Wafer vertical cleaning device

Abstract

The embodiment of the utility model provides a wafer vertical cleaning device which comprises the components of a box body which is internally provided with a processing chamber, and a bottom plate of the box body is provided with a water outlet; the drainage net is arranged at the drainage port; the chuck is arranged in the processing cavity to vertically clamp the wafer, and the plane where the chuck is located is parallel to the vertical plane; the liquid splashing prevention device is located above the water outlet and covers the water outlet, the liquid splashing prevention device comprises two fixing blocks and at least one guide plate, the fixing blocks are detachably arranged in the box body, the guide plate is arranged between the two fixing blocks, and the projection of the wafer clamping position on the vertical plane is located in the projection area of the guide plate on the vertical plane. A first included angle is formed between the plane where the guide plate is located and the vertical plane, so that liquid drops dripping from the wafer are received and guided to the water outlet; and a maintenance door is arranged on the side wall of the box body at a position opposite to the anti-splashing device and is used for maintaining the anti-splashing device. The embodiment of the utility model provides a wafer vertical cleaning device. The wafer vertical cleaning device can effectively prevent residual liquid on the surface of a wafer from being adhered to the surface of the wafer after dropping.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of wafer cleaning, and particularly relate to a wafer vertical cleaning device. BACKGROUND

[0002] At present, the cleaning of a wafer can be performed by a vertical wafer post-processing device, i.e., a wafer vertical cleaning device. The box of the wafer vertical cleaning device has a processing chamber.

[0003] Before the wafer is clamped by a mechanical hand to enter the processing chamber, the wafer is located directly above the processing chamber. Then, the wafer is synchronously moved downward by the mechanical hand to be delivered to a processing station in the processing chamber of the wafer vertical cleaning device, and the wafer can be then fixed by a chuck or other wafer clamping mechanism in the processing chamber. After the position of the wafer is fixed, the mechanical hand releases the wafer and leaves the processing chamber. Then, the wafer is processed by process components in the processing chamber. After the process is completed, the wafer is taken away by the mechanical hand and leaves the processing chamber.

[0004] However, the wafer surface can have liquid sprayed on it by a previous processing device. The liquid will gather on the wafer surface to the bottom of the wafer due to gravity and drip onto the bottom plate of the box of the vertical wafer post-processing device. After the wafer is processed, the wafer surface can have liquid left during the process of being taken away from the processing chamber by the mechanical hand. The liquid will also drip onto the bottom plate of the box of the vertical wafer post-processing device. After the liquid drops, a large number of small droplets will be splashed, and the direction of the splashed small droplets is random, which will pollute the environment in the chamber and reduce the wafer cleaning effect. SUMMARY

[0005] Therefore, embodiments of the present application provide a wafer vertical cleaning device, which can effectively avoid the pollution of the environment in the chamber by the liquid left on the wafer surface and then dripping, and the adhesion of the liquid to the wafer surface.

[0006] According to a first aspect of the present application, a wafer vertical cleaning device is provided, which comprises: a box, the box having a processing chamber inside, a bottom plate of the box being provided with a drain port; a drain net, the drain net being arranged at the drain port; a chuck, the chuck being arranged in the processing chamber to vertically clamp a wafer, a plane where the chuck is located being parallel to a vertical plane; a liquid splash prevention device, the liquid splash prevention device being located above the drain port and covering the drain port, the liquid splash prevention device comprising two fixing blocks, the two fixing blocks being detachably arranged in the box, and at least one guide plate, the at least one guide plate being arranged between the two fixing blocks, a projection of a wafer clamping position in a vertical plane being located in a projection area of the guide plate in the vertical plane, a plane where the guide plate is located having a first included angle with the vertical plane to catch and guide the liquid droplets dropped from the wafer to the drain port; and a maintenance door, the maintenance door being arranged at a position of a side wall of the box opposite to the liquid splash prevention device, the maintenance door being used for maintaining the liquid splash prevention device.

[0007] Optionally, the end surface of the upper part of the guide plate is parallel to a vertical plane, the end surface of the lower part of the guide plate is parallel to a horizontal plane, and the projection of the end surface of the lower part of the guide plate on the vertical plane is located in the projection area of the fixed block on the vertical plane.

[0008] Optionally, the fixed block is detachably arranged in the box through a horizontally arranged sliding slot.

[0009] Optionally, the splash-proof device comprises a plurality of guide plates, the plurality of guide plates are arranged between two fixed blocks, the plurality of guide plates are parallel to each other, and the end surfaces of the lower parts of the plurality of guide plates are located on the same plane.

[0010] Optionally, a rotating shaft is arranged at the vertical center position of the guide plate, the guide plate is arranged on the fixed block through the rotating shaft; a plurality of guide plates are connected in series through a horizontally arranged cross bar, the cross bar is arranged in the accommodating cavity of the fixed block, so as to adjust the inclination angle of the guide plate through the cross bar.

[0011] Optionally, the splash-proof device comprises a door plate matched with the maintenance door, the door plate is fixedly connected with the fixed block, the door plate comprises a locking piece arranged in a guide hole, the locking piece has a locking position for clamping the cross bar and an opening position away from the cross bar; a locking buckle is arranged on the side wall of the maintenance door corresponding to the position of the locking piece, so as to fix the locking piece in the locking position and lock the fixed block and the cross bar.

[0012] Optionally, the first included angle is between 10° and 45°.

[0013] Optionally, the first included angle is between 20° and 35°.

[0014] Optionally, the parallel spacing between two adjacent guide plates is between 3 mm and 20 mm.

[0015] Optionally, the projections of two adjacent guide plates on the horizontal plane at least partially coincide, and the width of the coinciding projection area is greater than or equal to 1 mm.

[0016] The wafer vertical cleaning device provided by the embodiments of the present application has the following beneficial effects:

[0017] 1. The splash-proof device is located above the drain of the bottom plate of the wafer vertical cleaning device, and has at least one guide plate, so that liquid droplets can fall on the guide plate of the splash-proof device, and direct splashing of liquid falling on the bottom plate of the wafer vertical cleaning device is avoided as much as possible.

[0018] 2. The first angle between the plane where the guide plate is located and the vertical plane is provided, that is, the guide plate is provided in an inclined manner, so that when the liquid drops on the guide plate, the guide plate can catch the liquid drops and prevent splashing, avoiding splashing to the chuck and other structures. And the liquid can be guided to the drain by the guide plate, avoiding pollution of the environment in the processing chamber.

[0019] 3. After the wafer is cleaned in the processing chamber of the wafer vertical cleaning device, the surface of the wafer will also have liquid residues. The liquid residues on the surface of the wafer can also drop on the splash-proof liquid device, so that the splash-proof liquid device can also prevent the liquid drops dropped after cleaning the wafer from splashing on the chuck and other structures.

[0020] 4. The splash-proof liquid device is in long-term contact with liquid, which is easy to be corroded or accumulate pollutants. The maintenance door is arranged at the position of the side wall of the box body opposite to the splash-proof liquid device, so as to facilitate maintenance and replacement of the splash-proof liquid device. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application. Those skilled in the art can also obtain other drawings according to these drawings.

[0022] Figure 1 It is a sectional view of a wafer vertical cleaning device;

[0023] Figure 2 It is a sectional view of a wafer vertical cleaning device according to the present application;

[0024] Figure 3 It is a sectional view of an embodiment of a splash-proof liquid device according to the present application;

[0025] Figure 4 It is a sectional view of another embodiment of a splash-proof liquid device according to the present application;

[0026] Figure 5 It is a schematic view of a locking cross bar and a fixing block according to the present application.

[0027] Explanation of reference signs:

[0028] Wafer vertical cleaning device 1000;

[0029] Splash-proof liquid device 100; fixing block 10; containing cavity 11; guide plate 20; door plate 30; locking part 31; cross bar 40;

[0030] Box body 200; processing chamber 210; bottom plate 220; drain 230; maintenance door 240;

[0031] drainage net 300; chuck 400; chuck motor 500;

[0032] baffle ring 600; mechanical arm 700. DETAILED DESCRIPTION

[0033] In order for those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those skilled in the art should belong to the scope of protection of the embodiments of the present application.

[0034] As mentioned above, the current wafer cleaning can be performed by a vertical wafer post-processing device, i.e., a wafer vertical cleaning device 1000 as shown in the drawings. Figure 1 The box 200 of the wafer vertical cleaning device 1000 has a processing chamber 210.

[0035] Before the wafer is clamped by the mechanical hand into the processing chamber 210 for cleaning, the wafer is located directly above the processing chamber 210. Then the mechanical hand drives the wafer to move downward synchronously to deliver the wafer to a processing station in the processing chamber 210 of the wafer vertical cleaning device 1000, and the wafer can be fixed by a chuck 400 or other wafer clamping mechanism in the processing chamber 210. After the position of the wafer is fixed, the mechanical hand releases the wafer and leaves the processing chamber 210. Then the wafer is processed by the process components in the processing chamber 210. After the process is completed, the wafer is taken away by the mechanical hand and leaves the processing chamber 210.

[0036] However, the wafer surface may have residual liquid sprayed on the wafer surface by the previous processing device, Figure 1 and Figure 2 wherein W represents the wafer. Due to the action of gravity, the liquid will gather on the wafer surface to the bottom of the wafer and drip onto the bottom plate 220 of the box 200 of the vertical wafer post-processing device. After the wafer is processed, the wafer is taken away by the mechanical hand and leaves the processing chamber 210, and the wafer surface may have residual liquid, which will also drip onto the bottom plate 220 of the box 200 of the vertical wafer post-processing device. After the liquid drops, a large number of small droplets are easily splashed, and the direction of the splashed small droplets is random, which will cause pollution of the environment in the box 200 and thus reduce the wafer cleaning effect.

[0037] Therefore, the present application proposes a wafer vertical cleaning device 1000. As shown in the drawings, Figure 2As shown, it comprises a box body 200, a drainage net 300, a chuck 400, a chuck motor 500, a liquid splash-proof device 100, a retaining ring 600 and a mechanical arm 700. The box body 200 has a processing chamber 210 inside, and the bottom plate 220 of the box body 200 is provided with a drainage port 230, which can make the liquid remaining on the wafer drop to the bottom of the processing chamber 210 and then be discharged through the drainage port 230. The drainage net 300 is arranged at the drainage port 230. The residual particles in the waste liquid after the wafer cleaning can be filtered through the drainage net 300. The chuck 400 is arranged in the processing chamber 210 to vertically clamp the wafer, and the plane where the chuck 400 is located is parallel to the vertical plane. The chuck motor 500 is arranged on the outer wall of the box body 200, and the output shaft of the chuck motor 500 extends towards the processing chamber 210 through the wall of the box body 200 to connect with the chuck 400 and drive the chuck 400 to rotate along the rotation axis of the output shaft of the chuck motor 500, and the rotation axis of the output shaft of the chuck motor 500 is perpendicular to the vertical plane.

[0038] The bottom of the processing chamber 210 inside the wafer vertical cleaning device 1000 is provided with the liquid splash-proof device 100, so that when the liquid on the wafer drops, it can be avoided from directly dropping on the bottom plate 220 of the processing chamber 210 of the wafer vertical cleaning device 1000, but can drop on the liquid splash-proof device 100 and be adhered back to the wafer through the liquid splash-proof device 100 to avoid the liquid droplets splashing after the liquid drops; the position of the box side wall opposite to the liquid splash-proof device 100 is provided with a maintenance door 240 for maintaining the liquid splash-proof device.

[0039] The following will be described in conjunction with the drawings in the specification Figures 3-5 The liquid splash-proof device 100 of the present application is described in detail. As shown, Figures 3-5 According to the liquid splash-proof device 100 of the present application, the liquid splash-proof device 100 is located above the drainage port 230 of the bottom plate 220 of the wafer vertical cleaning device 1000 and covers the drainage port 230, the wafer vertical cleaning device 1000 is used for vertically cleaning the wafer, and the liquid splash-proof device 100 covers the drainage port 230, so as to guide the liquid droplets dropped on the wafer to be guided to the drainage port 230 through the liquid splash-proof device 100 to be discharged. The liquid splashing droplets are avoided from adhering to other structures in the wafer vertical cleaning device 1000.

[0040] As shown, Figure 3 and Figure 4As shown, the splash-proof liquid device 100 includes two fixing blocks 10 and at least one guide plate 20. The projection of the wafer clamping position in the vertical plane is located in the projection area of the guide plate in the vertical plane, so that the liquid droplets can fall on the guide plate 20 of the splash-proof liquid device 100, avoiding the liquid directly falling on the bottom plate 220 of the vertical wafer cleaning device 1000. The two fixing blocks 10 are detachably arranged in the box body 200. When the splash-proof liquid device 100 is maintained through the maintenance door 240, the fixing block 10 can be disassembled and the splash-proof liquid device 100 can be taken out of the box body. The splash-proof liquid device 100 is in long-term contact with liquid, which is easy to be corroded or to accumulate pollutants. The maintenance door 240 is arranged at the position of the side wall of the box body opposite to the splash-proof liquid device 100, so as to facilitate the maintenance and replacement of the splash-proof liquid device 100.

[0041] The two fixing blocks 10 can be used to fix the guide plate 20. Specifically, the two fixing blocks 10 are parallel to each other. As shown in Figure 3 and Figure 4 , the at least one guide plate 20 is arranged between the two fixing blocks 10 and is vertically connected with the inner wall surfaces of the two fixing blocks 10. Therefore, the guide plate 20 is vertically connected with the two fixing blocks 10 at the same time, which can form a plurality of angles between the plane where the guide plate 20 is located and the horizontal plane, and the end surfaces of the two end portions in the left-right direction of the guide plate 20 are respectively vertically connected with the two fixing blocks 10. It should be noted that the horizontal plane herein refers to the plane perpendicular to the direction of gravity in physics and daily life. The vertical plane herein refers to the plane perpendicular to the horizontal plane.

[0042] Among them, at least one means that the number of guide plates 20 is one or more. The number can be one, or multiple, such as two or more.

[0043] Further, as shown in Figure 3 and Figure 4 , the plane where the guide plate 20 is located has a first included angle with the vertical plane, so as to catch and guide the liquid droplets of the wafer falling to the drain port 230. The vertical plane can be the line L1 as shown in Figure 3 . The first included angle can be as shown in Figure 3The first included angle between the plane where the guide plate 20 is located and the vertical plane is that the guide plate 20 is arranged obliquely. When the liquid drops on the guide plate 20, the contact surface between the liquid and the guide plate 20 has an oblique angle. Compared with the liquid directly dropping on the bottom plate 220 of the box 200 at a 90° angle, the guide plate 20 having the first included angle with the vertical plane can guide the liquid drops dropped by the wafer to impact the surface of the guide plate 20 at a more tangent angle and catch the liquid drops, preventing splashing caused by the nearly vertical impact angle and avoiding pollution of the environment in the processing chamber 210. The liquid drops can flow through the gap between the guide plates 20 to the drain 230 to be drained away, thereby ensuring that the anti-splashing liquid device does not accumulate liquid and can continuously play the anti-splashing liquid function.

[0044] The liquid drops will not splash back to the chuck 400 and the like, and the environment in the processing chamber 210 will not be polluted, so that after the wafer is placed on the chuck 400, the chuck 400 is moved, the pollutants in the liquid drops splashed by the liquid on the chuck 400 are dispersed into the air and re-stuck on the wafer, polluting the surface of the wafer and reducing the cleaning effect of the wafer.

[0045] Correspondingly, as described above, after the wafer is cleaned in the processing chamber 210 of the wafer vertical cleaning device 1000, liquid will also be left on the surface of the wafer. The liquid left on the surface of the wafer can also drop on the anti-splashing liquid device 100, so that the anti-splashing liquid device 100 can also prevent the liquid drops dropped after the wafer is cleaned from splashing on the chuck 400 and the like.

[0046] According to the wafer vertical cleaning device 1000 of the present application, the anti-splashing liquid device 100 is arranged above the drain 230 of the bottom plate 220 of the wafer vertical cleaning device 1000 and has at least one guide plate 20, so that the liquid drops can drop on the guide plate 20 of the anti-splashing liquid device 100 and the direct dropping of the liquid on the bottom plate 220 of the wafer vertical cleaning device 1000 is avoided as much as possible. The first included angle between the plane where the guide plate 20 is located and the vertical plane is that the guide plate 20 is arranged obliquely. When the liquid drops on the guide plate 20, the guide plate 20 can guide the liquid drops dropped by the wafer to impact the surface of the guide plate 20 at a more tangent angle and catch the liquid drops, preventing splashing caused by the nearly vertical impact angle and avoiding pollution of the environment in the processing chamber 210. The liquid drops can flow through the gap between the guide plates 20 to the drain 230 to be drained away, thereby ensuring that the anti-splashing liquid device does not accumulate liquid and can continuously play the anti-splashing liquid function. The anti-splashing liquid device can be conveniently maintained and replaced through the maintenance door 240, and the anti-splashing effect is ensured.

[0047] The liquid droplets will not splash back to the chuck 400 and other locations, and will not contaminate the environment in the processing chamber 210, so that after the wafer is placed on the chuck 400, the chuck moves to cause the contaminants in the liquid droplets splashed by the liquid to float into the air and re-adhere to the wafer, thereby contaminating the surface of the wafer and reducing the cleaning effect of the wafer.

[0048] Correspondingly, as described above, after the wafer is cleaned in the processing chamber 210 of the wafer vertical cleaning device 1000, liquid will also remain on the surface of the wafer, and the liquid remaining on the surface of the wafer can also drop on the splash-proof liquid device 100, so that the splash-proof liquid device 100 can also prevent the liquid droplets splashed by the liquid dropped after the wafer is cleaned from splashing on the chuck 400 and other structures.

[0049] As shown in Figure 3 and Figure 4 , the upper part of the guide plate 20 extends towards the chuck 400, and the end face of the upper part of the guide plate 20 is parallel to the plane where the chuck 400 is located. Specifically, the plane where the chuck 400 is located is a vertical plane, the end face of the upper part of the guide plate 20 is located in the vertical plane, and the two vertical planes are parallel, so that the liquid droplets dropped from the wafer can be prevented from splashing by the splash-proof liquid device 100. The liquid is prevented from splashing on the surface of the chuck 400.

[0050] In some embodiments of the present application, as shown in Figure 3 , the upper part of the guide plate 20 extends away from the chuck 400, and the end face of the upper part of the guide plate 20 is parallel to the plane where the chuck 400 is located. That is, the splash-proof liquid device 100 is arranged as shown in Figure 3 , the guide plate 20 extends away from the position where the chuck 400 is located. Thus, the liquid droplets dropped from the wafer can still achieve the effect of preventing splashing by the splash-proof liquid device 100.

[0051] The present application is not limited to the above two orientations of the guide plate 20. The orientation of the guide plate 20 relative to the vertical plane can also be set to other inclined directions, and according to the design needs in actual use, the liquid droplets dropped from the wafer can be stably dropped on the splash-proof liquid device 100.

[0052] In some embodiments of the present application, as shown in Figure 2As shown, the projection of the guide plate 20 of the liquid splash-proof device 100 on the horizontal plane at least partially overlaps the projection of the wafer held by the robot. That is, the wafer held by the robot and the guide plate 20 have a height difference in the height direction, and the wafer and the guide plate 20 partially overlap in the horizontal position. Thus, when the chuck 400 holds the wafer, or when the wafer is inside the processing chamber 210, the liquid droplets dripping from the wafer can all be received by the liquid splash-proof device 100, and the liquid cannot directly drip onto the bottom plate 220 of the processing chamber 210. Thus, the liquid splash-proof effect of the liquid splash-proof device 100 is ensured.

[0053] In some embodiments of the present application, as shown in Figure 3 and Figure 4 As shown, the end surface of the upper portion of the guide plate 20 is parallel to the vertical plane, and the end surface of the lower portion of the guide plate 20 is parallel to the horizontal plane. It should be noted that, in this document, the upper portion of the guide plate 20 refers to the side of the guide plate 20 facing upwards, and the lower portion of the guide plate 20 refers to the side of the guide plate 20 facing downwards. In the liquid splash-proof device 100 of the embodiments of the present application, the guide plate 20 has a thickness, the end of the upper portion of the guide plate 20 has an end surface, and the end of the lower portion of the guide plate 20 also has an end surface. The end surface of the upper portion of the guide plate 20 is parallel to the vertical plane.

[0054] Therefore, it can be understood that the end surface of the upper portion of the guide plate 20 is a vertical plane. Thus, when the liquid on the wafer drips, if the position where the liquid drips corresponds to the end surface of the upper portion of the guide plate 20, the liquid can drip onto the surface of the guide plate 20 facing upwards at a more tangential angle, or drip onto the end surface of the upper end of the guide plate 20, thereby preventing splashing.

[0055] As shown in Figure 3 and Figure 4 As shown, the projection of the end surface of the lower portion of the guide plate 20 on the vertical plane is within the projection area of the fixed block 10 on the vertical plane. That is, the position of the lower portion of the guide plate 20 does not exceed the lower edge of the fixed block 10. Moreover, the end surface of the lower portion of the guide plate 20 is also within the coverage area of the fixed block 10 on the vertical plane, and does not exceed the lower edge of the fixed block 10. Therefore, the overall structure of the liquid splash-proof device 100 is supported by the two fixed blocks 10, which can better ensure the stability of the liquid splash-proof device 100 during use.

[0056] The fixed block is detachably arranged in the box through the horizontally arranged sliding slot, and when maintenance is performed through the maintenance door 240, the fixed block 10 and the guide plate 20 can be integrally removed for maintenance.

[0057] In some embodiments of the present application, as shown in Figure 3 and Figure 4As shown, the splash-proof liquid device 100 includes a plurality of guide plates 20, each of which is arranged between two fixed blocks 10, the plurality of guide plates 20 are parallel to each other, and the end faces of the lower parts of the plurality of guide plates 20 are located in the same plane.

[0058] Specifically, the lower end faces of the plurality of guide plates 20 are located in the same plane, so that the plurality of guide plates 20 are arranged at the same height. The plurality of guide plates 20 can enable the splash-proof liquid device 100 to perform splash-proof treatment on liquids in a larger area. At the same time, the plurality of guide plates 20 are parallel to each other, so that when the liquid drops, it can stably drop on the surface of the guide plate 20 facing upwards or the end face of the upper part of the guide plate 20, improving the splash-proof effect.

[0059] Referring to Figure 5 , the vertical center position of the guide plate 20 is provided with a rotating shaft, and the guide plate 20 is arranged on the fixed block 10 by rotating the rotating shaft; the plurality of guide plates 20 are connected in series by a horizontally arranged cross bar 40, and the cross bar 40 is arranged in the accommodating cavity 11 of the fixed block 10, so as to adjust the inclination angle of the guide plate 20 through the cross bar 40. By adjusting the inclination angle of the guide plate 20, the angle or overlapping condition of the guide plate 20 can be adjusted according to the splash direction of the liquid in the chamber, so as to achieve a better splash-proof effect.

[0060] Specifically, the splash-proof liquid device 100 includes a door plate 30 adapted to the maintenance door 240, the door plate 30 is fixedly connected with the fixed block 10, and the door plate 30 includes a locking piece 31 arranged in a guide hole, the locking piece 31 has a locking position for clamping the cross bar 40 and an opening position away from the cross bar 40; the side wall of the maintenance door 240 is provided with a locking buckle corresponding to the position of the locking piece 31, for fixing the locking piece 31 in the locking position, so as to lock the fixed block 10 and the cross bar 40.

[0061] The locking piece 31 can be movable or rotatable, both of which are within the protection scope of the present application, Figure 5 and a movable type is taken as an example for description.

[0062] If the locking piece 31 is a movable locking piece 31, the guide hole can be a long strip-shaped guide hole parallel to the guide plate 20, and the end of the long strip-shaped guide hole of the locking piece 31 away from the fixed block 10 is the opening position, and the end close to the fixed block 10 is the locking position, as shown by the arrow in Figure 3 When in the locking position, the locking piece 31 is clamped with the cross bar 40 and can be fixed by the locking buckle.

[0063] If the locking piece 31 is a rotating locking piece 31, the guide hole can be arc-shaped, the locking piece 31 is in an open position at one end of the arc-shaped guide hole away from the fixed block 10, and is in a locking position after being rotated to the other end close to the fixed block 10. When in the locking position, the locking piece 31 can be in limited contact with the cross rod 40 through the clamping groove, and the locking piece 31 can be fixed through the locking buckle.

[0064] In addition, the locking piece 31 is in limited contact or clamped with the cross rod 40, and passes through the fixed block 10 and the side wall of the box body, so that the fixed block 10 and the cross rod 40 can be limited by the locking piece 31 at the same time, which is simple in structure and convenient to operate.

[0065] In some embodiments of the present application, as shown in Figure 4 , Figure 3 , the first included angle is between 10° and 45°. Specifically, the plurality of guide plates 20 are parallel to each other, and the first included angle between each guide plate 20 and the vertical plane is between 10° and 45°, so that the projection of the plurality of guide plates 20 on the horizontal plane has partial overlap, thereby allowing the falling liquid droplets to fall on the surface of the guide plate 20 facing upwards or the end surface of the upper part of the guide plate 20, thereby preventing the liquid from splashing onto the chuck 400 and other structures after falling.

[0066] Further, in some embodiments of the present application, as shown in Figure 4 , Figure 3 , the first included angle can be further selected to be between 20° and 35°, so that the guide plate 20 has an inclination angle, and the projections of the adjacent two guide plates 20 on the horizontal plane have overlap, preventing the falling liquid droplets from directly falling through the guide plate 20 onto the bottom plate 220 of the processing chamber 210.

[0067] In some embodiments of the present application, as shown in Figure 4 , Figure 3 , the parallel spacing between the adjacent two guide plates 20 is between 3mm and 20mm.

[0068] Specifically, as mentioned above, the plurality of guide plates 20 are parallel to each other, and the parallel spacing between the adjacent two guide plates 20 is between 3mm and 20mm. This can make the liquid fall along the surface above the guide plate 20 and fall to the bottom of the processing chamber 210.

[0069] If the parallel spacing between the two adjacent guide plates 20 is greater than 20mm, the projections of the adjacent two guide plates 20 on the horizontal plane do not overlap, which means that the two adjacent guide plates 20 have a spacing between the horizontal planes, so that the liquid can directly fall through the spacing to the bottom plate 220 of the processing chamber 210 after falling.

[0070] Correspondingly, if the interval between two adjacent guide plates 20 is small, the arrangement of the plurality of guide plates 20 is dense, and after the liquid drops, due to the small horizontal interval between the two adjacent guide plates 20, the liquid may slide along the upwardly facing surface of the guide plate 20 downwardly, causing the liquid to be discharged smoothly, and after the subsequent liquid drops, the liquid collides with the previously discharged liquid, causing the liquid to splash.

[0071] Wherein, the horizontal interval of two adjacent guide plates 20 can be further selected from 5mm to 10mm, thereby ensuring that the liquid slides along the guide plate 20 to the bottom of the processing chamber 210 after the liquid drops, and preventing the small parallel interval between the two adjacent guide plates 20 from affecting the discharge of the liquid.

[0072] As can be appreciated by those skilled in the art, in geometry, two straight lines or two planes can be called parallel when they have no common point in the plane or space. For two parallel plates, the parallel interval between them can be measured by drawing a straight line on one plate perpendicular to the plate, which will pass through the other plate and be perpendicular to that plate. Since each of the two parallel plates has an intersection with the straight line, the distance between the two intersections is the parallel interval between the two parallel plates. This definition is applicable not only to plane geometry but also to spatial geometry for clear calculation and processing of the distance between two parallel objects.

[0073] It should be noted that, as shown in Figure 4 , Figure 2 , the parallel interval refers to the interval between two parallel guide plates 20. A straight line is drawn on one guide plate 20 perpendicular to the surface of the guide plate 20, which passes through the surface of the other guide plate 20 and is perpendicular to it. Each of the two guide plates 20 has an intersection with the straight line, and the distance between the two intersections is the parallel interval between the two parallel guide plates 20. The parallel interval is shown as the interval D in Figure 3 and Figure 3 .

[0074] In some embodiments of the present application, as shown in Figure 4 , Figure 3 , the projections of the two adjacent guide plates 20 on the horizontal plane at least partially overlap, and the width of the overlapping projection area is greater than or equal to 1mm. Specifically, the projections of the two adjacent guide plates 20 on the horizontal plane have overlapping portions, i.e. Figure 4 , Figure 3As shown in region S, the width of the overlapping portion of the projected areas is greater than or equal to 1 mm. This ensures that droplets falling from above will land directly on the upward-facing surface of the guide plate 20 or the upper end face of the guide plate 20, preventing liquid from dripping directly onto the bottom plate 220 of the processing chamber 210. The width of the overlapping projected area is... Figure 4 , Figure 3 The width of region S shown in the figure.

[0075] Furthermore, in some embodiments of the present invention, such as Figure 4 , Figure 3 As shown, the width of the overlapping projection area of ​​two adjacent guide plates 20 on the horizontal plane is between 2mm and 5mm. Specifically, the width of the projection of two adjacent guide plates 20 on the horizontal plane can be between 2mm and 5mm, which ensures that the distance between the two adjacent guide plates 20 is sufficient to allow liquid droplets to slide smoothly onto the guide plates 20 and drain to the bottom of the processing chamber 210. It also ensures that the liquid droplets fall onto the guide plates 20.

[0076] In some embodiments of the present invention, the anti-splash device 100 has six guide plates 20. The width of the overlapping portion of the projection of two adjacent guide plates 20 on the horizontal plane is 3 mm, the first included angle between the guide plate 20 and the vertical plane is 30°, and the parallel spacing between two adjacent guide plates 20 is 5 mm. Thus, droplets falling from above will directly drip onto the upward-facing surface of the guide plate 20 or the upper end face of the guide plate 20, instead of directly dripping onto the bottom plate 220 of the processing chamber 210. Because the liquid drips onto the upward-facing surface of the guide plate 20 or the upper end face of the guide plate 20 at a closer tangential angle, splashing during liquid dripping is prevented. Furthermore, the liquid can smoothly pass through the gap between two adjacent guide plates 20 and be drained away through the drainage structure at the bottom of the processing chamber 210, preventing liquid accumulation between two adjacent guide plates 20 and thus avoiding affecting the anti-splash effect.

[0077] In some embodiments of the present invention, such as Figure 4 , Figure 3 As shown, the guide plate 20 and the inner walls of the two fixing blocks 10 are connected by at least one method, namely welding or bolting. Specifically, the connection between the guide plate 20 and the fixing blocks 10 can be welding, which ensures a stable connection between the guide plate 20 and the fixing blocks 10, guaranteeing the overall strength and operational stability of the splash-proof device 100. Alternatively, the connection between the guide plate 20 and the fixing blocks 10 can be bolted, allowing the entire splash-proof device 100 to be disassembled for easy transportation and storage, reducing space occupation during storage, and enabling replacement of individual fixing blocks 10 or guide plates 20 if damaged, thus reducing maintenance costs.

[0078] In addition, the connection between the fixed block 10 and the guide plate 20 can also be in the form of clamping, insertion, bonding, etc., and can be designed according to actual use requirements.

[0079] As shown in FIGS. 1 and 2, the guide plate 20 is in the shape of a rectangular plate with a thickness, and the length of the guide plate 20 extends in the direction parallel to the diameter of the wafer. Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure 3 Figure 4 Figure As shown in FIGS. 1 and 2, the guide plate 20 is in the shape of a rectangular plate with a thickness, and the length of the guide plate 20 extends in the direction parallel to the diameter of the wafer.

[0080] In some embodiments of the present application, the guide plate 20 can be in the shape of a rectangular plate with a thickness, and the length of the guide plate 20 extends in the direction parallel to the diameter of the wafer.

[0081] The above embodiments are only used to illustrate the present application, and are not intended to limit the present application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, all equivalent technical solutions also belong to the scope of the present application, and the patent protection scope of the present application should be defined by the claims.​

Claims

1. A wafer vertical cleaning apparatus, characterized by, The utility model relates to a wafer processing device, comprising: a box with a processing chamber inside, the bottom plate of the box is provided with a drain port; a drain net is arranged at the drain port; a chuck is arranged at the processing chamber to vertically clamp a wafer, the plane where the chuck is located is parallel to the vertical plane; a liquid splash prevention device is located above the drain port and covers the drain port, the liquid splash prevention device comprises two fixed blocks which are detachably arranged in the box, and at least one guide plate which is arranged between the two fixed blocks, the projection of the wafer clamping position on the vertical plane is located in the projection area of the guide plate on the vertical plane, the plane where the guide plate is located has a first included angle with the vertical plane to catch and guide the liquid drops dropped by the wafer to the drain port; a maintenance door is arranged on the side wall of the box opposite to the position of the liquid splash prevention device for maintaining the liquid splash prevention device.

2. The wafer vertical cleaning apparatus of claim 1, wherein, The end surface of the upper part of the guide plate is parallel to the vertical plane, the end surface of the lower part of the guide plate is parallel to the horizontal plane, and the projection of the end surface of the lower part of the guide plate on the vertical plane is located in the projection area of the fixed block on the vertical plane.

3. The wafer vertical cleaning apparatus of claim 2, wherein, The fixed block is detachably arranged in the box through a horizontally arranged sliding slot.

4. The wafer vertical cleaning apparatus of claim 2, wherein, The liquid splash prevention device comprises a plurality of guide plates, the plurality of guide plates are arranged between the two fixed blocks, the plurality of guide plates are parallel to each other, and the end surfaces of the lower parts of the plurality of guide plates are located on the same plane.

5. The wafer vertical cleaning apparatus of claim 4, wherein, A rotating shaft is arranged at the vertical center position of the guide plate, and the guide plate is rotatably arranged on the fixed block through the rotating shaft. The plurality of guide plates are connected in series through a horizontally arranged cross bar, the cross bar is arranged in the accommodating cavity of the fixed block to adjust the inclination angle of the guide plate through the cross bar.

6. The wafer vertical cleaning apparatus of claim 5, wherein, The liquid splash prevention device comprises a door plate matched with the maintenance door, the door plate is fixedly connected with the fixed block, the door plate comprises a locking member arranged in a guide hole, the locking member has a locking position for clamping the cross bar and an opening position away from the cross bar; The side wall of the maintenance door is provided with a locking buckle corresponding to the position of the locking member to fix the locking member in the locking position to lock the fixed block and the cross bar.

7. The wafer vertical cleaning apparatus according to any one of claims 1 to 6, wherein The angle of the first included angle is between 10° and 45°.

8. The wafer vertical cleaning apparatus of claim 7, wherein, The angle of the first included angle is between 20° and 35°.

9. The wafer vertical cleaning apparatus of claim 7, wherein, The parallel distance between the two adjacent guide plates is between 3mm and 20mm.

10. The wafer vertical cleaning apparatus of claim 9, wherein, The projections of the two adjacent guide plates on the horizontal plane at least partially coincide, and the width of the coinciding projection area is greater than or equal to 1mm.

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