Wafer clamping and spin-drying mechanism

By controlling the expansion or contraction of the cladding pins of the rotary table and fixing them with the fixing pins through the eccentric shaft, the problem of unstable wafer drying in the prior art is solved, and efficient wafer fixing and drying are achieved.

CN223678159UActive Publication Date: 2025-12-16辰轩半导体设备(江苏)有限公司
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Patent Information

Application Number
CN202422840456.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-21
Publication Date
2025-12-16
Estimated Expiration
2034-11-21

AI Technical Summary

Technical Problem

Existing wafer spin-drying mechanisms cannot securely clamp and fix the wafers, causing them to easily fly out or be damaged during spin-drying.

Method used

By setting an eccentric shaft to drive multiple locking pins on the top of the rotary table to expand or contract synchronously, the outer edge of the wafer is locked in place by the locking grooves on the inner side of the locking pins, and the rotary table is fixed by fixing pins, so that the wafer is firmly clamped and then rotated and spun dry.

Benefits of technology

This improved the stability of the wafers and enabled an efficient spin-drying process, preventing the wafers from flying out or being damaged.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer clamping and spin-drying mechanism. The wafer clamping and spin-drying mechanism comprises a mounting rack and a rotating table arranged at the top of the mounting rack, a plurality of clamping columns are evenly distributed on the top of the rotating table in the circumferential direction, clamping grooves are formed in the inner sides of the clamping columns, and wafers are arranged in the clamping grooves. A power assembly is connected to the bottom of the rotating table in a matched mode and used for controlling the rotating table to rotate. The clamping columns are connected with eccentric shafts in a matched mode, one sides of the eccentric shafts are connected with clamping motors in a matched mode, and the clamping motors are used for controlling the multiple clamping columns to expand or contract synchronously. An eccentric shaft is arranged to drive a plurality of clamping columns at the top of a rotating table to simultaneously contract or expand inwards, when the eccentric shaft contracts, the outer edge of a wafer is clamped through clamping grooves in the inner sides of the clamping columns, when the eccentric shaft is controlled to rotate, the rotating table is fixed through a fixing pin, the rotating table cannot rotate at the moment, and after the wafer is firmly fixed, the fixing pin descends, so that the wafer is fixed. And the rotating table is controlled to rotate and spin-dry, so that high-efficiency spin-drying is realized while the wafer fixing firmness is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer spin-drying technical field, more specifically, relate to a wafer clamping spin-drying mechanism. BACKGROUND

[0002] Wafer cleaning is completed, need to carry out spin-drying operation to wafer, the existing wafer spin-drying mechanism cannot firmly clamp and fix wafer, when wafer rotates and spins, cannot realize quick spin-drying, and wafer is easily thrown out or damaged wafer. SUMMARY

[0003] In order to solve the above at least one technical problem, the utility model provides a wafer clamping spin-drying mechanism.

[0004] The utility model discloses a wafer clamping spin-drying mechanism, including: mounting bracket and setting at the top of mounting bracket's rotating table;

[0005] The rotating table top is evenly distributed with a plurality of clamping posts in the circumferential direction, the inner side of the clamping post is provided with a clamping groove, and the clamping groove is provided with a wafer.

[0006] The bottom of the rotating table is matched with a power assembly, and the power assembly is used for controlling the rotation of the rotating table.

[0007] The clamping post is matched with an eccentric shaft, one side of the eccentric shaft is matched with a clamping motor, and the clamping motor is used for controlling the synchronous expansion or contraction of the plurality of clamping posts.

[0008] In a preferred embodiment of the utility model, the two ends of the side of the mounting bracket are symmetrically provided with adjusting cylinders, and the top of the adjusting cylinder is provided with a fixed pin.

[0009] In a preferred embodiment of the utility model, the bottom of the rotating table is provided with a fixed hole matched with the fixed pin, the adjusting cylinder is used for controlling the lifting of the fixed pin, and when the fixed pin rises, the top part of the fixed pin is inserted into the fixed hole in the bottom of the rotating table.

[0010] In a preferred embodiment of the utility model, the bottom of the rotating table is provided with a rotating shaft, and the eccentric shaft is arranged at the bottom of the rotating shaft.

[0011] In a preferred embodiment of the utility model, the utility model further includes a power platform, the power platform is arranged at the bottom of the mounting bracket, the top of one end of the power platform is provided with a power wheel, and the bottom of the power wheel is connected with a power motor.

[0012] In a preferred embodiment of the utility model, the bottom outside of the eccentric shaft is provided with a follow-up wheel, and the power wheel and the outside of the follow-up wheel are matched and connected through a synchronous belt.

[0013] In a preferred embodiment of the utility model, the mounting frame bottom is provided with a base, and the power platform is arranged between the base and the mounting frame.

[0014] Compared with the prior art, the above technical scheme of the utility model has the following advantages:

[0015] The plurality of clamping columns on the top of the rotating table are simultaneously contracted or expanded inwards by the eccentric shaft, when being contracted, the wafer outer side edge is clamped by the clamping groove on the inner side of the clamping column, when the eccentric shaft is controlled to rotate, the rotating table is fixed by the fixing pin, at this time, the rotating table cannot rotate, when the wafer is fixed firmly, the fixing pin is lowered, the rotating table is controlled to rotate and spin dry, wafer fixing firmness is improved, and high-efficiency spin drying is realized. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the specific embodiment of the utility model or the prior art, the drawings needed to be used in the specific embodiment or the prior art description will be briefly introduced as follows, obviously, some drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0017] Fig. 1 It is a three-dimensional structure schematic diagram of the wafer clamping spin-drying mechanism of the embodiment of the utility model;

[0018] Fig. 2 It is another angle schematic diagram of the wafer clamping spin-drying mechanism of the embodiment of the utility model;

[0019] Fig. 3 It is a side view of the wafer clamping spin-drying mechanism of the embodiment of the utility model.

[0020] In the drawing: 1, wafer, 2, clamping column, 3, rotating table, 4, fixing pin, 5, adjusting cylinder, 6, base, 7, synchronous belt, 8, power motor, 9, power platform, 10, power wheel, 11, lifting cylinder, 12, mounting frame, 13, follow-up wheel, 14, eccentric shaft, 15, clamping motor, 16, rotating shaft. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model will be further described in detail in combination with specific embodiments. It should be noted that the embodiments of the application and the features in the embodiments can be combined with each other without conflict.

[0022] In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can be practiced in other manners different from those described herein, therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below.

[0023] Embodiment one

[0024] Referring to Figs. 1-3 The utility model discloses a wafer clamping spin-drying mechanism, including: mounting bracket 12 and setting at the top of mounting bracket 12's rotating table 3,

[0025] Rotating table 3 top along the circumferential uniformity has a plurality of clamping posts 2, and the inside of clamping post 2 is provided with a clamping groove, and the wafer 1 is arranged in the clamping groove.

[0026] Rotating table 3 bottom is matched and is connected with power assembly, and the power assembly is used for controlling rotating table 3 rotation.

[0027] Clamping post 2 is matched and is connected with eccentric shaft 14, and one side of eccentric shaft 14 is matched and is connected with servo motor 15, and servo motor 15 is used for controlling the synchronous expansion or contraction of a plurality of clamping posts 2.

[0028] According to the utility model embodiment, the both ends of one side of mounting bracket 12 are symmetrically provided with adjusting cylinder 5, and the top of adjusting cylinder 5 is provided with fixed pin 4.

[0029] According to the utility model embodiment, the bottom of rotating table 3 is provided with fixed hole matched with fixed pin 4, and adjusting cylinder 5 is used for controlling the lifting of fixed pin 4, when fixed pin 4 rises, the top part of fixed pin 4 is inserted into the fixed hole in the bottom of rotating table 3.

[0030] According to the utility model embodiment, the bottom of rotating table 3 is provided with rotating shaft 16, and eccentric shaft 14 is arranged at the bottom of rotating shaft 16.

[0031] According to the utility model embodiment, still include power platform 9, and power platform 9 is set up at the bottom of mounting bracket 12, and the top of one end of power platform 9 is provided with power wheel 10, and the bottom of power wheel 10 is connected with power motor 8.

[0032] According to the utility model embodiment, the outside of the bottom of eccentric shaft 14 is provided with follow-up wheel 13, and power wheel 10 and the outside of follow-up wheel 13 are matched and connected through synchronous belt 7.

[0033] According to the utility model embodiment, the bottom of mounting bracket 12 is provided with base 6, and power platform 9 is arranged between base 6 and mounting bracket 12.

[0034] According to the embodiment of the present application, the lifting cylinder 11 is fixedly installed on one side of the mounting frame 12, one end of the lifting cylinder 11 is connected to the adjusting cylinder 5 in a matching mode, and the lifting cylinder 11 controls the lifting of the adjusting cylinder 5.

[0035] In summary, the application is provided with the eccentric shaft 14 to drive the multiple clamping columns 2 on the top of the rotating table 3 to simultaneously contract or expand inwardly, when the clamping columns 2 contract, the wafer 1 is clamped by the clamping grooves on the inner sides of the clamping columns 2, when the eccentric shaft 14 rotates, the rotating table 3 is fixed by the fixing pin 4, at this time, the rotating table 3 cannot rotate, when the wafer 1 is fixed firmly, the fixing pin 4 is lowered, and the rotating table 3 is rotated to spin dry, which improves the firmness of the wafer 1 and realizes high-efficiency spin dry.

[0036] The technical features of the above embodiments can be combined in any manner, and to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0037] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to the above embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application should not be limited to the above-described embodiments shown herein, but should be consistent with the widest scope of principles and novel features disclosed herein.

[0038] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer chuck and spin-dry mechanism comprising: The mounting frame and the rotating table arranged on the top of the mounting frame; characterized in that, The rotating table top is uniformly distributed with a plurality of clamping columns along the circumference, the inner side of the clamping column is provided with a clamping groove, and the clamping groove is provided with a wafer; The bottom of the rotating table is matched and connected with a power assembly, and the power assembly is used to control the rotation of the rotating table; The clamping column is matched and connected with an eccentric shaft, one side of the eccentric shaft is matched and connected with a servo motor, and the servo motor is used to control the synchronous expansion or contraction of the plurality of clamping columns.

2. A wafer chuck-spin-dry mechanism according to claim 1, wherein The two ends of one side of the mounting frame are symmetrically provided with adjusting cylinders, and the top of the adjusting cylinder is provided with a fixed pin.

3. A wafer chuck-spin-dry mechanism according to claim 2, wherein The bottom of the rotating table is provided with a fixed hole matched with the fixed pin, the adjusting cylinder is used to control the lifting of the fixed pin, and when the fixed pin rises, the top of the fixed pin is inserted into the fixed hole in the bottom of the rotating table.

4. The wafer chuck and spin-dry mechanism of claim 1 wherein, The bottom of the rotating table is provided with a rotating shaft, and the eccentric shaft is arranged at the bottom of the rotating shaft.

5. A wafer chuck-spin-dry mechanism according to claim 4, wherein Further comprising a power platform, the power platform is arranged at the bottom of the mounting frame, the top of one end of the power platform is provided with a power wheel, and the bottom of the power wheel is connected with a power motor.

6. A wafer chuck-spin-dry mechanism according to claim 5, wherein The bottom outside of the eccentric shaft is provided with a follow-up wheel, and the power wheel and the outside of the follow-up wheel are matched and connected through a synchronous belt.

7. A wafer chuck and spin-dry mechanism according to claim 5, wherein The bottom of the mounting frame is provided with a base, and the power platform is arranged between the base and the mounting frame.