Sensor and electronic device

Abstract

The utility model provides a sensor and electronic equipment. The sensor comprises a shell, an MEMS chip and an ASIC chip, wherein the MEMS chip and the ASIC chip are in signal connection; the shell comprises a substrate, a side coaming and a bottom plate which are sequentially stacked, the substrate, the side coaming and the bottom plate are sequentially connected to define a containing cavity, the MEMS chip and the ASIC chip are arranged in the containing cavity, and the ASIC chip is in signal connection with the substrate; the side surrounding plate is an elastic plate, and the side surrounding plate can elastically deform so as to change the size of the containing cavity. The sensor has the advantage of being small in size.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a sensor and an electronic device. BACKGROUND

[0002] For a sensor that needs to play a role in shock detection, the sensor vibrates by sensing external changes through a vibration component, and then the pressure in the accommodating cavity changes, and the MEMS chip can sense the pressure change, thereby playing a role in detecting external shock. However, the current sensor with shock detection function has a large size, which is difficult to meet the market demand for miniaturization.

[0003] Therefore, it is necessary to provide a new sensor and an electronic device to solve or at least alleviate the above technical defects. CONTENT OF THE INVENTION

[0004] In view of the above problems, the present application provides a sensor and an electronic device, which aims to solve the technical problem of large size of the sensor in the related art.

[0005] According to some embodiments of the present application, a sensor is provided, which comprises a shell, and a MEMS chip and an ASIC chip connected by a signal; the shell comprises a substrate, a side wall plate and a bottom plate which are sequentially stacked and connected to form an accommodating cavity, the MEMS chip and the ASIC chip are arranged in the accommodating cavity, and the ASIC chip is connected to the substrate by a signal; the side wall plate is an elastic plate, and the side wall plate can be elastically deformed to change the size of the accommodating cavity.

[0006] In some embodiments, the side wall plate can be elastically deformed in a direction perpendicular to the substrate to change the distance between the bottom plate and the substrate.

[0007] In some embodiments, a counterweight is arranged on the bottom plate.

[0008] The counterweight is arranged on one side of the bottom plate facing the accommodating cavity; or

[0009] The counterweight is arranged on one side of the bottom plate away from the accommodating cavity.

[0010] In some embodiments, an elastic bending structure is arranged on the side wall plate.

[0011] In some embodiments, the shape of the bending structure is in the form of a circular arc, and the bending structure is recessed towards the accommodating cavity.

[0012] In some embodiments, the MEMS chip is mounted on the substrate, and a recessed groove is formed on the position of the substrate facing the MEMS chip and recessed away from the accommodating cavity.

[0013] In some embodiments, the recessed groove comprises a first sub-groove and a second sub-groove in communication with each other, the first sub-groove is arranged close to the MEMS chip, and the second sub-groove is arranged in the substrate, and in a cross section parallel to the substrate, a cross-sectional area of the first sub-groove is smaller than a cross-sectional area of the second sub-groove.

[0014] In some embodiments, a through hole is arranged on the substrate, the through hole is arranged facing the MEMS chip, and an annular pad is arranged on a side of the substrate away from the accommodating cavity, the annular pad is arranged around an opening of the through hole, and the annular pad is used for welding with a circuit board of an external device.

[0015] In some embodiments, the bottom plate is a rigid plate.

[0016] In some embodiments, the side plate is made of a metal material, or the side plate is made of rubber, or the side plate is made of an elastic composite material.

[0017] In some embodiments, the side plate comprises an elastic part and first and second rigid parts arranged on two sides of the elastic part respectively, a side of the first rigid part away from the elastic part is connected with the bottom plate, and a side of the second rigid part away from the elastic part is connected with the substrate.

[0018] In some embodiments, the sensor further comprises a voice processing chip, the voice processing chip is mounted on the substrate, the ASIC chip is stacked on the voice processing chip, and the voice processing chip is connected with the substrate in signal respectively.

[0019] According to some embodiments of the present application, the present application provides an electronic device comprising the sensor of any one of the above.

[0020] The sensor of the present application detects the vibration signal by adopting a three-layer plate structure to manufacture the sensor shell, adopting an elastic material to manufacture the side plate, receiving the vibration signal by the side plate and deforming to change the volume of the accommodating cavity, and detecting the vibration signal by the change of the air pressure signal in the accommodating cavity. The embodiment replaces the material of the side plate of the sensor itself, realizes the detection function of the vibration signal, cancels the setting of the vibration component in the related technology, does not add extra components to the sensor, is conducive to reducing the volume of the sensor, and in the related technology, the MEMS chip and the vibration component are stacked, so that the cancellation of the vibration component is conducive to reducing the thickness of the sensor and realizing the small size and thin design of the sensor.

[0021] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clearly understood and implemented according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0022] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a better understanding of the preferred embodiments, and are not to be considered as limiting of the present application. Moreover, in the drawings, like reference numerals refer to similar components throughout the several views. In the drawings:

[0023] Figure 1 A structural schematic diagram of a sensor of some embodiments of the present application;

[0024] Figure 2 Another structural schematic diagram of a sensor of some embodiments of the present application;

[0025] Figure 3 Another structural schematic diagram of a sensor of some embodiments of the present application;

[0026] Figure 4 A partial structural schematic diagram of a sensor of some embodiments of the present application;

[0027] Figure 5 Another structural schematic diagram of a sensor of some embodiments of the present application;

[0028] Figure 6 Another structural schematic diagram of a sensor of some embodiments of the present application;

[0029] Figure 7 Another structural schematic diagram of a sensor of some embodiments of the present application.

[0030] Reference signs in the detailed description of the embodiments are as follows:

[0031] 100, sensor;

[0032] 1, substrate; 2, side wall; 21, elastic bending structure; 22, elastic part; 23, first rigid part; 24, second rigid part; 3, bottom plate; 4, accommodating cavity; 5, MEMS chip; 6, ASIC chip; 7, voice processing chip; 8, counterweight; 9, recessed groove; 91, first sub-groove; 92, second sub-groove; 10, through hole; 11, annular pad; 12, rear cavity. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be described in detail below with reference to the drawings. The following examples are only used to more clearly illustrate the technical scheme of the present application, and therefore only serve as examples, but cannot be used to limit the protection scope of the present application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application; the terms "comprising," "comprises" and "including" as used herein are synonymous with and meant to have the same meaning as the term "including"; the term "coupled" as used herein means the joining of two members together with one or more intervening members.

[0035] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0036] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily independent or alternative embodiments to each other. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0038] In the description of the embodiments of the present application, the term "a plurality of" refers to two or more (including two), and similarly, "a plurality of groups" refers to two or more groups (including two groups), and "a plurality of pieces" refers to two or more pieces (including two pieces).

[0039] In the description of the embodiments of the present application, the orientations or positional relationships indicated by the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0040] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0041] There are many types of sensors, such as acoustic sensors, optical sensors and vibration sensors. The acoustic sensor detects the air pressure signal through the sound hole, the optical sensor detects the light, and the vibration sensor detects the vibration signal from the outside.

[0042] With the increasing demand of people, the demand for miniaturization and thinness of sensor products is also increasing. However, the current vibration sensor generally has the problem of large size.

[0043] The applicant found through careful research that in related technologies, compared with acoustic sensors, for sensors that need to detect vibration signals, a vibration component needs to be additionally arranged in the accommodation cavity of the sensor. When receiving the vibration from the outside, the vibration component will vibrate, driving the air in the sensor to vibrate, thereby causing the pressure in the sensor accommodation cavity to change. Here, the pressure mainly refers to the air pressure, and the MEMS chip can sense the air pressure change, thereby playing a role in detecting the external vibration signal. However, the additional arrangement of the vibration component in the accommodation cavity occupies a large space, resulting in a large volume of the sensor, which is difficult to meet the market demand for miniaturization.

[0044] Therefore, the applicant provides a sensor.

[0045] Reference Figure 1According to some embodiments of the present application, the present application provides a sensor 100, comprising a shell, and a signal-connected MEMS chip 5 and ASIC chip 6; the shell comprises a substrate 1, a side wall 2 and a bottom plate 3 which are sequentially stacked, and the substrate 1, the side wall 2 and the bottom plate 3 are sequentially connected to form a containing cavity 4, the MEMS chip 5 and the ASIC chip 6 are arranged in the containing cavity 4, and the ASIC chip 6 is signal-connected with the substrate 1; the side wall 2 is an elastic plate, and the side wall 2 can be elastically deformed to change the size of the containing cavity 4.

[0046] It should be noted that in the related art, the shell of the sensor 100 generally comprises a substrate 1 and a shell covering the substrate 1, and the substrate 1 and the shell form a containing cavity 4. The shell is integrally formed and generally made of one material, such as a metal material. In the present application, the shell adopts a three-layer plate structure, which comprises a substrate 1, a side wall 2 and a bottom plate 3 which are sequentially stacked. The substrate 1 is generally a printed circuit board, which is provided with a wiring layer, and the surface of the printed circuit board is provided with a solder pad for electrical connection with the MEMS chip 5 or the ASIC chip 6 through a gold wire. The side wall 2 refers to a rectangular side wall or a circular side wall formed around the outer edge of the substrate 1, and the specific shape is set according to actual needs. The bottom plate 3 and the substrate 1 are respectively arranged on both sides of the side wall, such as the bottom plate 3 connected to the top of the side wall and the substrate 1 connected to the bottom of the side wall, and the three cooperate to form a substantially closed containing cavity 4, which is used to arrange electronic components, such as the MEMS chip 5 and the ASIC chip 6. The MEMS chip 5 and the ASIC chip 6 are signal-connected, the MEMS chip 5 is used to perceive the change of the air pressure signal and transmit it to the electrically connected ASIC chip 6, the ASIC chip 6 is calculated and processed and then transmitted to the external circuit through the electrically connected substrate 1, or it can also be transmitted to the voice processing chip 7 arranged in the containing cavity 4.

[0047] In the above embodiment of the utility model, the side wall 2 is made of elastic plate, the side wall 2 is made of elastic material or at least includes part elastic material, therefore, when being influenced by external vibration, the side wall 2 will occur elastic deformation, as the containing cavity 4 is formed by the base plate 1, the side wall 2 and the bottom plate 3, as one component part of the containing cavity 4 periphery, the deformation of the side wall 2 will cause the size change of the containing cavity 4, as the containing cavity 4 is relatively closed, the total amount of gas inside is invariable, and the volume changes, then will cause the pressure change in the containing cavity 4, the MEMS chip 5 can detect the pressure change signal, and the pressure change signal is used for detecting vibration signal. It needs to be explained that the direction of the elastic deformation of the side wall 2 here can be perpendicular to the base plate 1, also can be parallel to the base plate 1, or the superposition of the two directions. The bottom plate 3 can also be made of elastic material, when being influenced by external vibration, the bottom plate 3 can also occur deformation to make the volume of the containing cavity 4 change, of course, the bottom plate 3 can also be made of rigid material, when being influenced by external vibration, the bottom plate 3 will not occur deformation, but as the bottom plate 3 is connected with the side wall 2, the bottom plate 3 will move along with the deformation of the side wall 2. Specifically, the sensor 100 is a vibration sensor, it needs to be explained that in the application, the vibration sensor can also be called vibration sensor, and the vibration can also be called vibration, and the vibration signal can also be called vibration signal, and the vibration assembly can also be called vibration assembly.

[0048] By adopting the three-layer plate structure to manufacture the shell of the sensor 100, the side wall 2 is made of elastic material, the side wall 2 receives the vibration signal and occurs deformation, changes the size of the containing cavity 4, and the vibration signal is detected through the pressure signal change in the containing cavity 4. The material of the side wall 2 of the sensor 100 itself is replaced in the embodiment, and the vibration signal detection function is realized. In the case that the vibration assembly in the related art is cancelled, no additional components are added to the sensor 100, which is conducive to reducing the volume of the sensor 100, and in the related art, the MEMS chip 5 and the vibration assembly are stacked, therefore, cancelling the vibration assembly is conducive to reducing the thickness of the sensor 100, and realizing the small size and thin design of the sensor 100.

[0049] Referring to Figure 1 Or Figure 2 In some embodiments, the side wall 2 can occur elastic deformation along the direction perpendicular to the base plate 1 to change the distance between the bottom plate 3 and the base plate 1. The direction perpendicular to the base plate 1 is as shown in the figure, and the side wall 2 can occur elastic deformation along the direction perpendicular to the base plate 1 to change the distance between the bottom plate 3 and the base plate 1. Figure 1 Or Figure 2The main direction of the elastic deformation of the side wall 2 is set as the direction perpendicular to the substrate 1, that is, the side wall 2 mainly deforms in the direction perpendicular to the substrate 1, and the vibration signal in the direction perpendicular to the substrate 1 is mainly detected. It can be understood by those skilled in the art that if the side wall 2 can also deform in the horizontal direction, a tangential force will be applied to the connection between the substrate 1 and the bottom plate 3 during the deformation of the side wall 2, which will cause the connection to be easily loosened. In a specific application scenario, when used on an electronic device, the substrate 1 can be connected to the main body of the electronic device through external pads, and the substrate 1 is stationary. When subjected to vibration, the bottom plate 3 will move towards or away from the substrate 1 under the action of the elastic deformation of the side wall 2, so that the distance between the bottom plate 3 and the substrate 1 changes, thereby changing the volume of the accommodation cavity 4, and causing the change of the air pressure in the accommodation cavity 4.

[0050] With reference to Figure 1 In some embodiments, the sensor 100 further comprises a voice processing chip 7, the voice processing chip 7 is mounted on the substrate 1, the ASIC chip 6 is stacked on the voice processing chip 7, and the voice processing chip 7 is signal-connected with the substrate 1. The voice processing chip 7 is used to receive the electrical signal processed by the ASIC chip 6, and can process the electrical signal to obtain the information of the vibration signal, and the information at least includes the vibration intensity information. This embodiment can realize the localized processing of the signal. With the rapid development of the Internet of Things technology, more and more ordinary objects with independent functions are interconnected to realize the Internet of Everything. In order to solve the problems of high time delay and lack of real-time data analysis capability caused by sending a large amount of data to a central computing platform for analysis and processing, edge computing technology emerges as the times require. The voice processing chip 7 is arranged in the sensor 100, and the voice processing chip 7 can receive and process the electrical signal sent by the ASIC chip 6, so as to realize the localized edge computing processing of the signal and meet the needs of the Internet of Things technology. Moreover, this embodiment has high integration, adopts integrated design, has compact structure, simple structure, and is easy to realize mass production.

[0051] With reference to Figure 1 In some embodiments, the bottom plate 3 is provided with a counterweight 8; the counterweight 8 is arranged on the side of the bottom plate 3 facing the accommodation cavity 4; or, the counterweight 8 is arranged on the side of the bottom plate 3 away from the accommodation cavity 4.

[0052] The counterweight 8 can be a counterweight block, a rubber block or a metal block, and can be connected to the bottom plate 3 by bonding or other means, and can be connected to the outer side of the bottom plate 3, that is, the side of the bottom plate 3 away from the accommodating cavity 4, or can be installed on the inner side of the top side, that is, the side of the bottom plate 3 facing the accommodating cavity 4. The counterweight 8 can also be a reinforcing block, a reinforcing plate or a reinforcing rib, and in this case, the counterweight 8 can be made of the same material as the bottom plate 3, or can be integrally formed with the bottom plate 3, or can be installed on the bottom plate 3 by welding or bonding. The counterweight 8 is provided to increase or adjust the counterweight of the bottom plate 3, so as to adjust the sensitivity of the vibration sensing.

[0053] Referring to Figure 2 or Figure 3 In some embodiments, the side wall 2 is provided with an elastic bending structure 21.

[0054] The elastic bending structure 21 is the main position of the elastic deformation of the side wall 2, and the stretching or compression of the bending structure can better realize the deformation of the side wall 2, thereby changing the distance between the base plate 1 and the bottom plate 3, and improving the detection sensitivity. Those skilled in the art can understand that the elastic coefficient of the bending structure can be adjusted by adjusting the thickness of the material of the elastic bending structure 21, the angle of the bending and the number of the bending, and thereby the sensitivity of the vibration sensing can be adjusted.

[0055] Referring to Figure 3 In some embodiments, the shape of the bending structure is in the form of a circular arc, and the bending structure is recessed towards the accommodating cavity 4.

[0056] In theory, the design of the elastic bending structure 21 can only satisfy the deformation to adjust the distance between the bottom plate 3 and the base plate 1. However, in order to facilitate subsequent calculation, the elastic bending structure 21 can be designed as a circular arc structure, and the convex surface of the circular arc is arranged towards the accommodating cavity 4. In this way, the movement of the bottom plate 3 and the elastic deformation of the side wall can be consistent with the direction of compression or expansion of the space of the accommodating cavity 4.

[0057] Specifically, when the elastic bending structure 21 is contracted, that is, shortened in the direction perpendicular to the substrate 1, the contraction of the pure elastic bending structure 21 causes the space of the accommodating cavity 4 to be reduced, that is, the volume is reduced; at the same time, the bottom plate 3 moves towards the substrate 1, the distance between the bottom plate 3 and the substrate 1 is reduced, and the movement of the pure bottom plate 3 also causes the space of the accommodating cavity 4 to be reduced. At this time, the movement of the bottom plate 3 and the change of the elastic bending structure 21 both have the effect of reducing the space of the accommodating cavity 4. Similarly, when the elastic bending structure 21 is elongated, that is, lengthened in the direction perpendicular to the substrate 1, the elongation of the pure elastic bending structure 21 causes the space of the accommodating cavity 4 to be increased; at the same time, the bottom plate 3 moves away from the substrate 1, the distance between the bottom plate 3 and the substrate 1 is increased, and the movement of the pure bottom plate 3 also causes the space of the accommodating cavity 4 to be increased. At this time, the movement of the bottom plate 3 and the change of the elastic bending structure 21 both have the effect of increasing the space of the accommodating cavity 4. Therefore, the shape of the elastic bending structure 21 is designed as a circular arc, which can make the movement of the bottom plate 3 and the elastic deformation of the side wall have the same direction of compression or expansion on the space of the accommodating cavity 4, thereby improving the sensitivity of detection.

[0058] Referring to Figure 4 In some embodiments, the MEMS chip 5 is mounted on the substrate 1, and the position of the substrate 1 facing the MEMS chip 5 is recessed to form a recessed groove 9 facing away from the accommodating cavity 4.

[0059] In the embodiments of the present application, the space surrounded by the MEMS chip 5 and the substrate 1 is referred to as the rear cavity 12, and those skilled in the art can understand that increasing the volume of the rear cavity 12 can increase the sensitivity of the sensor 100. Due to the limitation of the volume of the sensor 100, it is necessary to consider how to increase the volume of the rear cavity 12 without increasing the volume of the sensor 100. In this embodiment, the recessed groove 9 is excavated on the surface of the substrate 1, and the space of the recessed groove 9 is communicated with the rear cavity 12. The volume of the excavated recessed groove 9 is the increased volume of the rear cavity 12, thereby improving the sensitivity of the sensor 100 without increasing the volume of the sensor 100.

[0060] Referring to Figure 5In some embodiments, the recessed groove 9 comprises a first sub-groove 91 and a second sub-groove 92 which are in communication with each other, the first sub-groove 91 is arranged close to the MEMS chip 5, and the second sub-groove 92 is arranged in the substrate 1. In a cross section parallel to the substrate 1, the cross-sectional area of the first sub-groove 91 is smaller than that of the second sub-groove 92. The first sub-groove 91 is in direct communication with the space formed by the MEMS chip 5 and the substrate 1, and the second sub-groove 92 is in communication with the space formed by the MEMS chip 5 and the substrate 1 through the first sub-groove 91. The first sub-groove 91 is located on the surface of the substrate 1, and the second sub-groove 92 is arranged in the substrate 1. The design of the first sub-groove 91 is limited by the size of the MEMS chip 5 and cannot be designed too large, otherwise there is no supporting position for the MEMS chip 5. The second sub-groove 92 can be designed larger because it is arranged inside the substrate 1, and the cross-sectional area in the cross section parallel to the substrate 1, that is, the projection area on the substrate 1. The first sub-groove 91 and the second sub-groove 92 are equivalent to increase the volume of the rear cavity 12, so the second sub-groove 92 can be designed larger than the first sub-groove 91, thereby increasing the volume of the rear cavity 12 to a greater extent and further improving the sensitivity of the sensor 100.

[0061] With reference to Figure 6 In some embodiments, the substrate 1 is provided with a through hole 10, the through hole 10 is arranged to face the MEMS chip 5, and the side of the substrate 1 away from the accommodation cavity 4 is provided with an annular pad 11, the annular pad 11 is arranged around the opening of the through hole 10, and the annular pad 11 is used for welding with the circuit board of the external device.

[0062] The external device can be a circuit board on an electronic device, and the electronic device can be a headset, a mobile phone, a computer, etc. It should be noted that after the circuit board is installed on the annular pad 11, the side of the through hole 10 facing the circuit board is closed, which is different from the sound hole of the acoustic sensor 100. In fact, the through hole 10 also serves to increase the volume of the rear cavity 12 and improve the sensitivity of the sensor 100.

[0063] In some embodiments, the bottom plate 3 is a rigid plate.

[0064] The rigid plate can be a metal plate, such as a copper plate or a steel plate of a certain thickness, which will not elastically deform during vibration, and the rigid plate has a certain mass, which is more sensitive to vibration.

[0065] In some embodiments, the side wall 2 is made of a metal material; or, the side wall 2 is made of rubber; or, the side wall 2 is made of an elastic composite material.

[0066] The side wall plate 2 is made of a material with elasticity, which can be made of a metal material, such as steel or an alloy material with elasticity, or made of rubber, which has elasticity by itself. Of course, the side wall plate 2 can also be made of an elastic composite material, which can be a metal + rubber interval. It should be noted that the material composition or components of the metal material, rubber material and elastic composite material in the embodiment are known, and the application protects the structure of the side wall plate 2 composed of known materials, rather than the composition of the materials themselves.

[0067] With reference to Figure 7 In some embodiments, the side wall plate 2 includes an elastic part 22 and first and second rigid parts 23 and 24 respectively arranged on both sides of the elastic part 22. The first rigid part 23 is connected to the bottom plate 3 away from the elastic part 22, and the second rigid part 24 is connected to the base plate 1 away from the elastic part 22.

[0068] The side wall plate 2 can be made of one material or two or more materials to form different structures by splicing. In a specific embodiment, the side wall plate 2 includes an elastic part 22 made of an elastic material and first and second rigid parts 23 and 24 made of a rigid material. The first and second rigid parts 23 and 24 are respectively connected to both ends of the elastic part 22, and the first rigid part 23 is connected to the bottom plate 3, and the second rigid part 24 is connected to the base plate 1. In this embodiment, the parts connected to the base plate 1 or the bottom plate 3 are the first and second rigid parts 23 and 24 that do not deform, so the connection is not easy to fall off, and the stability of the connection can be improved.

[0069] According to some embodiments of the application, an electronic device is provided, which includes the sensor 100 of any one of the above. The electronic device can be a smart wearable device, such as an earphone, a computer, a mobile phone, a tablet, a bracelet or a ring, etc. Since the electronic device includes all the technical solutions of the embodiments of the sensor 100, it at least has all the beneficial effects brought by all the technical solutions, which will not be repeated here.

[0070] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some or all of the technical features can be replaced equivalently. Such modifications or replacements do not change the essence of the corresponding technical solutions, which should be covered in the scope of the claims and the specification of the present application. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A sensor, characterized in that, This includes the housing, as well as the MEMS and ASIC chips for signal connections; The housing includes a substrate, side panels and a bottom plate stacked in sequence, and the substrate, side panels and bottom plate are connected in sequence to form a receiving cavity. The MEMS chip and the ASIC chip are disposed in the receiving cavity, and the ASIC chip is signal connected to the substrate. The side panel is an elastic plate, which can undergo elastic deformation to change the size of the receiving cavity.

2. The sensor according to claim 1, characterized in that, The side panel can elastically deform in a direction perpendicular to the substrate to change the distance between the bottom plate and the substrate.

3. The sensor according to claim 2, characterized in that, The base plate is equipped with a counterweight; The counterweight is disposed on the side of the base plate facing the receiving cavity; or, The counterweight is located on the side of the base plate opposite to the receiving cavity.

4. The sensor according to claim 1, characterized in that, The side panel is provided with an elastic bending structure.

5. The sensor according to claim 4, characterized in that, The bending structure is arc-shaped and recessed towards the receiving cavity.

6. The sensor according to claim 1, characterized in that, The MEMS chip is mounted on the substrate, and the substrate has a recessed groove formed at the position facing the MEMS chip in a direction away from the receiving cavity.

7. The sensor according to claim 6, characterized in that, The recessed groove includes a first sub-groove and a second sub-groove that are interconnected. The first sub-groove is disposed close to the MEMS chip, and the second sub-groove is disposed within the substrate. On a cross-section parallel to the substrate, the cross-sectional area of ​​the first sub-groove is smaller than that of the second sub-groove.

8. The sensor according to claim 1, characterized in that, The substrate has a through hole facing the MEMS chip. An annular pad is provided on the side of the substrate away from the receiving cavity. The annular pad surrounds the opening of the through hole and is used for soldering to the circuit board of an external device.

9. The sensor according to any one of claims 1 to 7, characterized in that, The base plate is a rigid plate.

10. The sensor according to any one of claims 1 to 7, characterized in that, The side panels are made of metal; or, The side panels are made of rubber; or, The side panels are made of an elastic composite material.

11. The sensor according to any one of claims 1 to 7, characterized in that, The side panel includes an elastic portion and a first rigid portion and a second rigid portion respectively disposed on both sides of the elastic portion. The side of the first rigid portion away from the elastic portion is connected to the bottom plate, and the side of the second rigid portion away from the elastic portion is connected to the substrate.

12. The sensor according to any one of claims 1 to 7, characterized in that, The sensor also includes a voice processing chip, which is mounted on the substrate. The ASIC chip is stacked on the voice processing chip, and the voice processing chip is connected to the substrate for signal transmission.

13. An electronic device, characterized in that, The electronic device includes the sensor according to any one of claims 1 to 12.

Images