axis and minor axis of the inverted semi-ellipsoidal groove are equal to the length of the transparent shell 103. By scattering the light emitted by the light-emitting chip 102 through the inverted semi-ellipsoidal groove, the light experiences multiple reflections and refractions inside the transparent shell 103, thereby realizing uniform diffusion of the light. This expands the angle at which the light emitted by the light-emitting chip 102 passes through the transparent shell 103 and disperses outward, and reduces the dependence on the light-emitting chip 102 while maintaining the same illumination intensity requirement, thereby effectively reducing the manufacturing cost of the LED light source.

[0053] In addition, in some embodiments, a reflective layer 106 is attached to the light guide groove 106 of the ellipsoidal LED light source.

[0054] Specifically, the reflective layer 106 includes a metal reflective film, a full-dielectric reflective film, and a metal-dielectric composite reflective film, which are used to improve the efficiency of light reflection and ensure that the light is maximally utilized and directed in the intended direction. Based on the high reflectivity of metals, the metal reflective film directly uses metal materials such as aluminum, silver, copper, gold, chromium, or platinum to effectively reflect the light emitted by the light-emitting chip 102. The full-dielectric reflective film is a structure composed of multiple layers of dielectric materials with different refractive indices, which utilizes the interference effect of light to achieve extremely high reflectivity. The metal-dielectric composite reflective film is composed of multiple layers of metal and dielectric layers, which not only has the high reflectivity of the metal layer but also reduces absorption loss by using the dielectric layer, thereby enhancing the reflectivity and widening the reflection spectrum range.

[0055] According to the technical scheme provided by the embodiment of the present application, the light guide groove 106 of the ellipsoidal LED light source is attached with a reflective layer 106, and the light emitted by the light emitting chip 102 is reflected by the reflective layer 106, thereby reducing the light loss at the interface of the substrate 101, and further enabling the transparent lens to further diffuse the exit angle of the light, thereby reducing the demand for the light emitting chip 102 under the same lighting conditions, effectively improving the utilization rate of light and reducing light loss, and thereby reducing the manufacturing cost of the LED light source.

[0056] In some embodiments, the ellipsoidal LED light source further comprises a light homogenizing plate 105, and the light homogenizing plate 105 is arranged outside the transparent shell 103 and is spaced apart from the transparent shell 103 by a preset distance.

[0057] Specifically, the light homogenizing plate 105 refers to a light homogenizing plate based on light guide technology, which utilizes light scattering effect to uniformly distribute light. The light homogenizing plate 105 is uniformly dispersed with nano-level scattering particles inside, which can effectively scatter the incident light multiple times. When the light passes through the light homogenizing plate 105, it will be repeatedly refracted and reflected by the nano particles, thereby reducing light absorption and loss, and making the light randomly propagate in the plate surface and finally uniformly scattered from the entire plate surface to form a surface light source. The light is effectively utilized, the energy loss is reduced, the lighting effect is improved, the light source that may have produced a light spot or a dark area is converted into a uniform and soft light, the visual comfort is improved, and in addition, the light homogenizing plate 105 can be cut into different sizes and shapes according to actual application requirements, and is easy to process and install. The preset distance is set according to actual conditions, and the volume of the ellipsoidal LED light source and the number of corresponding light emitting chips 102 are considered, and the present embodiment does not make any limitation on this.

[0058] According to the technical scheme provided by the embodiment of the present application, the light homogenizing plate 105 realizes effective management and uniform distribution of light, thereby reducing the dependence on the light emitting chip 102 based on the uniformity of light emission, thereby reducing the manufacturing cost of the ellipsoidal LED light source,

[0059] In some embodiments, the ellipsoidal LED light source further comprises a transparent adhesive layer 104, and the transparent adhesive layer 104 is arranged between the light emitting chip 102 and the transparent shell 103.

[0060] The encapsulation layer of the LED light source is made of a transparent adhesive material. The transparent adhesive layer 104 refers to the filling layer between the substrate 101 made of transparent adhesive material and the transparent shell 103. The transparent adhesive layer 104 has excellent elasticity and toughness, and can effectively cope with mechanical stress and external force. When subjected to external force, the transparent adhesive layer 104 can deform and absorb and disperse energy, thereby significantly reducing or preventing the external force from being directly transmitted to the light emitting chip 102, and thereby reducing the risk of damage to the light source due to physical impact or vibration. The transparent adhesive layer 104 can be completed by a dispensing process. After curing, the transparent adhesive layer 104 not only strengthens the connection between the light emitting chip 102 and the substrate 101, but also fixes the position of the transparent shell 103 on the substrate 101, thereby reducing the possibility of displacement or falling of the transparent shell 103.

[0061] In addition, in some embodiments, the refractive index of the transparent adhesive layer 104 is equal to the refractive index of the transparent shell 103.

[0062] Specifically, when the refractive index of the transparent adhesive layer 104 is consistent with that of the transparent lens, by reducing the reflection and refraction phenomena when light propagates between different media, the light loss at the interface between the transparent adhesive layer 104 and the transparent shell 103 is reduced, and more light directly transmits through the shell rather than repeatedly reflecting between the interfaces of the layers, thereby improving the light extraction efficiency and reducing the dependence on high-power light emitting chips 102 and the cost of the ellipsoidal LED light source.

[0063] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An ellipsoidal LED light source, characterized by The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source.

2. The ellipsoidal LED light source of claim 1, wherein, The application relates to an ellipsoid LED light source.

3. The ellipsoidal LED light source of claim 2, wherein, The application relates to an ellipsoid LED light source.

4. The spheroidal LED light source of claim 2, wherein, The application relates to an ellipsoid LED light source.

5. The spheroidal LED light source of claim 2, wherein, The application relates to an ellipsoid LED light source.

6. The spheroidal LED light source of claim 1, wherein, The application relates to an ellipsoid LED light source.

7. The spheroidal LED light source of claim 1, wherein, The application relates to an ellipsoid LED light source.

8. The ellipsoidal LED light source of claim 7, wherein, The application relates to an ellipsoid LED light source.

9. A backlight module, characterized in that, The application relates to an ellipsoid LED light source.

10. An electronic device, comprising: The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to an ellipsoid LED light source. The application relates to

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