SIC wafer cleaning and fixing device

Abstract

The utility model discloses an SIC wafer cleaning fixing device, which relates to the field of SIC wafers and comprises a bottom placing frame, the left side and the right side of the upper end of the bottom placing frame are respectively provided with a clamping groove, a bottom filter screen is arranged in the bottom placing frame, the upper end of the bottom placing frame is provided with a clamping frame, the upper end of the clamping frame is provided with a round hole, and the clamping frame is provided with a through hole. A soft cushion is installed at the upper end of the clamping frame, a fixing hole is formed in the outer end of the clamping frame, and a fixing rod is installed at the upper end of the fixing hole. Through the arrangement of the clamping frames, the round holes, the soft cushions, the fixing holes, the fixing rods and the nuts, the SIC wafer can be placed through the clamping frames installed in the device, the SIC wafer is supported through the attached soft cushions during placement, the SIC wafer is prevented from being abraded, the SIC wafer is fixed through the two opposite clamping frames, the clamping frames are fixed through the fixing rods, and the SIC wafer is prevented from being abraded. And a plurality of groups of clamping frames can fix a plurality of SIC wafers, so that the cleaning efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of SIC wafer, concretely is a kind of SIC wafer cleaning fixing device. BACKGROUND

[0002] The main application field of silicon carbide wafer has LED solid-state lighting and high-frequency device.The material has several times higher band gap, drift speed, breakdown voltage, thermal conductivity, high-temperature resistance and other excellent characteristics of traditional silicon, has irreplaceable advantage in high-temperature, high-pressure, high-frequency, high-power, photoelectric, radiation resistance, microwave and other electronic application fields and aerospace, military, nuclear energy and other extreme environment applications, when SIC wafer is cleaned, it needs to be fixed, to prevent damage during cleaning, thus a kind of SIC wafer cleaning fixing device is required.

[0003] The existing SIC wafer cleaning fixing device cannot simultaneously clamp and fix multiple groups of SIC wafers without damage during operation, and cannot maintain better stability during cleaning of SIC wafer, so there is an urgent need for a SIC wafer cleaning fixing device. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims at providing a SIC wafer cleaning fixing device to solve the problem that the existing SIC wafer cleaning fixing device cannot simultaneously clamp and fix multiple groups of SIC wafers without damage during operation, and cannot maintain better stability during cleaning of SIC wafer, and cannot guarantee the stability of SIC wafer cleaning.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a SIC wafer cleaning fixing device, comprising a bottom placing frame, a clamping frame is installed on the upper end of the bottom placing frame, a soft pad is installed on the upper end of the clamping frame, a fixing hole is formed in the outer end of the clamping frame, a fixing rod is installed on the upper end of the fixing hole, a nut is sleeved on the upper end of the fixing rod, a top placing frame is installed on the upper end of the bottom placing frame, a top filter screen is installed in the top placing frame, threaded holes are formed in the left and right ends of the top placing frame, and threaded rods are installed in the threaded holes.

[0006] Preferably, the bottom placing frame is connected with the top placing frame through the clamping groove, and the bottom placing frame is connected with the top placing frame through the threaded rod.

[0007] Preferably, the bottom filter screen is connected with the bottom placing frame, and the size of the bottom filter screen is smaller than that of the bottom placing frame.

[0008] Preferably, the clamping frame is closely attached with the soft pad, and the clamping frames are distributed at equal intervals with the bottom placement frame.

[0009] Preferably, the clamping frame is screw-connected through the fixing hole, and the clamping frame is designed as an open hole type.

[0010] Preferably, the top placement frame is connected with the top filter screen in a clamping manner, and the top filter screen is distributed in parallel with the bottom filter screen.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] 1、The utility model discloses a clamping frame, a round hole, a soft pad, a fixing hole, a fixed rod and a nut are set up, the clamping frame installed in the device can place SIC wafer, and the soft pad is supported through attachment to prevent abrasion of the SIC wafer, and the SIC wafer is fixed through the relative two clamping frames, and the clamping frame is fixed through the fixed rod, and a plurality of clamping frames are installed to fix a plurality of SIC wafers, so that the cleaning efficiency is improved.

[0013] 2、The utility model discloses a bottom placement frame, a clamping groove, a bottom filter screen, a top placement frame and a top filter screen are set up, and the clamping frame in the device can be positionally limited through the bottom placement frame and the top placement frame at the upper and lower ends, so that the clamping frame can better keep the position limitation when cleaning the SIC wafer, and the SIC wafer can be better kept stable when being cleaned. DRAWINGS

[0014] Figure 1 It is a front view structure schematic diagram of the utility model;

[0015] Figure 2 It is a front view structure sectional view of the utility model;

[0016] Figure 3 It is a position relation structure schematic diagram of the bottom placement frame of the utility model;

[0017] Figure 4 It is a component part structure schematic diagram of the clamping frame of the utility model.

[0018] In the drawing: 1, bottom placement frame; 2, clamping groove; 3, bottom filter screen; 4, clamping frame; 5, round hole; 6, soft pad; 7, fixing hole; 8, fixed rod; 9, nut; 10, top placement frame; 11, top filter screen; 12, threaded hole; 13, threaded rod. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The embodiments described below with reference to the drawings are exemplary and are used to explain the present application only, and cannot be understood as a limitation on the present application.

[0020] The embodiments of the present application will be described below according to the overall structure of the present application.

[0021] Please refer to Figures 1-4 A SIC wafer cleaning fixing device, including bottom placing frame 1, the upper end of bottom placing frame 1 is provided with clamping groove 2 on both sides, bottom placing frame 1 is internally provided with bottom filter screen 3, bottom placing frame 1 is connected with top placing frame 10 through clamping groove 2, and bottom placing frame 1 is screw-connected with top placing frame 10 through threaded rod 13, the bottom placing frame 1 and top placing frame 10 in the device can better fix clamping frame 4, the position of clamping frame is limited, the stability of SIC wafer cleaning is ensured, the upper end of bottom placing frame 1 is provided with clamping frame 4, the upper end of clamping frame 4 is provided with round hole 5, the upper end of clamping frame 4 is provided with soft pad 6, the outer end of clamping frame 4 is provided with fixing hole 7, the upper end of fixing hole 7 is provided with fixing rod 8, clamping frame 4 is tightly combined with soft pad 6, and clamping frame 4 is distributed at equal intervals with bottom placing frame 1, the clamping frame 4 installed in the device can store SIC wafers separately, meanwhile, the soft pad 6 installed in clamping frame 4 can prevent SIC wafers from being abraded, and the safety during cleaning is ensured, the upper end of fixing rod 8 is provided with nut 9, the upper end of bottom placing frame 1 is provided with top placing frame 10, top placing frame 10 is internally provided with top filter screen 11, threaded hole 12 is provided on both ends of top placing frame 10, and threaded rod 13 is installed in threaded hole 12.

[0022] Working principle: when in use, clamping frame 4 in the device can be separated by rotating fixing rod 8 on the outer wall, SIC wafers needing to be cleaned can be placed separately, when placing SIC wafers, the edge of SIC wafers is in contact with soft pad 6 on the inner wall of clamping frame 4, after contact, clamping frame 4 is fixed through fixing rod 8, meanwhile, multiple clamping frames 4 can clamp and fix multiple SIC wafers at the same time, after fixing, clamping frame 4 can be placed above bottom filter screen 3 internally installed in bottom placing frame 1 in the device, after placement is completed, bottom placing frame 1 and top placing frame 10 can be closed, after closing is completed, clamping frame 4 can be fixed through threaded rod 13, clamping frame 4 can move in the space inside bottom placing frame 1 and top placing frame 10, SIC wafers can be cleaned better, meanwhile, the position of SIC wafers can be limited, so that the use process of the device is completed, and the contents not described in detail in the specification belong to the prior art known by the professional technical personnel in the field.

[0023] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A SIC wafer cleaning fixing device, comprising a bottom placing frame (1), characterized in that: The bottom placement frame (1) is provided with clamping grooves (2) on the left and right sides of the upper end, a bottom filter screen (3) is installed inside the bottom placement frame (1), a clamping frame (4) is installed on the upper end of the bottom placement frame (1), a round hole (5) is formed on the upper end of the clamping frame (4), a soft pad (6) is installed on the upper end of the clamping frame (4), a fixing hole (7) is formed on the outer end of the clamping frame (4), a fixing rod (8) is installed on the upper end of the fixing hole (7), a nut (9) is sleeved on the upper end of the fixing rod (8), a top placement frame (10) is installed on the upper end of the bottom placement frame (1), a top filter screen (11) is installed inside the top placement frame (10), threaded holes (12) are formed on the left and right ends of the top placement frame (10), and threaded rods (13) are installed in the threaded holes (12).

2. The SIC wafer cleaning fixing device according to claim 1, wherein: The bottom placement frame (1) is connected with the top placement frame (10) through the clamping grooves (2), and the bottom placement frame (1) is threadedly connected with the top placement frame (10) through the threaded rods (13).

3. The SIC wafer cleaning fixing device according to claim 1, wherein: The bottom filter screen (3) is connected with the bottom placement frame (1), and the size of the bottom filter screen (3) is smaller than that of the bottom placement frame (1).

4. The SIC wafer cleaning fixture of claim 1, wherein: The clamping frame (4) is tightly attached to the soft pad (6), and the clamping frame (4) is distributed at equal intervals on the bottom placement frame (1).

5. The SIC wafer cleaning fixture of claim 1, wherein: The clamping frame (4) is threadedly connected through the fixing hole (7), and the clamping frame (4) is designed as an open type.

6. The SIC wafer cleaning fixture of claim 1, wherein: The top placement frame (10) is connected with the top filter screen (11), and the top filter screen (11) is distributed in parallel with the bottom filter screen (3).

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