Defect detection equipment
By combining a light source and a height detection component, the reflection problem caused by a single light source in optical inspection equipment is solved, improving the image acquisition accuracy and reducing the false detection rate, thus achieving efficient defect detection.
Patent Information
- Application Number
- CN202422954338.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing optical inspection equipment uses a single light source, which easily causes reflections, resulting in shadows or blind spots when the lens is shooting, affecting image acquisition and increasing the probability of false defect detection.
The system employs a combined light source, consisting of multiple individual light sources working together, along with a height detection component to adjust the shooting height and diopter, thereby achieving automatic focusing, improving the image acquisition accuracy and reducing the false detection rate.
By combining a light source and a height detection component, reflections are effectively reduced, image quality and accuracy are improved, false detection rates are lowered, and efficient defect detection is achieved.
Smart Images
Figure CN223679090U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical detection equipment technical field, specifically relates to a kind of defect detection equipment. BACKGROUND
[0002] Glass micro-fusion pressure sensor chip can be used in the EMB wheel hub brake force sensor, EHB brake-by-wire pressure sensor, hydraulic suspension pressure sensor etc. in automobile field, it is a kind of high-precision pressure measuring element manufactured using glass micro-fusion process and silicon strain gauge. Among them, glass micro-fusion pressure sensor is prone to bubble, scratch, color difference, dirt and other defects in the baking curing process.
[0003] Therefore, at present, mainly using automatic optical inspection (AOI) equipment and automatic optical inspection (AOI) algorithm to detect it, so as to automatically identify the bubble, scratch, color difference, dirt and other defects of the above glass micro-fusion pressure sensor. But the current AOI equipment is mostly dependent on single and fixed light source, especially when it is applied to glass micro-fusion pressure sensor, single light source is easy to cause reflection, which leads to shadow or dead angle in lens shooting detection, and then affects image acquisition, resulting in high defect mis-detection probability. UTILITARY MODEL CONTENT
[0004] The utility model provides a kind of defect detection equipment to solve the problem of single light source of optical detection equipment in prior art, prone to reflection.
[0005] To solve the above technical problems, the utility model provides a kind of defect detection equipment, the defect detection equipment includes: detection platform, shooting component, height detection component and combination light source.
[0006] The detection platform is used to place target chip;The shooting component is located above the detection platform along the first direction, wherein the shooting component includes shooting camera and liquid lens or high-definition lens capable of being connected with the shooting camera;The height detection component is used to measure the interval between the strain gauge and pressure surface of the target chip;The combination light source is located between the detection platform and the shooting camera along the first direction.
[0007] The technical scheme provided by the utility model compared with prior art has the beneficial effects that:
[0008] By adding height detection component to detect the interval between the strain gauge and pressure surface of target chip, so that staff can determine the shooting height of shooting component according to height difference. Specifically, since the diopter of liquid lens has linear relationship with working distance, when shooting camera is connected with liquid lens, the diopter of the liquid lens is adjusted according to the measured interval height to realize automatic focusing.
[0009] Wherein, a combination light source is further arranged between the camera and the detection platform, and the combination light source is composed of multiple single light sources to comprehensively cover the target chip for facilitating defect detection. Compared with the prior art in which the target chip surface is illuminated by a single light beam, the above-mentioned adjustment of the shooting height and the combination light source can effectively improve the full detection rate of image acquisition and reduce the false detection rate.
[0010] In some embodiments, the defect detection device comprises a first detection module, the first detection module comprises a first light source, a second light source and a third light source, the first light source is a coaxial light source, the second light source is a shadowless light source, and the third light source is a low-angle ring light source.
[0011] By adopting the above technical solution, the first detection module is arranged to detect whether there is a bubble in the glass glue inside the target chip or whether the target chip has surface scratches, silicon wire damage and other adverse conditions. Since the precision requirement is very high, a single light source may be blocked by the bubble feature due to the reflection of the glass glue surface of the target chip. Therefore, the optical scheme of multiple light source combinations can effectively reduce the reflection phenomenon of the target chip, thereby improving the image quality.
[0012] Further, the first light source and the third light source are combined into a first combination light source, and the second light source and the third light source are combined into a second combination light source.
[0013] By adopting the above technical solution, the first light source, the second light source and the third light source are sequentially combined into the first combination light source and the second combination light source to shoot images of different brightness, so that clear images of the surface defects and bubble defects of the strain sheet can be obtained.
[0014] In some embodiments, the defect detection device comprises a second detection module, the second detection module comprises a first light source and a fourth light source, and the first light source and the fourth light source are combined into a third combination light source.
[0015] By adopting the above technical solution, the second detection module is arranged to detect adverse conditions such as glass glue haze, glass glue dirt, glass glue connection, glass glue crack and strain sheet color difference of the target chip. Since the glass glue of the target chip is transparent, the glass glue haze needs to be shot by a camera with high resolution, and the higher the resolution of the camera, the higher the cost. Therefore, the first light source and the fourth light source are combined into the third combination light source to improve the contrast of the images shot by the camera.
[0016] Further, the first light source is a coaxial light source, and the fourth light source is a bowl-shaped light source.
[0017] By adopting the above technical solution, when the coaxial light source and the bowl-shaped light source are combined, the image quality and precision can be effectively improved, and the contrast of the images shot by the camera can be improved.
[0018] In some embodiments, the defect detection device comprises a third detection module, the third detection module comprises a first light source and two fifth light sources, the first light source is a coaxial light source, and the fifth light source is a ring light source.
[0019] By adopting the technical scheme, the third detection module is arranged to detect the pressure surface defects of the target chip, such as pressure surface glue, scratches, and dirt, and the like. The optical scheme formed by arranging different light sources can effectively highlight the surface state of the pressure surface of the target chip.
[0020] Further, the first light source and the fifth light source are combined into a fourth combined light source, and the two fifth light sources are combined into a fifth combined light source.
[0021] By adopting the technical scheme, the fourth combined light source and the fifth combined light source are used to realize different brightness illumination, and the imaging assembly can sequentially acquire images with different precisions.
[0022] In some embodiments, the height detection assembly is a laser height gauge.
[0023] By adopting the technical scheme, the laser height gauge is used for testing, which can improve the precision of the height data and realize non-contact measurement, thereby avoiding damage to the target chip.
[0024] In some embodiments, the defect detection device further comprises a first station and a second station arranged at intervals, wherein the target chip comprises two strain gauges, and the first station and the second station are used to sequentially detect the strain gauges of the target chip.
[0025] By adopting the technical scheme, the double-station design of the first station and the second station can effectively detect real defects and reduce the time required for replacing the camera lens.
[0026] Further, the imaging cameras of the first station and the second station are connected with the liquid lens, so that the imaging cameras can automatically focus without secondary adjustment when the first station and the second station are switched. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings, wherein:
[0028] Figure 1This is a schematic diagram of an embodiment of a defect detection device provided by this utility model. Figure 1 ;
[0029] Figure 2 This is a schematic diagram of height measurement of an embodiment of a defect detection device provided by this utility model;
[0030] Figure 3 This is a schematic diagram of an embodiment of a defect detection device provided by this utility model. Figure 2 ;
[0031] Figure 4 This is a schematic diagram of an embodiment of a defect detection device provided by this utility model. Figure 3 ;
[0032] Figure 5 This is a schematic diagram of the first station inspection of an embodiment of a defect detection device provided by this utility model;
[0033] Figure 6 This is a schematic diagram of the second station inspection of an embodiment of a defect detection device provided by this utility model.
[0034] In the picture:
[0035] 10. Inspection platform; 11. First station; 12. Second station; 20. Imaging assembly; 21. Imaging camera; 22. Liquid lens; 23. High-definition lens; 30. Height detection assembly;
[0036] 40. Combined light source; 41. First light source; 42. Second light source; 43. Third light source; 44. Fourth light source; 45. Fifth light source; 50. Target chip; 51. Strain gauge. Detailed Implementation
[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0038] See Figures 1 to 2 As shown, Figure 1 This application provides a schematic diagram illustrating the detection process of an embodiment of a defect detection device. Figure 1 ; Figure 2 A schematic diagram illustrating height measurement is shown for one embodiment of a defect detection device provided in this application.
[0039] In some embodiments, the defect detection device comprises a detection platform 10, a shooting assembly 20, a height detection assembly 30 and a combined light source 40.
[0040] The detection platform 10 is used for placing the target chip 50; the shooting assembly 20 is located above the detection platform 10 along a first direction, wherein the shooting assembly 20 comprises a shooting camera 21 and a liquid lens 22 or a high-definition lens 23 capable of being connected with the shooting camera 21; the height detection assembly 30 is used for measuring the distance between the strain gauge 51 of the target chip 50 and the pressure surface; and the combined light source 40 is located between the detection platform 10 and the shooting camera 21 along the first direction.
[0041] In the embodiments of the present application, as shown in Figure 2 The height detection assembly 30 is added to detect the distance between the strain gauge 51 of the target chip 50 and the pressure surface, so that the staff can determine the shooting height of the shooting assembly 20 according to the height difference. Specifically, since the diopter of the liquid lens 22 has a linear relationship with the working distance, when the shooting camera 21 is connected with the liquid lens 22, the diopter of the liquid lens 22 is adjusted according to the measured distance to realize automatic focusing. Exemplarily, the height detection assembly 30 is a laser height meter. Thus, the measurement accuracy can be improved, and non-contact measurement is realized to avoid damage to the target chip 50.
[0042] As shown in Figure 1 The combined light source 40 is composed of multiple single light sources to comprehensively cover the target chip 50 to facilitate defect detection. Compared with the prior art in which a single light beam is used to illuminate the surface of the target chip 50, the above-mentioned adjustment of the shooting height and the combined light source 40 can effectively improve the full detection rate of image acquisition and reduce the false detection rate.
[0043] In some embodiments, as shown in Figure 1 The defect detection device comprises a first detection module, the first detection module comprises a first light source 41, a second light source 42 and a third light source 43, the first light source 41 is a coaxial light source, the second light source 42 is a shadowless light source, and the third light source 43 is a low-angle ring light source.
[0044] In the embodiments of the present application, the module for detecting whether there is a bubble in the glass glue of the target chip 50 or whether the target chip 50 has surface scratches, silicon wire damage and other adverse conditions is set as the first detection module. Since the accuracy requirement is very high, a single light source may be blocked by the reflection of the glass glue surface of the target chip 50. Therefore, the optical scheme of multiple light sources can effectively reduce the reflection phenomenon of the target chip 50, thereby improving the image quality.
[0045] Exemplarily, as shown inFigure 1 As shown, the first light source 41, the second light source 42 and the third light source 43 are sequentially arranged along the first direction. Among them, the coaxial light source refers to the light source and the lens of the shooting camera 21 on the same axis to highlight the unevenness of the surface of the target chip 50; the shadowless light source refers to the light source for uniform illumination to eliminate or reduce the shadow of the strain sheet 51 compression joint edge; the low-angle ring light source refers to the light source for providing illumination from the side of the target chip 50 at a lower angle to highlight the texture and profile of the surface of the target chip 50.
[0046] In some embodiments, the first light source 41 and the third light source 43 are combined into a first combined light source 40, and the second light source 42 and the third light source 43 are combined into a second combined light source 40.
[0047] In the embodiments of the present application, the first light source 41, the second light source 42 and the third light source 43 are sequentially combined into the first combined light source 40 and the second combined light source 40 to shoot images of different brightness, so as to facilitate obtaining clear images of the surface defects of the strain sheet 51 and the bubble defects. For example, one image is shot under the illumination of the first combined light source 40, and another image is shot under the illumination of the second combined light source 40, so as to improve the data amount of image acquisition.
[0048] Referring to Figure 3 As shown, Figure 3 The detection schematic diagram of an embodiment of a defect detection device provided by the present application is shown Figure 2 .
[0049] In some embodiments, the defect detection device comprises a second detection module, and the second detection module comprises the first light source 41 and the fourth light source 44, and the first light source 41 and the fourth light source 44 are combined into a third combined light source 40.
[0050] In the embodiments of the present application, the module for detecting the glass glue cloud, glass glue dirt, glass glue connection, glass glue crack and strain sheet 51 color difference and other adverse conditions of the target chip 50 is set as the second detection module. Since the glass glue of the target chip 50 is transparent material, for the glass glue cloud and the like, the shooting camera 21 needs to have strong resolution ability to detect, and the higher the resolution ability of the shooting camera 21, the higher the cost. Based on this, the first light source 41 and the fourth light source 44 are combined into the third combined light source 40 to improve the contrast of the image shot by the shooting camera 21.
[0051] Further, the first light source 41 is a coaxial light source, and the fourth light source 44 is a bowl-shaped light source.
[0052] In the embodiments of the present application, when the coaxial light source is matched with the bowl-shaped light source, the image quality and accuracy can be effectively improved to improve the contrast of the image captured by the camera 21. Specifically, the coaxial light source refers to the light source and the lens of the camera 21 being on the same axis to highlight the unevenness of the surface of the target chip 50; the bowl-shaped light source refers to the diffuse lighting that can provide high uniformity to eliminate or reduce shadows.
[0053] Referring to Figure 4 illustrated, Figure 4 Fig. 1 shows a detection schematic diagram of an embodiment of a defect detection device provided by the present application; Figure 3 .
[0054] In some embodiments, the defect detection device comprises a third detection module, and the third detection module comprises a first light source 41 and two fifth light sources 45. The first light source 41 is a coaxial light source, and the fifth light source 45 is a ring-shaped light source.
[0055] In the embodiments of the present application, the third detection module is provided to detect the pressure surface defects of the target chip 50, such as pressure surface glue, scratches, and dirt, etc. The optical scheme formed by setting different light sources can effectively highlight the surface state of the pressure surface of the target chip 50. Among them, the coaxial light source refers to the light source and the camera lens being on the same axis to highlight the unevenness of the surface of the target chip 50; the ring-shaped light refers to the 360-degree ring-shaped lighting source to reduce shadows and reflections caused by the uneven surface of the strain gauge 51 of the target chip 50. Based on this, the surface state of the pressure surface of the target chip 50 is more highlighted.
[0056] In some embodiments, the first light source 41 and the fifth light source 45 are combined into a fourth combined light source 40, and the two fifth light sources 45 are combined into a fifth combined light source 40. The fourth combined light source 40 and the fifth combined light source 40 are used to realize different brightness illuminations, so that the shooting assembly 20 can sequentially acquire images of different accuracies. Exemplarily, the camera 21 is used to shoot images under the illumination of the fourth combined light source 40 and the fifth combined light source 40, respectively, so as to have sufficient data quantity for subsequent detection.
[0057] Referring to Figures 5 to 6 illustrated, Figure 5 Fig. 1 shows a detection schematic diagram of an embodiment of a defect detection device provided by the present application; Figure 6 Fig. 2 shows a detection schematic diagram of a second station 12 of an embodiment of a defect detection device provided by the present application.
[0058] In some embodiments, the defect detection device is further provided with a first station 11 and a second station 12, wherein the target chip 50 comprises two strain gauges 51, and the first station 11 and the second station 12 are used for sequentially detecting the strain gauges 51 of the target chip 50.
[0059] In the embodiments of the present application, the double-station design of the first station 11 and the second station 12 can effectively detect real defects and reduce the time required for replacing the camera lens.
[0060] For example, the shooting cameras 21 of the first station 11 and the second station 12 are respectively connected with liquid lenses 22, so that the first station 11 and the second station 12 can automatically focus without secondary adjustment when switching. Figures 5 to 6 As shown in the figure, the first station 11 detects the strain gauge 51 located on the left side, and the second station 12 detects the strain gauge 51 located on the right side.
[0061] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields based on the content of the present application specification and drawings, should be within the protection scope of the present application.
Claims
1. A defect detection apparatus characterized by comprising: The device comprises: a detection platform for placing a target chip; a shooting assembly above the detection platform along a first direction, wherein the shooting assembly comprises one or more shooting cameras and a liquid lens or a high-definition lens connectable with the shooting cameras; a height detection assembly for measuring the distance between a strain gauge and a pressure surface of the target chip; a combined light source between the detection platform and the shooting cameras along the first direction.
2. The defect detection apparatus according to claim 1, characterized by, The defect detection device comprises a first detection module, the first detection module comprises a first light source, a second light source and a third light source, the first light source is a coaxial light source, the second light source is a shadowless light source, and the third light source is a low-angle ring light source.
3. The defect detection apparatus according to claim 2, characterized by, The first light source and the third light source are combined into a first combined light source, and the second light source and the third light source are combined into a second combined light source.
4. The defect detection apparatus according to claim 1, characterized by, The defect detection device comprises a second detection module, the second detection module comprises a first light source and a fourth light source, and the first light source and the fourth light source are combined into a third combined light source.
5. The defect detection apparatus according to claim 4, characterized by The first light source is a coaxial light source, and the fourth light source is a bowl-shaped light source.
6. The defect detection apparatus according to claim 1, wherein The defect detection device comprises a third detection module, the third detection module comprises a first light source and two fifth light sources, the first light source is a coaxial light source, and the fifth light source is a ring light source.
7. The defect detection apparatus according to claim 6, characterized by The first light source and the fifth light source are combined into a fourth combined light source, and the two fifth light sources are combined into a fifth combined light source.
8. The defect detection apparatus according to any one of claims 1 to 7, characterized by, The height detection assembly is a laser height gauge.
9. The defect detection apparatus according to any one of claims 1 to 7, characterized by, The defect detection device is further provided with a first station and a second station, wherein the target chip comprises two strain gauges, and the first station and the second station are used for sequentially detecting the strain gauges of the target chip.
10. The defect detection apparatus according to claim 9, wherein The shooting cameras of the first station and the second station are respectively connected with the liquid lens.