Combined electrode plasma processing system

Abstract

The utility model relates to a combined electrode plasma processing system. The combined electrode plasma processing system comprises a vacuum cavity, an upper electrode, a first electrode, a second electrode and a double-sided adhesive piece, wherein the upper electrode is arranged in the vacuum cavity; the double-sided pasting piece is used for fixing a substrate to be processed on the second electrode, the second electrode is selectively combined with the first electrode to form a lower electrode, and a plasma processing space is formed between the lower electrode and the upper electrode so as to carry out plasma processing on the substrate; when the plasma processing is stopped, the first electrode can be separated from the second electrode, and the first electrode and the substrate fixed on the second electrode can be taken out and carried together. Through the design of the second electrode, the touch panel has the advantage of elastically arranging the process time sequence.

Description

TECHNICAL FIELD

[0001] The utility model relates to a plasma processing system, in particular to a combined electrode plasma processing system. BACKGROUND

[0002] In the semiconductor related applications, the plasma processing is mainly used for cleaning, etching and sputtering. During the plasma processing, high temperature is generated in the cavity, and the surface temperature of the plasma contacting the object to be processed is also very high. The object to be processed is easily bent and deformed by heat, especially the substrate with plastic material or the plate with flexible characteristics. The bending and deformation of the object to be processed will cause the surface to be uneven, so that the plasma is difficult to uniformly process. Therefore, the product quality of the object to be processed is unstable due to the above reasons, and even the product yield is affected. SUMMARY

[0003] The main purpose of the utility model is to solve the problem of the object to be processed in the plasma processing process due to heat warping.

[0004] To achieve the above purpose, the utility model provides a combined electrode plasma processing system and a method for plasma processing using a combined electrode to perform plasma processing on a substrate. The combined electrode plasma processing system includes a vacuum cavity, an upper electrode, a first electrode, a second electrode and a double-sided adhesive member. The upper electrode is arranged in the vacuum cavity, the first electrode is arranged in the vacuum cavity and spaced apart from the upper electrode by a distance, and the first electrode has a conductive combination part. The second electrode includes a bearing surface for bearing the substrate and a contact combination part adjacent to the first electrode. The double-sided adhesive member includes a first adhesive layer and a second adhesive layer. The first adhesive layer is attached to the substrate, and the second adhesive layer is attached to the bearing surface of the second electrode. When the conductive combination part and the contact combination part are in electrical contact, the first electrode and the second electrode form a lower electrode, and an plasma processing space is formed between the lower electrode and the upper electrode to perform plasma processing on the substrate. When the conductive combination part and the contact combination part are separated, the plasma processing of the substrate is stopped.

[0005] In another embodiment of the utility model, a frame-shaped cover plate is arranged on one side of the second electrode adjacent to the upper electrode. When the plasma processing is performed in the vacuum cavity, the frame-shaped cover plate compresses the outer peripheral edge of the substrate.

[0006] In another embodiment of the utility model, the adhesive area of the double-sided adhesive member on the substrate accounts for 70-99% of the substrate area.

[0007] In another embodiment of the utility model, the double-sided adhesive member has a plurality of exhaust holes penetrating through the first adhesive layer and the second adhesive layer.

[0008] In another embodiment of the present application, the diameter of the exhaust hole is between 0.5mm and 1mm.

[0009] In another embodiment of the present application, the interval distance between the exhaust holes is between 2mm and 5mm.

[0010] In another embodiment of the present application, the density of the exhaust holes on the double-sided adhesive member is between 5 and 10 per square centimeter.

[0011] In another embodiment of the present application, the material of the first adhesive layer has UV photolysis.

[0012] In another embodiment of the present application, the material of the first adhesive layer has pyrolysis.

[0013] In another embodiment of the present application, the material of the second adhesive layer has UV photolysis.

[0014] In another embodiment of the present application, the material of the second adhesive layer has pyrolysis.

[0015] In another embodiment of the present application, the double-sided adhesive member has a thickness, and the thickness is between 50μm and 200μm.

[0016] In another embodiment of the present application, a lifting module is further included, and the lifting module is connected to the side of the first electrode away from the second electrode to control the vertical height of the first electrode in the vacuum cavity.

[0017] Therefore, the present application optimizes the processing timing of the plasma process by using the technical features of the combined electrode that can combine and separate the electrodes, and improves the problem of uneven heating of the substrate by using the adhesive member to flatly attach the substrate to the electrode, thereby improving the yield of the plasma process. BRIEF DESCRIPTION OF DRAWINGS

[0018] The aspects of the present application can be better understood from the following detailed description given with reference to the drawings. It should be noted that the features are not drawn to scale according to standard industry practices. In fact, the dimensions of the features can be arbitrarily increased or decreased in order to make the discussion clearer.

[0019] Figure 1 FIG. 1 is a structural perspective view of a combined electrode plasma process system according to the present application.

[0020] Figure 2 FIG. 2 is an exploded view of the combined electrode plasma process system according to the present application.

[0021] Figure 3 FIG. 3 is a schematic view of a cross section of a double-sided adhesive member according to the present application.

[0022] Figure 4A schematic view of a lifting step of the combined electrode plasma processing system.

[0023] Figure 5 A schematic view of a combining step of the first electrode and the second electrode.

[0024] Figure 6 A schematic view of a combining step of the lower electrode and the frame-shaped cover plate.

[0025] Figure 7 A block diagram of a use step of the combined electrode plasma processing system.

[0026] Figure 8 A block diagram of another use step of the combined electrode plasma processing system.

[0027] Figure 9 A block diagram of a substrate fixing step.

[0028] Figure 10 A block diagram of a lower electrode combining step.

[0029] BRIEF DESCRIPTION OF DRAWINGS

[0030] 1: substrate;

[0031] 1a: outer peripheral edge;

[0032] 100: combined electrode plasma processing system;

[0033] 10: vacuum chamber;

[0034] 20: upper electrode;

[0035] 30: first electrode;

[0036] 31: electrically conductive combining portion;

[0037] 40: second electrode;

[0038] 41: bearing surface;

[0039] 42: contact combining portion;

[0040] 50: double-sided adhesive member;

[0041] 51: first adhesive layer;

[0042] 52: second adhesive layer;

[0043] 53: exhaust hole;

[0044] 54: first release film;

[0045] 55: second release film;

[0046] 56: body;

[0047] 60: lower electrode;

[0048] 70: frame-shaped cover plate;

[0049] 80: lifting module;

[0050] P: plasma processing space;

[0051] S0: piercing step;

[0052] S1: substrate fixing step;

[0053] S1a: adsorbing step;

[0054] S1b: sticking step;

[0055] S1c: fixing step;

[0056] S2: lower electrode assembling step;

[0057] S2a: placing step;

[0058] S2b: assembling step;

[0059] S2c: pressing step;

[0060] S3: substrate taking-out step;

[0061] S3a: electrode separating step;

[0062] S3b: taking-out step;

[0063] S4: substrate separating step. DETAILED DESCRIPTION

[0064] The spatial relationship between the two elements described in the present application is not only applicable to the orientation shown in the drawings, but also applicable to the orientation not presented in the drawings, such as the inverted orientation.

[0065] In addition, the "first", "second", and the like used herein do not specifically mean the order or sequence, and are only used to distinguish the elements or operations described by the same technical terms.

[0066] Please refer to Figures 1 to 6 As shown in the drawings, a combined electrode plasma processing system 100 of the present application is disclosed, which is used to perform plasma processing on a substrate 1. The system includes a vacuum chamber 10, an upper electrode 20, a first electrode 30, a second electrode 40, and a double-sided sticking member 50. The upper electrode 20 is arranged in the vacuum chamber 10, and the first electrode 30 is arranged in the vacuum chamber 10 and spaced apart from the upper electrode 20 by a distance.

[0067] Please refer to Figure 2 、 4As shown in FIG. 6, in this embodiment, the first electrode 30 has a conductive assembly 31, which can be, for example, beryllium copper; the second electrode 40 includes a bearing surface 41 of the bearing substrate 1 and a contact assembly 42 adjacent to the first electrode 30. When the conductive assembly 31 is in electrical contact with the contact assembly 42, the first electrode 30 and the second electrode 40 form a lower electrode 60, and an external power source can conduct electrical energy to the bearing surface 41 of the second electrode 40 through the electrical contact between the first electrode 30 and the second electrode 40. In this way, a plasma processing space P is formed between the lower electrode 60 and the upper electrode 20 to perform plasma processing on the substrate 1; when the conductive assembly 31 is separated from the contact assembly 42, the plasma processing of the substrate 1 is stopped.

[0068] In an embodiment, the first electrode 30 or the second electrode 40 further has a cooling structure (not shown in the figure) disposed in the first electrode 30 or the second electrode 40 through a fluid pipe to quickly remove the heat received by the electrode.

[0069] In an embodiment, the double-sided adhesive member 50 includes a first adhesive layer 51 and a second adhesive layer 52, the first adhesive layer 51 is attached to the substrate 1, and the second adhesive layer 52 is attached to the bearing surface 41 of the second electrode 40. The double-sided adhesive member 50 is not limited to a stacked structure, as long as it has two opposite adhesive surfaces in a structure. Please refer to Figure 3 As shown in FIG. 6, in this embodiment, the double-sided adhesive member 50 has a body 56, a first adhesive layer 51, a second adhesive layer 52, a first release film 54, and a second release film 55. In addition, the double-sided adhesive member 50 has a thickness (e.g., the entire thickness of the body 56, the first adhesive layer 51, and the second adhesive layer 52), and the aforementioned thickness is between 50 μm and 200 μm. The thickness will affect the distance between the substrate 1 and the bearing surface 41. If the thickness is too thin, the adhesion of the double-sided adhesive member 50 may not be enough, and the substrate 1 may be easily warped. However, if the thickness is too thick, the substrate 1 will be too far away from the bearing surface 41, and the second electrode 40 will have difficulty in cooling the substrate 1 through contact or conduction.

[0070] In actual conditions, it is difficult to find a large-area double-sided adhesive member 50. Therefore, in an embodiment, the double-sided adhesive member 50 has a plurality of double-sided adhesive members 50 that are closely tiled to form a large double-sided adhesive member 50 relative to the area of the substrate 1. The tiling area can account for 70% to 99% of the area of the substrate 1. If the tiling area of the double-sided adhesive member 50 is less than 70%, the problem of warping of the substrate 1 at the unadhered part of the double-sided adhesive member 50 when heated cannot be avoided.

[0071] In some embodiments, since the second electrode 40 is made of metal and has good thermal conductivity, the second adhesive layer 52 can be made of a thermolysis material. The second electrode 40 can be separated from the second adhesive layer 52 by heating the second adhesive layer 52 with a heating tool, such as a heat gun, to make the second adhesive layer 52 lose its adhesion. The first adhesive layer 51 is made of a UV light resolution material. Since the second electrode 40 has been separated, the second adhesive layer 52 is transparent to light. The first adhesive layer 51 can be separated from the substrate 1 by irradiating the double-sided adhesive member 50 with UV light to make the first adhesive layer 51 lose its adhesion. In addition, if the substrate 1 is transparent to light, the first adhesive layer 51 can be separated from the substrate 1 by irradiating the first adhesive layer 51 with UV light after the plasma process is completed. Then, the second adhesive layer 52 can be separated from the second electrode 40 by heating the second adhesive layer 52 with a heating tool, such as a heat gun, to make the second adhesive layer 52 lose its adhesion.

[0072] In some embodiments, the first adhesive layer 51 and the second adhesive layer 52 are both made of a thermolysis material. The double-sided adhesive member 50 can be separated by heating the double-sided adhesive member 50 with a heating tool, such as a heat gun, to make the double-sided adhesive member 50 lose its adhesion.

[0073] In some embodiments, the first adhesive layer 51 and the second adhesive layer 52 are both made of a UV light resolution material. In the case that the substrate 1 is transparent to light, the double-sided adhesive member 50 can be separated by irradiating the double-sided adhesive member 50 with UV light to make the double-sided adhesive member 50 lose its adhesion.

[0074] In some embodiments, the first adhesive layer 51 is made of a thermolysis material. The substrate 1 can be separated from the first adhesive layer 51 by heating the first adhesive layer 51 with a heating tool, such as a heat gun, to make the first adhesive layer 51 lose its adhesion. The second adhesive layer 52 is made of a UV light resolution material. Since the substrate 1 has been separated, the first adhesive layer 51 is transparent to light. The second adhesive layer 52 can be separated from the second electrode 40 by irradiating the double-sided adhesive member 50 with UV light to make the second adhesive layer 52 lose its adhesion.

[0075] In addition, please refer to Figure 2 In addition, as shown in FIG. 5, in some embodiments, the double-sided adhesive member 50 has a plurality of exhaust holes 53. The exhaust holes 53 pass through the first adhesive layer 51 and the second adhesive layer 52. In actual operation, small bubbles are easily generated when the double-sided adhesive member 50 is attached to the substrate 1. Therefore, the exhaust holes 53 can be used to exhaust the bubbles to avoid the generation of gaps between the double-sided adhesive member 50 and the substrate 1, which can affect the uniformity of the heating of the substrate 1 and the cooling of the substrate 1 by a cooling structure (not shown) and further affect the process yield. In addition, the diameter of the exhaust holes 53 is between 0.5 mm and 1 mm, the interval between the exhaust holes 53 is between 2 mm and 5 mm, and the density of the exhaust holes 53 on the double-sided adhesive member 50 is between 5 and 10 per square centimeter.

[0076] Please refer to Figure 4 As shown, in an embodiment, the utility model also includes a frame-shaped cover plate 70, which is fixed to one side of the second electrode 40 adjacent to the upper electrode 20. When the plasma process begins in the vacuum cavity 10, the frame-shaped cover plate 70 presses the outer peripheral edge 1a of the substrate 1. In this way, the pressing of the frame-shaped cover plate 70 can further make the substrate 1 flatly adhere to the second electrode 40. In addition, during the plasma process, in some embodiments, cooling gas is introduced into the electrode to prevent the substrate 1 from being damaged due to high temperature. Therefore, the pressing of the frame-shaped cover plate 70 can also ensure that the substrate 1 is flatly adhered to the second electrode 40 to effectively perform the cooling operation.

[0077] In addition, as Figure 1 shown, the lower electrode 60 composed of the first electrode 30 and the second electrode 40 has separability, which makes the timing arrangement of the plasma process more flexible. After completing the plasma process, the substrate 1 can be removed from the opening of the vacuum cavity 10 by using a conveying device (such as a robot arm or a transmission mechanism), without additional waiting for the glue removal procedure of the substrate 1, so that the next second electrode 40 carrying a new substrate 1 can be smoothly introduced into the vacuum cavity 10 to continue the plasma process. In an embodiment, the vacuum cavity 10 is part of an inline type machine, that is, the vacuum cavity 10 has an inlet and an outlet, and can be connected with other cavities to make a plurality of substrates 1 to be processed sequentially enter the vacuum cavity 10 for plasma processing, and after processing is completed, the transmission mechanism (not shown) transports the processed substrate 1 out of the vacuum cavity 10 from one side opening, while the transmission mechanism transports the substrate 1 to be processed into the vacuum cavity 10 for processing.

[0078] In another embodiment, please also refer to Figures 4 to 6 , the utility model includes a lifting module 80 connected to the side of the first electrode 30 away from the second electrode 40 to control the vertical height of the first electrode 30 in the vacuum cavity 10. As Figure 4 shown, the second electrode 40 with the substrate 1 adhered is placed in the vacuum cavity 10 by manual, robotic arm or transmission mechanism, at this time, the second electrode 40 has not contacted the first electrode 30. In Figure 4 , only the relative position of the second electrode 40 and the first electrode 30 is shown, and the positioning method of the second electrode 40 is not drawn. In fact, the positioning of the second electrode 40 can be achieved by a support or track arranged inside the vacuum cavity 10. Then as Figure 5 shown, the lifting module 80 lifts the first electrode 30 to make the first electrode 30 touch the second electrode 40 to form the lower electrode 60. Then as Figure 6As shown, the lifting module 80 continuously raises the lower electrode 60 to the position of the frame-shaped cover plate 70, using the frame-shaped cover plate 70 to press the substrate 1 against the lower electrode 60 for plasma processing. After the plasma process is completed, the lifting module 80 can descend to remove the substrate 1 from the pressed state of the frame-shaped cover plate 70, and then continue to descend to return the second electrode 40 to its original position. Figure 4 The state of separation of the first electrode 30 and the second electrode 40 can then be removed from the vacuum chamber 10 by manual operation, a robotic arm or a transport device.

[0079] In addition, this utility model also provides a method for plasma processing using combined electrodes; please refer to the following for further information. Figures 7 to 10 As shown, it is used to perform a plasma process on substrate 1, and includes the following steps:

[0080] Substrate fixing step S1: A double-sided adhesive 50 is formed between the substrate 1 and the second electrode 40 to fix the substrate 1 onto the second electrode 40.

[0081] like Figure 8 As shown, in some embodiments, the substrate fixing step S1 may further include the following steps:

[0082] Adsorption step S1a: First, the substrate 1 is vacuum-adsorbed and fixed to one side of the adsorption platform (not shown). Since the substrate 1 itself may be made of a flexible material and it is not easy to attach the double-sided adhesive 50, the adsorption platform can be used to fix the substrate 1 to facilitate the subsequent attachment of the double-sided adhesive 50.

[0083] Adhesion step S1b: First, remove the first release film 54 of the double-sided adhesive 50 and attach the double-sided adhesive 50 to the side of the substrate 1 away from the adsorption platform.

[0084] Fixing step S1c: Remove the second release film 55 of the double-sided adhesive 50 so that the substrate 1 can be attached to the second electrode 40.

[0085] In one embodiment, during the bonding step S1b, the second release film 55 can be removed first, and the double-sided adhesive 50 can be attached to the side of the substrate 1 away from the adsorption platform. Then, during the fixing step S1c, the first release film 54 can be removed, so that the substrate 1 can be attached to the second electrode 40.

[0086] After completing the substrate fixing step S1, the lower electrode assembly step S2 is performed: the second electrode 40, on which the substrate 1 is fixed, is placed into the vacuum chamber 10 and comes into contact with the first electrode 30 located in the vacuum chamber 10 to form the lower electrode 60. The vacuum chamber 10 also has an upper electrode 20. A plasma process space P is formed between the lower electrode 60 and the upper electrode 20 to perform plasma process processing on the substrate 1.

[0087] like Figure 9 As shown, in one embodiment, the lower electrode assembly step S2 further includes the following steps:

[0088] Insertion step S2a: First, place the second electrode 40 into the vacuum chamber 10 and position the second electrode 40 above the first electrode 30. The frame-shaped cover plate 70 is already positioned in the vacuum chamber 10 and is located between the upper electrode 20 and the second electrode 40.

[0089] Assembly step S2b: Using the lifting module 80 connected to the side of the first electrode 30 away from the second electrode 40, the first electrode 30 is lifted, so that the first electrode 30 and the second electrode 40 make electrical contact to form the lower electrode 60.

[0090] Pressing step S2c: The lower electrode 60 is lifted by the lifting module 80, so that the lower electrode 60 contacts the frame cover plate 70, thereby pressing the substrate 1 on the second electrode 40 into a pressed state by the frame cover plate 70. Then, the substrate 1 can be subjected to plasma processing.

[0091] Next, after the lower electrode assembly step S2 and the completion of the plasma process, the substrate removal step S3 is performed: the combined contact state of the first electrode 30 and the second electrode 40 is released, and the second electrode 40, along with the substrate 1 fixed thereon, is removed from the vacuum chamber 10. Please refer to the reference. Figure 10 In some embodiments, the substrate removal step S3 may further include the following steps:

[0092] Electrode separation step S3a: After the plasma process is completed, the lifting module 80 descends to separate the first electrode 30 from the second electrode 40, and the substrate 1 leaves the pressed state of the frame cover plate 70.

[0093] Step S3b: The second electrode 40, together with the substrate 1 fixed thereon, is removed from the vacuum chamber 10 by manual labor, a robotic arm or a transport device.

[0094] like Figure 7 As shown, in one embodiment, after the substrate removal step S3, there is also a substrate separation step S4: using an adhesive release tool to remove the adhesive of the double-sided adhesive 50, so as to separate the substrate 1 from the second electrode 40.

[0095] In one embodiment, the adhesive release tool may be a heating tool (e.g., a heat gun) or an irradiation device that emits UV light, and the material of the double-sided adhesive 50 may be thermally degradable or UV photodegradable accordingly.

[0096] The substrate separation step S4 may have several variations depending on the material of the double-sided adhesive 50, as illustrated below:

[0097] I. First, the irradiation device emitting UV light is used to make the first adhesive layer 51 lose adhesion, so that the substrate 1 is separated from the first adhesive layer 51, and then a heating tool (such as a heat gun) is used to heat the second adhesive layer 52 to make it lose adhesion and be separated from the second electrode 40.

[0098] II. Different from the above, the first adhesive layer 51 and the second adhesive layer 52 both have pyrolysis, so that in the second case, the heating tool is used to separate the double-sided adhesive member 50 from the substrate 1 and the second electrode 40.

[0099] III. The first adhesive layer 51 and the second adhesive layer 52 both have UV photolysis, so that in the third case, the irradiation device emitting UV light is used to emit UV light to the double-sided adhesive member 50, so that the double-sided adhesive member 50 is separated from the substrate 1 and the second electrode 40.

[0100] IV. The first adhesive layer 51 has pyrolysis, and the heating tool is used to make the first adhesive layer 51 lose adhesion, so that the substrate 1 is separated from the first adhesive layer 51; the second adhesive layer 52 has UV photolysis, and then the irradiation device emitting UV light is used to make the second adhesive layer 52 lose adhesion and be separated from the second electrode 40.

[0101] In addition, in an embodiment, referring to Figure 7 Before the substrate fixing step S1, there can be a piercing step S0, which uses a piercing method to form a plurality of exhaust holes 53 in the double-sided adhesive member 50, and the exhaust holes 53 penetrate through the double-sided adhesive member 50, so that the gas generated in the process of adhesion can be smoothly discharged through the piercing channels. Further, the piercing method can be a sword mountain bubble piercing method, a laser punching method, or a hot needle piercing method, etc., which can make the two sides of the double-sided adhesive member 50 have through holes and be sufficient to exhaust the gas. However, the piercing step S0 is only one embodiment, and is not limited to all embodiments of the present case which must perform the piercing step S0.

[0102] Therefore, the utility model has the following advantages:

[0103] 1. The utility model discloses a plurality of exhaust holes 53 in the double-sided adhesive member 50, so that the bubbles generated in the process of adhesion can be discharged through the exhaust holes 53, avoiding the generation of gaps between the double-sided adhesive member 50 and the substrate 1, and affecting the process yield.

[0104] 2. The utility model discloses a frame-shaped cover plate 70 is arranged to press the outer peripheral edge 1a of the substrate 1, so as to prevent the substrate 1 from being curled and deformed due to temperature rise in the vacuum cavity 10, and make the substrate 1 can be uniformly heated and uniformly cooled, and achieve the effect of stable process yield.

[0105] 3.The utility model discloses a lower electrode 60 that is formed by a first electrode 30 and a second electrode 40, and the separability of the lower electrode 60 makes the timing arrangement of the plasma process more flexible. After the plasma process is completed, the substrate 1 can be moved out by using the conveying device, and the next process can be successfully performed without additional waiting for the glue removal procedure of the substrate 1, thereby optimizing the timing arrangement of the process.

[0106] 4.The double-sided adhesive material of the double-sided adhesive member 50 can have different adhesive release properties, and can be used in combination to separate the substrate 1 and the second electrode 40.

[0107] Although the utility model has disclosed as above with the embodiment, it is not used to limit the utility model, any in this technical field technical personnel, when can make various changes and adornment without departing from the spirit and scope of the utility model, therefore the protection scope of the utility model should be defined as accurate as the utility model patent range.

Claims

1. A combined electrode plasma process system, characterized in that, The combined electrode plasma process system for performing plasma processes on a substrate includes: A vacuum chamber; An upper electrode is placed inside the vacuum chamber; A first electrode is disposed in the vacuum cavity and spaced apart from the upper electrode by a distance; the first electrode has a conductive assembly portion. A second electrode includes a bearing surface supporting the substrate and a contact assembly adjacent to the first electrode; and A double-sided adhesive component includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is attached to the substrate and the second adhesive layer is attached to the bearing surface of the second electrode. When the conductive assembly and the contact assembly are in electrical contact, the first electrode and the second electrode form a lower electrode, and a plasma process space is formed between the lower electrode and the upper electrode.

2. The combined electrode plasma process system as described in claim 1, characterized in that, It also includes a frame-shaped cover plate, which is disposed on the side of the second electrode adjacent to the upper electrode. When the plasma process is performed in the vacuum chamber, the frame-shaped cover plate presses against an outer peripheral edge of the substrate.

3. The combined electrode plasma process system as described in claim 1, characterized in that, The adhesive area of ​​the double-sided adhesive on the substrate occupies 70 to 99% of the area of ​​the substrate.

4. The combined electrode plasma process system as described in claim 1, characterized in that, The double-sided adhesive has multiple vent holes that extend through the first adhesive layer and the second adhesive layer.

5. The combined electrode plasma process system as described in claim 4, characterized in that, The diameter of these vent holes is between 0.5 mm and 1 mm.

6. The combined electrode plasma process system as described in claim 4, characterized in that, The spacing between these vent holes is between 2mm and 5mm.

7. The combined electrode plasma process system as described in claim 4, characterized in that, The vents are distributed at a density of 5 to 10 per square centimeter on the double-sided adhesive.

8. The combined electrode plasma process system as described in claim 1, characterized in that, The material of the first adhesive layer is UV photodegradable.

9. The combined electrode plasma process system as described in claim 1, characterized in that, The material of the first adhesive layer is pyrolytic.

10. The combined electrode plasma process system as described in claim 1, characterized in that, The material of the second adhesive layer is UV photodegradable.

11. The combined electrode plasma process system as described in claim 1, characterized in that, The material of the second adhesive layer is pyrolytic.

12. The combined electrode plasma process system as described in claim 1, characterized in that, The double-sided adhesive has a thickness between 50 μm and 200 μm.

13. The combined electrode plasma process system as described in claim 1, characterized in that, It also includes a lifting module for controlling the vertical height of the first electrode within the vacuum chamber, the lifting module being connected to the side of the first electrode away from the second electrode.

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