Structure capable of improving chip test efficiency and chip aging test equipment

Abstract

The utility model relates to a structure capable of improving chip test efficiency and a chip aging test device, the structure comprises a plurality of groups of detection assemblies and an aging oven, each detection assembly comprises a test part and a heat dissipation part, the test part comprises a test socket, and the test socket is used for installing a chip; the heat dissipation part comprises a heat dissipation block and a pair of heat dissipation fans, and the heat dissipation block is arranged at the top of the test socket and attached to the chip; the pair of heat dissipation fans are symmetrically arranged on the two sides of the heat dissipation block, and the wind directions of the two heat dissipation fans are consistent; the multiple groups of detection assemblies are arranged at equal intervals in the length axial direction and the width axial direction of the aging oven, and any two adjacent groups of detection assemblies in the axis direction of the cooling fan are arranged in a staggered mode. According to the utility model, the detection assemblies which are distributed in a staggered manner are adopted, so that the distance between the detection assemblies is shortened under the condition of ensuring good heat dissipation, more detection assemblies can be placed in a limited aging oven, more chips can be tested at a time, and the test efficiency is improved under the premise of ensuring the accuracy of a test result.

Description

TECHNICAL FIELD

[0001] The utility model relates to precision stamping die processing and manufacturing technical field, especially a structure and chip aging test equipment that can improve chip test efficiency. BACKGROUND

[0002] The aging test of chip mainly is that product is placed in high temperature, high temperature and high humidity or low temperature environment and carries out power running, monitors the electric variable of product in the running process and the chemical or physical change etc.

[0003] In the prior art, the detection device in the aging furnace is usually arranged linearly, and the test equipment will emit heat during the test process. If the distance between two adjacent test equipment is too close, the heat emitted by the test equipment arranged in the front position will be quickly absorbed by the test equipment behind. This results in that less test equipment is placed in the aging furnace, and the number of chips tested at one time is less, which affects the detection efficiency. UTILITY MODEL CONTENTS

[0004] Therefore, the utility model wants to solve the technical problem of overcoming the defect of low detection efficiency caused by the small number of linearly arranged detection equipment in the aging furnace in the prior art.

[0005] To solve the above technical problems, the utility model provides a structure capable of improving chip test efficiency, which comprises:

[0006] A plurality of detection assemblies, the detection assembly comprises a test part and a heat dissipation part, the test part comprises a test socket, and the test socket is used for mounting a chip; the heat dissipation part comprises a heat dissipation block and a pair of heat dissipation fans, the heat dissipation block is arranged on the top of the test socket and is attached to the chip; a pair of heat dissipation fans are symmetrically arranged on the two sides of the heat dissipation block, and the directions of the two heat dissipation fans are consistent;

[0007] An aging furnace, a plurality of detection assemblies are equidistantly arranged along the length axis and the width axis of the aging furnace, and any two adjacent detection assemblies along the axis direction of the heat dissipation fan are staggered.

[0008] In an embodiment of the utility model, probes matched with the chip are arranged on the test socket.

[0009] In an embodiment of the utility model, a heat conduction plate is arranged on the side of the heat dissipation block attached to the chip.

[0010] In one embodiment of the present application, the test socket is detachably connected with the aging furnace.

[0011] In one embodiment of the present application, a heat dissipation cover is arranged between the heat dissipation block and the heat dissipation fan, the heat dissipation cover is arranged on the outer side of the heat dissipation block, and the heat dissipation fan is detachably connected with the heat dissipation cover.

[0012] In one embodiment of the present application, a connecting rod is arranged on the top of the test socket, and the heat dissipation block is hingedly connected with the connecting rod.

[0013] In one embodiment of the present application, a fixing rod is arranged on the side of the test socket away from the connecting rod, and a clamping hook is arranged on the bottom of the heat dissipation block, and the clamping hook is matched with the fixing rod.

[0014] In one embodiment of the present application, a compression spring is further arranged between the heat dissipation block and the test socket, and the compression spring is arranged on the side close to the connecting rod.

[0015] In one embodiment of the present application, a pad is arranged on the side of the test socket adhering to the heat dissipation block.

[0016] The chip aging test equipment comprises the structure capable of improving chip test efficiency.

[0017] Compared with the prior art, the above technical scheme of the present application has the following advantages:

[0018] The structure capable of improving chip test efficiency and the chip aging test equipment have the following advantages. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to specific embodiments of the present application and in combination with the drawings, in which

[0020] Figure 1 is a schematic view of the overall structure of the present application;

[0021] Figure 2 is Figure 1 a structure side view of the detection assembly in the present application;

[0022] Figure 3 is Figure 1 a structure isometric view of the detection assembly in the present application;

[0023] The description reference signs are as follows: 1, detection assembly; 2, aging furnace; 11, test part; 12, heat dissipation part; 13, chip; 111, test socket; 112, probe; 113, connecting rod; 114, fixing rod; 115, compression spring; 116, pad block; 121, heat dissipation block; 122, heat dissipation fan; 123, heat conduction plate; 124, heat dissipation cover; 125, clamping hook. DETAILED DESCRIPTION

[0024] The utility model will be further explained in combination with the drawings and specific embodiments, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model. Embodiment one

[0025] Refer to Figures 1-3 The utility model discloses a structure of can improve chip test efficiency, including:

[0026] Multiple detection assemblies 1, the detection assembly 1 includes test part 11 and heat dissipation part 12, test part 11 includes test socket 111, and the test socket 111 is used to install chip 13;Heat dissipation part 12 includes heat dissipation block 121 and a pair of heat dissipation fan 122, and heat dissipation block 121 sets up at test socket 111 top and is combined with chip 13;A pair of heat dissipation fan 122 is symmetrically set up in the both sides of heat dissipation block 121, and the direction of two heat dissipation fan 122 is consistent;

[0027] Aging furnace 2, multiple detection assemblies 1 are respectively equidistantly arranged along the length axis and width axis of aging furnace 2, and are staggered arranged along the axis direction of heat dissipation fan 122.

[0028] The utility model discloses a detection assembly 1's test department 11 is used for the detection of chip 13, simulates the use environment of chip 13, and the detection of chip 13 is carried out. And the heat generated in the detection process of test department 11 is dissipated to heat dissipation part 12, avoids the problem that the heat of chip 13 cannot be discharged quickly and will influence the temperature of high -power chip 13 aging test and test, influence the precision of test. Specifically, the heat generated in the testing process of chip 13 is absorbed by heat dissipation block 121, and a pair of heat dissipation fans 122 are arranged on the two sides of heat dissipation block 121, which are used for taking away the heat dissipated by heat dissipation block 121 in time, and cold air is brought into heat dissipation block 121 to exchange heat. Preferably, the directions of the two heat dissipation fans 122 are consistent, and when they are installed on the two sides of heat dissipation block 121, one is used for air outlet to take away the heat dissipated by heat dissipation block 121 in time, and the other is used for air inlet to supplement cold air outside detection assembly 1 to exchange heat and dissipate heat for heat dissipation block 121. As a preferred scheme of the utility model, the heat dissipation fans 122 are all high-temperature resistant axial flow fans.

[0029] When the plurality of detection assemblies 1 in the utility model are placed in the aging furnace 2, the plurality of detection assemblies 1 are equally spaced in the length direction and the width direction of the aging furnace 2, so that the distance between any two detection assemblies 1 in the X-axis direction and the distance in the Y-axis direction are equal. As a preferred scheme of the utility model, the adjacent two detection assemblies 1 are staggered in the axial direction of the heat dissipation fan 122, so that the hot air blown by the front heat dissipation fan 122 is not sucked by the rear heat dissipation fan 122 before being dissipated, and the temperature of the rear heat dissipation block 121 is too high. In addition, compared with the array distribution structure in the prior art, the staggered distribution structure reduces the installation distance between the detection devices, can increase the installation number of the detection devices in the aging furnace 2, and can test more chips 13 at one time, thereby improving the test efficiency under the premise of ensuring the accuracy of the test results.

[0030] The utility model adopts the staggered distribution detection assembly 1, shortens the distance between the detection assemblies 1 under the condition of ensuring good heat dissipation, can place more detection assemblies 1 in the limited aging furnace 2, can test more chips 13 at one time, and improves the test efficiency under the premise of ensuring the accuracy of the test results.

[0031] Further, the test socket 111 is provided with a probe 112 matched with the chip 13. Specifically, the chip 13 is installed in the test socket 111 and connected with the probe 112 in the test socket 111, which is used for simulating the use of the chip 13.

[0032] Further, the side of the heat dissipation block 121 abutting with the chip 13 is provided with a heat conduction plate 123.

[0033] Specifically, the heat generated during the testing of the chip 13 can be well transferred to the heat dissipation block 121 through the heat conduction plate 123, thereby improving the heat dissipation efficiency.

[0034] Further, the test socket 111 is detachably connected with the aging furnace 2.

[0035] Specifically, during the testing, the whole detection device is fixed between the aging furnace 2 through bolt connection, so that the position of the detection device is fixed, and the movement of the detection device during the testing is avoided to affect the testing effect and the testing precision.

[0036] Further, the heat dissipation block 121 is provided with a heat dissipation cover 124, the heat dissipation cover 124 covers the outside of the heat dissipation block 121, and the heat dissipation fan 122 is detachably connected with the heat dissipation cover 124.

[0037] Specifically, the heat dissipation cover 124 has two functions, one is to facilitate the fixation and installation of the heat dissipation fan 122, and the other is to collect the heat dissipated by the heat dissipation block 121, so that more heat is dissipated by the heat dissipation fan 122 and the heat is taken away in time.

[0038] Further, the test socket 111 is provided with a connecting rod 113 at the top, the heat dissipation block 121 is hinged with the connecting rod 113, and the test socket 111 is provided with a fixing rod 114 away from the connecting rod 113 at the top, and the bottom of the heat dissipation block 121 is provided with a clamping hook 125 matched with the fixing rod 114.

[0039] Specifically, during the testing of the chip 13, the chip 13 is first installed in the test socket 111 and connected with the probe 112, and then the heat dissipation block 121 is attached to the chip 13.

[0040] Further, the heat dissipation block 121 and the test socket 111 are further provided with a compression spring 115, and the compression spring 115 is arranged on the side close to the connecting rod 113.

[0041] Specifically, the compression spring 115 can support the overturning of the heat dissipation block 121, so that the heat dissipation block 121 is not closed during the installation of the chip 13, and the installation of the chip 13 is affected.

[0042] Further, the test socket 111 is provided with a pad 116 on the side attached to the heat dissipation block 121.

[0043] Specifically, the role of the cushion block 116 is to form support for the heat dissipation block 121, avoid the pressure of the heat dissipation block 121 being too large to damage the chip 13, and affect normal testing. Embodiment two

[0044] A chip aging test equipment, comprising the structure capable of improving chip test efficiency in embodiment one.

[0045] In conclusion, the utility model introduces a structure and chip 13 aging test equipment capable of improving chip 13 test efficiency, and the detection part in detection assembly 1 can realize the aging test of chip 13, and the heat dissipation part 12 is used for dissipating the heat generated in the process of chip 13 detection. The utility model adopts staggered detection assembly 1, shortens the distance between detection assembly 1 under the condition of guaranteeing good heat dissipation, can place more detection assembly 1 in the limited aging furnace 2, and can test more chips 13 at a time, improves test efficiency under the premise of guaranteeing the accuracy of test results.

[0046] Obviously, the above embodiment is only an example for clearly illustrating, and is not limited to the embodiment. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments need not and cannot be exhausted. The obvious changes or variations derived therefrom are still within the protection scope of the utility model.

Claims

1. A structure that can improve chip testing efficiency, characterized in that, The utility model relates to a chip testing device capable of improving testing efficiency, comprising: a plurality of testing assemblies, each testing assembly comprising a testing part and a heat dissipation part, the testing part comprising a testing socket for mounting a chip, and the heat dissipation part comprising a heat dissipation block and a pair of heat dissipation fans, the heat dissipation block being arranged on the top of the testing socket and being in contact with the chip; the pair of heat dissipation fans being symmetrically arranged on both sides of the heat dissipation block, and the directions of the air flows of the two heat dissipation fans being consistent; an aging furnace, a plurality of testing assemblies being equidistantly arranged along the length and width axes of the aging furnace, and any two adjacent testing assemblies being staggered along the axial direction of the heat dissipation fans.

2. The structure capable of improving chip test efficiency according to claim 1, wherein: a probe being arranged on the testing socket and being in cooperation with the chip.

3. The structure for improving the efficiency of chip testing according to claim 1, wherein: a heat conduction plate being arranged on the side of the heat dissipation block in contact with the chip.

4. The structure capable of improving chip test efficiency according to claim 1, wherein: the testing socket and the aging furnace being detachably connected.

5. The structure for improving the efficiency of testing a chip according to claim 1, wherein: a heat dissipation cover being arranged between the heat dissipation block and the heat dissipation fans, the heat dissipation cover being arranged on the outer side of the heat dissipation block, and the heat dissipation fans and the heat dissipation cover being detachably connected.

6. The structure for improving the efficiency of testing a chip according to claim 1, wherein: a connecting rod being arranged on the top of the testing socket, and the heat dissipation block being hinged to the connecting rod.

7. The structure for improving the efficiency of chip testing according to claim 6, wherein: a fixing rod being arranged on the side of the testing socket away from the connecting rod, and a clamping hook being arranged on the bottom of the heat dissipation block, the clamping hook being in cooperation with the fixing rod.

8. The structure for improving the efficiency of testing a chip according to claim 6, wherein: a compression spring being further arranged between the heat dissipation block and the testing socket, the compression spring being arranged on the side close to the connecting rod.

9. The structure for improving the efficiency of testing chips according to claim 1, wherein: a pad being arranged on the side of the testing socket in contact with the heat dissipation block.

10. A chip burn-in test apparatus, characterized by comprising: the chip testing device capable of improving testing efficiency as claimed in any one of claims 1-9.

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