Adjusting assembly for adjusting flat spray pipe of wafer cutting machine
By combining the position adjustment component and the level adjustment component, the misalignment problem during the reinstallation of the flat spray pipe after disassembly and cleaning was solved, ensuring the water spraying effect and product quality of the wafer dicing machine.
Patent Information
- Application Number
- CN202520075431.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-13
AI Technical Summary
The flat spray nozzles of existing wafer dicing machines are prone to misalignment when disassembled, cleaned, and reinstalled, affecting the spray angle and position, resulting in excessive blade temperature or product scratches.
An adjustment assembly consisting of a position adjustment component and a level adjustment component is used to ensure the correct position and levelness of the flat nozzle by simulating the shape of a blade and coaxial adjustment with the rotating shaft.
It achieves accurate positioning and level adjustment of the flat spray nozzle, avoiding poor water spray and product damage, and improving cutting accuracy and safety.
Smart Images
Figure CN223685766U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor equipment, and specifically relates to an adjusting assembly of a flat spray pipe of a wafer cutting machine. BACKGROUND
[0002] The wafer cutting machine is a device for cutting wafers, and the wafers are cut by high-speed rotating blades. In order to ensure the strength of the blades and prevent damage to the wafers, water needs to be sprayed in real time for cooling during cutting. The cutting machine in the prior art is provided with two groups of water spraying structures, namely flat spray pipes and inclined spray pipes. The flat spray pipe is relatively close to the blade, and chippings are generated during cutting of the wafer, which may flow into the flat spray pipe along with the water flow, thereby affecting the cooling effect due to poor water spraying of the flat spray pipe. Therefore, the flat spray pipe needs to be regularly disassembled and cleaned. After disassembly, cleaning and debugging, the flat spray pipe is prone to misalignment during reinstallation, which may cause the temperature of the blade to be too high due to the influence of the water spraying angle, or the product may be scratched due to the shift of the installation position.
[0003] The information disclosed in this Background section is only for the purpose of increasing the understanding of the background of the present utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms prior art that is publicly known. SUMMARY
[0004] The utility model aims at providing an adjusting assembly for adjusting the flat spray pipe to the correct position during installation.
[0005] In order to achieve the above-mentioned purpose, one embodiment of the utility model provides an adjusting assembly for adjusting the flat spray pipe of a wafer cutting machine, which comprises a position adjusting part and a horizontal adjusting part. The position adjusting part is used for fixing to the wafer cutting machine and adjusting the position of the flat spray pipe, and comprises a cylindrical first main body part and a protruding part protruding from the side wall of the first main body part for simulating the blade. The diameter of the protruding part is the same as the diameter of the blade, and the diameter of the first main body part is greater than the diameter of the blade seat and smaller than the diameter of the protruding part. The horizontal adjusting part is used for adjusting the levelness of the flat spray pipe, and comprises a cylindrical second main body part. The second main body part is provided with a through hole along the axial direction thereof, and a plug hole for inserting the flat spray pipe is formed in the side wall thereof.
[0006] In one or more embodiments of the utility model, the first main body part comprises a first part and a second part arranged on both sides of the protruding part in the axial direction. The first part and the second part are used for contacting two flat spray pipes respectively.
[0007] In one or more embodiments of the utility model, the thickness of the protruding part is the same as the distance between the flat spray pipes.
[0008] In one or more embodiments of the utility model, the first main body part has a first abutting part protruding along its own axial direction, and the first abutting part is in contact with the wafer cutting machine.
[0009] In one or more embodiments of the utility model, the first abutting part protrudes annularly on the first main body part.
[0010] In one or more embodiments of the utility model, the first main body part has a mounting hole opened along its own axial direction, and the position adjusting member is fixed to the rotating shaft of the wafer cutting machine through the mounting hole.
[0011] In one or more embodiments of the utility model, the horizontal adjusting member is configured to be coaxial with the rotating shaft of the wafer cutting machine only when the socket is inserted into the horizontal state flat nozzle.
[0012] In one or more embodiments of the utility model, the diameter of the second main body part is the same as the diameter of the blade.
[0013] In one or more embodiments of the utility model, the second main body part has a second abutting part protruding along its own axial direction, and the second abutting part is in contact with the wafer cutting machine.
[0014] In one or more embodiments of the utility model, the second abutting part protrudes annularly on the second main body part.
[0015] Compared with the prior art, the adjusting assembly of the utility model adjusts the position and level of the flat nozzle through two adjusting members respectively, so as to adjust the flat nozzle to the correct position. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.
[0017] Figure 1 It is a schematic view of the position adjusting member and the horizontal adjusting member in an embodiment of the utility model;
[0018] Figure 2 It is a schematic view of the position adjusting member installed on the wafer cutting machine in an embodiment of the utility model;
[0019] Figure 3 It is a schematic view of the horizontal adjusting member inserted into the flat nozzle in an embodiment of the utility model;
[0020] Figure 4This is a schematic diagram illustrating the use of the position adjustment component in one embodiment of the present invention.
[0021] Explanation of key figure labels:
[0022] 10-Position adjustment component, 11-First main body, 111-First part, 112-Second part, 12-Protrusion, 13-Mounting hole, 14-First abutting part, 20-Horizontal adjustment component, 21-Second main body, 22-Insertion hole, 23-Through hole, 24-Second abutting part, 30-Wafer dicing machine, 40-Flat nozzle. Detailed Implementation
[0023] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0024] As described in the background section, during wafer dicing, two horizontal spray nozzles are used to spray water onto the cutting edge in real time for cooling. The cutting edge is located between the two nozzles, and the nozzles need to be removed and cleaned periodically. Misalignment can easily occur when the nozzles are disassembled, cleaned, and reinstalled. This invention aims to solve this technical problem.
[0025] like Figures 1-4 As shown, in one embodiment of this utility model, an adjustment assembly for adjusting the flat nozzle of a wafer dicing machine is used to adjust the flat nozzle 40 to the correct position during installation. This adjustment assembly includes a position adjustment component 10 and a level adjustment component 20. The position adjustment component 10, used to fix to the wafer dicing machine and adjust the position of the flat nozzle 40, includes a cylindrical first main body 11 and a protrusion 12 extending from the side wall of the first main body 11 to simulate a cutting edge. The diameter of the protrusion 12 is the same as the diameter of the cutting edge, and the diameter of the first main body 11 is larger than the diameter of the cutting edge but smaller than the diameter of the protrusion 12. The level adjustment component 20, used to adjust the levelness of the flat nozzle 40, includes a cylindrical second main body 21. The second main body 21 has a through hole 23 along its axial direction, and its side wall has an insertion hole 22 for inserting the flat nozzle 40.
[0026] Specifically, the position adjusting member 10 comprises a cylindrical first body part 11 and a protruding part 12 protruding from the side wall of the first body part 11, the diameter of the first body part 11 is slightly larger than the diameter of the blade holder of the wafer cutting machine, and the diameter and shape of the protruding part 12 are substantially the same as the blade of the wafer cutting machine. The horizontal adjusting member 20 comprises a cylindrical second body part 21, two insertion holes 22 are formed in the side wall of the second body part 21 for inserting the flat nozzles 40, and a through hole 23 is formed in the second body part 21 along the axial direction of the second body part 21.
[0027] During the reinstallation of the two flat nozzles 40, the cutting blade assembly (including the blade holder and the blade) of the wafer cutting machine is first disassembled, and the position adjusting member 10 is fixed to the wafer cutting machine 30. Since the diameter of the first body part 11 is slightly larger than the diameter of the blade holder of the wafer cutting machine, and the size and shape of the protruding part 12 are substantially the same as the blade of the wafer cutting machine, it means that the actual shape of the position adjusting member 10 is very similar to the shape structure of the cutting blade assembly, only the diameter of the first body part 11 is slightly larger, and when the flat nozzles 40 abut against the first body part 11, the water outlets of the flat nozzles 40 are directed to the edge position of the protruding part 12. By adjusting the position between the flat nozzles 40 and the protruding part 12 to pre-fix the flat nozzles 40, that is, when the flat nozzles 40 abut against the first body part 11, the water outlets on the flat nozzles 40 are directed to the edge position of the protruding part 12, that is, the actual cutting position of the blade and the wafer. Then the horizontal adjusting member 20 is inserted on the flat nozzles 40, and the horizontal degree adjustment of the flat nozzles 40 is realized by adjusting the angle of the flat nozzles 40 so that the through hole 23 is coaxial with the rotating shaft on the wafer cutting machine 30.
[0028] The position adjusting member 10 is similar in shape to the cutting tool and is used to simulate the cutting tool, so the diameter of the protruding part 12 is the same as the diameter of the blade, so that after the position adjusting member 10 is fixed to the wafer cutting machine 30, the position of the protruding part 12 is the position of the blade, and the water outlets of the flat nozzles 40 are aligned with the tip position of the blade, which can realize the pre-positioning and fixing of the flat nozzles 40. In order to fully simulate the cutting tool, the first body part 11 comprises a first part 111 and a second part 112 protruding on both sides of the axial direction of the protruding part 12, and the two flat nozzles 40 are supported on the first part 111 and the second part 112 respectively, so that after the position adjusting member 10 is fixed to the wafer cutting machine 30, the position of the protruding part 12 is the actual working position of the blade, and when the flat nozzles 40 are moved, the blade holder at both ends of the blade can be abutted at the same time, so as to improve the accuracy of the position adjustment.
[0029] In an embodiment, the thickness of the protruding part 12 is the same as the distance between the flat nozzles 40, so that when the position of the flat nozzles 40 is adjusted, the protruding part 12 can be embedded between the two flat nozzles 40.
[0030] Preferably, the diameter of the first main body 11 is set such that when the first main body 11 is supported on the horizontal spray pipe 40, the spray nozzle on the horizontal spray pipe 40 is directly opposite the edge of the protrusion 12. This means that when the position of the horizontal spray pipe 40 is adjusted using the position adjustment member 10, moving the horizontal spray pipe 40 to abut against the first main body 11 means that the horizontal spray pipe 40 has moved to a preset position, and subsequent leveling adjustments can be made.
[0031] like Figure 1 As shown, a mounting hole 13 is provided on the first main body 11. The mounting hole 13 is provided along the axial direction of the first main body 11, and the position adjustment member 10 is fixed on the rotating shaft of the wafer dicing machine 30 through the mounting hole 13.
[0032] In one embodiment, the horizontal adjustment member 20 has a through hole 23 along its own axial direction. The horizontal adjustment member 20 is configured such that the through hole 23 is coaxial with the rotating shaft on the wafer dicing machine 30 only when the insertion hole 22 is inserted into the horizontally positioned flat nozzle 40.
[0033] Once the position of the flat nozzle 40 is adjusted to the correct position, proceed to the leveling adjustment step. Insert the leveling adjustment component 20 onto the flat nozzle 40 and adjust the posture of the flat nozzle 40 until the through hole 23 is coaxial with the rotating shaft on the wafer dicing machine 30. The flat nozzle 40 is then adjusted to the final correct posture.
[0034] like Figure 1 As shown, a first abutting part 14 protrudes from one end of the first main body 11 along the axial direction. When the position adjustment member 10 is fixed to the wafer dicing machine 30, the first abutting part 14 directly contacts the wafer dicing machine 30. The first abutting part 14 acts like a gasket. Therefore, the horizontal position of the protrusion 12 can be adjusted by adjusting the distance of the first abutting part 14 along the axial direction of the first main body 11, so that the protrusion 12 can fall smoothly between the two flat nozzles 40.
[0035] Similarly, a second abutment portion 24 protrudes from one end of the second main body 21 along the axial direction. After the flat nozzle 40 is inserted into the insertion hole 22, the second abutment portion 24 directly contacts the wafer dicing machine 30. The second abutment portion 24 acts like a gasket. By adjusting the distance of the second abutment portion 24 along the axial direction of the second main body 21, the position of the insertion hole 22 is adjusted so that the flat nozzle 40 can be smoothly inserted into the insertion hole 22.
[0036] The first abutment part 14 and the second abutment part 24 can be Figure 1 As shown, the structure is an annular structure protruding from the first main body 11 and the second main body 21 respectively. In other embodiments, it may also be a block structure protruding from the surface of the first main body 11 and the second main body 21. This embodiment is not limited.
[0037] In one embodiment, the second body portion 21 has the same diameter as the diameter of the blade.
[0038] The position of the flat nozzle 40 is adjusted first, and then the levelness is adjusted. As shown in Figure 2 the position adjusting member 10 is fixed to the rotating shaft of the wafer cutting machine 30, the flat nozzle 40 is moved to be supported on the first body portion 11, at this time the water outlet is directed to the protruding portion 12, and then the flat nozzle 40 is fixed; then as shown in Figure 3 the level adjusting member 20 is inserted on the flat nozzle 40, the posture of the flat nozzle 40 is adjusted, until the through hole 23 is coaxial with the rotating shaft of the wafer cutting machine 30, at this time the flat nozzle 40 is adjusted to the correct position and posture. The level adjusting member 20 is removed, and the cutter is fixed to the rotating shaft of the wafer cutting machine 30.
[0039] When the levelness is determined, it can be judged by whether the level adjusting member 20 can be fixed to the rotating shaft of the wafer cutting machine 30 through the through hole 23, otherwise the flat nozzle 40 has an angle deviation, and the levelness needs to be further adjusted.
[0040] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to embrace all changes falling within the meaning and range of equivalents of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.
[0041] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the specification is described in this way only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.
Claims
1. An adjustment assembly for adjusting the flat nozzle of a wafer dicing machine, characterized in that, The application relates to a position adjusting device for fixing to a wafer cutting machine and adjusting the position of a flat nozzle, which comprises a cylindrical first body part and a protruding part protruding from the sidewall of the first body part for simulating a blade, the diameter of the protruding part being the same as that of the blade, the diameter of the first body part being larger than that of the blade seat and smaller than that of the protruding part. The application also relates to a horizontal adjusting device for adjusting the horizontal degree of the flat nozzle, which comprises a cylindrical second body part, the second body part being provided with a through hole along the axial direction and a inserting hole for inserting the flat nozzle. The first body part comprises a first part and a second part arranged on the axial direction of the protruding part, the first part and the second part being used for contacting two flat nozzles respectively.
2. The adjustment assembly of claim 1, wherein, The thickness of the protruding part is the same as the distance between the two flat nozzles.
3. The adjustment assembly of claim 1, wherein, The first body part is provided with a first abutting part protruding along the axial direction, the first abutting part being in contact with the wafer cutting machine.
4. The adjustment assembly of claim 1, wherein, The first abutting part is annularly protruding on the first body part.
5. The adjustment assembly of claim 4, wherein, The first body part is provided with a mounting hole along the axial direction, the position adjusting device being fixed to the rotating shaft of the wafer cutting machine through the mounting hole.
6. The adjustment assembly of claim 1, wherein, The horizontal adjusting device is configured to be coaxial with the rotating shaft of the wafer cutting machine only when the inserting hole is inserted into the flat nozzle in the horizontal state.
7. The adjustment assembly of claim 1, wherein, The diameter of the second body part is the same as that of the blade.
8. The adjustment assembly of claim 1, wherein, The second body part is provided with a second abutting part protruding along the axial direction, the second abutting part being in contact with the wafer cutting machine.
9. The adjustment assembly of claim 1, wherein, The second abutting part is annularly protruding on the second body part.
10. The adjustment assembly of claim 9, wherein,