Heat dissipation dielectric plate with built-in mushroom heat conduction structure
By incorporating a mushroom-shaped heat-conducting structure into the heat dissipation medium plate and utilizing a combination of columnar tubes, heat-conducting fins, and heat-conducting rings, the problem of inconsistent phase change rates in the phase change medium is solved, enabling rapid and uniform heat absorption and storage, and ensuring the safe operation of electronic devices.
Patent Information
- Application Number
- CN202423215970.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
The inconsistent phase change rate of the phase change medium inside the existing heat dissipation plate results in low heat absorption efficiency and cannot effectively cope with the problem of rapid temperature rise under high heat generation power.
A heat dissipation medium plate with a built-in mushroom-shaped heat conduction structure is designed. The mushroom-shaped heat conduction structure is evenly distributed inside the medium plate. The heat conduction unit composed of columnar tubes, heat conduction fins and heat conduction rings is used to achieve uniform heat transfer and rapid heat absorption of the phase change medium.
This technology enables the heat dissipation plate to absorb heat quickly and evenly under high heat generation power, preventing the equipment from heating up too quickly, improving the heat absorption efficiency and heat storage performance of the heat dissipation plate, and keeping electronic components operating within a safe temperature range.
Smart Images
Figure CN223681397U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation medium plate technical field especially a heat dissipation medium plate with built-in mushroom heat conduction structure. BACKGROUND
[0002] At present, the aircraft thermal control system design mainly takes passive thermal control measures with high reliability, long service life and good economic performance. The improvement of thermal conductivity and heat capacity of the thermal control system is always the key direction of high-power microwave and electronic equipment thermal design. Using phase change heat storage technology, improving the system heat capacity under limited weight and space is the main way of high-power equipment thermal control. Solid-liquid phase change has achieved wide development and obtained a large number of research and application experience in the field of hypersonic aircraft thermal control.
[0003] However, the heat dissipation medium plate is filled with phase change medium, and the phase change heat storage needs a certain process and time. When the heat dissipation power of the electronic equipment is too high, the heat absorption efficiency of the heat dissipation medium plate may be insufficient, resulting in rapid temperature rise of the equipment.
[0004] Therefore, it is necessary to provide a heat dissipation medium plate with a new structure to improve the heat absorption efficiency of the internal phase change medium. UTILITY MODEL CONTENT
[0005] In view of the above analysis, the utility model aims to provide a heat dissipation medium plate with built-in mushroom heat conduction structure to solve the problem of low heat absorption efficiency caused by inconsistent phase change speed of the internal phase change medium of the existing heat dissipation medium plate.
[0006] The purpose of the utility model is mainly realized through the following technical schemes:
[0007] A heat dissipation medium plate with built-in mushroom heat conduction structure, comprising: a medium shell, a mushroom heat conduction structure and a phase change medium filled in the internal medium shell;
[0008] The mushroom heat conduction structure is fixedly installed on the inner wall surface of the medium shell by means of bonding or welding;
[0009] The mushroom heat conduction structure comprises: a plurality of heat conduction units arranged in an array;
[0010] The heat conduction unit is composed of a plurality of mushroom type heat conduction cells in series;
[0011] The mushroom type heat conduction cell comprises: a columnar tube, a heat conduction fin and a heat conduction ring.
[0012] Further, the columnar tube is filled with solid phase change medium inside.
[0013] Further, the solid phase change medium inside the columnar tube is a copper-zinc alloy or iron-nickel alloy with solid-solid phase change.
[0014] Further, a plurality of heat-conducting fins are fixedly arranged on the outer side of the columnar tube, and the plurality of heat-conducting fins are equidistantly arranged along the circumferential direction of the columnar tube.
[0015] Further, the heat-conducting fins are in triangular or sector structures.
[0016] Further, the heat-conducting ring is fixedly mounted on the outer side edges of the plurality of heat-conducting fins.
[0017] Further, the thicknesses of the columnar tube, the heat-conducting fins and the heat-conducting ring are all not greater than 1 mm.
[0018] Further, the columnar tube is arranged perpendicularly to the medium shell.
[0019] Further, the diameter of the heat-conducting ring is not greater than 10 mm.
[0020] Further, the gap between the medium shell and the mushroom heat-conducting structure is filled with a solid-liquid phase-change medium.
[0021] The technical scheme of the utility model can at least realize one of the following effects:
[0022] 1. The heat-dissipating medium plate with the built-in mushroom heat-conducting structure can quickly transfer heat to the phase-change medium in the heat-dissipating medium plate through the mushroom heat-conducting structure, so that the phase-change medium can quickly absorb heat, and the temperature of the electronic device can be prevented from rising too fast.
[0023] 2. The heat-dissipating medium plate with the built-in mushroom heat-conducting structure can quickly transfer heat to the phase-change medium in the heat-dissipating medium plate through the mushroom heat-conducting structure, so that the phase-change medium can quickly absorb heat, and the temperature of the electronic device can be prevented from rising too fast.
[0024] In the utility model, the above technical schemes can be combined with each other to realize more optional combination schemes. Other features and advantages of the utility model will be described in the subsequent specification, and some advantages can be apparent from the specification or can be understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained through the contents specifically pointed out in the specification and the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0025] The drawings are only used for the purpose of showing the specific embodiments and are not considered as limiting the utility model. In the whole drawings, the same reference signs represent the same parts.
[0026] Figure 1This is a schematic diagram of the heat dissipation medium plate with a built-in mushroom heat conduction structure of the present invention;
[0027] Figure 2 for Figure 1 A schematic diagram of the mushroom-shaped heat-conducting structure in the image;
[0028] Figure 3 This is a schematic diagram of the heat-conducting unit.
[0029] Figure 4 This is a schematic diagram of the structure of a mushroom-shaped heat-conducting cell.
[0030] Figure label:
[0031] 1-Dielectric shell; 2-Mushroom-shaped heat-conducting structure; 3-Columnar tube; 4-Heat-conducting fins; 5-Heat-conducting ring. Detailed Implementation
[0032] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.
[0033] Example 1
[0034] In one specific embodiment of this utility model, an improved design of an existing heat dissipation medium plate is provided, which has a built-in mushroom heat conduction structure to enhance its heat absorption and heat storage capabilities.
[0035] like Figure 1 , Figure 2 As shown, in this embodiment, the heat dissipation medium plate includes: a medium shell 1, a mushroom-shaped heat-conducting structure 2, and a phase change medium filled inside the medium shell 1.
[0036] Preferably, the mushroom-shaped heat-conducting structure 2 is fixedly installed on the inner wall surface of the medium shell 1 by bonding or welding. The medium shell 1 is a split structure, including a medium storage cavity and a cover plate; the cover plate and the medium storage cavity are fixed together by bonding or welding.
[0037] Preferably, such as Figure 3 , Figure 4 As shown, the mushroom-shaped heat-conducting structure 2 includes multiple heat-conducting units arranged in an array.
[0038] Specifically, such as Figure 3 As shown, the heat-conducting unit is composed of multiple mushroom-shaped heat-conducting cells connected in series.
[0039] Furthermore, such as Figure 1 , Figure 2As shown, the mushroom heat conduction structure 2 is formed by multiple mushroom heat conduction cells arranged in horizontal direction and multiple layers of mushroom heat conduction cells arranged in vertical direction, and the multiple layers of mushroom heat conduction cells are fixedly connected.
[0040] Further, the mushroom heat conduction structure 2 is made of metal material with high heat conductivity.
[0041] Preferably, as shown, the mushroom heat conduction cell comprises a columnar tube 3, a heat conduction fin 4 and a heat conduction ring 5. Figure 4
[0042] In this embodiment, the columnar tube 3 is filled with solid phase change medium. Preferably, the solid phase change medium in the columnar tube 3 is solid-solid phase change copper-zinc alloy or iron-nickel alloy.
[0043] Further, multiple heat conduction fins 4 are fixedly arranged on the outer side of the columnar tube 3, and the multiple heat conduction fins 4 are arranged at equal intervals along the circumferential direction of the columnar tube 3. That is, the heat conduction fins 4 form a circle on the outside of the columnar tube 3, and the intervals between adjacent heat conduction fins 4 are equal.
[0044] Preferably, the heat conduction fin 4 is in triangular structure or fan-shaped structure.
[0045] Further, the heat conduction ring 5 is fixedly installed on the outer edge of the multiple heat conduction fins 4, as shown. Figure 4
[0046] Preferably, the thickness of the columnar tube 3, the heat conduction fin 4 and the heat conduction ring 5 is not greater than 1mm.
[0047] Preferably, the columnar tube 3 is arranged perpendicularly to the medium shell 1, as shown. Figure 1
[0048] Preferably, the diameter of the heat conduction ring 5 is not greater than 10mm.
[0049] Preferably, the shape of the medium shell 1, the horizontal distribution number, the layer number and the horizontal distribution area of the heat conduction unit in the mushroom heat conduction structure 2 can be adjusted according to actual needs.
[0050] Further, the gap between the medium shell 1 and the mushroom heat conduction structure 2 is filled with solid-liquid phase change medium; preferably, the solid-liquid phase change medium is paraffin phase change medium.
[0051] In the embodiment, when the medium shell 1 of the heat dissipation medium plate absorbs heat generated by the heat generating electronic device, the heat dissipation medium plate is quickly heated, and then the heat is conducted to the mushroom heat conduction structure 2 in a contact conduction mode, and then the mushroom heat conduction structure 2 exchanges heat with the phase change medium filled in the heat dissipation medium plate, and since the mushroom heat conduction structure 2 is uniformly distributed in the heat dissipation medium plate, the heat can be uniformly transmitted to the phase change medium in the heat dissipation medium plate, the phase change medium is quickly heated as a whole, and the temperature of the electrical equipment is prevented from rising too fast.
[0052] In the embodiment, by filling the solid-solid phase change medium in the columnar tube 3, the heat can be directly stored after the mushroom heat conduction structure 2202 absorbs heat, and the heat storage and heat conduction performance of the heat dissipation medium plate is improved.
[0053] In the embodiment, by setting the mushroom heat conduction structure 2 as a thin plate structure, the internal space of the heat dissipation medium plate is as small as possible, the heat dissipation medium plate is prevented from being heated too fast under the premise of realizing fast heat conduction, the heat generating electronic device is maintained in a safe temperature state to work, the mushroom heat conduction structure 2 can realize synchronous heating of the whole heat dissipation medium plate, the heat is quickly transferred, and the temperature overload of the heat generating electronic device is avoided.
[0054] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A heat dissipation medium plate having a built-in mushroom heat guide structure, characterized by, The application relates to a heat-conducting structure of a mushroom type. The heat-conducting structure of the mushroom type comprises a medium shell (1), a heat-conducting structure of the mushroom type (2) and phase-change medium filled in the medium shell (1). The heat-conducting structure of the mushroom type (2) is fixedly installed on the inner wall surface of the medium shell (1) by means of bonding or welding. The heat-conducting structure of the mushroom type (2) comprises a plurality of heat-conducting units arranged in an array. The heat-conducting units are a plurality of heat-conducting cells of the mushroom type connected in series. The heat-conducting cell of the mushroom type comprises a columnar tube (3), a heat-conducting fin (4) and a heat-conducting ring (5).
2. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 1, characterized by, The columnar tube (3) is internally filled with solid phase-change medium.
3. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 2, characterized by, The solid phase-change medium in the columnar tube (3) is copper-zinc alloy or iron-nickel alloy of solid-solid phase change.
4. The heat dissipation medium plate having a mushroom heat guide structure built-in according to any one of claims 1 to 3, characterized by, The columnar tube (3) is externally fixedly provided with a plurality of heat-conducting fins (4), and the heat-conducting fins (4) are arranged at equal intervals along the circumferential direction of the columnar tube (3).
5. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 4, characterized by, The heat-conducting fin (4) is in a triangular structure or a sector structure.
6. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 5, characterized by, The heat-conducting ring (5) is fixedly installed on the outer side edge of the heat-conducting fin (4).
7. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 6, characterized by, The thickness of the columnar tube (3), the heat-conducting fin (4) and the heat-conducting ring (5) is not greater than 1 mm.
8. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 7, characterized by, The columnar tube (3) is arranged perpendicularly to the medium shell (1).
9. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 8, characterized by, The diameter of the heat-conducting ring (5) is not greater than 10 mm.
10. The heat dissipation medium plate having a built-in mushroom heat guide structure according to claim 1, characterized by, Solid-liquid phase-change medium is filled in the gap between the medium shell (1) and the heat-conducting structure of the mushroom type (2).