Loading mechanism
By combining a vacuum pump and suction pipe with a loading slot, the problem of quality degradation caused by the outer wall workpiece during wafer dicing was solved, achieving efficient positioning and dicing and improving the overall yield of wafers.
Patent Information
- Application Number
- CN202520223161.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-12
AI Technical Summary
In the existing wafer dicing process, the limiting workpieces on the outer wall of the wafer cause a decrease in the quality of the chips in the edge area, which affects the overall yield.
The design employs a vacuum pump and suction pipe combined with a loading tank, using adsorption force to position the wafer, avoiding the need to add workpieces to the outer wall of the wafer. Combined with an adjustment plate to guide airflow, the wafer can be rotated and cut, improving positioning accuracy and cutting efficiency.
This enables efficient wafer positioning and cutting, improves wafer yield, and avoids quality degradation caused by external workpieces.
Smart Images
Figure CN223680086U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a carrying mechanism and belongs to the field of carrying mechanism. BACKGROUND
[0002] Wafer cutting is the wafer cutting into multiple independent dies through multiple process treatments, and the dies usually contain complete circuit functions and are the core components for manufacturing electronic products, and the process is to butt joint the wafer by using a wire butt joint machine, the wire butt joint machine is internally provided with a carrying mechanism for clamping the wafer, the carrying mechanism drives the wafer to move to one side of the wire cutting machine, the wire cutting machine can cut the wafer, after the wafer cutting is completed, the carrying mechanism drives the wafer to move downward through the electric telescopic rod, when the wafer is located above the storage box, the carrying mechanism no longer clamps the wafer, and then the cut wafer can be stored.
[0003] However, the carrying mechanism in the prior art is provided with a groove with the same shape as the limiting workpiece arranged on the top of the wafer at the bottom of the carrying platform, so that the limiting workpiece on the top of the wafer is clamped with the groove to realize the fixation, and the existence of the edge effect and the unevenness in processing when the workpiece is arranged on the outer wall of the wafer can cause the quality of the chips in the edge region of the wafer to be reduced, thereby causing the overall yield to be reduced. UTILITY MODEL CONTENT
[0004] In view of the deficiencies in the prior art, the utility model aims to provide a carrying mechanism to solve the problems in the background art, and the utility model realizes that the positioning process of the device does not need to add a workpiece to the outer wall of the wafer, the quality of the wafer is not affected, and the overall yield of the wafer is improved.
[0005] In order to achieve the above-mentioned purpose, the utility model is implemented by the following technical scheme: a carrying mechanism, comprising a base, the top of the base is fixedly connected with a butt joint box, one side of the butt joint box is provided with a butt joint groove, the inner top wall of the butt joint groove is provided with a moving platform body, the bottom of the moving platform body is fixedly connected with an electric telescopic rod, the bottom of the electric telescopic rod is fixedly connected with a carrying table, the bottom of the carrying table is provided with a carrying groove, and the top of the carrying table is fixedly connected with a vacuum pump.
[0006] The outer wall of the vacuum pump is provided with an air inlet, and the air inlet is fixedly connected with a suction pipe, one side of the carrying table is provided with a vacuum groove, the inner top wall of the vacuum groove is provided with a suction port, the inner wall of the vacuum groove is provided with an adjusting port, and the inner wall of the adjusting port is provided with a turning part.
[0007] Further, the carrying groove is a "semicircle" structure, and the outer wall of the vacuum pump is provided with an air outlet.
[0008] Further, one end of the air suction pipe penetrates the object table and extends to the inside of the vacuum groove, and the air suction pipe is fixedly connected with the object table.
[0009] Further, the turning component comprises an auxiliary rod rotatably connected to the inner wall of the adjusting port, and one end of the auxiliary rod is fixedly connected with an adjusting direction plate.
[0010] Further, a groove is formed in the outer wall of the adjusting direction plate, and a motor is fixedly connected to the inner wall of the groove, and an output end of the motor is fixedly connected with a connecting rod through a shaft coupling.
[0011] Further, one end of the connecting rod is fixedly connected with a mounting rod, and one end of the mounting rod is fixedly connected with the inner wall of the adjusting port.
[0012] The beneficial effects of the present application are as follows:
[0013] 1. By placing one half of the wafer into the inside of the object groove, starting the vacuum pump, the vacuum pump will extract air from the air suction pipe, and then the air suction of the vacuum groove will be extracted, and since the inner wall of the vacuum groove is provided with an adsorption port, the air in the object groove will enter the vacuum groove through the adsorption port, thereby generating an adsorption force in the object groove, and when a part of the wafer is placed into the inside of the object groove, the adsorption force will adsorb the wafer, thereby positioning the wafer in the inside of the object groove, and the quality of the wafer will not be affected, and the yield of the wafer will be improved.
[0014] 2. By adjusting the direction plate, the direction of the air flow can be guided, so that the air will enter the vacuum groove along the adjusting direction plate, thereby realizing an air flow in the inner wall of the object groove in the direction of the adjusting port, and the wafer will rotate along the air flow, thereby enabling the part located in the inside of the object groove to rotate to the outside of the object groove, thereby enabling the part of the wafer that has not been cut by the wire to be cut, thereby making it more convenient to cut the wafer. BRIEF DESCRIPTION OF DRAWINGS
[0015] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:
[0016] Figure 1 Fig. 1 is a structural schematic view of the object carrying mechanism of the present application;
[0017] Figure 2 Fig. 2 is a schematic view of the internal structure of the object table in the object carrying mechanism of the present application;
[0018] Figure 3 Fig. 3 is an enlarged view of the structure at A in Fig. 2; Figure 2
[0019] Figure 4 This is a schematic diagram of an adjusting direction plate in a loading mechanism according to the present invention;
[0020] Figure 5 for Figure 4 Enlarged view of the structure at point B.
[0021] In the diagram: 1. Docking box; 2. Mobile platform body; 3. Electric telescopic rod; 4. Loading platform; 5. Docking groove; 6. Air outlet; 7. Suction pipe; 8. Loading groove; 9. Adsorption port; 10. Vacuum tank; 11. Adjustment port; 12. Auxiliary rod; 13. Adjustment direction plate; 14. Groove; 15. Motor; 16. Connecting rod; 17. Mounting rod; 18. Base; 19. Vacuum pump. Detailed Implementation
[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0023] Please see Figures 1-5 This utility model provides a technical solution: a loading mechanism, including a base 18, a docking box 1 fixedly connected to the top of the base 18, a docking groove 5 opened on one side of the docking box 1, a moving platform body 2 provided on the inner top wall of the docking groove 5, the moving platform body 2 being an existing device, which will not be explained in detail here, an electric telescopic rod 3 fixedly connected to the bottom of the moving platform body 2, and a loading platform 4 fixedly connected to the bottom of the electric telescopic rod 3, the moving platform body 2 can drive the loading platform 4 to move to the outside of the docking groove 5 through the electric telescopic rod 3, thereby... The position of the wafer at the bottom of the stage 4 can be changed. The wafer passes one side of the wire cutting machine, which will cut the wafer. After the wafer is cut, the moving platform body 2 can move the stage 4 to change its position again. The stage 4 is used to move the wafer to the position required for the next process. The bottom of the stage 4 is provided with a loading groove 8, and the top of the stage 4 is fixedly connected to a vacuum pump 19. The vacuum pump 19 is an existing device and will not be explained in detail here. The vacuum pump 19 is a pump with strong suction force, and its model is "VT4.40".
[0024] The outer wall of the vacuum pump 19 is provided with an air inlet, and the air inlet is fixedly connected to the suction pipe 7. A vacuum tank 10 is provided on one side of the stage 4. An adsorption port 9 is provided on the inner top wall of the vacuum tank 10. When the vacuum pump 19 is started, the vacuum pump 19 will draw air from the suction pipe 7, and the air in the vacuum tank 10 will be drawn out. Since the inner wall of the vacuum tank 10 is provided with the adsorption port 9, the air inside the stage 8 will enter the vacuum tank 10 through the adsorption port 9, thereby creating an adsorption force in the stage 8. An adjustment port 11 is provided on the inner wall of the vacuum tank 10, and a steering component is provided on the inner wall of the adjustment port 11.
[0025] The carrier tank 8 is a "half circle" structure, and the outer wall of the vacuum pump 19 is provided with an air outlet 6. Since the wafer is mostly circular in structure, one half of the wafer can be placed inside the carrier tank 8.
[0026] One end of the air suction pipe 7 penetrates the carrier table 4 and extends into the inside of the vacuum tank 10, and the air suction pipe 7 is fixedly connected with the carrier table 4. When the vacuum pump 19 is started, the vacuum pump 19 will suck air from the air suction pipe 7, and the air in the vacuum tank 10 will be sucked. Since the inner wall of the vacuum tank 10 is provided with a suction port 9, the air in the carrier tank 8 will enter the vacuum tank 10 through the suction port 9, so that there is a suction force in the carrier tank 8. When a part of the wafer is placed inside the carrier tank 8, the suction force will suck the wafer, so that the wafer is positioned in the carrier tank 8. The device does not need to add a workpiece to the outer wall of the wafer during the positioning process of the wafer, and the quality of the wafer will not be affected, thereby improving the yield of the wafer.
[0027] The turning component includes an auxiliary rod 12 rotatably connected to the inner wall of the adjusting port 11. One end of the auxiliary rod 12 is fixedly connected with an adjusting direction plate 13. The auxiliary rod 12 can support the adjusting direction plate 13. The adjusting direction plate 13 will block the adjusting port 11, so that the adjusting port 11 will not have a suction effect on the inside of the carrier tank 8.
[0028] The outer wall of the adjusting direction plate 13 is provided with a groove 14. The inner wall of the groove 14 is fixedly connected with a motor 15. The output end of the motor 15 is fixedly connected with a connecting rod 16 through a shaft coupling. After the part of the wafer outside the carrier tank 8 is cut by the wire, the motor 15 can be started. The output end of the motor 15 drives the connecting rod 16 to rotate through the shaft coupling.
[0029] One end of the connecting rod 16 is fixedly connected with a mounting rod 17. The other end of the mounting rod 17 is fixedly connected with the inner wall of the adjusting port 11. The rotation of the connecting rod 16 will give the mounting rod 17 a rotating force. Since one end of the mounting rod 17 is fixedly connected with the inner wall of the adjusting port 11, the motor 15 will be subjected to a counterforce through the interaction of forces. The adjusting direction plate 13 will rotate, and the adjusting port 11 will leak out a gap. The adjusting direction plate 13 is in an inclined state, so that the adjusting direction plate 13 can guide the direction of the air flow. The air will enter the vacuum tank 10 along the adjusting direction plate 13, so that there is an air flow in the adjusting port 11. The wafer will rotate along the air flow, so that the part inside the carrier tank 8 can be rotated to the outside of the carrier tank 8. The part of the wafer that has not been cut by the wire can be cut, thereby making it more convenient to cut the wafer.
[0030] Working principle: first, the half of the wafer is placed in the inside of the carrier groove 8, start the vacuum pump 19, the vacuum pump 19 will be drawn to the suction pipe 7, and then the suction of the vacuum tank 10 will be drawn, because the inner wall of the vacuum tank 10 is provided with adsorption port 9, and then the air in the carrier groove 8 will enter the vacuum tank 10 through the adsorption port 9, so that the carrier groove 8 has an adsorption force, and then when a part of the wafer is placed in the inside of the carrier groove 8, the adsorption force will adsorb the wafer, so that the wafer is positioned in the inside of the carrier groove 8, realizing the positioning process of the device to the wafer without adding workpiece to the outer wall of the wafer, and the quality of the wafer will not be affected;
[0031] Secondly, when the part of the wafer outside the carrier groove 8 is completed by wire cutting, the motor 15 can be started, the output end of the motor 15 drives the connecting rod 16 to rotate through the coupling, and then the mounting rod 17 has a rotating force, because one end of the mounting rod 17 is fixedly connected to the inner wall of the adjusting port 11, and then through the mutual action of force, the motor 15 will be subjected to a reaction force, so that the adjusting direction plate 13 will rotate, and then the adjusting port 11 will leak the gap;
[0032] Finally, the adjusting direction plate 13 is in an inclined state, so that the adjusting direction plate 13 can guide the direction of the airflow, so that the air will enter the vacuum tank 10 along the adjusting direction plate 13, so that the inner wall of the carrier groove 8 has an airflow in the direction of the adjusting port 11, so that the wafer will rotate along the airflow, so that the part located in the inside of the carrier groove 8 can be rotated to the outside of the carrier groove 8, so that the part of the wafer not cut by the wire can be cut, so that the wafer can be cut more conveniently.
[0033] Although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.
Claims
1. A carrier mechanism comprising a base (18), characterised in that: The top of the base (18) is fixedly connected with a docking box (1), one side of the docking box (1) is provided with a docking groove (5), the inner top wall of the docking groove (5) is provided with a moving platform body (2), the bottom of the moving platform body (2) is fixedly connected with an electric telescopic rod (3), the bottom of the electric telescopic rod (3) is fixedly connected with a loading table (4), the bottom of the loading table (4) is provided with a loading groove (8), and the top of the loading table (4) is fixedly connected with a vacuum pump (19). The outer wall of the vacuum pump (19) is provided with an air inlet, and the air inlet is fixedly connected with a suction pipe (7), one side of the loading table (4) is provided with a vacuum groove (10), the inner top wall of the vacuum groove (10) is provided with a suction port (9), the inner wall of the vacuum groove (10) is provided with an adjusting port (11), and the inner wall of the adjusting port (11) is provided with a turning part.
2. The carrier mechanism of claim 1, wherein: The loading groove (8) is a "semicircle" structure, and the outer wall of the vacuum pump (19) is provided with an air outlet (6).
3. The carrier mechanism of claim 1, wherein: One end of the suction pipe (7) penetrates through the loading table (4) and extends to the inside of the vacuum groove (10), and the suction pipe (7) is fixedly connected with the loading table (4).
4. The carrier mechanism of claim 1, wherein: The turning part comprises an auxiliary rod (12) rotatably connected to the inner wall of the adjusting port (11), and one end of the auxiliary rod (12) is fixedly connected with an adjusting direction plate (13).
5. A carrier mechanism according to claim 4, wherein: The outer wall of the adjusting direction plate (13) is provided with a groove (14), the inner wall of the groove (14) is fixedly connected with a motor (15), and the output end of the motor (15) is fixedly connected with a connecting rod (16) through a shaft coupling.
6. A carrier mechanism according to claim 5, wherein: One end of the connecting rod (16) is fixedly connected with a mounting rod (17), and one end of the mounting rod (17) is fixedly connected with the inner wall of the adjusting port (11).