Heat resistance device with power supply function and circuit assembly

Abstract

The utility model relates to the field of heat resistance, in particular to a heat resistance device with a power supply function and a circuit assembly, and the heat resistance device with the power supply function comprises a plurality of semiconductor chilling plates, the hot surfaces of the semiconductor chilling plates are attached to the surface of a power device, and the semiconductor chilling plates are used for generating direct-current voltage when the temperature difference exists between the hot surfaces and the cold surfaces of the semiconductor chilling plates; and the total output end of the plurality of semiconductor chilling plates is connected with the input end of the voltage conversion module. The heat resistance device with the power supply function can solve the problem that the internal environment temperature of the closed shell is difficult to accurately detect due to the fact that the internal environment temperature of the closed shell rises due to heating of the power device, has the advantage that the internal environment temperature of the closed shell is not greatly influenced, and can effectively utilize heat generated by the power device; the method is suitable for different types of power devices with different requirements, and the labor cost is low.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat resistance, in particular to a heat resistance device with power supply function and a circuit assembly. BACKGROUND

[0002] For a closed shell installed on a circuit board with a power device, when it is necessary to measure the temperature of the internal environment of the closed shell, the heat generated by the power device will cause the temperature of the internal environment of the closed shell to rise, making it difficult to accurately detect the temperature of the internal environment of the closed shell. Even if heat conduction is based on the heat sink attached to the power device, or the power device is blown by the fan arranged on one side of the power device, or the power device installed on the edge of the circuit board is in contact with the shell made of metal, the heat will still be transmitted to the air inside the closed shell, making it difficult to accurately detect the temperature of the internal environment of the closed shell.

[0003] Therefore, the prior art needs to be improved and developed. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a heat resistance device with power supply function and a circuit assembly, aiming to solve the problem that the heat generated by the power device causes the temperature of the internal environment of the closed shell to rise, making it difficult to accurately detect the temperature of the internal environment of the closed shell.

[0005] In a first aspect, the present application provides a heat resistance device with power supply function, applied to a circuit assembly with closed environment temperature measurement requirement, the circuit assembly comprising a closed shell and a circuit board arranged in the closed shell, the circuit board having a power device, the heat resistance device comprising:

[0006] A plurality of semiconductor refrigeration pieces connected in series, connected in parallel or connected in a combination of series and parallel, the semiconductor refrigeration piece having a hot surface and a cold surface, the hot surface being attached to the surface of the power device, the semiconductor refrigeration piece being used to generate a direct current voltage when there is a temperature difference between its hot surface and its cold surface;

[0007] A voltage conversion module, the total output end of the plurality of semiconductor refrigeration pieces being connected to the input end of the voltage conversion module, the voltage conversion module being used to convert the direct current voltage output by the plurality of semiconductor refrigeration pieces.

[0008] The heat resistance device with power supply function provided by the present application has the advantage of not having too great an impact on the temperature of the internal environment of the closed shell, can effectively utilize the heat generated by the power device, is suitable for different types and different requirements of power devices, and has low labor cost.

[0009] Optionally, the plurality of semiconductor refrigeration pieces are connected in parallel or connected in a combination of series and parallel, and the circuit formed by the combination of the plurality of semiconductor refrigeration pieces comprises a plurality of series branches.

[0010] The heat blocking device further comprises:

[0011] A switch module is connected to each of the series branches of the circuit formed by the plurality of semiconductor Peltier devices, and is configured to control the corresponding series branch to be disconnected when an overcurrent phenomenon or an overvoltage phenomenon occurs in the corresponding series branch.

[0012] Optionally, the switch module comprises:

[0013] A first voltage detection chip is connected to each of the series branches, and the first voltage detection chip is configured to detect the voltage generated by all the semiconductor Peltier devices in the corresponding series branch;

[0014] A first switch member is connected to all the first voltage detection chips, and the first voltage detection chip is further configured to send a first cutoff signal to the first switch member when the voltage generated by all the semiconductor Peltier devices in the corresponding series branch is greater than a first preset voltage threshold, and the first switch member is configured to control the corresponding series branch to be disconnected when the first cutoff signal is received.

[0015] In this embodiment, the switch module is provided, which can disconnect the corresponding series branch in time when an overvoltage phenomenon or an overcurrent phenomenon occurs in the series branch to protect the circuit, and can ensure that other series branches with normal voltage and current work normally.

[0016] Optionally, the switch module comprises:

[0017] A first current detection chip is connected to each of the series branches, and the first current detection chip is configured to detect the current in the corresponding series branch;

[0018] A first switch member is connected to all the first current detection chips, and the first current detection chip is further configured to send a first cutoff signal to the first switch member when the current in the corresponding series branch is greater than a first preset current threshold, and the first switch member is configured to control the corresponding series branch to be disconnected when the first cutoff signal is received.

[0019] Optionally, the first switch member comprises a relay.

[0020] In this embodiment, the heat blocking device with the power supply function is provided with a relay, which can disconnect the corresponding series branch when an overvoltage phenomenon or an overcurrent phenomenon occurs in the series branch to protect the circuit.

[0021] Optionally, the switch module comprises:

[0022] A total circuit breaker module is connected to the total output end of the plurality of semiconductor Peltier devices, and is configured to control the connection between the total output end of the plurality of semiconductor Peltier devices and the input end of the voltage conversion module to be disconnected when an overcurrent phenomenon or an overvoltage phenomenon occurs in the total output end of the plurality of semiconductor Peltier devices.

[0023] Optionally, the plurality of semiconductor refrigeration pieces are arranged in a rectangular array on the surface of the power device.

[0024] Optionally, the top surface of the power device is square, the hot surface of the semiconductor refrigeration piece is attached to the top surface of the power device, and the number of semiconductor refrigeration pieces is less than or equal to the maximum square number of the ratio of the area of the top surface of the power device to the area of the hot surface of the semiconductor refrigeration piece.

[0025] Optionally, the voltage conversion module comprises a DC-DC converter.

[0026] In a second aspect, the present application provides a circuit assembly comprising a closed shell and a circuit board arranged in the closed shell, the circuit board having a power device thereon, and the circuit board being provided with any of the heat-blocking devices with power supply function as above.

[0027] The circuit assembly provided by the present application has the advantage of not having too great an impact on the internal environment temperature of the closed shell, can effectively utilize the heat generated by the power device, is suitable for different types and different requirements of power devices, and has low labor cost.

[0028] As can be seen from the above, the present application provides a heat-blocking device with power supply function and a circuit assembly, wherein the heat-blocking device with power supply function provided by the present application has the advantage of not having too great an impact on the internal environment temperature of the closed shell, can effectively utilize the heat generated by the power device, is suitable for different types and different requirements of power devices, and has low labor cost.

[0029] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and achieved by means of the structures particularly pointed out in the written description and the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A circuit diagram of the heat-blocking device with power supply function provided by the embodiment of the present application.

[0031] Figure 2 A circuit diagram of the heat-blocking device with power supply function provided by the embodiment of the present application when the semiconductor refrigeration pieces are connected in a connection mode.

[0032] Figure 3 A schematic diagram of another connection mode of the semiconductor refrigeration piece provided by the embodiment of the present application.

[0033] Figure 4 A structural schematic diagram of the circuit assembly provided by the embodiment of the present application.

[0034] Label description: 10, circuit component; 101, closed shell; 102, circuit board; 103, power device; 1, semiconductor refrigeration piece; 2, voltage conversion module; 3, switch module; 31, first voltage detection chip; 32, first current detection chip; 33, first switch piece; 34, total circuit breaking module; 341, second voltage detection chip; 342, second current detection chip; 343, second switch piece. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0036] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0037] In a first aspect, as shown in the drawings, the present application provides a heat-resistant device with power supply function, applied to a circuit component 10 with temperature measurement demand in a closed environment, the circuit component 10 comprising a closed shell 101 and a circuit board 102 arranged in the closed shell 101, the circuit board 102 having a power device 103 thereon, the heat-resistant device comprising: Figure 1

[0038] A plurality of semiconductor refrigeration pieces 1, the plurality of semiconductor refrigeration pieces 1 being connected in series, connected in parallel or connected in a combination of series and parallel, the semiconductor refrigeration piece 1 having a hot face and a cold face, the hot face being attached to the surface of the power device 103, the semiconductor refrigeration piece 1 being used to generate a direct current voltage when there is a temperature difference between the hot face and the cold face thereof;

[0039] A voltage conversion module 2, the total output end of the plurality of semiconductor refrigeration pieces 1 being connected to the input end of the voltage conversion module 2, the voltage conversion module 2 being used to boost convert the direct current voltage output by the plurality of semiconductor refrigeration pieces 1.

[0040] ​Specifically, in the present application, the output end of the voltage conversion module 2 can be connected with the load included in the circuit assembly 10, or can be connected with other electrical appliances independent of the circuit assembly 10.

[0041] More specifically, the plurality of semiconductor refrigeration pieces 1 can be connected by the connection mode as shown in the following figure when connected by the connection mode of series-parallel combination. Figure 2 Or as shown in the following figure Figure 3 As shown in the following figure.

[0042] More specifically, the circuit assembly 10 with the requirement of temperature measurement in a closed environment can be a mobile cold box, or can also be other existing circuit assemblies 10 with the requirement of temperature measurement in a closed environment.

[0043] More specifically, the conventional use of the semiconductor refrigeration piece 1 is to make the cold surface of the semiconductor refrigeration piece 1 adhere to the surface of the heat-generating power device 103 and electrify the semiconductor refrigeration piece 1, and after the semiconductor refrigeration piece 1 is electrified, the cold surface absorbs the heat generated on the surface of the power device 103 and releases the heat to the hot surface. On the contrary, as known from the thermoelectric power generation principle, when there is a certain temperature difference between the hot surface and the cold surface of the semiconductor refrigeration piece 1, the semiconductor refrigeration piece 1 can output a direct current voltage, so when the heat blocking device is working, the heat generated by the power device 103 makes the temperature of the hot surface of each semiconductor refrigeration piece 1 rise, and a temperature difference is generated between the hot surface and the cold surface of each semiconductor refrigeration piece 1, which generates and outputs a direct current voltage to the voltage conversion module 2 based on the total output end, and the voltage conversion module 2 is used to step up and convert the direct current voltage output by the plurality of semiconductor refrigeration pieces 1. Therefore, the heat blocking device of the present application can convert the heat generated by the power device 103 into electrical energy to power the load in the circuit assembly 10 or other electrical appliances independent of the circuit assembly 10.

[0044] More specifically, when refrigeration is performed based on the conventional use of the semiconductor refrigeration piece 1, the cold surface of the semiconductor refrigeration piece 1 absorbs heat and the hot surface releases heat; while in the power supply process of the present application, the hot surface of the semiconductor refrigeration piece 1 adheres to the surface of the power device 103, so the hot surface of the semiconductor refrigeration piece 1 of the present application will not spread the heat of the power device 103 to the air, has the advantage of not having too great an impact on the internal environment temperature of the closed shell 101, and can effectively utilize the heat generated by the power device 103.

[0045] More specifically, the heat blocking device of the present application can work in the closed shell 101, is suitable for power devices 103 with waterproof and dustproof requirements, and only needs to adhere the hot surface of the semiconductor refrigeration piece 1 to the surface of the power device 103 to output voltage when the power device 103 generates heat, so the present application is suitable for different types and different requirements of power devices 103. In addition, the present application only needs to ensure that the hot surface of the semiconductor refrigeration piece 1 adheres to the surface of the power device 103, without the need for manual installation, so the present application also has the advantage of low labor cost.

[0046] The heat resistance device with power supply function provided by the application has the advantages of not having too much influence on the internal environment temperature of the closed shell 101, effectively utilizing the heat generated by the power device 103, being suitable for different types and different requirements of the power device 103, and low labor cost.

[0047] In some preferred embodiments, the plurality of semiconductor refrigeration pieces 1 are connected in parallel or by a combination of series and parallel connection, and the circuit formed by the combination of the plurality of semiconductor refrigeration pieces 1 includes a plurality of series branches.

[0048] The heat resistance device further includes:

[0049] The switch module 3 is connected to each series branch in the circuit formed by the combination of the plurality of semiconductor refrigeration pieces 1, and is used to control the disconnection of the corresponding series branch when overcurrent phenomenon or overvoltage phenomenon occurs in the series branch.

[0050] Specifically, the series branch is a circuit through which the same current flows in the circuit formed by the combination of the semiconductor refrigeration pieces 1, and the switch module 3 can be connected to each series branch by the connection mode as shown in the figure. Figure 2

[0051] More specifically, the overcurrent phenomenon of the series branch refers to that the current in the corresponding series branch is greater than a first preset current threshold, and the overvoltage phenomenon of the series branch refers to that the voltage generated by all the semiconductor refrigeration pieces 1 in the corresponding series branch is greater than a first preset voltage threshold.

[0052] More specifically, the way in which the switch module 3 controls the disconnection of the corresponding series branch can be that the micro control unit included in the switch module 3 detects the current and / or voltage of the series branch, and controls the disconnection of the corresponding series branch when overcurrent phenomenon or overvoltage phenomenon occurs in the series branch, or can be that the existing circuit element included in the switch module 3 has the function of controlling the on-off of the circuit, and controls the disconnection of the corresponding series branch when overcurrent phenomenon or overvoltage phenomenon occurs in the series branch.

[0053] In this embodiment, the switch module 3 is provided, which can disconnect the corresponding series branch in time to protect the circuit when overvoltage phenomenon or overcurrent phenomenon occurs in the series branch, and can ensure that other series branches with normal voltage and current work normally.

[0054] In some preferred embodiments, the switch module 3 includes:

[0055] The first voltage detection chip 31 is connected to each series branch, and the first voltage detection chip 31 is used to detect the voltage generated by all the semiconductor refrigeration pieces 1 in the corresponding series branch;

[0056] ​The first switch element 33 is connected with all the first voltage detection chips 31, and the first voltage detection chip 31 is further configured to send a first cut-off signal to the first switch element 33 when the voltage generated in all the semiconductor refrigeration plates 1 in the corresponding series branch is greater than a first preset voltage threshold, and the first switch element 33 is configured to control the corresponding series branch to be disconnected when the first cut-off signal is received.

[0057] Specifically, the first voltage detection chip 31 can be an existing chip with voltage detection function, and the first switch element 33 can be an existing circuit element with circuit on-off control function.

[0058] In this embodiment, the heat-resistant device with power supply function provided by the application is provided with the first voltage detection chip 31 and the first switch element 33, which can detect the voltage of each series branch, so as to accurately determine whether the overvoltage phenomenon occurs, and control the corresponding series branch to be disconnected based on the first cut-off signal to protect the circuit when the overvoltage phenomenon occurs, which has simple structure, fast series branch disconnection speed and high safety.

[0059] In some preferred embodiments, the switch module 3 comprises:

[0060] The first current detection chip 32 is connected with each series branch, and the first current detection chip 32 is configured to detect the current in the corresponding series branch;

[0061] The first switch element 33 is connected with all the first current detection chips 32, and the first current detection chip 32 is further configured to send a first cut-off signal to the first switch element 33 when the current in the corresponding series branch is greater than a first preset current threshold, and the first switch element 33 is configured to control the corresponding series branch to be disconnected when the first cut-off signal is received.

[0062] Specifically, the first current detection chip 32 can be an existing chip with current detection function.

[0063] In this embodiment, the heat-resistant device with power supply function provided by the application is provided with the first current detection chip 32 and the first switch element 33, which can detect the current of each series branch, so as to accurately determine whether the overcurrent phenomenon occurs, and control the corresponding series branch to be disconnected based on the first cut-off signal to protect the circuit when the overcurrent phenomenon occurs, which has simple structure, fast series branch disconnection speed and high safety.

[0064] In some preferred embodiments, the first switch element 33 comprises a relay.

[0065] In this embodiment, the heat-resistant device with power supply function provided by the application is provided with a relay, which can disconnect the corresponding series branch to protect the circuit when the overvoltage phenomenon or the overcurrent phenomenon occurs in the series branch.

[0066] In some preferred embodiments, the switch module 3 comprises;

[0067] The total circuit breaker module 34 is connected with the total output end of the plurality of semiconductor refrigeration pieces 1, and is used for controlling the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 to be disconnected when the total output end of the plurality of semiconductor refrigeration pieces 1 generates an overcurrent phenomenon or an overvoltage phenomenon.

[0068] Specifically, the total output end of the plurality of semiconductor refrigeration pieces 1 generating an overcurrent phenomenon refers to the current flowing out of the total output end of the plurality of semiconductor refrigeration pieces 1 being greater than a second preset current threshold, and the total output end of the plurality of semiconductor refrigeration pieces 1 generating an overvoltage phenomenon refers to the total voltage output by the plurality of semiconductor refrigeration pieces 1 being greater than a second preset voltage threshold.

[0069] More specifically, the total circuit breaker module 34 can control the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 to be disconnected in the following manners: based on the micro control unit included in the total circuit breaker module 34, the total output end of the plurality of semiconductor refrigeration pieces 1 is detected for current and voltage, and the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 is controlled to be disconnected; or based on the existing circuit element with circuit on-off control function included in the total circuit breaker module 34, the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 is controlled to be disconnected when the total output end of the plurality of semiconductor refrigeration pieces 1 generates an overcurrent phenomenon or an overvoltage phenomenon.

[0070] In this embodiment, the heat-resistant device with power supply function can control the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 to be disconnected to protect the circuit when the total output end of the plurality of semiconductor refrigeration pieces 1 generates an overvoltage phenomenon or an overcurrent phenomenon.

[0071] Preferably, the total circuit breaker module 34 comprises:

[0072] The second voltage detection chip 341 is connected with the total output end of the plurality of semiconductor refrigeration pieces 1, and is used for detecting the total voltage output by the plurality of semiconductor refrigeration pieces 1;

[0073] The second current detection chip 342 is connected with the total output end of the plurality of semiconductor refrigeration pieces 1, and is used for detecting the current flowing out of the total output end of the plurality of semiconductor refrigeration pieces 1;

[0074] The second switch 343 is connected with the second voltage detection chip 341 and the second current detection chip 342. The second voltage detection chip 341 is further configured to send a second cutoff signal to the second switch 343 when the total voltage output by the plurality of semiconductor refrigeration pieces 1 is greater than a second preset voltage threshold. The second current detection chip 342 is further configured to send a third cutoff signal to the second switch 343 when the current flowing out of the total output end of the plurality of semiconductor refrigeration pieces 1 is greater than a second preset current threshold. The second switch 343 is configured to disconnect the connection between the total output end of the plurality of semiconductor refrigeration pieces 1 and the input end of the voltage conversion module 2 when the second cutoff signal or the third cutoff signal is received.

[0075] Specifically, the second voltage detection chip 341 can be an existing chip with voltage detection function, the second current detection chip 342 can be an existing chip with current detection function, and the second switch 343 can be an existing circuit element with circuit on-off control function.

[0076] In this embodiment, the heat-resistant device with power supply function of the present application is provided with the second voltage detection chip 341, the second current detection chip 342 and the second switch 343, which can respectively detect the voltage input into the voltage conversion module 2 and the current flowing into the voltage conversion module 2, so as to accurately determine whether the total output end of the plurality of semiconductor refrigeration pieces 1 generates overvoltage phenomenon or overcurrent phenomenon, and control the circuit to be disconnected based on the second cutoff signal or the third cutoff signal to protect the circuit when the total output end of the plurality of semiconductor refrigeration pieces 1 generates overvoltage phenomenon or overcurrent phenomenon. The structure is simple, the circuit disconnection speed is fast, and the safety is high.

[0077] More preferably, the second switch 343 comprises a relay.

[0078] In some preferred embodiments, the plurality of semiconductor refrigeration pieces 1 are arranged in a rectangular array on the surface of the power device 103.

[0079] In this embodiment, the heat-resistant device with power supply function of the present application can densely arrange the plurality of semiconductor refrigeration pieces 1 on the surface of the power device 103, and the integration degree is high.

[0080] In some preferred embodiments, the top surface of the power device 103 is square, the hot surface of the semiconductor refrigeration piece 1 is attached to the top surface of the power device 103, and the number of semiconductor refrigeration pieces 1 is less than or equal to the maximum square number of the ratio of the area of the top surface of the power device 103 to the area of the hot surface of the semiconductor refrigeration piece 1.

[0081] Specifically, taking the case that the top surface area of the power device 103 is 10 times the heat surface area of the semiconductor refrigeration sheet 1, the ratio of the top surface area of the power device 103 to the heat surface area of the semiconductor refrigeration sheet 1 is 10, and the square number less than 10 is 9, which can be the square of some integer, thus the number of the semiconductor refrigeration sheets 1 is 9 in this case.

[0082] In this embodiment, the power device 103 can fully utilize the area of the top surface, and thus the heat generated by the power device 103 can be fully utilized.

[0083] In some preferred embodiments, the voltage conversion module 2 comprises a DC-DC converter.

[0084] Specifically, since the direct current voltage generated by the semiconductor refrigeration sheet 1 is small and unstable, in this embodiment, the DC-DC converter is provided, which can convert the direct current voltage output by the plurality of semiconductor refrigeration sheets 1 into a direct current voltage with a higher voltage value and better stability, so that the heat blocking device can be better powered.

[0085] In a second aspect, as shown in Figure 4 The circuit assembly provided by the present application has the advantages of not greatly affecting the internal environment temperature of the closed shell 101, effectively utilizing the heat generated by the power device 103, being suitable for different types of power devices 103 with different requirements, and low labor cost.

[0086] The circuit assembly provided by the present application has the advantages of not greatly affecting the internal environment temperature of the closed shell 101, effectively utilizing the heat generated by the power device 103, being suitable for different types of power devices 103 with different requirements, and low labor cost.

[0087] As can be seen from the above, the present application provides a heat blocking device with power supply function and a circuit assembly, wherein the heat blocking device with power supply function provided by the present application has the advantages of not greatly affecting the internal environment temperature of the closed shell 101, effectively utilizing the heat generated by the power device 103, being suitable for different types of power devices 103 with different requirements, and low labor cost.

[0088] In the embodiments provided by the present application, it should be understood that the relative terms, such as first and second, etc., are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations.

[0089] The above merely provides an example of the present application, and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat-resistant device with power supply function, applied to a circuit assembly (10) with temperature measurement demand in a closed environment, the circuit assembly (10) comprising a closed shell (101) and a circuit board (102) arranged in the closed shell (101), the circuit board (102) having a power device (103) thereon, characterized in that, The heat blocking device comprises: a plurality of semiconductor refrigeration pieces (1), the plurality of semiconductor refrigeration pieces (1) are connected in series, connected in parallel or connected through a series-parallel combination, the semiconductor refrigeration piece (1) has a hot face and a cold face, the hot face is attached to the surface of the power device (103), and the semiconductor refrigeration piece (1) is used for generating a direct-current voltage when the hot face and the cold face have a temperature difference; a voltage conversion module (2), the total output end of the plurality of semiconductor refrigeration pieces (1) is connected with the input end of the voltage conversion module (2), and the voltage conversion module (2) is used for boosting and converting the direct-current voltage output by the plurality of semiconductor refrigeration pieces (1).

2. The heat shielding device having a power supply function according to claim 1, characterized by The plurality of semiconductor refrigeration pieces (1) are connected in parallel or connected through a series-parallel combination, and the circuit formed by the combination of the plurality of semiconductor refrigeration pieces (1) comprises a plurality of series branches. The heat blocking device further comprises: a switch module (3) connected in each series branch of the circuit formed by the combination of the plurality of semiconductor refrigeration pieces (1), used for controlling the disconnection of the corresponding series branch when an overcurrent phenomenon or an overvoltage phenomenon occurs in the series branch.

3. The heat shielding device having a power supply function according to claim 2, characterized by The switch module (3) comprises: a first voltage detection chip (31) connected in each series branch, the first voltage detection chip (31) is used for detecting the voltage generated by all semiconductor refrigeration pieces (1) in the corresponding series branch; a first switch piece (33) connected with all first voltage detection chips (31), the first voltage detection chip (31) is further used for sending a first cutoff signal to the first switch piece (33) when the voltage generated by all semiconductor refrigeration pieces (1) in the corresponding series branch is greater than a first preset voltage threshold, and the first switch piece (33) is used for controlling the disconnection of the corresponding series branch when the first cutoff signal is received.

4. The heat shielding device having a power supply function according to claim 2, characterized by The switch module (3) comprises: a first current detection chip (32) connected in each series branch, the first current detection chip (32) is used for detecting the current in the corresponding series branch; a first switch piece (33) connected with all first current detection chips (32), the first current detection chip (32) is further used for sending a first cutoff signal to the first switch piece (33) when the current in the corresponding series branch is greater than a first preset current threshold, and the first switch piece (33) is used for controlling the disconnection of the corresponding series branch when the first cutoff signal is received.

5. The heat shielding device having a power supply function according to claim 3 or 4, wherein The first switch piece (33) comprises a relay.

6. The heat shielding device having a power supply function according to claim 2, wherein The switch module (3) comprises; a total cutoff module (34) connected with the total output end of the plurality of semiconductor refrigeration pieces (1), used for controlling the disconnection of the connection between the total output end of the plurality of semiconductor refrigeration pieces (1) and the input end of the voltage conversion module (2) when an overcurrent phenomenon or an overvoltage phenomenon occurs in the total output end of the plurality of semiconductor refrigeration pieces (1).

7. The heat shielding device having a power supply function according to claim 1, wherein The plurality of semiconductor refrigeration pieces (1) are arranged in a rectangular array on the surface of the power device (103).

8. The heat shielding device having a power supply function according to claim 7, wherein The top surface of the power device (103) is square, the hot surface of the semiconductor refrigeration sheet (1) is attached to the top surface of the power device (103), and the number of the semiconductor refrigeration sheets (1) is less than or equal to the maximum square number of the ratio of the top surface area of the power device (103) to the hot surface area of the semiconductor refrigeration sheet (1).

9. The heat shielding device having a power supply function according to claim 1, wherein The voltage conversion module (2) comprises a DC-DC converter.

10. A circuit assembly comprising an enclosing housing (101) and a circuit board (102) arranged in the enclosing housing (101), the circuit board (102) having a power device (103) thereon, characterized in that The circuit board (102) is provided with the heat resistance device with power supply function according to any one of claims 1-9.

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