MEMS micro-motion platform supporting structure, micro-motion assembly and electronic equipment

Abstract

The utility model relates to the field of micro electro mechanical systems, in particular to an MEMS micro-motion platform supporting structure, a micro-motion assembly and electronic equipment, the MEMS micro-motion platform supporting structure is used for supporting an MEMS micro-motion platform when the MEMS micro-motion platform and a part to be assembled are assembled, and the MEMS micro-motion platform supporting structure comprises a plate-shaped part which is detachably connected to the bottom of an outer frame of the MEMS micro-motion platform and can upwards support the outer frame; the protruding part is located between the plate-shaped part and the MEMS micro-motion platform and can support the MEMS micro-motion platform upwards, and the protruding part is at least detachably connected with the MEMS micro-motion platform. According to the scheme, high-reliability assembly of the micro-motion platform and the to-be-assembled part can be achieved, and the micro-motion platform can bear external force applied in the technological processes of lead bonding, chip mounting and the like and cannot be damaged; the whole assembling scheme does not need extra vacuum or negative pressure adsorption, the technology is simple and reliable, complex devices are not needed, and the assembling cost and the assembling equipment arrangement difficulty are reduced.

Description

Technical Field

[0001] This application relates to the field of microelectromechanical systems (MEMS), specifically to a MEMS micro-motion platform support structure, micro-motion components, and electronic devices. Background Technology

[0002] Image stabilization technology in MEMS (Micro-Electro-Mechanical Systems) micro-motion platforms primarily relies on MEMS actuators to precisely control the CIS (CMOS Image Sensor) to achieve image stabilization. Specifically, when shake occurs during image capture, the MEMS micro-motion platform responds rapidly by generating minute mechanical movements through MEMS actuators to compensate for the image shift caused by the shake, thereby ensuring the stability of the CIS-captured image.

[0003] Currently, such as Figure 1 As shown, the most typical MEMS micro-motion platform 300 is included in the electrostatically driven anti-shake device (hereinafter referred to as the device) developed by MEMSDrive. The MEMS micro-motion platform 300 in the figure can only achieve movement and rotation in the xy plane. Since the device suspends the MEMS micro-motion platform 300 through the upwardly protruding support spring 600, there are height differences between the MEMS micro-motion platforms 300 of different devices. Therefore, for the assembly of this type of MEMS micro-motion platform 300 with the CIS chip, it is necessary to adsorb and limit the MEMS micro-motion platform 300 during the CIS mounting and wire bonding process. Specifically, the bottom of the MEMS micro-motion platform 300 can be adsorbed by the air suction nozzle of the wire bonding machine, and then the CIS chip and the MEMS micro-motion platform 300 can be bonded and assembled, wire bonded, etc., to achieve the assembly of the two. For the specific process, please refer to the patent publication with publication number CN218941213U. However, due to the need for the above adsorption operation, the entire assembly device and process are relatively complex and are prone to damage to the MEMS micro-motion platform, resulting in poor reliability. Utility Model Content

[0004] The purpose of this application is to provide a MEMS micro-motion platform support structure, micro-motion components and electronic devices, which aims to at least solve the technical problems of MEMS micro-motion platforms being easily damaged during the assembly process with the parts to be assembled, having complex installation processes and poor reliability in the prior art.

[0005] To achieve this objective, the technical solution adopted in this application is:

[0006] A MEMS micro-motion platform support structure is provided for supporting the MEMS micro-motion platform during assembly with a component to be assembled. The MEMS micro-motion platform support structure includes:

[0007] a plate-shaped portion, detachably connected to the bottom of the outer frame of the MEMS micro-motion platform and capable of supporting the outer frame upward;

[0008] a protruding portion, located between the plate-shaped portion and the MEMS micro-motion platform and capable of supporting the MEMS micro-motion platform upward, the protruding portion being detachably connected to the plate-shaped portion.

[0009] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that the protruding portion is detachably connected to the plate-shaped portion.

[0010] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that a plurality of protruding portions with different height sizes correspond to the same plate-shaped portion.

[0011] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that the height size of the protruding portion is adjustable when the protruding portion is located between the plate-shaped portion and the MEMS micro-motion platform.

[0012] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that the protruding portion is integrally formed with the plate-shaped portion.

[0013] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that the height size of the protruding portion is 10-2000 microns.

[0014] The second aspect of the present application provides an assembly method of a MEMS micro-motion platform and a component to be assembled, comprising: connecting the MEMS micro-motion platform support structure described above to the bottom of the MEMS micro-motion platform and the bottom of the outer frame respectively; and after the MEMS micro-motion platform and the component to be assembled are assembled, removing the MEMS micro-motion platform support structure.

[0015] The third aspect of the present application provides a micro-motion assembly, comprising a component to be assembled and a MEMS micro-motion platform, wherein the MEMS micro-motion platform is assembled with the component to be assembled by using the MEMS micro-motion platform support structure described above.

[0016] In addition to one or more features described herein, or as an alternative, further embodiments of the MEMS micro-motion platform support structure can include that the MEMS micro-motion platform and its outer frame form a back cavity.

[0017] The fourth aspect of the present application provides an electronic device comprising the micro-motion assembly described above.

[0018] One of the above technical solutions has the following advantages or beneficial effects: by setting the MEMS micro-motion platform support structure as a plate-shaped portion and a protruding portion, the plate-shaped portion is detachably connected to the bottom of the outer frame of the MEMS micro-motion platform and can support the outer frame upward, the protruding portion is located between the plate-shaped portion and the MEMS micro-motion platform and can support the MEMS micro-motion platform upward, and the protruding portion is detachably connected with the MEMS micro-motion platform. When the MEMS micro-motion platform is assembled with the to-be-assembled component, the MEMS micro-motion platform support structure can provide reliable support force for the MEMS micro-motion platform, so that the MEMS micro-motion platform can withstand external force applied in the process of wire bonding, chip mounting and the like, and is not damaged, thereby realizing high-reliability assembly of the MEMS micro-motion platform and the to-be-assembled component; the entire assembly scheme does not need additional vacuum or negative pressure adsorption, and is simple and reliable in technology, does not need complex devices, and reduces assembly cost and assembly equipment arrangement difficulty.

[0019] Other advantages of the present application and technical effects of the preferred embodiments will be further described in the specific embodiments below. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0021] Figure 1 is a perspective view of a prior art MEMS micro-motion platform;

[0022] Figure 2 is a plan view of a device with a back cavity formed by the MEMS micro-motion platform and its outer frame;

[0023] Figure 3 is a plan view of the MEMS micro-motion platform shown in Figure 2 after moving in the vertical direction;

[0024] Figure 4 is a plan view of the MEMS micro-motion platform support structure provided by the embodiments of the present application;

[0025] Figure 5 is a plan view of the MEMS micro-motion platform support structure provided by the embodiments of the present application when it functions as a support;

[0026] Figure 6 is a plan view of the MEMS micro-motion platform support structure provided by the embodiments of the present application when it functions as a support;

[0027] Figure 7 is a plan view of a MEMS micro-motion platform support structure provided by an embodiment of the present application, which is too small in height;

[0028] Figure 8 is a plan view of a MEMS micro-motion platform support structure provided by an embodiment of the present application, which is too small in height;

[0029] Figure 9 is a plan view of a MEMS micro-motion platform support structure provided by an embodiment of the present application, which is too small in height;

[0030] In the drawings, various elements are labeled the same as or similarly to the same or similar elements in other drawings, and the following description refers to these elements using the same or similar reference numerals.

[0031] 100: plate-shaped portion 200: protruding portion 300: MEMS micro-motion platform

[0032] 400: outer frame 500: component to be assembled 600: support spring

[0033] 700: back cavity 800: bonding wire A: interference position

[0034] P: pad J: gap DETAILED DESCRIPTION

[0035] Embodiments of the present application are described in detail below with reference to the accompanying drawings. Examples of the embodiments are shown in the drawings, in which the same or similar elements are denoted by the same or similar reference numerals throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.

[0036] It should be understood that the terms "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore should not be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be understood as limiting the present application.

[0037] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing", and the like should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] In addition, in the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0039] by Figures 1 to 9 Taking this application as an example, a MEMS micro-motion platform support structure is described and introduced. The MEMS micro-motion platform support structure provided in this application is applicable, but not limited to, in the assembly process of the MEMS micro-motion platform 300 and CIS chip, and can also be used for assembly with various other chips and components, such as electronic components and PCB boards. Specifically, the MEMS micro-motion platform support structure may include a plate-shaped portion 100 and a protrusion 200. The plate-shaped portion 100 and the protrusion 200 can be integrally formed or detachably connected. The plate-shaped portion 100 can be configured as a carrier tape or other strip, plate, or sheet-like material, and can be a rigid or flexible component. Its rigidity is sufficient to provide adequate support for the MEMS micro-motion platform 300. Alternatively, it can be placed on a rigid platform during assembly to reduce the rigidity requirements of the plate-shaped portion 100.

[0040] The plate-shaped portion 100 is detachably connected to the bottom of the outer frame 400 of the MEMS micro-motion platform 300 and can support the outer frame 400 upwards. The detachable connection method includes, but is not limited to, adhesive connection, magnetic adsorption connection, snap-fit ​​connection, etc. The protrusion 200 can be located between the plate-shaped portion 100 and the MEMS micro-motion platform 300 and can support the MEMS micro-motion platform 300 upwards. The protrusion 200 is at least detachably connected to the MEMS micro-motion platform 300. The detachable connection includes, but is not limited to, adhesive connection, magnetic adsorption connection, snap-fit ​​connection, etc.

[0041] against Figure 1 The device shown can also achieve upward support for the MEMS micro-motion platform 300 by reasonably arranging the height of the protrusion 200. It should be noted that the MEMS micro-motion platform support structure provided in this application is particularly suitable for devices where the MEMS micro-motion platform 300 and its outer frame 400 enclose a back cavity 700 (such as...). Figure 2 As shown in the diagram, the protrusion 200 can be embedded in the back cavity 700 to provide support for the MEMS micro-motion platform 300. When the MEMS micro-motion platform 300 is assembled with the component 500, the MEMS micro-motion platform support structure can provide reliable support for the MEMS micro-motion platform 300, enabling the MEMS micro-motion platform 300 to withstand the external forces applied during wire bonding, chip mounting and other processes without damage, thus achieving highly reliable assembly of the MEMS micro-motion platform 300 and the component 500. The entire assembly scheme does not require additional vacuum or negative pressure adsorption, the technology is simple and reliable, and no complex devices are needed, reducing assembly costs and the difficulty of arranging assembly equipment.

[0042] In at least one embodiment, the protruding part 200 is detachably connected with the plate part 100, which includes but is not limited to adhesive connection, magnetic adsorption connection, clamping connection, etc. In this way, the protruding part 200 can be first connected with the MEMS micro-motion platform 300, and then the protruding part 200 and the outer frame 400 of the MEMS micro-motion platform 300 are simultaneously connected with the plate part 100. Of course, the protruding part 200 can be first connected with the plate part 100 to form an integral whole, and then the MEMS micro-motion platform 300 and its outer frame 400 are simultaneously connected with the integral whole. The detachable connection of the protruding part 200 and the plate part 100 makes the connection sequence more diversified, and can be freely and flexibly set according to the actual situation. On the other hand, the detachable connection of the protruding part 200 and the plate part 100 also provides the possibility of one plate part 100 corresponding to multiple protruding parts 200. That is, as a further optimization, multiple protruding parts 200 with different heights can correspond to the same plate part 100. Accordingly, the protruding part 200 with the corresponding height can be arranged on the plate part 100 to provide support for the corresponding MEMS micro-motion platform 300 according to the height of the device back cavity 700 to be assembled, which improves the versatility of the plate part 100 and makes the configuration scheme more flexible.

[0043] In at least one embodiment, the height of the protruding part 200 can be adjusted when it is located between the plate part 100 and the MEMS micro-motion platform 300. The specific implementation can be to configure the protruding part 200 as a magnetostrictive protruding part 200, an electrostrictive protruding part 200, etc. The height of the protruding part 200 can be changed after the external magnetic field, electric field or even temperature field changes. The specific structure of the protruding part 200 can be adaptively adjusted according to the characteristics of different materials. Of course, the height of the protruding part 200 can also be adjusted by a mechanical mechanism. For example, an adjusting mechanism that can adjust the height of the protruding part 200 can be arranged between the protruding part 200 and the plate part 100. The driving of the adjusting mechanism can be realized by a motor. Correspondingly, a guide structure on the plate part 100 can be arranged on the outer periphery of the protruding part 200, so as to ensure the stability of the whole structure during the height adjustment of the protruding part 200.

[0044] In at least one embodiment, the protruding part 200 is integrally formed with the plate part 100. This structure is convenient for the production, processing, transportation and use of the MEMS micro-motion platform support structure.

[0045] In at least one embodiment, the height dimension of the protrusion 200 varies for different device size specifications, but is preferably controlled to be between about 10-2000 microns. It should be noted that while the numerical ranges and parameters recited in the broad description of this application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements, including the measurement of their respective instruments. Also, it should be understood that any numerical range recited herein is intended to include all sub-ranges subsumed therein. For example, a range of "10-2000" is intended to include all sub-ranges between (and including) the recited minimum value of 10 and the recited maximum value of 2000, that is, having a minimum value equal to or greater than 10 and a maximum value of equal to or less than 2000. Because the disclosed numerical ranges are continuous, they contain every value between the minimum and maximum values. Thus, although the numerical values for a range are continuous, they do not necessarily have to be attained or, indeed, be attainable in the particular examples.

[0046] In one specific embodiment, the present application is directed to a multi-degree of freedom MEMS micro-motion platform 300 (hereinafter referred to as micro-motion platform, specific structure as shown in Figure 2 , which moves in the vertical direction z as shown in Figure 3 , when micro-assembled with a CIS chip, a technical solution is proposed to support the micro-motion platform in the form of a carrier tape (i.e. one embodiment of the plate-shaped portion 100) combined with a boss (i.e. the boss portion), achieving high reliability and fast assembly. The specific cooperation mode of the plate-shaped portion 100 and the protrusion 200 is shown in Figure 4 , and the specific implementation mode of the assembly is shown in Figure 5 . The boss can be attached above the carrier tape (or integrated with the carrier tape), and the micro-motion platform is nested on the boss through its back cavity 700. In this way, the boss can provide support for the micro-motion platform, and finally the micro-motion platform is attached to the carrier tape. After the micro-motion platform and the CIS chip are assembled, the carrier tape and the boss are removed.

[0047] Generally, the micro-motion platform with a back cavity 700 will have a lift relative to the top surface of the support substrate structure, or be flush with it. If the boss embedded in the back cavity 700 is greater than the depth of the back cavity 700 and greater than the planar size of the micro-motion platform, it will cause interference between the boss and the support structure of the chip, resulting in device damage. The interference position A is shown in Figure 6 . If the boss height is reduced to avoid interference, the micro-motion platform and the boss will not fit tightly, and there will be a gap J, which will cause the structure to be damaged due to impact in the stress process such as mounting and wire bonding, as shown in Figure 7 .

[0048] To this end, a specific embodiment can be that, for a sunken micro-motion platform (designed by structure and process), as shown in Figure 9 , a micro-motion platform and CIS chip assembly scheme can be matched to improve the reliability of the assembly, and the device is not easy to be damaged. The height of the boss can be slightly greater than the distance from the micro-motion platform support ground to the lower surface of the micro-motion platform, so that the boss will not interfere with the driving and connecting structure.

[0049] In fact, with the continuous improvement of the performance requirements of electronic products, higher requirements are put forward for the anti-shake function of the micro-motion platform, which needs to meet the more degrees of freedom of the motion space of the micro-motion platform and the CIS chip after assembly, such as the activity space in the direction perpendicular to the x-y plane (x-y plane can be referred to Figure 1 ) (such as the z direction shown in Figure 3 ), and the micro-motion platform corresponding to the back cavity, as shown in Figure 2 . Because it does not have a basic adsorption or the existing adsorption device cannot extend into the back cavity for adsorption, or the space adsorption effect is poor, the assembly method of the MEMS micro-motion platform 300 and the CIS chip disclosed in the patent will no longer be applicable. Correspondingly, the beneficial effects of the above-mentioned MEMS micro-motion platform support structure provided by the present application at least include:

[0050] 1. The present application provides a technical scheme suitable for the assembly of a multi-degree-of-freedom micro-motion platform with a back cavity 700 and a CIS chip (or other to-be-assembled component 500), solving the problem that the current scheme cannot realize the assembly of a multi-degree-of-freedom micro-motion platform with a back cavity 700 and a CIS;

[0051] 2. The scheme can realize high-reliability assembly of the micro-motion platform and the CIS chip, so that the micro-motion platform can withstand external forces applied in the process of wire bonding, chip mounting and other processes, and will not be damaged;

[0052] 3. The entire assembly scheme does not require additional vacuum or negative pressure adsorption, and is simple and reliable without the need for complex devices.

[0053] 4. In addition, for a sunken micro-motion platform, the reliability of chip assembly can be further improved, as shown in Figure 9 .

[0054] The present application also provides an assembly method of a MEMS micro-motion platform 300 and a to-be-assembled component 500, comprising: connecting the above-mentioned MEMS micro-motion platform support structure to the bottom of the MEMS micro-motion platform 300 and the bottom of the outer frame 400, respectively, as shown in Figure 5 ; after the assembly of the MEMS micro-motion platform 300 and the to-be-assembled component 500 (the assembly can be through the bonding wire 800 and the pad P in Figure 5 ), the MEMS micro-motion platform support structure is removed, and after removal, it can be as shown in Figure 8 .

[0055] The application also provides a micro-motion assembly, comprising the to-be-assembled component 500 and the MEMS micro-motion platform 300, and the MEMS micro-motion platform 300 is assembled with the to-be-assembled component 500 by using the MEMS micro-motion platform support structure.

[0056] In at least one embodiment, referring to Figure 2 , the MEMS micro-motion platform 300 and the outer frame 400 form a back cavity 700. In at least one embodiment, referring to Figure 9 , the top surface of the MEMS micro-motion platform 300 is lower than the top surface of the outer frame 400, so that the MEMS micro-motion platform 300 is configured as a sunken micro-motion platform, as shown in Figure 9 The above two types of micro-motion assemblies are assembled by using the MEMS micro-motion platform support structure, and the assembly reliability is higher and the adaptability is higher.

[0057] The application also provides an electronic device comprising the above micro-motion assembly.

[0058] Obviously, the above embodiments of the application are only examples for clarity, and are not intended to limit the embodiments of the application. Based on the above description, those skilled in the art can make other different forms of changes or modifications. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the application shall be included in the protection scope of the claims of the application.

Claims

1. A MEMS micro-motion platform support structure, characterized in that, A MEMS micro-motion platform support structure for supporting a MEMS micro-motion platform when assembling the MEMS micro-motion platform with an assembly part, the MEMS micro-motion platform support structure comprising: a plate-shaped part removably connected to the bottom of the outer frame of the MEMS micro-motion platform and capable of upwardly supporting the outer frame; a protruding part between the plate-shaped part and the MEMS micro-motion platform and capable of upwardly supporting the MEMS micro-motion platform, the protruding part being removably connected to the MEMS micro-motion platform.

2. The MEMS micro-motion platform support structure of claim 1, wherein, The protruding part is removably connected to the plate-shaped part.

3. The MEMS micromotion platform support structure of claim 2, wherein, A plurality of protruding parts with different height sizes correspond to the same plate-shaped part.

4. The MEMS micro-motion platform support structure of claim 1, wherein, The height size of the protruding part is adjustable when the protruding part is between the plate-shaped part and the MEMS micro-motion platform.

5. The MEMS micro-motion platform support structure of claim 1, wherein, The protruding part is integrally formed with the plate-shaped part.

6. The MEMS micromotion platform support structure of any one of claims 1 to 5, wherein, The height size of the protruding part is 10-2000 microns.

7. A microdrive assembly, comprising: An assembly part and a MEMS micro-motion platform, the MEMS micro-motion platform being assembled with the assembly part by using the MEMS micro-motion platform support structure according to any one of claims 1-6.

8. The microdrive assembly of claim 7, wherein, The MEMS micro-motion platform and its outer frame enclose a back cavity.

9. An electronic device, comprising: A micro-motion assembly according to claim 7 or 8. A micro-motion assembly according to claim 7 or 8.

Images