LED (light-emitting diode) for socket
By designing an LED light-emitting diode with a lead frame structure, direct assembly without secondary processing is achieved, solving the problems of multiple welding processes and excessive solder paste usage, and improving welding efficiency and component yield.
Patent Information
- Application Number
- CN202422558969.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-10-22
AI Technical Summary
Existing technologies involve numerous welding processes and require a large amount of solder paste, resulting in low welding efficiency and a low yield rate for components.
The socket uses LED light-emitting diodes and is designed with a lead frame structure. The lead frame is stamped to achieve precise control of lead size and bending accuracy, avoiding conventional secondary processing. It can be directly assembled with other structures and components, eliminating the need for wave soldering or reflow soldering.
It improves welding efficiency, avoids electrical defects caused by high-temperature welding, and increases the yield rate of components.
Smart Images

Figure CN223681445U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the packaging device technical field of electronic components, specifically relates to a socket uses LED light emitting diode. BACKGROUND
[0002] With the continuous development of smart home, communication field, innovative products with high reliability emerge in endlessly, with the surrounding supporting products innovation and improvement ceaselessly, and the application requirement of plug-in components is higher and higher, on the basis of the existing application suitable for conventional welding assembly, higher efficiency assembly mode has been pursued, such as saving high temperature soldering, directly assembling plug-in components into application structure parts,
[0003] The conventional support lead is vertical and linear (see Figure One ), and the general application end has two welding modes, the first is that the pin is directly inserted into the PCB board soldering hole and passes through the soldering furnace high temperature welding, the plug-in electronic component is fixed on the PCB board, and electrical connection is formed, and the second is that the plug-in electronic component is connected with longer lead, resistance and the like by using soldering iron or other automatic welding equipment, and the lead needs to be sleeved with an insulating shell and then assembled.
[0004] Therefore, during on-site welding, especially the second welding method, the welding process and the solder paste cost are high, the application end assembly efficiency is reduced, and high temperature welding may cause poor electrical property of the component. CONTENT OF THE UTILITY MODEL
[0005] TECHNICAL PROBLEM
[0006] In view of the above-mentioned defects in the prior art, the utility model provides a socket uses LED light emitting diode, which can effectively solve the problems of multiple welding processes, more solder paste use, low welding efficiency and low component yield in the prior art.
[0007] TECHNICAL SCHEME
[0008] In order to achieve the above object, the utility model is realized by the following technical scheme:
[0009] The utility model provides a socket uses LED light emitting diode, including bottom rib, the top of the bottom rib is fixed with pin, the top of the pin is fixed with function area, the bottom of the function area is also provided with a group of pins, the bottom of the group of pins is electrically connected with first horizontal rib, and the middle part of another group of pins is electrically connected with second horizontal rib.
[0010] Further, the function area adopts single bowl cup, double equal size platform and big and small double platform, and the two groups of pins under the function area are all formed by stamping and bending 90 degrees to the two sides.
[0011] Further, the distance between the first horizontal rib and the functional area is greater than or equal to 4 mm.
[0012] Further, the width of the first horizontal rib is greater than or equal to 0.4 mm, and the thickness of the pin is greater than or equal to the width of the pin.
[0013] Further, the second horizontal rib is a two-segment structure composed of a bottom horizontal rib and a thin rib with a smaller radial surface than the bottom horizontal rib, the top end of the bottom horizontal rib and the thin rib is added with a glue, the width of the thin rib is designed to be less than or equal to the size of the remaining pin, and at the same time greater than or equal to 0.2 mm, and the bottom horizontal rib is the same as the size of the remaining pin.
[0014] Further, a plurality of round holes are arranged in the middle of the bottom rib, and the minimum distance between each group of round holes is greater than or equal to 5.08 mm.
[0015] Beneficial effects
[0016] Compared with the known prior art, the technical scheme provided by the utility model has the following beneficial effects:
[0017] The utility model discloses a lead frame structure, which is formed by setting two groups of horizontal ribs, and the lead frame is stamped and formed, the size precision of the lead, especially the bending precision, can be controlled within ±1°, and the length size precision of the lead can be controlled within ±0.1mm, which greatly avoids various precision deficiencies and abnormal deformation caused by conventional secondary processing bending and other bad conditions.
[0018] The device can be directly assembled with other structures and components without bending and other processing, and does not need conventional wave soldering or reflow soldering, etc., which improves the efficiency and avoids the electrical properties caused by high-temperature soldering. DRAWINGS
[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating labor.
[0020] Figure 1 It is a structure schematic view of the conventional support lead;
[0021] Figure 2 It is a structure schematic view of the utility model;
[0022] Figure 3 It is a connection between the packaging glue and the pin in the utility model;
[0023] Figure 4 The assembling structure of the light emitting diode in the utility model.
[0024] The numbers in the drawing represent: 1, pin; 2, functional area; 3, bottom rib; 4, first horizontal rib; 5, second horizontal rib; 6, colloid. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0026] The utility model will be further described in combination with the embodiments.
[0027] Embodiment: a socket uses LED light emitting diode, referring to the attached Figure 2 -attached Figure 4 , including bottom rib 3, the top end of the bottom rib 3 is fixed with pin 1, the top end of the pin 1 is fixed with functional area 2, the bottom end of the functional area 2 is also provided with a group of pins 1, the bottom end of the group of pins 1 is electrically connected with first horizontal rib 4, the middle part of another group of pins 1 is electrically connected with second horizontal rib 5;By setting two groups of horizontal rib structures, the lead frame structure is formed, the lead frame is stamped and formed, the lead size precision, especially the bending precision, can be controlled within ±1 ° range, and the lead length size precision can be controlled within the precision of ±0.1mm, which greatly avoids various precision deficiencies and abnormal deformation caused by conventional secondary reprocessing bending and other defects.
[0028] The functional area 2 adopts single-bowl cup, double equal-size platforms and double platforms with big and small sizes, and the two groups of pins 1 under the functional area 2 are all formed by stamping and bending 90 ° to both sides.
[0029] The distance between the first horizontal rib 4 and the functional area 2 is greater than or equal to 4 mm; the width of the first horizontal rib 4 is greater than or equal to 0.4 mm, and the thickness of the pin 1 is greater than or equal to the width of the pin 1; the second horizontal rib 5 is a two-section structure composed of a bottom horizontal rib and a thin rib with a smaller diameter than the bottom horizontal rib, and the top end of the bottom horizontal rib and the thin rib is added with a glue 6; the width of the thin rib is designed to be less than or equal to the size of the remaining pin 1, and at the same time greater than or equal to 0.2 mm, and the bottom horizontal rib has the same size as the remaining pin 1; the middle part of the bottom rib 3 is provided with a plurality of groups of circular holes, and the minimum distance of each group of circular holes is greater than or equal to 5.08 mm; the user can directly cooperate and assemble with other structures and components without bending and other processing, without the need for conventional wave soldering or reflow soldering, etc., on the basis of improving efficiency, avoiding electrical and other bad effects caused by high-temperature soldering.
[0030] Figure Four The light-emitting diode shown in the actual application assembly process is with the lamp holder facing down, the lamp holder is arranged in the clamping hole, the positive and negative electrode pins are placed in the corresponding clamping groove, then the negative electrode pin is placed above the resistor, then the resistor and the positive electrode pin are placed above the spring, then the plastic buckle (or plastic shell) with the copper sheet connected with the external power supply is assembled above the spring, so that each assembly part is fastened and the electrical connection is smooth. The whole process has no high-temperature soldering process, the efficiency is improved, the energy is saved, and the appearance or electrical failure caused by high-temperature soldering can be avoided.
[0031] The above examples are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the protection scope of the technical solutions of the embodiments of the present application.
Claims
1. A socket using LED light emitting diode, characterized in that, It includes bottom rib (3), the top end of the pin (1) is fixed with the pin (1), the top end of the pin (1) is fixed with the functional area (2), the bottom end of the functional area (2) is also provided with a group of pins (1), the bottom end of the group of the pin (1) is electrically connected with the first horizontal rib (4), the middle part of another group of pins (1) is electrically connected with the second horizontal rib (5).
2. A socket using LED light emitting diode according to claim 1, wherein, The functional area (2) adopts single bowl cup, double equal size platform and double platform with big and small, and the two groups of pins (1) under the functional area (2) are all formed by stamping to bend 90° to the two sides.
3. The LED light emitting diode for socket use according to claim 1, wherein The interval between the first horizontal rib (4) and the functional area (2) is greater than or equal to 4 mm.
4. The LED light emitting diode for use in a socket according to claim 1, wherein, The width size of the first horizontal rib (4) is greater than or equal to 0.4 mm, and the thickness size of the pin (1) should be greater than or equal to the width size of the pin (1).
5. A socket using LED light emitting diode according to claim 4, wherein, The second horizontal rib (5) is a two-section structure, which is composed of a bottom horizontal rib and a thin rib with a smaller diameter than the bottom horizontal rib, and the top end of the bottom horizontal rib and the thin rib is added with a colloid (6), the width size of the thin rib is designed to be less than or equal to the size of the reserved pin (1), and at the same time, it is greater than or equal to 0.2 mm, and the size of the bottom horizontal rib is the same as the size of the reserved pin (1).
6. The LED light emitting diode for use in a socket according to claim 1, wherein, The middle part of the bottom rib (3) is provided with a plurality of circular holes, and the minimum interval of each group of circular holes is greater than or equal to 5.08 mm.