Three-side three-dimensional water-cooling heat dissipation shell structure
The three-sided water-cooling heat dissipation shell structure solves the problems of low efficiency and poor safety in existing water-cooling designs, achieving efficient heat dissipation and safe three-sided water-cooling effect, and extending the service life of the circuit board.
Patent Information
- Application Number
- CN202422970674.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-03
AI Technical Summary
Existing water-cooling designs for drives have simple water channels, low heat exchange efficiency, and are unable to effectively dissipate heat, especially for side-heating components of high-power electrical appliances, and there is also a risk of water channel damage.
It adopts a three-sided three-dimensional water-cooling heat dissipation shell structure, and increases the heat dissipation path length through a three-dimensional interconnected water channel design. It uses the serpentine structure of the top and side water channels to achieve three-sided water cooling, and the partitions separate the water channels to improve safety.
It improves heat dissipation efficiency, reduces the risk of water channel damage, balances the temperature distribution of the circuit board, extends service life, and reduces the failure rate caused by temperature differences.
Smart Images
Figure CN223681374U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to radiator technical field, especially a three -dimensional water cooling heat dissipation shell structure of three sides. BACKGROUND
[0002] The high -power motor driver can bring a large amount of heat due to loss when working, and the heat accumulation is too high to affect the normal working setting of the driver circuit board and burn, and the common driver heat dissipation mode is mainly two, water cooling and air cooling, and water cooling is more common in high -power and high -current occasions, and the common water cooling mode is closely attached to the main heating surface of the internal circuit board. Water cooling liquid flows through the heating element through the internal heat dissipation water channel, and the heat generated by the internal circuit board is conducted to the low-temperature liquid to realize heat dissipation.
[0003] The internal water cooling channel of the common driver water cooling design is relatively simple, the size of the water channel is limited, the heat exchange efficiency is low, and the heat dissipation capacity of the high -power electric appliance is insufficient. At the same time, the heat dissipation structure is equivalent to an additional water channel for heat dissipation, and the water channel itself has a risk of damage, and the safety factor of the integrated water channel is higher. More importantly, the existing water channel is mostly single-sided heat dissipation, and if the heating element is on the side, the heat dissipation effect cannot be well played. INVENTION CONTENTS
[0004] To solve the above problems, a three -dimensional water cooling heat dissipation shell structure, the shell structure can realize three -dimensional water cooling design through three -dimensional interconnection water channel.
[0005] To achieve the above purpose, the technical scheme adopted by the utility model is:
[0006] A three -dimensional water cooling heat dissipation shell structure is used for heat dissipation of electronic devices, the electronic device has three heating bodies, the shell structure includes a radiator body and a water channel, the radiator body is a shell structure, the top plate of the radiator body has a top water channel, and the inside of the two side plates of the radiator body has a side water channel.
[0007] The side water channel of one side is communicated with the side water channel of the other side through the top water channel, the water channel top and the side water channel form a water channel, the radiator body also has a water inlet and a water outlet, and the water outlet is connected with a side water channel, and the water inlet is connected with another side water channel.
[0008] As preferred, the top water channel and / or side water channel are rotary structure or serpentine structure.
[0009] As preferred, the radiator body has a groove structure on the side opposite to the heating body for forming the top water channel and the side water channel, and the open end of each groove structure has a detachable sealing plate structure.
[0010] As preferred, the top water channel and / or the side water channel comprises water channel side plates for forming the water channel and located on both sides of the water channel, and further comprises a partition plate arranged in the same direction as the water channel between the two water channel side plates, which separates the water channel into a double water channel.
[0011] As preferred, the partition plate has a gap for connecting the double water channels to each other.
[0012] As preferred, the gap is arranged at a straight section of the partition plate.
[0013] As preferred, the four peripheral edges of the sealing plate structure are detachably connected to the radiator body by screws.
[0014] The beneficial effects of using the present application are:
[0015] The radiator shell structure provided by the present application realizes three-dimensional water cooling design through the three-dimensional communication water channel, and due to the extension shape design of the water channel, the length of the effective heat dissipation path is increased, and the heat dissipation efficiency is increased. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a whole axial side schematic view of the three-dimensional water cooling radiator shell structure of the present application.
[0017] Figure 2 It is a schematic view of the three-dimensional water cooling radiator shell structure of the present application after removing the top cover plate and the side cover plate.
[0018] Figure 3 It is a simplified schematic view of the whole heat dissipation water channel.
[0019] Figure 4 It is a partial cross-sectional schematic view of the three-dimensional water cooling radiator shell structure of the present application.
[0020] The reference signs include:
[0021] 1-radiator body, 11-top water channel, 12-side water channel, 13-connection water channel, 14-water channel side plate, 15-partition plate, 2-water inlet, 3-water outlet, 4-top sealing plate, 5-side sealing plate, 6-heating body. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the present application more clear and explicit, the present application will be further described in detail below with specific embodiments.
[0023] To solve the problem that the water channel structure of the heat sink in the prior art cannot dissipate heat for the multi-surface heat generating body 6 and there is a potential risk of liquid leakage, as shown in Figure 1 The three-dimensional water-cooled heat dissipation shell structure is mainly composed of a heat sink body 1. The heat sink body 1 is made of a material with high thermal conductivity, such as aluminum or copper metal material. A water inlet 2 and a water outlet 3 are arranged at the front of the heat sink body 1. A top sealing plate 4 is arranged at the top of the heat sink body 1. The top sealing plate 4 and the heat sink body 1 are connected to each other by a plurality of screws around the top sealing plate 4 to ensure that the top sealing plate 4 and the heat sink body 1 are tightly attached around to avoid liquid leakage. Similarly, the left and right sides of the heat sink body 1 are sealed by side sealing plates 5.
[0024] As shown in Figure 2 As shown in Figure 1 Based on the three-dimensional water-cooled heat dissipation shell structure shown in
[0025] The side water channel 12 includes water channel side plates 14 arranged on both sides of the water channel. The main function of the water channel side plates 14 is to form the side water channel 12 in cooperation with the inner wall of the side sealing plate 5. The direction of the side water channel 12 is determined by the arrangement of the water channel side plates 14.
[0026] A partition plate 15 is arranged between the two water channel side plates 14 and extends in the same direction as the water channel. The partition plate 15 divides the water channel into a double water channel. To avoid the speed difference of the cooling liquid in the water channel, the partition plate 15 has a notch for connecting the double water channels to each other. Therefore, the partition plate 15 is in a discontinuous form. In this embodiment, a notch is arranged on each linearly extending partition plate 15.
[0027] As shown in Figure 4 As shown in Figure 3 is a schematic view of the simplified water channel. When the cooling liquid enters the water channel from the water inlet 2, the cooling liquid first enters a side water channel 12. Since the side water channel 12 is a densely arranged serpentine water channel, the cooling liquid flows in the side water channel 12 for a long distance, then enters the top water channel 11, which is a backfolding water channel arranged in an "S" shape, and then enters the other side water channel 12 after passing through the top water channel 11, and finally is discharged from the water outlet 3 of the heat sink body 1. In this process, since the cooling liquid stays in the heat sink body 1 for a long time and flows for a long distance, the cooling liquid carries a large amount of heat out of the heat sink body 1 after fully exchanging heat with the heat generating body 6 of the electronic device through the heat sink body 1, thereby achieving cooling of the heat generating body 6.
[0028] In the embodiment, the inner wall of the heat sink body 1 is closely attached, and in some feasible embodiments, the heat generating body 6 is in thermal conduction with the inner wall of the heat sink body 1 through a heat conduction component, such as heat conductive silicone grease and a heat dissipation pad, so as to increase the effective contact area of the heat generating body 6 and the heat sink body 1.
[0029] The connection of the top water channel 11 and the side water channel 12 is realized through the connecting water channel 13, so that the cooling water flows between the top water channel 11 and the side water channel 12.
[0030] The heat dissipation shell structure provided in the embodiment realizes the three-side water cooling design through the three-dimensional connecting water channel, and due to the extension shape design of the water channel, the length of the effective heat dissipation path is increased, and the heat dissipation efficiency is increased.
[0031] The heat dissipation shell structure improves the problem of low heat exchange efficiency of the existing water channel structure through the water channel expansion. The potential risk caused by the water channel damage is avoided through the integrated water channel design. The heat balance between the heat dissipation element and the shell is realized to the greatest extent through the three-side heat dissipation structure design, which can reduce the parameter temperature drift difference of the same elements at different positions caused by the temperature difference of the circuit board during work, thereby reducing the failure rate and fully improving the problem of uneven heat dissipation. At the same time, the uneven distribution of thermal deformation stress on a large heat area can also be greatly improved, thereby increasing the service life of the circuit board.
[0032] The above is only a preferred embodiment of the present application, and for ordinary skilled in the art, according to the technical content of the present application, many changes can be made in the specific implementation manner and application range, as long as the changes do not deviate from the concept of the present application, and all belong to the protection scope of the present application.
Claims
1. A three-sided cubic water-cooled heat-dissipation housing structure for dissipating heat from an electronic device having a three-sided heat generator, characterized by: The shell structure comprises a radiator body and water channels, the radiator body is a shell structure, the top plate of the radiator body has a top water channel inside, and the two side plates of the radiator body each have a side water channel inside; The side water channel on one side is communicated with the side water channel on the other side through the top water channel, the top and side water channels form water channels, the radiator body further has a water inlet and a water outlet, the water outlet is connected with one side water channel, and the water inlet is connected with the other side water channel.
2. The three-dimensional water-cooled heat-dissipation shell structure according to claim 1, characterized in that: The top water channel and / or the side water channel is a rotary structure or a serpentine structure.
3. The three-dimensional cubic water-cooled heat-dissipation shell structure according to claim 1, characterized in that: The side opposite to the heat generating body of the radiator body has groove structures for forming the top water channel and the side water channel, and the opening of each groove structure has a detachable sealing plate structure.
4. The three-dimensional water-cooled heat-dissipation shell structure according to claim 3, characterized in that: The top water channel and / or the side water channel comprises water channel side plates for forming the water channels and located on both sides of the water channels, and further has a partition plate arranged in the same extension direction as the water channels between the two water channel side plates, which separates the water channels into double water channels.
5. The three-dimensional water-cooled heat-dissipation shell structure according to claim 4, characterized in that: The partition plate has a notch for communicating the double water channels with each other.
6. The three-dimensional water-cooled heat-dissipation enclosure structure according to claim 5, characterized in that: The notch is arranged on the straight section of the partition plate.
7. The three-dimensional water-cooled heat-dissipation shell structure according to claim 3, characterized in that: The four peripheral edges of the sealing plate structure are detachably connected with the radiator body through screws.