Power module with heat dissipation pins

Abstract

The utility model discloses a power module with heat dissipation pins, belongs to the field of heat dissipation of power modules, and solves the problems of low integration level and poor heat dissipation effect of the power module in the prior art. A plurality of middle layer conductors are arranged in the substrate, components are arranged on the substrate, power devices are arranged on the substrate through bonding pads, cooling fins are arranged on the power devices, the components and the power devices are wrapped with plastic packaging bodies, overall plastic packaging is carried out through plastic packaging glue, the heat radiation effect is good, and the shell cost and space are saved. The substrate is provided with a plurality of heat dissipation pins, and the pins are welded in a surface-mounted manner, so that the current-carrying capability is improved, the surface-mounted assembly of the module is realized, and the occupied space is small.

Description

TECHNICAL FIELD

[0001] The utility model relates to power module heat dissipation field, concretely, especially relates to a power module with heat dissipation pin. BACKGROUND

[0002] Power module is used more and more widely in military products, and is usually adopted in high reliable application fields such as airborne, vehicle-mounted and missile-mounted, and is usually adopted full metal sealed hybrid integrated circuit power module or metal sealed microcircuit power module. The full metal sealed hybrid integrated circuit power module is heavy in volume, high in cost and complex in process. The metal sealed microcircuit power module has relatively low integration degree and large volume. The application with the announcement number CN212485311U discloses a power module, which comprises a heat dissipation substrate, a stress blocking part is arranged on the heat dissipation substrate, and the stress blocking part is arranged at the outer periphery of the power chip. But it occupies large space and has low heat dissipation effect. At present, there lacks a power module which is simple and mature in process, low in weight, high in integration degree, high in power density and can be assembled in a patch type. SUMMARY

[0003] The utility model discloses a power module with heat dissipation pin to solve the problem of low integration degree and poor heat dissipation effect of the power module in the prior art.

[0004] The utility model discloses a power module with heat dissipation pin to solve the problem of low integration degree and poor heat dissipation effect of the power module in the prior art.

[0005] A power module with heat dissipation pin, including the substrate, the inside of substrate is equipped with a plurality of intermediate layer conductor, the substrate is equipped with component on, and the substrate is equipped with power device through the solder pad, and the power device is equipped with the fin, and the component and power device outside are wrapped plastic sealing body, and the whole plastic sealing is carried out through plastic sealing glue, and the heat radiation effect is good, and the shell cost and space are saved, and the substrate is equipped with a plurality of heat dissipation pins, and the pin is welded by mounting, and the current-carrying capacity is increased, and the module is assembled in a patch type, and the space is small.

[0006] Further, the heat dissipation pin is connected with the intermediate layer conductor through the blind hole or the embedded hole.

[0007] Further, the heat dissipation pin is connected with the intermediate layer conductor through the blind hole or the embedded hole.

[0008] Further, the heat dissipation pin is connected with the intermediate layer conductor through the blind hole or the embedded hole.

[0009] Further, the heat dissipation pin is flush with or slightly lower than the highest surface of the plastic package.

[0010] Further, the substrate is in double-sided assembly mode, and both surfaces of the substrate are provided with components or power devices, thereby improving space utilization and making the module more compact.

[0011] Compared with the prior art, the power module has the advantages that:

[0012] The power module is integrally plastic packaged by the plastic sealing glue with high heat conductivity, and has good heat radiation effect and saves the cost and space of the shell. The heat dissipation pin is attached and welded, the current carrying capacity is increased, the stress release structure is designed, the module is attached and assembled, and the occupied space is small. The double-sided assembly mode of the substrate enhances the assembly density. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a structural schematic view of the power module.

[0014] In the figure, 1 is a substrate, 2 is a plastic package, 3 is a component, 4 is a power device, 5 is a heat sink, 6 is an intermediate layer conductor, 7 is a heat dissipation pin, and 8 is a solder pad. DETAILED DESCRIPTION

[0015] In order to enable personnel in the art to better understand the technical scheme of the power module, the technical scheme of the power module will be clearly and completely described below in combination with the drawings of the power module.

[0016] The power module will be further described and explained below in combination with the drawings.

[0017] Embodiment 1, a power module with a heat dissipation pin, as shown in the figure, comprises a substrate 1, a plurality of intermediate layer conductors 6 are arranged in the substrate 1, a component 3 is arranged on the substrate 1, a power device 4 is arranged on the substrate 1 through a solder pad 8, a heat sink 5 is arranged on the power device 4, the component 3 and the power device 4 are wrapped by a plastic package 2, the power module is integrally plastic packaged by plastic sealing glue, has good heat radiation effect, and saves the cost and space of the shell. Figure 1 A plurality of heat dissipation pins 7 are arranged on the substrate 1, the pins are attached and welded, the current carrying capacity is increased, the module is attached and assembled, and the occupied space is small.

[0018] Embodiment 2, a power module with a heat dissipation pin, the heat dissipation pin 7 is connected with the intermediate layer conductor 6 through a blind hole or a buried hole; the shape of the heat dissipation pin 7 is horseshoe-shaped, the surface of the heat dissipation pin 7 is plated with gold, the shape of the heat dissipation pin 7 is horseshoe-shaped, the heat dissipation area is increased, the heat dissipation pin 7 can provide an additional heat dissipation path, and the heat dissipation effect is further improved; the current carrying capacity of the pin is increased and stress can be released; the surface of the heat dissipation pin 7 is plated with gold, and the heat dissipation pin 7 is welded and connected with the substrate 1 through Au-Sn solder, not only the heat conduction performance is improved, but also the corrosion resistance and oxidation resistance are enhanced, and the service life is prolonged; the intermediate layer conductors 6 are connected through the buried holes, the intermediate layer conductors 6 are coated with copper, and the intermediate layer conductors 6 are coated with copper, and the conductivity is improved; the bottom of the heat dissipation pin 7 is flush with or slightly lower than the highest surface of the plastic package 2, the mounting and welding pins and the heat dissipation fins 5 adopt a coplanar design, that is, the bottom surface of the welding pin and the surface of the heat sink are designed on the same plane, and the engineering error should not exceed 0.2mm; the substrate 1 adopts a double-sided assembly mode, the two surfaces of the substrate 1 are provided with components 3 or power devices 4, the space utilization is improved, and the module is more compact; the rest is the same as embodiment 1.

[0019] The substrate 1 adopts a printed board, the power components 3 are connected with the intermediate layer conductors 6 through the buried holes and the blind holes on the printed board, and the intermediate layer conductors 6 are uniformly heated through the large-area copper coating; the heat dissipation pins 7 are arranged, so that the heat dissipation pin 7 pads 8 are connected with the power component 3 pads 8 through the blind holes or the buried holes and the intermediate layer conductors 6. The heat dissipation fins 5 and the heat dissipation pins 7 can be assembled in a patch type.

[0020] The utility model has been described in detail above, and the above is only a preferred embodiment of the utility model, which cannot limit the scope of the utility model, that is, any equivalent changes and modifications made within the scope of the application shall still fall within the scope of the utility model.

Claims

1. A power module with heat dissipating pins, comprising a substrate (1) inside which a number of intermediate layer conductors (6) are provided, characterized in that: The substrate (1) is provided with components (3), the substrate (1) is fixedly connected with power devices (4) through soldering pads (8), the power devices (4) are provided with radiating fins (5), the components (3) and the power devices (4) are wrapped with plastic sealing bodies (2), and the substrate (1) is provided with a plurality of radiating pins (7); the radiating pins (7) are in the shape of horseshoe, and the surfaces of the radiating pins (7) are plated with gold; the substrate (1) adopts a double-sided assembly mode, and both sides of the substrate (1) are provided with components (3) or power devices (4).

2. The power module with heat dissipation pins according to claim 1, characterized in that: The radiating pins (7) are connected with the intermediate layer conductors (6) through blind holes or buried holes.

3. The power module with heat dissipation pins of claim 1, wherein: The intermediate layer conductors (6) are connected through buried holes, and the intermediate layer conductors (6) are coated with copper.

4. The power module with heat dissipation pins of claim 1, wherein: The bottom of the radiating pin (7) is flush with or slightly lower than the highest surface of the plastic sealing body (2).

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