Power electronic pipeline heat dissipation device

Abstract

The utility model relates to the technical field of electronic pipeline heat dissipation, and discloses a power electronic pipeline heat dissipation device which comprises two heat dissipation covers which are detachably installed over an electronic tube body, and circulation cavities used for air flowing are formed in the two heat dissipation covers. Ventilation holes communicating with the circulation cavity are formed in the inner walls of the two heat dissipation covers. According to the utility model, after air flow is transmitted to the interior of the flowing chamber, the air flow flows to the interior of the heat dissipation cover through the ventilation holes and acts on the top of the electron tube body, so that the air flow at the top of the electron tube body flows towards the bottom of the electron tube body along the outer wall of the electron tube body, and the air flow wraps the electron tube body; and the air flow speed around the electron tube body is ensured to be the same, so that the periphery of the electron tube body can timely dissipate heat, internal electronic components are prevented from being damaged due to excessive heating after the electron tube body works for a long time, and the service life of the electron tube body is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic pipeline heat dissipation technical field especially relates to a power electronic pipeline heat dissipation device. BACKGROUND

[0002] The electronic tube is the milestone of early electronic technology, the earliest signal amplifier device. It is enclosed in a glass container, and the effect of electric field on the electron flow in vacuum is used to obtain signal amplification or oscillation. Early application in television, radio amplifier, etc. Electronic products, however, the electronic tube generates heat when working, which is caused by the heat generated by the internal electron flow and the resistance of metal material. The heat of the electronic tube is beneficial to its normal work, but excessive heat will accelerate its aging and reduce the service life of the electronic tube.

[0003] At present, in order to quickly dissipate heat of the electronic tube and other electronic components, a cooling fan is installed inside the equipment where the electronic tube is located. By rotating the cooling fan, the air flow rate around the electronic tube and other electronic devices can be accelerated, so that the purpose of quickly cooling the electronic tube and other electronic devices can be achieved. However, in order to improve the heat dissipation area of the cooling fan during work, the cooling fan is often installed on one side of the equipment, which leads to the fact that the air flow rate on the side of the electronic tube opposite to the cooling fan is much smaller than that on the side opposite to the cooling fan. The heat dissipation on the side of the electronic tube opposite to the cooling fan is not timely enough, which reduces the overall heat dissipation rate of the electronic tube. When the electronic tube works for a long time, the internal electronic components are damaged due to excessive heat, which reduces the service life of the electronic tube. UTILITY MODEL CONTENT

[0004] In order to make up for the above shortcomings, the utility model provides a power electronic tube pipeline heat dissipation device, which aims at solving the problems in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: a power electronic tube pipeline heat dissipation device, comprising:

[0006] The electronic tube body;

[0007] Two heat sinks, which are detachably installed above the electronic tube body, and the inner part of the two heat sinks is provided with a flow chamber for air flow, the inner wall of the two heat sinks is provided with a ventilation hole communicating with the flow chamber, the outer wall of one of the heat sinks is fixedly installed with a micro air pump, the air outlet end of the micro air pump is fixedly installed with a duct, the top of the two heat sinks is fixedly installed with a connecting head communicating with the flow chamber, and the outer wall of the duct is fixedly installed with a ventilation head matched with the connecting head;

[0008] The heat dissipation piece is detachably installed outside the electronic tube body, and the heat generated by the electronic tube body during work can be absorbed by bonding the heat dissipation piece with the outer wall of the electronic tube body.

[0009] As a further description of the above technical solutions:

[0010] The ventilation head is made of rubber material.

[0011] As a further description of the above technical solutions:

[0012] The heat dissipation piece is composed of heat dissipation plates and connecting plates, a plurality of connecting plates are fixedly installed at the bottom of each of the two heat dissipation covers, and a heat dissipation plate is fixedly sleeved with the connecting plates below the two heat dissipation covers, one end of each of the two adjacent heat dissipation plates is fixedly installed with a mounting block, a positioning groove is formed in the top of the mounting block, and a fixing frame is detachably installed between the two adjacent mounting blocks through the positioning grooves.

[0013] As a further description of the above technical solutions:

[0014] The fixing frame is in U-shaped structure, and a pressing block is fixedly installed at each side of the inner cavity of the fixing frame, and one end of the pressing block away from the inner wall of the fixing frame is bent.

[0015] As a further description of the above technical solutions:

[0016] The heat dissipation plate is made of metal copper, and the heat dissipation plate is bent.

[0017] As a further description of the above technical solutions:

[0018] A plurality of heat conduction blocks are fixedly installed on the side of the heat dissipation plate away from the electronic tube body.

[0019] The utility model has the advantages of the following beneficial effects:

[0020] In the utility model, after the airflow is transmitted to the inside of the flow chamber, the airflow flows to the inside of the heat dissipation cover through the ventilation hole and acts on the top of the electronic tube body, so that the airflow on the top of the electronic tube body flows to the bottom of the electronic tube body along the outer wall of the electronic tube body, thereby accelerating the flow rate of the air around the electronic tube body, wrapping the airflow around the outside of the electronic tube body, ensuring the same flow rate of the air around the electronic tube body, and allowing the electronic tube body to be timely cooled around, preventing the internal electronic components from being damaged due to excessive heating after long-time work of the electronic tube body, and prolonging the service life of the electronic tube body. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a perspective view of the utility model;

[0022] Figure 2 It is an assembly view of the heat dissipation cover and the guide pipe of the utility model;

[0023] Figure 3The utility model discloses a main body structure schematic view of heat dissipation cover

[0024] Figure 4 The utility model discloses Figure 2 The structure enlarged view of A in the middle.

[0025] Legend:

[0026] 1, heat dissipation cover, 2, heat dissipation plate, 3, heat conduction block, 4, electronic tube body, 5, guide pipe, 6, micro air pump, 7, connecting plate, 8, ventilation head, 9, connecting head, 10, fixing frame, 11, top pressing block, 12, mounting block, 13, positioning groove. Specific embodiments

[0027] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0028] Referring to Figures 1-4 The utility model provides an embodiment: a kind of power electronic tube pipeline heat dissipation device, comprising:

[0029] Electronic tube body 4 is a kind of electronic device, with multiple functions, mainly including amplification, switching, oscillation and rectification etc. (this is prior art, here do not make too much elaboration).

[0030] Two heat dissipation covers 1 are detachably installed above electronic tube body 4, one end of two heat dissipation covers 1 is mutually adhered and placed above electronic tube body 4, then let heat dissipation cover 1 be fixed above electronic tube body 4, at this time the shape formed after two heat dissipation covers 1 are spliced is same with the top shape of electronic tube body 4, and the radius of heat dissipation cover 1 is greater than the radius of electronic tube body 4.

[0031] The inner part of the two heat sinks 1 is provided with a flow chamber for air flow, and the inner wall of the two heat sinks 1 is provided with a ventilation hole communicating with the flow chamber. After the airflow is transmitted to the inside of the flow chamber, the airflow flows to the inside of the heat sink 1 through the ventilation hole and acts on the top of the electronic tube body 4. At the same time, due to the airflow velocity of the top of the electronic tube body 4 being greater than that of the bottom of the electronic tube body 4, the airflow at the top of the electronic tube body 4 flows along the outer wall of the electronic tube body 4 to the bottom of the electronic tube body 4, thereby accelerating the airflow rate around the electronic tube body 4, wrapping the airflow around the outside of the electronic tube body 4, and ensuring the same airflow rate around the electronic tube body 4, so that the electronic tube body 4 can be cooled in time, preventing the internal electronic components from being damaged due to excessive heating after long-time work, and improving the service life of the electronic tube body 4.

[0032] One of the heat sinks 1 is fixedly installed with a micro air pump 6 (which can be directly purchased on the market, and the model is VBY2106). The air outlet end of the micro air pump 6 is fixedly installed with a conduit 5. The top of the two heat sinks 1 is fixedly installed with a connecting head 9 communicating with the flow chamber. The outer wall of the conduit 5 is fixedly installed with a ventilation head 8 matched with the connecting head 9. When the two heat sinks 1 are installed directly above the electronic tube body 4, the two ventilation heads 8 are installed at the top of the two connecting heads 9 away from the conduit 5, until the top of the connecting head 9 is inserted into the inner cavity of the ventilation head 8. Then the micro air pump 6 is connected to the outer wall of the heat sink 1 by bolts, so as to realize the connection between the micro air pump 6 and the heat sink 1.

[0033] When the micro air pump 6 is fixed outside the heat sink 1, the micro air pump 6 is started. At this time, the air around the micro air pump 6 is sucked into the inside of the conduit 5 through the air inlet end, and enters the inside of the connecting head 9 through the conduit 5. The airflow enters the inside of the flow chamber through the connecting head 9, thereby improving the airflow rate around the electronic tube body 4.

[0034] The heat dissipation piece is detachably installed outside the electronic tube body 4. By fitting the heat dissipation piece with the outer wall of the electronic tube body 4, the heat generated by the electronic tube body 4 during work can be absorbed. When the heat sink 1 is fixed on the top of the electronic tube body 4, the outer wall of the heat dissipation piece is fitted with the outer wall of the electronic tube body 4. The heat generated by the electronic tube body 4 during work can be directly transmitted to the heat dissipation piece, which is conducive to improving the efficiency of heat dissipation of the electronic tube body 4.

[0035] The ventilation head 8 is made of rubber material. The inner diameter of the ventilation head 8 is the same as the outer diameter of the connecting head 9, which can improve the plastic deformation ability of the ventilation head 8, so that the ventilation head 8 can be directly sleeved on the top of the connecting head 9. The deformed ventilation head 8 can extrude the outer wall of the connecting head 9, thereby improving the friction between the connecting head 9 and the ventilation head 8, and increasing the stability of the connection between the connecting head 9 and the ventilation head 8.

[0036] The heat dissipation piece is the heat dissipation plate 2 and the connecting plate 7, the bottom of the two heat dissipation covers 1 is fixedly installed with a plurality of connecting plates 7, and the lower side of the two heat dissipation covers 1 is fixedly sleeved with the heat dissipation plate 2 through a plurality of connecting plates 7, the connecting plate 7 is fixedly sleeved with a plurality of heat dissipation plates 2 along the axis direction, and the plurality of heat dissipation plates 2 and the plurality of heat dissipation covers 1 are connected through the plurality of connecting plates 7.

[0037] The side wall of one end of the adjacent two heat dissipation plates 2 is fixedly installed with the mounting block 12, the top of the mounting block 12 is provided with the positioning groove 13, and the adjacent two mounting blocks 12 are detachably installed with the fixing frame 10 through the positioning groove 13. One end of the fixing frame 10 can be inserted into the inner cavity of the adjacent two positioning grooves 13 at the same time. When the two heat dissipation covers 1 are placed on the top of the electronic tube body 4, the plurality of heat dissipation plates 2 on the two sides are combined with the outer wall of the electronic tube body 4 at the same time. Then the fixing frame 10 is placed between the adjacent two mounting blocks 12, and then one end of the fixing frame 10 is inserted into the inner cavity of the adjacent two positioning grooves 13. The connection of the adjacent two heat dissipation plates 2 can be realized, the heat dissipation plate 2 is always combined with the outer wall of the electronic tube body 4, so that the splicing of the two heat dissipation covers 1 is realized, and the two heat dissipation covers 1 are fixed on the top of the electronic tube body 4.

[0038] The fixing frame 10 is provided in a U-shaped structure, so that one end of the fixing frame 10 can be inserted into the inside of the adjacent two positioning grooves 13 at the same time, and the adjacent two heat dissipation plates 2 are connected.

[0039] The inner cavity of the fixing frame 10 is fixedly installed with the top pressing block 11 on both sides, and one end of the top pressing block 11 away from the inner wall of the fixing frame 10 is bent. When one end of the fixing frame 10 is inserted into the inner cavity of the positioning groove 13, the inner wall of the positioning groove 13 is first combined with the inclined side wall of the top pressing block 11, and as the fixing frame 10 is completely inserted, the two top pressing blocks 11 simultaneously press the inner wall of the positioning groove 13, and the two heat dissipation plates 2 are extruded in the direction of approaching each other, so that the heat dissipation plate 2 is tightly attached to the outer wall of the electronic tube body 4, the friction between the outer wall of the heat dissipation plate 2 and the outer wall of the electronic tube body 4 is improved, and the stability of the heat dissipation cover 1 installed on the top of the electronic tube body 4 is improved.

[0040] The heat dissipation plate 2 is composed of metal copper, part of the heat generated by the electronic tube body 4 is transmitted to the surrounding flowing air, part of the heat is transmitted to the heat dissipation plate 2, and the heat absorbed by the heat dissipation plate 2 is transmitted to the air, so that the heat dissipation of the electronic tube body 4 can be realized.

[0041] The heat dissipation plate 2 is bent, which can improve the contact area between the heat dissipation plate 2 and the outer wall of the electronic tube body 4, improve the stability of the combination between the heat dissipation plate 2 and the electronic tube body 4, and improve the heat absorption area of the heat dissipation plate 2 to the electronic tube body 4, and improve the rate of heat transfer from the electronic tube body 4 to the heat dissipation plate 2.

[0042] The heat dissipation plate 2 is fixedly installed with a plurality of heat conduction blocks 3 on the side away from the electronic tube body 4, the heat conduction blocks 3 are integrally arranged with the heat dissipation plate 2, the area of the outer wall of the heat dissipation plate 2 in contact with air can be improved, and the efficiency of heat transfer of the heat dissipation plate 2 to air can be further improved.

[0043] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for those skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A power electronic tube cooling device, characterized by: Include: The electronic tube body (4); Two heat sinks (1) are detachably mounted above the electronic tube body (4), and the inside of the two heat sinks (1) is provided with a flow-through chamber for air flow, and the inner wall of the two heat sinks (1) is provided with a ventilation hole communicated with the flow-through chamber, and the outer wall of one of the heat sinks (1) is fixedly installed with a micro air pump (6), and the air outlet end of the micro air pump (6) is fixedly installed with a conduit (5), and the top of the two heat sinks (1) is fixedly installed with a connector (9) communicated with the flow-through chamber, and the outer wall of the conduit (5) is fixedly installed with a ventilation head (8) matched with the connector (9); The heat dissipation piece is detachably mounted outside the electronic tube body (4), and the heat dissipation piece is attached to the outer wall of the electronic tube body (4), so as to absorb the heat generated by the electronic tube body (4) during operation; The bottom of the two heat sinks (1) is fixedly installed with a plurality of connecting plates (7), and the lower side of the two heat sinks (1) is fixedly sleeved with a heat sink plate (2) through a plurality of connecting plates (7), and the side wall of one end of the adjacent two heat sink plates (2) is fixedly installed with a mounting block (12), and the top of the mounting block (12) is provided with a positioning groove (13), and the adjacent two mounting blocks (12) are detachably installed with a fixing frame (10) through the positioning groove (13), and one end of the fixing frame (10) can be inserted into the inner cavity of the adjacent two positioning grooves (13).

2. A power electronic tube cooling arrangement according to claim 1, characterised in that: The ventilation head (8) is made of rubber material.

3. A power electronic tube cooling arrangement according to claim 1, characterised in that: The fixing frame (10) is provided with a U-shaped structure, and the inner cavity of the fixing frame (10) is fixedly installed with a pressing block (11) on both sides, and the end of the pressing block (11) away from the inner wall of the fixing frame (10) is curved.

4. A power electronic tube cooling arrangement according to claim 1, characterized in that: The heat sink plate (2) is made of metal copper, and the heat sink plate (2) is curved.

5. A power electronic tube cooling arrangement according to claim 4, wherein: The heat sink plate (2) is fixedly installed with a plurality of heat conduction blocks (3) on the side away from the electronic tube body (4).

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