Multi-wafer jacking mechanism
By designing a multi-wafer lifting mechanism and high-temperature resistant non-metallic ejector pins, the problems of low efficiency and metal contamination in single-wafer lifting mechanisms are solved, achieving efficient and stable wafer heat treatment.
Patent Information
- Application Number
- CN202422661387.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-11-01
AI Technical Summary
Existing single-piece metal ejector wafer lifting mechanisms are inefficient, may damage the wafer and cause metal contamination, have low heat resistance, and affect the stability of heat treatment processes.
The multi-wafer lifting mechanism uses a high-temperature resistant non-metallic material ejector pin assembly, combined with a precision linear module and sensors, to achieve simultaneous lifting of multiple wafers, ensuring accurate wafer positioning without damage.
It improves production efficiency, avoids wafer damage and metal contamination, and ensures the stability of the heat treatment process and the normal operation of the equipment.
Smart Images
Figure CN223680089U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer production technical field, concretely is a kind of multi wafer jacking mechanism. BACKGROUND
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuit, its shape is circular, is the basic material of manufacturing integrated circuit (IC) or chip. Various circuit element structures can be processed on the silicon wafer, and become IC product with specific electrical function.
[0003] Wafer needs to use jacking mechanism in production process, conventional jacking mechanism is usually single piece jacking, and efficiency is lower, the material of needle is generally metal material, and metal needle may have certain damage to wafer bottom when contacting wafer, meanwhile, metal needle and wafer contact can leave part of metal trace, wafer can produce metal pollution after entering furnace body and heating, and there is certain risk to whole wafer heat treatment process, and the heat resistance temperature of metal needle is lower, can be influenced by wafer with higher temperature after heating, to cause part of deformation phenomenon of needle, to cause abnormality of overall jacking, therefore we need to propose a kind of multi wafer jacking mechanism. SUMMARY
[0004] The utility model aims at providing a kind of multi wafer jacking mechanism, adopt multi wafer jacking design, improve the production efficiency of equipment, to solve the problems proposed in the above background technology.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A kind of multi wafer jacking mechanism, including needle assembly A, needle assembly B, needle assembly C, needle mounting plate, needle lifting module, inductor and connecting rod, the needle mounting plate is installed on the mobile end of needle lifting module, the needle assembly A, needle assembly B, needle assembly C are all fixedly installed on needle mounting plate, the needle assembly A, needle assembly B, needle assembly C are arranged in stepped type, the inductor is installed on one side of needle mounting plate.
[0007] Preferably, the needle lifting module includes L-shaped assembly frame, one side surface of the L-shaped assembly frame is fixedly installed with linear module, the mobile end of the linear module is fixedly installed with L-shaped fixed frame, one side of the L-shaped fixed frame is symmetrically fixedly installed with four groups of fixed rods, one end of four groups of the fixed rods is fixedly installed with connecting plate, and the needle mounting plate is installed on one side of the connecting plate.
[0008] Preferably, the L-shaped assembly frame is fixedly installed with first reinforcing frame on one side, and the L-shaped fixed frame is fixedly installed with second reinforcing frame on one side.
[0009] Preferably, the three sets of the ejector pin assembly A are arranged at the same height and on the same line, the three sets of the ejector pin assembly B are arranged at the same height and on the same line, and the three sets of the ejector pin assembly C are arranged at the same height and on the same line.
[0010] Preferably, the heights of the ejector pin assembly A, the ejector pin assembly B and the ejector pin assembly C are arranged in sequence.
[0011] Preferably, each of the ejector pin assembly A, the ejector pin assembly B and the ejector pin assembly C is composed of three ejector pins arranged in a triangle, and the ejector pins are made of high-temperature-resistant non-metallic materials.
[0012] Preferably, the inductor is provided with two groups, one of which is arranged between the ejector pin assembly A and the ejector pin assembly B, and the other of which is arranged between the ejector pin assembly B and the ejector pin assembly C.
[0013] Preferably, one side of the ejector pin mounting plate is fixedly provided with four connecting rods, and one end of each of the four connecting rods is fixedly connected to one side of the connecting plate.
[0014] Compared with the prior art, the utility model has the advantages that:
[0015] The utility model discloses a plurality of wafer top-up designs, which are matched with the ejector pin lifting module, greatly improve the production efficiency of the equipment, and the ejector pins are made of high-temperature-resistant non-metallic materials, so that the wafer is not polluted, the normal work of the top-up is ensured, the wafer is not damaged or influenced, and the process stability of the wafer heat treatment process is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a side view of the three-dimensional structure schematic diagram of the utility model;
[0017] Figure 2 It is a front view of the three-dimensional structure schematic diagram of the utility model;
[0018] Figure 3 It is a structure schematic diagram of the ejector pin lifting module of the utility model;
[0019] Figure 4 It is a structure schematic diagram of the ejector pin mounting plate of the utility model.
[0020] In the drawing: 1, ejector pin assembly A; 2, ejector pin assembly B; 3, ejector pin assembly C; 4, ejector pin mounting plate; 5, ejector pin lifting module; 51, L-shaped assembly frame; 52, linear module; 53, L-shaped fixed frame; 54, fixed rod; 55, connecting plate; 56, first reinforcing frame; 57, second reinforcing frame; 6, inductor; 7, connecting rod. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the utility model.
[0022] Please refer to Figures 1-4 The utility model provides a technical scheme:
[0023] A multi wafer lifting mechanism, including the needle assembly A1, the needle assembly B2, the needle assembly C3, the needle mounting plate 4, the needle lifting module 5, the inductor 6 and the connecting rod 7, the needle mounting plate 4 is installed on the mobile end of the needle lifting module 5, the needle assembly A1, the needle assembly B2, the needle assembly C3 are all fixedly installed on the needle mounting plate 4, the needle assembly A1, the needle assembly B2, the needle assembly C3 are arranged in a stepped type, the inductor 6 is installed on one side of the needle mounting plate 4.
[0024] The needle lifting module 5 includes the L-shaped assembly frame 51, one side surface of the L-shaped assembly frame 51 is fixedly installed with the linear module 52, the linear module 52 is arranged as a precision linear module, the mobile end of the linear module 52 is fixedly installed with the L-shaped fixing frame 53, one side of the L-shaped fixing frame 53 is symmetrically fixedly installed with four groups of fixed rods 54, one end of the four groups of fixed rods 54 is fixedly installed with the connecting plate 55, and the needle mounting plate 4 is installed on one side of the connecting plate 55.
[0025] The needle lifting module 5 can control the needle mounting plate 4 and the needle assembly A1, the needle assembly B2 and the needle assembly C3 to perform lifting actions, and cooperate with the wafer robot to perform wafer picking and placing actions.
[0026] One side of the L-shaped assembly frame 51 is fixedly installed with the first reinforcing frame 56, and one side of the L-shaped fixing frame 53 is fixedly installed with the second reinforcing frame 57.
[0027] The first reinforcing frame 56 can reinforce the support strength of the L-shaped assembly frame 51, and the second reinforcing frame 57 can reinforce the support strength of the L-shaped fixing frame 53.
[0028] The needle assembly A1, the needle assembly B2 and the needle assembly C3 are all provided with three groups, the three groups of needle assembly A1 are located at the same height and on the same line, the three groups of needle assembly B2 are located at the same height and on the same line, and the three groups of needle assembly C3 are located at the same height and on the same line.
[0029] The heights of the needle assembly A1, the needle assembly B2 and the needle assembly C3 are sequentially increased.
[0030] Convenient for wafer robot to take and place material, the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3 can all lift 3 wafers.
[0031] Each group of the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3 is composed of three ejector pins, the three ejector pins are arranged in a triangle, and the ejector pins are made of high-temperature-resistant non-metallic materials.
[0032] It is worth noting that the heights of the ejector pins on the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3 are different, the three ejector pins arranged in a triangle form an ejector pin assembly for lifting a wafer, the ejector pins adopt a clamping fixing mode on both sides to ensure that the ejector pins will not loosen and fall off due to long-term use, causing abnormality of the entire lifting process.
[0033] The inductor 6 is provided with two groups, one group of inductors 6 is located between the ejector pin assembly A1 and the ejector pin assembly B2, and the other group of inductors 6 is located between the ejector pin assembly B2 and the ejector pin assembly C3.
[0034] The inductor 6 detects the through hole of the carrier disc to determine whether the carrier disc is deviated, ensures the accurate position of the carrier disc, prevents the interference between the ejector pin and the through hole of the carrier disc, causes the damage of the carrier disc and the ejector pin, and causes the loss of equipment property and the delay of shutdown
[0035] One side of the ejector pin mounting plate 4 is fixedly provided with four groups of connecting rods 7, one end of the four groups of connecting rods 7 is fixedly connected with one side of the connecting plate 55.
[0036] It is worth noting that the ejector pin mounting plate 4 serves as a reference for fixing the ejector pin assembly, and ensures the accurate position of the ejector pin assembly (a total of 9 groups of ejector pin assemblies are installed, and 9 wafers can be lifted at a time).
[0037] Working principle: when the wafer robot takes and places wafers, the ejector pin lifting module 5 lifts the ejector pin mounting plate 4 and the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3, after the wafer robot places 9 wafers in turn, the ejector pin lifting module 5 lowers the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3, so that the 9 wafers fall gently on the carrier disc;
[0038] After the heat treatment process of the wafer is completed, the furnace door handle extends the carrier disc, after the carrier disc is in place, the inductor 6 detects the position of the carrier disc, confirms that the carrier disc is in place, and then the ejector pin lifting module 5 lifts the ejector pin mounting plate 4 and the ejector pin assembly A1, the ejector pin assembly B2 and the ejector pin assembly C3, so as to lift the 9 wafers, the wafer is separated from the carrier disc, the wafer robot takes the wafers in turn, after the wafer taking action is completed, the ejector pin lifting module 5 is lowered to the original position, and waits for the next wafer lifting process.
[0039] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multi-wafer lifting mechanism, comprising a top pin assembly A (1), a top pin assembly B (2), a top pin assembly C (3), a top pin mounting plate (4), a top pin lifting module (5), a sensor (6) and a connecting rod (7), characterized in that: The needle mounting plate (4) is installed on the moving end of the needle lifting module (5), the needle assembly A (1), the needle assembly B (2) and the needle assembly C (3) are fixedly installed on the needle mounting plate (4), the needle assembly A (1), the needle assembly B (2) and the needle assembly C (3) are arranged in a stepped manner, and the inductor (6) is installed on one side of the needle mounting plate (4).
2. The multi-wafer lift mechanism of claim 1, wherein: The needle lifting module (5) comprises an L-shaped assembly frame (51), a linear module (52) is fixedly installed on one side surface of the L-shaped assembly frame (51), an L-shaped fixing frame (53) is fixedly installed on the moving end of the linear module (52), four groups of fixing rods (54) are fixedly installed on one side of the L-shaped fixing frame (53) in a symmetrical manner, a connecting plate (55) is fixedly installed on one end of the four groups of fixing rods (54), and the needle mounting plate (4) is installed on one side of the connecting plate (55).
3. The multi-wafer lift mechanism of claim 2, wherein: A first reinforcing frame (56) is fixedly installed on one side of the L-shaped assembly frame (51), and a second reinforcing frame (57) is fixedly installed on one side of the L-shaped fixing frame (53).
4. The multi-wafer lift mechanism of claim 1, wherein: The needle assembly A (1), the needle assembly B (2) and the needle assembly C (3) are provided in three groups, three groups of the needle assembly A (1) are located at the same height and on the same line, three groups of the needle assembly B (2) are located at the same height and on the same line, and three groups of the needle assembly C (3) are located at the same height and on the same line.
5. The multi-wafer lift mechanism of claim 4, wherein: The heights of the needle assembly A (1), the needle assembly B (2) and the needle assembly C (3) are arranged in an increasing order.
6. The multi-wafer lift mechanism of claim 5, wherein: Each group of the needle assembly A (1), the needle assembly B (2) and the needle assembly C (3) comprises three needles, the three needles are arranged in a triangular shape, and the needles are made of high-temperature-resistant non-metallic materials.
7. The multi-wafer lift mechanism of claim 1, wherein: The inductor (6) is provided in two groups, one group of the inductor (6) is located between the needle assembly A (1) and the needle assembly B (2), and the other group of the inductor (6) is located between the needle assembly B (2) and the needle assembly C (3).
8. The multi-wafer lift mechanism of claim 1, wherein: Four groups of connecting rods (7) are fixedly installed on one side of the needle mounting plate (4), and one end of each group of the connecting rods (7) is fixedly connected to one side of the connecting plate (55).