Cold and hot impact equipment

By installing a dehumidification system in the thermal shock equipment to dry the gas at the low-temperature inlet, the problem of water stain contamination in the luminescent area of ​​the sample during thermal shock testing was solved, thereby improving the luminescent performance of the sample and the working efficiency of the equipment.

CN223683565UActive Publication Date: 2025-12-19JADE BIRD DISPLAY (SHANGHAI) LTD
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Patent Information

Application Number
CN202423323044.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-19
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

The luminescent area of ​​the sample is easily contaminated by water stains during thermal shock tests, which affects its luminescence performance.

Method used

A dehumidification system is installed in the thermal shock equipment to dry the air inlet of the low-temperature chamber, thereby reducing the humidity of the low-temperature gas and decreasing the probability of water stains.

Benefits of technology

It reduces the probability of condensation of frost and water droplets on the sample surface, improves the luminescence performance and cleanliness of the sample, and extends the effective working time of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides cold and hot shock equipment. The cold and hot shock equipment comprises a test chamber; a gas outlet of the high-temperature chamber is communicated with the test chamber, and the high-temperature chamber is used for providing high-temperature gas for the test chamber; the low-temperature chamber is provided with a gas inlet and a gas outlet, the gas outlet of the low-temperature chamber is communicated with the test chamber, the low-temperature chamber is used for providing low-temperature gas for the test chamber, and the temperature of the low-temperature gas is lower than that of the high-temperature gas; and the dehumidification system is at least used for drying gas entering the gas inlet of the low-temperature chamber. According to the scheme, the probability of generating water stains on the sample can be reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to test equipment technical field especially relates to a cold and hot impact equipment. BACKGROUND

[0002] The cold and hot impact equipment, also known as cold and hot impact test box, cold and hot impact test box or temperature impact test box, is a kind of equipment that can simulate extreme temperature environment change. Sample is placed in the equipment, and by quickly switching high temperature and low temperature environment, the use state of sample under extreme temperature condition is simulated to evaluate its performance and reliability.

[0003] In some scenarios, cold and hot impact test needs to be carried out on the sample with light-emitting area. In the test process, the sample light-emitting area is fixed upward in the aging process, and the sample light-emitting area is easy to be contaminated by water stain, which affects the light-emitting performance of the sample. UTILITY MODEL CONTENT

[0004] The technical problem solved by the utility model is that the sample light-emitting area is easy to be contaminated by water stain, which affects the light-emitting performance of the sample.

[0005] To solve the above technical problem, the utility model embodiment provides a cold and hot impact equipment, which comprises: a test chamber; a high-temperature chamber, which is communicated with the test chamber at an outlet, and is used for providing high-temperature gas to the test chamber; a low-temperature chamber, which has an inlet and an outlet, and is communicated with the test chamber at the outlet, and is used for providing low-temperature gas to the test chamber, and the temperature of the low-temperature gas is lower than that of the high-temperature gas; and a dehumidification system, which is used at least for drying the gas entering the inlet of the low-temperature chamber.

[0006] Optionally, the dehumidification system comprises a dehumidification part and a filtering part, wherein: the dehumidification part comprises: a shell, which has a gas inlet and a gas outlet; a gas-permeable accommodating part, which is located in the shell and is used for accommodating moisture-absorbing particles, the moisture-absorbing particles are used for adsorbing water in the flowing gas to obtain dry gas; a first air flow channel, which is communicated with the gas inlet and is located between the inner wall of the shell and the accommodating part; and a second air flow channel, which is used for collecting the dry gas and is connected with the gas outlet; and the filtering part is connected with the dehumidification part and filters the dry gas.

[0007] Optionally, the accommodating part surrounds the second air flow channel.

[0008] Optionally, the accommodating part is concave and hollow.

[0009] Optionally, the first air flow channel surrounds the accommodating part.

[0010] Optionally, the number of the dehumidifying units is multiple, the multiple dehumidifying units are connected in series, or the multiple dehumidifying units are connected in parallel to obtain multiple parallel branches, and one or more dehumidifying units are arranged on each parallel branch.

[0011] Optionally, the multiple dehumidifying units are connected with the filtering unit, or each dehumidifying unit is respectively provided with a corresponding filtering unit.

[0012] Optionally, the surface of the hygroscopic particle is provided with multiple grooves.

[0013] Optionally, the hygroscopic particle is a structure including silica gel material and having micropores.

[0014] Optionally, the number of the dehumidifying systems is multiple, and the dehumidifying system is further used for drying the gas entering the gas inlet of the high-temperature chamber.

[0015] Optionally, the first switching device is arranged between the low-temperature chamber and the test chamber and is used for controlling the low-temperature chamber to supply or stop supplying the low-temperature gas to the test chamber, and / or the second switching device is arranged between the high-temperature chamber and the test chamber and is used for controlling the high-temperature chamber to supply or stop supplying the high-temperature gas to the test chamber.

[0016] Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:

[0017] The cold and hot impact equipment is provided with the dehumidifying system, the dehumidifying system is used for drying the gas entering the gas inlet of the low-temperature chamber, so as to reduce the humidity of the gas entering the low-temperature chamber, and further reduce the humidity of the low-temperature gas obtained by the low-temperature chamber, that is, reduce the humidity of the low-temperature gas provided by the low-temperature chamber to the test chamber. By reducing the humidity of the low-temperature gas provided to the test chamber, the probability of condensation of ice and water droplets on the surface of the sample can be reduced, that is, the probability of water stains on the sample can be reduced. For the sample with a light-emitting area, the probability of the light-emitting area of the sample being contaminated by water stains is reduced, and the probability of the light-emitting area being contaminated by water stains and affecting the light-emitting performance of the sample is avoided.

[0018] Further, by connecting the multiple dehumidifying units in series, the dehumidifying effect can be improved to reduce the humidity of the obtained dry gas as much as possible, that is, the dryness degree of the dry gas is improved. In the cold and hot impact test, the probability of water stains on the sample is further reduced, and even the generation of water stains on the sample is expected to be avoided.

[0019] Further, the multiple dehumidifying units are connected in parallel to obtain multiple parallel branches, one dehumidifying unit can be arranged on each parallel branch, and multiple dehumidifying units can also be arranged on each parallel branch. Since the processing rate of a single dehumidifying unit has a certain upper limit, connecting the multiple dehumidifying units in parallel helps to improve the output rate of the dry gas. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structure schematic view of a cold and hot impact equipment in the embodiment of the utility model;

[0021] Figure 2 is a structure schematic view of a dehumidification part in the embodiment of the utility model;

[0022] Figure 3 is a layout schematic view of a dehumidification part;

[0023] Figure 4 is another layout schematic view of a dehumidification part;

[0024] Figure 5 is still another layout schematic view of a dehumidification part. DETAILED DESCRIPTION

[0025] As described above, in some scenarios, cold and hot impact test needs to be carried out on a sample with a light-emitting area, and in the test process, the sample light-emitting area is fixed upward in the aging process, and with the continuous switching of low temperature and high temperature, the sample temperature is switched back and forth in the low-temperature and high-temperature conversion process of the cold and hot impact equipment, and ice and water droplets will condense on the surface of the sample at low temperature, and then evaporate when the temperature is switched from low to high, leaving water stains on the surface of the sample such as the sample light-emitting area, which pollutes the sample light-emitting area and affects the light-emitting performance of the sample.

[0026] To solve the above problems, the cold and hot impact equipment is provided with a dehumidification system, which dries the gas at the air inlet of the low-temperature chamber to reduce the humidity of the gas entering the low-temperature chamber, and in turn reduce the humidity of the low-temperature gas obtained by the low-temperature chamber, that is, reduce the humidity of the low-temperature gas provided by the low-temperature chamber to the test chamber. By reducing the humidity of the low-temperature gas provided to the test chamber, the probability of condensation of ice and water droplets on the surface of the sample can be reduced, that is, the probability of water stains on the sample can be reduced. For the sample with a light-emitting area, the probability of the light-emitting area of the sample being polluted by water stains is reduced, and the probability of the light-emitting area being polluted by water stains and affecting the light-emitting performance of the sample is avoided.

[0027] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0028] The utility model provides a kind of cold and hot impact equipment, and cold and hot impact equipment includes test chamber, high-temperature chamber and low-temperature chamber.Test chamber is used to place the sample to be carried out cold and hot impact test.High-temperature chamber provides high-temperature gas for test chamber, and low-temperature chamber provides low-temperature gas for test chamber.

[0029] The cold and hot shock equipment can further comprise a heating device for heating the gas to prepare high-temperature gas. The heating device can be placed in the high-temperature chamber. The heating device can also be placed outside the high-temperature chamber, and the high-temperature gas prepared by the heating device is delivered into the high-temperature chamber. The specific structure of the heating device is not limited here, as long as the high-temperature gas with the required temperature can be prepared.

[0030] In some embodiments, when the heating device is placed in the high-temperature chamber, the gas can be delivered to the gas inlet of the heating device or the gas inlet of the high-temperature chamber through the gas pipeline. When the heating device is placed outside the high-temperature chamber, the gas can be delivered to the gas inlet of the heating device through the gas pipeline.

[0031] The cold and hot shock equipment can further comprise a refrigeration device for cooling the gas to prepare low-temperature gas. The refrigeration device can be placed in the low-temperature chamber. The refrigeration device can also be placed outside the low-temperature chamber, and the low-temperature gas prepared by the refrigeration device is delivered into the low-temperature chamber. The specific structure of the refrigeration device is not limited here, as long as the low-temperature gas with the required temperature can be prepared.

[0032] In some embodiments, when the refrigeration device is placed in the low-temperature chamber, the gas can be delivered to the gas inlet of the refrigeration device or the gas inlet of the low-temperature chamber through the gas pipeline. When the refrigeration device is placed outside the low-temperature chamber, the gas can be delivered to the gas inlet of the refrigeration device through the gas pipeline.

[0033] In specific implementations, an air compressor or the like can be used to provide the heating device or the refrigeration device with gas to ensure the supply of gas.

[0034] The gas in the embodiments of the utility model can be air or other suitable gas.

[0035] Referring to Figure 1 , a structure diagram of a cold and hot shock equipment in the embodiments of the utility model is given. The specific structure of the cold and hot shock equipment will be described below. Figure 1

[0036] In specific implementations, the cold and hot shock equipment can comprise a test chamber 10, a high-temperature chamber 20, a low-temperature chamber 30, and a dehumidification system 40. The gas outlet of the high-temperature chamber 20 is communicated with the test chamber 10, and the high-temperature chamber 20 is used to provide high-temperature gas to the test chamber 10. The low-temperature chamber 30 has a gas inlet and a gas outlet, and the gas outlet of the low-temperature chamber 30 is communicated with the test chamber 10, and the low-temperature chamber 30 is used to provide low-temperature gas to the test chamber 10. The dehumidification system 40 is used to dry at least the gas entering the gas inlet of the low-temperature chamber 30.

[0037] ​In specific implementations, the sample 100 type subjected to the cold-heat shock test, the temperature of the high-temperature gas, and the temperature of the low-temperature gas are different according to requirements. The specific temperature values of the high-temperature gas and the specific temperature values of the low-temperature gas are configured according to actual requirements, which are not limited here, as long as the temperature of the low-temperature gas is lower than the temperature of the high-temperature gas. It should be noted that the high and low temperatures here refer to the relative high and low temperatures, that is, the temperature of the gas supplied by the high-temperature chamber is higher than the temperature of the gas supplied by the low-temperature chamber, and not specifically a certain temperature.

[0038] As can be seen from the above scheme, the dehumidification system 40 is used to dry the gas entering the inlet of the low-temperature chamber 30 to reduce the humidity of the gas entering the low-temperature chamber 30, thereby reducing the humidity of the low-temperature gas obtained by the low-temperature chamber 30, that is, the humidity of the low-temperature gas provided by the low-temperature chamber 30 to the test chamber 10. By reducing the humidity of the low-temperature gas provided to the test chamber 10, the probability of water stains on the sample 100 can be reduced. For the sample 100 with a light-emitting area, the probability of the light-emitting area of the sample 100 being contaminated by water stains is reduced, and the probability of the light-emitting area being contaminated by water stains affecting the light-emitting performance of the sample 100 is avoided. In addition, by reducing the probability of the light-emitting area of the sample 100 being contaminated by water stains, the cleanliness of the surface of the sample 100 can be improved, the operation is facilitated, the by-products are controlled, and the repeated use of the sample 100 is satisfied.

[0039] In addition, by drying the gas entering the inlet of the low-temperature chamber 30, the probability of frosting in the low-temperature chamber 30 can also be reduced, the frosting phenomenon in the low-temperature chamber 30 can be slowed down, and the defrosting cycle of the low-temperature chamber 30 can be prolonged. By prolonging the defrosting cycle of the low-temperature chamber 30, the effective working time of the cold-heat shock equipment can be increased, and the cold-heat shock test efficiency can be improved.

[0040] In specific implementations, in combination with Figures 2 to 5 The dehumidification system 40 can include a dehumidification part 41 and a filtering part 42. The dehumidification part 41 is used to dry the gas to obtain dry gas. The process of drying the gas is the process of adsorbing the moisture in the gas, that is, the process of dehumidifying the gas. The filtering part 42 is used to filter the dry gas to remove impurities (such as debris, etc.) in the dry gas.

[0041] In some embodiments, in combination with Figure 2 The dehumidification part 41 can include a shell 411, a containing part 412, a first gas flow channel 413, and a second gas flow channel 414.

[0042] The shell 411 has a gas inlet 4111 and a gas outlet 4112. The accommodation portion 412 is gas-permeable and is located in the shell 411 for accommodating the hygroscopic particles 415 for adsorbing moisture in the flowing gas to obtain dry gas. The use of the adsorption dehumidification principle for dehumidifying the gas can avoid the generation of additional substances to avoid pollution or damage to the sample 100.

[0043] Preferably, the main component of the hygroscopic particles 415 is silica gel, which is a material with a microporous structure capable of adsorbing surrounding water molecules to achieve drying effect. The microporous structure of the silica gel makes its surface area very large, which enables it to adsorb a large amount of moisture. In some variant embodiments, the main component of the hygroscopic particles 415 can also be calcium chloride.

[0044] The first gas flow channel 413 is in communication with the gas inlet 4111 and is located between the inner wall of the shell 411 and the accommodation portion 412.

[0045] In some non-limiting embodiments, the first gas flow channel 413 surrounds the accommodation portion 412, which can increase the contact area between the accommodation portion 412 and the first gas flow channel 413 and allow the hygroscopic particles 415 in the accommodation portion 412 to have a gap with the accommodation portion 412, so as to facilitate the more sufficient and rapid diffusion of the gas flow into the accommodation portion 412, which helps to improve the gas flow rate and the utilization rate of the hygroscopic particles 415, thereby improving the gas drying efficiency, i.e., the dehumidification efficiency of the gas.

[0046] In specific implementations, the second gas flow channel 414 is used to collect the dry gas and is connected with the gas outlet 4112.

[0047] In some non-limiting embodiments, the accommodation portion 412 surrounds the second gas flow channel 414. In this way, the contact area between the accommodation portion 412 and the second gas flow channel 414 can be increased, so as to facilitate the rapid diffusion of the dry gas obtained by the accommodation portion 412 to the second gas flow channel 414 for more efficient collection of the dry gas and improved collection efficiency of the dry gas.

[0048] In some embodiments, the accommodation portion 412 has a concave hollow shape. For example, the accommodation portion 412 has a U-shaped structure. For another example, the accommodation portion 412 has a concave structure. The concave hollow structure can further increase the specific surface area of the hygroscopic particles 415 and improve the dehumidification efficiency.

[0049] In some non-limiting embodiments, the accommodation portion 412 can be made of a mesh structure to ensure the gas permeability of the accommodation portion 412 and facilitate the diffusion of the gas.

[0050] Further, the mesh size of the mesh structure is smaller than the size of the hygroscopic particles 415, so as to avoid the hygroscopic particles 415 from falling off the mesh structure into the dry gas, ensure the cleanliness of the dry gas, and avoid additional substances from entering the test chamber 10 to contaminate or damage the sample 100.

[0051] In some embodiments, the number of the dehumidification parts 411 can be multiple.

[0052] In some non-limiting embodiments, referring to Figure 3 , the multiple dehumidification parts 411 can be connected in series. By connecting the multiple dehumidification parts 411 in series, the dehumidification effect can be improved, so as to reduce the humidity of the obtained dry gas as much as possible, that is, to improve the dryness degree of the dry gas. In the cold and hot impact test, the probability of water stains on the sample 100 can be further reduced, and even the water stains on the sample 100 can be avoided.

[0053] In other non-limiting embodiments, referring to Figure 4 and Figure 5 , the multiple dehumidification parts 411 can also be connected in parallel, multiple parallel branches are obtained, one dehumidification part 411 can be arranged on each parallel branch, and multiple dehumidification parts 411 can also be arranged on each parallel branch. Since the processing rate of a single dehumidification part 411 has a certain upper limit, connecting multiple dehumidification parts 411 in parallel helps to improve the output rate of the dry gas.

[0054] It should be noted that the number of dehumidification parts 411 arranged on each parallel branch can be configured according to actual needs, which is not limited here. Among them, Figure 5 the number of dehumidification parts 411 on the parallel branch shown in the figure is only a schematic example for easy understanding, and in actual use, it is not limited to this, and other values can also be used. For example, one of the parallel branches is configured with one dehumidification part 411, another parallel branch is configured with two dehumidification parts 411, and another parallel branch is configured with three dehumidification parts 411.

[0055] In specific implementation, the multiple dehumidification parts 411 are all connected with the filter part 42, or each dehumidification part 411 is respectively provided with a corresponding filter part 412.

[0056] In some embodiments, the surface of the hygroscopic particles 415 is provided with multiple grooves. The specific surface area of the hygroscopic particles 415 can be increased by the grooves, and the dehumidification efficiency can be improved by increasing the specific surface area of the hygroscopic particles 415.

[0057] In specific embodiments, the number of the dehumidification systems 40 is multiple, wherein the dehumidification systems are further used to dry the gas entering the gas inlet of the high-temperature chamber 20. By drying the gas entering the gas inlet of the high-temperature chamber 20, the humidity of the high-temperature gas is reduced, and the probability of the water on the sample 100 being cooled by the subsequent low-temperature gas and then evaporated by the high-temperature gas to cause water stains is reduced, thereby ensuring the cleanliness of the sample 100.

[0058] The specific structure of the dehumidification system used to dry the gas entering the gas inlet of the high-temperature chamber 20 can be the same as that of the dehumidification system used to dry the gas entering the gas inlet of the low-temperature chamber 30, which will not be described here.

[0059] In some embodiments, a first switching device 50 is arranged between the low-temperature chamber 30 and the test chamber 10, and the first switching device 50 is used to control the low-temperature chamber 30 to supply or stop supplying the low-temperature gas to the test chamber 10. The first switching device 50 can be a switching component such as a pneumatic valve that can realize the on-off of the gas.

[0060] In some embodiments, a second switching device 60 is arranged between the high-temperature chamber 20 and the test chamber 10, and the second switching device 60 is used to control the high-temperature chamber 20 to supply or stop supplying the high-temperature gas to the test chamber 10. The second switching device 60 can be a switching component such as a pneumatic valve that can realize the on-off of the gas.

[0061] The design concept of the cold and hot impact equipment provided in the present application is helpful for the controllable modification of the traditional three-box cold and hot impact equipment, and the modification process will not affect the sample 100 in the test chamber 10, and the modification of the part before the gas inlet of the low-temperature chamber 30 or the part before the gas inlet of the high-temperature chamber 20 is directional, which will not affect the normal operation of other parts of the equipment.

[0062] Preferably, the sample 100 tested by using the cold and hot impact equipment provided in the present application is a micro light-emitting diode (Micro LED) display panel. In the Micro LED display panel, each size of each Micro LED chip is not more than 1 centimeter, and preferably not more than 20 microns. The Micro LED chip includes a plurality of arrayed Micro LED structures, and the resolution is 720×480, 640×480, 1920×1080, 1280×720, 2k or 4k. The diameter of the Micro LED structure is nanoscale, such as 20nm-100nm.

[0063] The micro LED chip includes a driving backplane and a micro LED array. The micro LED array includes a plurality of micro LED structures. Each micro LED structure can administrate a pixel on the micro LED chip.

[0064] In some embodiments, the driving backplane can be electrically connected to each micro LED structure of the micro LED array through a separate metal interconnection. In some embodiments, each micro LED can be individually controlled by the driving backplane. In some embodiments, the driving backplane can be electrically connected to the electrodes of the micro LED chip through a metal interconnection. In some embodiments, a dielectric layer is formed in the gap between adjacent micro LEDs.

[0065] In some embodiments, each micro LED structure of the micro LED array can include a micro mesa structure. In some embodiments, the micro mesa structure can include, from bottom to top, a first type of epitaxial layer, a light emitting layer, and a second type of epitaxial layer. That is, among the three layers, the first type of epitaxial layer is closest to the driving backplane; the light emitting layer is on top of the first type of epitaxial layer and away from the driving backplane; the second type of epitaxial layer is on top of the light emitting layer and is farthest from the driving backplane. In some embodiments, the light emitting layer is composed of a plurality of stacked quantum well layers, in particular, superlattice stacked quantum well layers. Preferably, the superlattice of the stacked quantum well layers includes a plurality of pairs of quantum well layers stacked with quantum barrier layers. In some embodiments, the first type of epitaxial layer is a semiconductor material with a first conductivity type and includes a plurality of semiconductor layers. The bulk material of the first type of epitaxial layer can be composed of, but is not limited to, gallium (Ga), nitrogen (N), arsenic (As), phosphorus (P), indium (In), or aluminum (Al), etc.

[0066] In addition, the first type of epitaxial layer can include, from top to bottom, but not limited to, a waveguide layer, a confinement layer, a transition layer, and a window layer; in addition, an ohmic contact layer can be formed under the window layer. In some embodiments, the second type of epitaxial layer is a semiconductor material with a second conductivity type and includes a plurality of semiconductor layers. The bulk material of the second type of epitaxial layer can be composed of, but is not limited to, Ga, N, As, P, In, or Al, etc. In addition, the first type of epitaxial layer can include, from top to bottom, but not limited to, a confinement layer and a waveguide layer; in addition, an ohmic contact layer can be formed on the confinement layer in some embodiments.

[0067] In some embodiments, a top conductive layer can be formed on the top surface of the Micro LED array. In some embodiments, the top conductive layer can be shared by all Micro LED structures in the Micro LED array. In some embodiments, the light emitting layer can include at least one quantum well layer. In some embodiments, the Micro LED array can include single-layer Micro LED structures. In some embodiments, the Micro LED array can include multi-layer vertically stacked Micro LED structures.

[0068] In some embodiments, the Micro LED array can include blue Micro LED. In some embodiments, the pitch of the Micro LED array, i.e., the minimum center-to-center distance between the Micro LED, can range from about 2 pm to about 50 pm. In some embodiments, the number of pixels in the Micro LED chip can range from several thousands to several million or more.

[0069] The driving backplane can obtain signals such as image data from the outside world, and can control the corresponding Micro LED structure to emit light or not. The driving backplane is a Thin Film Transistor (TFT) plate or an Integrated Circuit (IC) plate. For example, the driving backplate of the micro display panel described above integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the Micro LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of the frame buffer to the second pixel storage area of the Micro LED array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different gray scales. When driving multiple Micro LED pixels in the Micro LED array, either a single pixel independent driving mode or a multiple pixel unit independent driving mode can be adopted, and the specific driving mode should not be construed as a limitation of the present application.

[0070] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be the range limited by claim.

Claims

1. A cold thermal shock apparatus, characterized in that, The application relates to a test chamber system. The test chamber system comprises: a test chamber; a high-temperature chamber, which is connected with the test chamber through an outlet, and is used for supplying high-temperature gas to the test chamber; a low-temperature chamber, which has an inlet and an outlet, and is connected with the test chamber through the outlet, and is used for supplying low-temperature gas to the test chamber, wherein the temperature of the low-temperature gas is lower than that of the high-temperature gas; 2. The cold thermal shock apparatus of claim 1, wherein, a dehumidification system, which is used for dehumidifying the gas entering the inlet of the low-temperature chamber. The dehumidification system comprises a dehumidification part and a filtering part, wherein: the dehumidification part comprises: a shell, which has a gas inlet and a gas outlet; a gas-permeable accommodating part, which is arranged in the shell and is used for accommodating hygroscopic particles, wherein the hygroscopic particles are used for adsorbing water in the flowing gas to obtain dry gas; a first gas flow channel, which is connected with the gas inlet and is arranged between the inner wall of the shell and the accommodating part; a second gas flow channel, which is used for collecting the dry gas and is connected with the gas outlet; 3. The cold thermal shock apparatus of claim 2, wherein, the filtering part is connected with the dehumidification part and is used for filtering the dry gas.

4. The cold thermal shock apparatus of claim 3, wherein, The accommodating part surrounds the second gas flow channel.

5. The cold thermal shock apparatus of claim 2, wherein, The accommodating part is in a concave hollow structure.

6. A cold thermal shock apparatus as claimed in any one of claims 2 to 5, wherein, The first gas flow channel surrounds the accommodating part.

7. The cold thermal shock apparatus of claim 6, wherein, The number of the dehumidification parts is plural, and the plural dehumidification parts are connected in series or are connected in parallel to form plural parallel branches, and one or more dehumidification parts are arranged in each parallel branch.

8. The cold thermal shock apparatus of claim 2, wherein, The plural dehumidification parts are connected with the filtering part, or each dehumidification part is respectively provided with a corresponding filtering part.

9. The cold thermal shock apparatus of claim 8, wherein, The surface of the hygroscopic particles is provided with plural grooves.

10. The thermal shock apparatus of claim 1, wherein, The hygroscopic particles are composed of silica gel material and have a microporous structure.

11. The cold thermal shock apparatus of claim 1, wherein, The number of the dehumidification systems is plural, and the dehumidification systems are also used for dehumidifying the gas entering the inlet of the high-temperature chamber. A first switching device is arranged between the low-temperature chamber and the test chamber, and is used for controlling the low-temperature chamber to supply or stop supplying the low-temperature gas to the test chamber; and / or, a second switching device is arranged between the high-temperature chamber and the test chamber, and is used for controlling the high-temperature chamber to supply or stop supplying the high-temperature gas to the test chamber.