Probe station

Abstract

The utility model discloses a probe station, which relates to the technical field of semiconductor testing and comprises a conveying device, a first testing device and a second testing device. Wherein the conveying device is internally provided with a housing, a manipulator module and a material box connection module which is used for taking out a wafer seat with a wafer from a wafer box or putting back the wafer seat with the wafer from the wafer box; each of the first testing device and the second testing device comprises a cabinet and a testing module; the direction from the material box connection module to the manipulator module is recorded as a first direction; two sides, parallel to the first direction, of the housing are respectively provided with two testing devices; the manipulator module comprises a feeding manipulator and a discharging manipulator, the feeding manipulator is used for conveying the wafer to the first test module or the second test module, and the discharging manipulator is used for taking the wafer out of the first test module or the second test module. Through the arrangement, the number of tested wafers in unit time can be increased, so that the production efficiency of the wafers is not influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor testing, especially relates to a probe station. BACKGROUND

[0002] The probe station is commonly used in the wafer testing process in the semiconductor industry. In the testing process, the mechanical hand module needs to take the wafer out of the wafer placing module and send it to the detection module for testing. After the wafer enters the detection module, a series of tests will be performed, and the testing time is relatively long. During this process, the mechanical hand module is in standby state continuously. After the wafer testing is completed, the mechanical hand module needs to first transfer the wafer that has been tested to the wafer placing module, and then take the new wafer that needs to be tested from the wafer placing module and transfer it to the detection module for testing. This situation leads to low wafer transfer efficiency and long standby time of the mechanical hand module, thereby greatly limiting the wafer production to the testing efficiency of the probe station, and further affecting the production efficiency of the wafer production line.

[0003] Therefore, it is necessary to provide a probe station to solve or at least alleviate the above technical problems. SUMMARY

[0004] The main purpose of the utility model is to provide a probe station, which aims to solve the technical problem of the probe station affecting the production efficiency of the wafer production line.

[0005] To achieve the above purpose, the utility model provides a probe station, which comprises:

[0006] The conveying device comprises a housing, a base frame, a magazine adapter module and a mechanical hand module arranged inside the housing. The magazine adapter module and the mechanical hand module are both installed on the base frame. The magazine adapter module is used to take out or put back the wafer seat loaded with the wafer from the wafer box.

[0007] The first testing device comprises a first cabinet and a first testing module arranged inside the first cabinet.

[0008] The second testing device comprises a second cabinet and a second testing module arranged inside the second cabinet.

[0009] Definition: the direction from the magazine adapter module to the mechanical hand module is the first direction.

[0010] The housing is parallel to the two sides of the first direction, and the first testing device and the second testing device are installed on the two sides respectively.

[0011] The mechanical hand module comprises a feeding mechanical hand and a discharging mechanical hand, the feeding mechanical hand is used for conveying the wafer to the first test module or the second test module, and the discharging mechanical hand is used for taking out the wafer from the first test module or the second test module.

[0012] In an embodiment, two sides of the cover parallel to the first direction are respectively provided with a first feeding port and a second feeding port, the first cabinet is provided with a first cabinet door in communication with the first feeding port, and the second cabinet is provided with a second cabinet door in communication with the second feeding port.

[0013] The first feeding port, the second feeding port, the first cabinet door and the second cabinet door can be passed through by the feeding mechanical hand and the discharging mechanical hand which grasp the wafer.

[0014] In an embodiment, the conveying device further comprises a calibration and identification module, the calibration and identification module is installed on the base frame and is installed on the side of the mechanical hand module away from the cartridge adapter module along the first direction, the calibration and identification module is used for identifying the identity information of the wafer and calibrating the position of the wafer, the wafer is first transported from the wafer seat to the calibration and identification module by the feeding mechanical hand, and then is carried to the first test module or the second test module for testing by the feeding mechanical hand.

[0015] In an embodiment, the calibration and identification module comprises a base, a negative pressure driving assembly, an adsorption table, a stand and a scanning head, the base is installed on the top of the base frame, the negative pressure driving assembly is installed on the base, the adsorption table is rotatably installed on the negative pressure driving assembly, and the top surface of the adsorption table is provided with a plurality of vacuum adsorption holes, and the negative pressure driving assembly is internally provided with a negative pressure pipeline, and the vacuum adsorption holes are in communication with the negative pressure pipeline.

[0016] The stand is installed on the top surface of the base, the scanning head is installed on the top of the stand, the bottom surface of the scanning head is higher than the top surface of the adsorption table, and the scanning head is used for identifying the identity information of the wafer and detecting the position information of the wafer.

[0017] In an embodiment, the mechanical hand module further comprises a support table, a rotary table and a bottom plate, the support table is installed on the top of the base frame, the rotary table is installed on the top of the support table, and the bottom plate is installed on the rotary table, and the rotary table is used for driving the bottom plate to rotate.

[0018] The feeding mechanical hand and the discharging mechanical hand are both installed on the top surface of the bottom plate, the feeding mechanical hand comprises a feeding gripper, the discharging mechanical hand comprises a discharging gripper, and the feeding gripper and the discharging gripper can perform telescopic motion relative to the bottom plate.

[0019] In an embodiment, the feeding manipulator comprises a first feeding slide rail, a first feeding slide block, a first feeding drive assembly and a first feeding slide arm, and the discharging manipulator comprises a first discharging slide rail, a first discharging slide block, a first discharging drive assembly and a first discharging slide arm.

[0020] The first feeding slide rail and the first discharging slide rail are arranged in parallel and spaced apart along the first direction on the top surface of the bottom plate.

[0021] The first feeding slide block is slidingly mounted on the first feeding slide rail, the first feeding drive assembly is configured to drive the first feeding slide block to slide, the first feeding slide arm is mounted on the top surface of the first feeding slide block, and the feeding gripper is movable with the first feeding slide arm.

[0022] The first discharging slide block is slidingly mounted on the first discharging slide rail, the first discharging drive assembly is configured to drive the first discharging slide block to slide, the first discharging slide arm is mounted on the top surface of the first discharging slide block, and the discharging gripper is movable with the first discharging slide arm.

[0023] In an embodiment, the feeding manipulator further comprises a second feeding slide rail, a second feeding slide block and a second feeding drive assembly, and the discharging manipulator further comprises a second discharging slide rail, a second discharging slide block and a second discharging drive assembly.

[0024] The second feeding slide rail is mounted on the first feeding slide arm in parallel with the first feeding slide rail, the second feeding slide block is slidingly mounted on the second feeding slide rail, the second feeding drive assembly is configured to drive the second feeding slide block to slide, and the feeding gripper is mounted on the second feeding slide block and moves synchronously with the second feeding slide block.

[0025] The second discharging slide rail is mounted on the first discharging slide arm in parallel with the first discharging slide rail, the second discharging slide block is slidingly mounted on the second discharging slide rail, the second discharging drive assembly is configured to drive the second discharging slide block to slide, and the discharging gripper is mounted on the second discharging slide block and moves synchronously with the second discharging slide block.

[0026] In an embodiment, the material box connection module comprises a lifting seat, the wafer seat is placed on the top surface of the lifting seat and synchronously lifted with the lifting seat, the feeding manipulator takes out the wafer to be tested from the wafer seat, and the discharging manipulator places the wafer that has been tested in the wafer seat.

[0027] In an embodiment, the probe station further comprises a main control module, the main control module comprises a human-computer interaction assembly and a controller, the human-computer interaction assembly comprises a display, a computer and an external input device, and the controller is in communication connection with the human-computer interaction assembly, the conveying device, the first testing device and the second testing device.

[0028] In an embodiment, the first testing module comprises a first four-axis motion mechanism, a first wafer table and a first detection assembly, the first wafer table is installed on the first four-axis motion mechanism, and the first detection assembly is used for testing the wafer placed on the surface of the first wafer table.

[0029] The second testing module comprises a second four-axis motion mechanism, a second wafer table and a second detection assembly, the second wafer table is installed on the second four-axis motion mechanism, and the second detection assembly is used for testing the wafer placed on the surface of the second wafer table.

[0030] According to the technical scheme provided in the utility model, the probe station comprises a conveying device, a first testing device and a second testing device. The conveying device comprises a cover shell, a base frame arranged inside the cover shell, a magazine connection module and a mechanical hand module, the magazine connection module and the mechanical hand module are both installed on the base frame, the magazine connection module is used for taking out a wafer seat loaded with wafers from a wafer box or putting the wafer seat loaded with wafers back into the wafer box; the first testing device comprises a first cabinet and a first testing module arranged inside the first cabinet; the second testing device comprises a second cabinet and a second testing module arranged inside the second cabinet; definition: the direction pointed by the magazine connection module to the mechanical hand module is a first direction; then the cover shell is provided with the first testing device and the second testing device on the two sides parallel to the first direction; the mechanical hand module comprises a feeding mechanical hand and a discharging mechanical hand, the feeding mechanical hand is used for conveying wafers to the first testing module or the second testing module, and the discharging mechanical hand is used for taking out wafers from the first testing module or the second testing module. Through the arrangement, one conveying device can be responsible for the feeding and discharging work of two testing devices, so that the idle time of the mechanical hand module is reduced; at the same time, the feeding mechanical hand and the discharging mechanical hand are used to complete the feeding and discharging operation in the testing device in a division of labor manner, so that the idle time of the first testing device and the second testing device is reduced, the number of wafers tested in unit time is increased, and the wafer testing efficiency is ultimately improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained from the structures shown in the drawings without creative labor for those skilled in the art.

[0032] Figure 1 This is a schematic diagram of the structure of an embodiment of the probe station provided by this utility model;

[0033] Figure 2 for Figure 1 The exploded structure diagram of the probe station provided in the image;

[0034] Figure 3 for Figure 2 A structural diagram from another perspective;

[0035] Figure 4 for Figure 1 A top view of a portion of the probe station structure provided in the diagram;

[0036] Figure 5 A schematic diagram of the structure of an embodiment of the probe station conveying device provided by this utility model;

[0037] Figure 6 for Figure 5 A structural diagram from another perspective;

[0038] Figure 7 for Figure 5 A schematic diagram of the structure of a robotic arm module in a transmission device provided in the present invention;

[0039] Figure 8 for Figure 7 A structural diagram from another perspective;

[0040] Figure 9 for Figure 7 The diagram shows the structure of the unloading robot arm in the robot arm module provided in the software when it extends.

[0041] Explanation of icon numbers:

[0042] 1000, Probe station;

[0043] 1, conveying device; 11, cover; 111, first feeding port; 112, second feeding port; 12, base frame; 13, magazine connection module; 131, lifting seat; 14, manipulator module; 141, feeding manipulator; 1411, first feeding slide rail; 1412, first feeding slide block; 1413, first feeding drive assembly; 1414, first feeding slide arm; 1415, second feeding slide rail; 1416, second feeding slide block; 1417, second feeding drive assembly; 1418, feeding gripper; 142, discharging manipulator; 1421, first discharging slide rail; 1422, first discharging slide block; 1423, first discharging drive assembly; 1424, first discharging slide arm; 1425, second discharging slide rail; 1426, second discharging slide block; 1427, second discharging drive assembly; 1428, discharging gripper; 143, support table; 144, rotary table; 145, bottom plate; 15, calibration and identification module; 151, base; 152, adsorption table; 153, stand; 154, scanning head; 155, negative pressure drive assembly;

[0044] 2, first test device; 21, first cabinet; 211, first cabinet door; 22, first test module;

[0045] 3, second test device; 31, second cabinet; 311, second cabinet door; 32, second test module;

[0046] 4, main control module; 41, display; 42, external input device;

[0047] X, first direction;

[0048] 2000, wafer seat;

[0049] 3000, wafer.

[0050] The realization, functional features and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0052] It should be noted that if the embodiment of the utility model has directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, if the certain posture changes, the directionality indication also changes accordingly.

[0053] In addition, if the embodiment of the utility model has the description of "first", "second" and the like, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the utility model.

[0054] Under the background of rapid development of semiconductor industry in China, chip market is developing hot, and wafer test is an essential process in chip manufacturing process, in the process, the performance of wafer needs to be tested by using probe station and other detection equipment. The probe station is a kind of equipment specially used for wafer performance test, which usually includes semi-automatic probe station and full-automatic probe station. The semi-automatic equipment needs to manually replace the wafer, and the degree of manual intervention is high. The full-automatic probe station can realize full automation of the test process, before testing, it usually transfers the wafer to be tested to the detection host through the mechanical hand, after the wafer test is completed, it also transfers the wafer after test to the wafer placing rack or wafer placing box through the mechanical hand. The full-automatic probe station has the advantages of less manual intervention, uninterrupted work, etc., so it has become an important development direction in wafer test industry.

[0055] According to the research of the applicant, it is found that during the working of the full-automatic probe station, the manipulator is mainly responsible for feeding and discharging. The feeding refers to the process that the manipulator takes the wafer to be tested from the wafer placing rack and transports it to the detection main machine. The discharging refers to the process that the manipulator takes the wafer which has been tested from the detection main machine and transports it to the wafer placing rack. During the actual work, the manipulator first feeds, and the wafer to be tested is tested in the detection main machine. The testing process takes a long time, and during the testing process, the manipulator is in standby state. After the wafer is tested, the manipulator discharges, and after the discharging is completed, the feeding is performed again. In this way, the wafer testing process is continuously performed. During the above process, when the wafer is tested, the manipulator is in standby state for a long time. After the wafer is tested, the manipulator needs to first discharge and then feed. This phenomenon makes the transfer time between the adjacent two wafers too long, and the idle time of the manipulator is long, which causes the waste of productivity, and the yield of the wafer is largely limited by the testing efficiency of the probe station, and further affects the production efficiency of the wafer production line.

[0056] In view of this, the utility model provides a kind of probe station to solve above-mentioned technical problems.

[0057] Please refer to Figures 1 to 9 In an embodiment of the utility model, the probe station 1000 includes conveying device 1, first testing device 2 and second testing device 3. Wherein, conveying device 1 includes cover 11 and the base frame 12, magazine interface module 13 and manipulator module 14 arranged in cover 11 interior, magazine interface module 13 and manipulator module 14 are all installed in base frame 12, and magazine interface module 13 is used to take out or put back wafer seat 2000 loaded with wafer 3000 from wafer magazine;First testing device 2 includes first cabinet 21 and the first test module 22 arranged in first cabinet 21 interior;Second testing device 3 includes second cabinet 31 and the second test module 32 arranged in second cabinet 31 interior;Definition: the direction that magazine interface module 13 points to manipulator module 14 is first direction X (the direction that first direction X points to is shown in arrow X in Figure 4 And Figure 5 the direction of arrow X in the middle) ; Cover 11 is installed with first testing device 2 and second testing device 3 respectively on both sides parallel to first direction X;Manipulator module 14 includes feeding manipulator 141 and discharging manipulator 142, and feeding manipulator 141 is used to transport wafer 3000 to first test module 22 or second test module 32, and discharging manipulator 142 is used to take out wafer 3000 from first test module 22 or second test module 32.

[0058] Specifically, in the direction perpendicular to the first direction X, the first test device 2 and the second test device 3 are respectively installed on both sides of the conveying device 1, and the conveying device 1 is provided with a magazine interface module 13 for unlocking the wafer box and taking out the wafer seat 2000 in the wafer box for the mechanical hand module 14 to take and place the wafer 3000. In the embodiment, the mechanical hand module 14 is provided with two mechanical hands, namely, the feeding mechanical hand 141 and the discharging mechanical hand 142, wherein the feeding mechanical hand 141 is responsible for taking out the wafer 3000 from the wafer seat 2000 and transporting it to the first test module 22 or the second test module 32, and the discharging mechanical hand 142 is responsible for taking out the wafer 3000 from the first test module 22 or the second test module 32 and placing it in the wafer seat 2000. In the embodiment, the mechanical hand module 14 simultaneously supplies the wafers 3000 to the two test devices, after the first wafer 3000 to be tested is placed in the first test module 22 by the feeding mechanical hand 141, the feeding mechanical hand 141 takes the second wafer 3000 to be tested and places it in the second test module 32 for testing, which reduces the idle time of the mechanical hand, and then the feeding mechanical hand 141 takes the third wafer 3000 to be tested and transports it to the vicinity of the first test device 2, and the discharging mechanical hand 142 also moves to this position, when the first wafer 3000 to be tested is tested, the discharging mechanical hand 142 takes down the wafer 3000, the feeding mechanical hand 141 timely places the third wafer 3000 to be tested in the first test module 22 for testing, and the wafer replacement process of the second test module 32 is the same as that of the first test module 22. This arrangement reduces the wafer replacement time of the two test devices, thereby facilitating the improvement of the wafer 3000 test efficiency. It should be noted that, since the magazine interface module 13, the mechanical hand module 14 and the like in the embodiment are only provided with one, and the two test devices are arranged on both sides parallel to the first direction X, the width of the conveying device 1 in the direction perpendicular to the first direction X is small, which is beneficial to reduce the volume of the overall structure of the probe station 1000.

[0059] According to the technical scheme of the embodiment, two test devices are arranged on both sides of the conveying device 1, and the feeding mechanical hand 141 and the discharging mechanical hand 142 are simultaneously arranged in the mechanical hand module 14. Through this arrangement, one conveying device 1 can be responsible for the feeding and discharging work of the two test devices, which reduces the idle time of the mechanical hand module 14; at the same time, the feeding mechanical hand 141 and the discharging mechanical hand 142 cooperate to complete the feeding and discharging operation in the test device, which reduces the wafer replacement time of the test device, thereby reducing the idle time of the first test device 2 and the second test device 3, and the probe station 1000 provided in the embodiment can simultaneously test two wafers 3000, thereby improving the number of wafers 3000 tested per unit time, and ultimately improving the wafer 3000 test efficiency.

[0060] In an embodiment of the utility model, the cover 11 is provided with a first feeding port 111 and a second feeding port 112 on both sides parallel to the first direction X, the first cabinet 21 is provided with a first cabinet door 211 communicating with the first feeding port 111, and the second cabinet 31 is provided with a second cabinet door 311 communicating with the second feeding port 112; the first feeding port 111, the second feeding port 112, the first cabinet door 211 and the second cabinet door 311 can be passed through by the wafer 3000 grabbing feeding manipulator 141 and discharging manipulator 142. Please refer to Figures 1 to 3 The cover 11 is used for protecting the internal structure such as the magazine adapter module 13, the manipulator module 14 and the base frame 12. Two testing devices are installed on both sides of the cover 11, wherein the first cabinet 21 and the second cabinet 31 are detachably connected with the cover 11, the connection mode includes one of thread connection, pin connection and lock catch connection, the split design can reduce the difficulty in transportation and facilitate maintenance and disassembly.

[0061] The first feeding port 111 is correspondingly arranged with the first cabinet door 211, and the second feeding port 112 is correspondingly arranged with the second cabinet door 311. The feeding manipulator 141 and the discharging manipulator 142 can extend into the interior of the first cabinet 21 through the first feeding port 111 and the first cabinet door 211, and also can extend into the interior of the second cabinet 31 through the second feeding port 112 and the second cabinet door 311, so that the manipulator module 14 can take or place the wafer 3000 in the two testing devices. According to the need, a sealing layer can be arranged between the first feeding port 111 and the first cabinet door 211 and between the second feeding port 112 and the second cabinet door 311, so as to ensure the sealing of the interior of the conveying device 1, the first testing device 2 and the second testing device 3.

[0062] In an embodiment of the utility model, the conveying device 1 further includes a calibration identification module 15, the calibration identification module 15 is installed on the base frame 12 and is installed on the side of the manipulator module 14 away from the magazine adapter module 13 along the first direction X, and the calibration identification module 15 is used for identifying the identity information of the wafer 3000 and calibrating the position of the wafer 3000. The wafer 3000 is first transported from the wafer seat 2000 to the calibration identification module 15 by the feeding manipulator 141, and then is carried to the first testing module 22 or the second testing module 32 for testing by the feeding manipulator 141. Please refer to Figures 2 to 6In the embodiment, the calibration and identification module 15 is installed on the side of the mechanical arm module 14 away from the magazine docking module 13 and is spaced apart from the mechanical arm module 14 to avoid affecting the movement path of the mechanical arm module 14. Calibration is used by the module to identify the identity information of the wafer 3000 to be tested and to adjust the position of the wafer 3000. After the wafer 3000 is picked up from the wafer holder 2000 by the loading mechanical arm 141, it is first transferred to the calibration and identification module 15 for transfer, so that the calibration and identification module 15 scans the digital code or graphic code of the wafer 3000, registers the wafer 3000, and then the calibration and identification module 15 adjusts the position of the wafer 3000 to ensure that after the wafer 3000 is picked up again by the loading mechanical arm 141 and placed in the test device, the dicing line of the single-chip in the wafer 3000 is flush with the horizontal movement direction of the movement mechanism in the test device that drives the wafer 3000 to move, and the center of the wafer 3000 is flush with the center of the movement mechanism.

[0063] Further, in an embodiment of the utility model, please refer to Figures 4 to 6 , the calibration and identification module 15 includes a base 151, a negative pressure driving assembly 155, an adsorption table 152, a stand 153 and a scanning head 154, the base 151 is installed on the top of the base frame 12, the negative pressure driving assembly 155 is installed on the base 151, the adsorption table 152 is rotatably installed on the negative pressure driving assembly 155, and a plurality of vacuum adsorption holes are formed in the top surface of the adsorption table 152, a negative pressure pipeline is arranged in the negative pressure driving assembly 155, and the vacuum adsorption holes are communicated with the negative pressure pipeline;The stand 153 is installed on the top surface of the base 151, and the scanning head 154 is installed on the top of the stand 153, the bottom surface of the scanning head 154 is higher than the top surface of the adsorption table 152, and the scanning head 154 is used to identify the identity information of the wafer 3000 and detect the position information of the wafer 3000. Wherein, the negative pressure driving assembly 155 is used as the base of the adsorption table 152, which supports the rotation of the adsorption table 152 and provides negative pressure to the vacuum adsorption holes in the adsorption table 152, and the negative pressure pipeline in the negative pressure driving assembly 155 is communicated with the external vacuum pressure pipeline. It should be noted that the rotation of the adsorption table 152 is realized by the driving motor in the negative pressure driving assembly 155, and the adsorption table 152 can be directly connected with the output shaft of the driving motor or connected with the driving motor through a belt drive. The scanning head 154 can identify the digital code or graphic code of the wafer 3000 on one hand and detect the direction of the dicing line of the single-chip in the wafer 3000 on the other hand. Through this setting, the calibration and identification module 15 can have the functions of recording the identity information of the wafer 3000 and adjusting the position of the wafer 3000, thereby facilitating the design of the conveying device 1 to be more compact.

[0064] In an embodiment of the utility model, mechanical arm module 14 still includes support platform 143, rotary table 144 and bottom plate 145, support platform 143 is installed at the top of base frame 12, rotary table 144 is installed at the top of support platform 143, bottom plate 145 is installed at rotary table 144, and rotary table 144 is used to drive bottom plate 145 to rotate, loading mechanical arm 141 and unloading mechanical arm 142 are all installed at the top surface of bottom plate 145, loading mechanical arm 141 includes loading gripper 1418, and unloading mechanical arm 142 includes unloading gripper 1428, and loading gripper 1418 and unloading gripper 1428 can stretch out and draw back movement relative to bottom plate 145. Figures 7 to 9 In the embodiment, rotary table 144 drives bottom plate 145 and loading mechanical arm 141 and unloading mechanical arm 142 to rotate, and when designing, rotary table 144 can adopt one of electric rotary table 144 and pneumatic rotary table 144. The rotation of rotary table 144 is matched with the stretch out and draw back movement of loading mechanical arm 141 and unloading mechanical arm 142, so that the movement of loading gripper and unloading gripper 1428 is more flexible, and it is convenient for loading gripper and unloading gripper 1428 to grab wafer 3000 at different positions. The surface of loading gripper and unloading gripper 1428 is all provided with negative pressure hole, and negative pressure hole is used to generate negative pressure to adsorb wafer 3000, so as to firmly adsorb wafer 3000 on the surface of loading gripper or unloading gripper 1428. In addition, loading mechanical arm 141 and unloading mechanical arm 142 are all provided with distance detector, and distance detector is used to detect the distance between loading gripper or unloading gripper 1428 and wafer 3000, so as to accurately identify the position of wafer 3000.

[0065] Further, refer to Figures 7 to 9In an embodiment of the utility model, the upper material mechanical arm 141 includes first upper material slide rail 1411, first upper material slide block 1412, first upper material drive assembly 1413 and first upper material slide arm 1414, the lower material mechanical arm 142 includes first lower material slide rail 1421, first lower material slide block 1422, first lower material drive assembly 1423 and first lower material slide arm 1424;First upper material slide rail 1411 and first lower material slide rail 1421 are spaced apart in parallel along the first direction X and are arranged on the top surface of bottom plate 145;First upper material slide block 1412 is slidably installed on first upper material slide rail 1411, first upper material drive assembly 1413 is used to drive first upper material slide block 1412 to slide, first upper material slide arm 1414 is installed on the top surface of first upper material slide block 1412, and upper material gripper 1418 can move with first upper material slide arm 1414;First lower material slide block 1422 is slidably installed on first lower material slide rail 1421, first lower material drive assembly 1423 is used to drive first lower material slide block 1422 to slide, first lower material slide arm 1424 is installed on the top surface of first lower material slide block 1422, and lower material gripper 1428 can move with first lower material slide arm 1424. Taking the structure of the lower material mechanical arm 142 as an example, the cooperation of first lower material slide block 1422, first lower material slide rail 1421 and first lower material slide arm 1424 can drive lower material gripper 1428 to perform telescopic motion along the extension direction of first lower material slide rail 1421, wherein first lower material drive assembly 1423 can adopt one of screw drive assembly and belt drive assembly, and in the embodiment, adopts belt drive assembly, drives the belt to rotate through drive motor, the belt is connected with first lower material slide block 1422, and both synchronous motion, so that drive motor can drive first lower material slide block 1422 to slide. Through the setting, the upper material clamp jaw and lower material gripper 1428 can realize telescopic motion by simple structure.

[0066] Further, in an embodiment of the utility model, the upper material mechanical arm 141 further includes second upper material slide rail 1415, second upper material slide block 1416 and second upper material drive assembly 1417, and the lower material mechanical arm 142 further includes second lower material slide rail 1425, second lower material slide block 1426 and second lower material drive assembly 1427;Second upper material slide rail 1415 is installed in parallel with the first direction X on first upper material slide arm 1414, second upper material slide block 1416 is slidably installed on second upper material slide rail 1415, second upper material drive element is used to drive second upper material slide block 1416 to slide, and upper material gripper 1418 is installed on second upper material slide block 1416 and moves synchronously with second upper material slide block 1416;Second lower material slide rail 1425 is installed in parallel with the first direction X on first lower material slide arm 1424, second lower material slide block 1426 is slidably installed on second lower material slide rail 1425, second lower material drive element is used to drive second lower material slide block 1426 to slide, and lower material gripper 1428 is installed on second lower material slide block 1426 and moves synchronously with second lower material slide block 1426. Please refer toFigures 7 to 9 , still taking the structure of the material unloading manipulator 142 as an example, on the basis that the first material unloading sliding arm 1424 slides with the first sliding block, a second material unloading sliding rail 1425 is installed on the side surface of the first material unloading sliding arm 1424, a second material unloading sliding block 1426 slides along the second material unloading sliding rail 1425 under the action of a second material unloading driving assembly 1427, and a material unloading gripper 1428 is installed on the second material unloading sliding block 1426, so that the second material unloading sliding block 1426 can drive the material unloading gripper 1428 to perform telescopic movement. The second material unloading driving assembly 1427 includes one of a screw driving assembly and a belt driving assembly, and in the embodiment, the belt driving assembly is adopted, a driving motor drives the belt to rotate, and the belt is connected with the second material unloading sliding block 1426, so that the belt can move synchronously with the second material unloading sliding block 1426. Through the cooperation of the second material unloading sliding rail 1425 and the second material unloading sliding block 1426 arranged on the first material unloading sliding arm 1424, the material unloading gripper 1428 can realize two-stage telescopic movement, and the flexibility of the material unloading gripper 1428 during use is further improved.

[0067] In an embodiment of the utility model, please refer to Figure 5 and Figure 6 The material box connecting module 13 includes a lifting seat 131, the wafer seat 2000 is placed on the top surface of the lifting seat 131 and lifts synchronously with the lifting seat 131, the material loading manipulator 141 takes out the wafer 3000 to be tested from the wafer seat 2000, and the material unloading manipulator 142 places the wafer 3000 that has finished testing in the wafer seat 2000. When the height of the wafer seat 2000 relative to the material loading manipulator 141 and the material unloading manipulator 142 needs to be changed, the lifting seat 131 can drive the wafer seat 2000 to lift. After the wafer box is placed in the material box connecting module 13, the lifting seat 131 will unlock the wafer box and take out the wafer seat 2000 from the wafer box. When the material loading or unloading operation is carried out, the wafer 3000 is taken out from the wafer seat 2000 by the material loading manipulator 141 and is placed back into the wafer seat 2000 by the material unloading manipulator 142, and in this process, the lifting seat 131 drives the wafer seat 2000 to adjust the position in real time.

[0068] In an embodiment of the utility model, the probe table 1000 further includes a main control module 4, the main control module 4 includes a man-machine interaction assembly and a controller, the man-machine interaction assembly includes a display 41, a computer and an external input device 42, and the controller is in communication connection with the man-machine interaction assembly, the conveying device 1, the first testing device 2 and the second testing device 3. Please refer to Figure 1The external input device 42 includes a mouse, a keyboard and the like, and can control the test process of the wafer 3000 and inquire the test result of the wafer 3000 through the man-machine interaction component, the controller can send action instructions and receive various detection information, so as to automatically complete the feeding and discharging process and the test process of the wafer 3000. By setting the matched main control module 4, the automation degree of the probe station 1000 can be improved, thereby reducing the degree of manual intervention.

[0069] In an embodiment of the utility model, first test module 22 includes first four -axis motion mechanism, first slide glass stage and first detection component, first slide glass stage install in first four -axis motion mechanism, first detection component is used for testing wafer 3000 of placing in the surface of first slide glass stage, second test module 32 includes second four -axis motion mechanism, second slide glass stage and second detection component, second slide glass stage installs in second four -axis motion mechanism, and second detection component is used for testing wafer 3000 of placing in the surface of second slide glass stage. The internal structure of first test device 2 and second test device 3 is same, taking first test module 22 as an example, after wafer 3000 is placed in first slide glass stage by feeding manipulator 141, first detection component starts testing this wafer 3000, in order to improve the stability of wafer 3000 placement, the top surface of first slide glass stage is provided with a plurality of first adsorption holes for generating negative pressure and adsorbing wafer 3000. After wafer 3000 is tested, discharging manipulator 142 is inserted into first cabinet 21 and grabs wafer 3000. First four -axis motion mechanism mainly realizes the movement and steering of first slide glass stage, and a driving mechanism and a closed-loop feedback system are arranged in the first four -axis motion mechanism, so that the movement of the first slide glass stage has high precision and stability. First detection component is used for detecting wafer 3000 for needle testing and other projects, and an auxiliary testing subassembly is further included in the first test component for simulating various environments during testing, such as vacuum, protective gas, high-temperature heating, low-temperature refrigeration, and light protection. In addition, a first marking subassembly is further arranged in the first detection component, which is used to mark the chips in the wafer 3000, and the first marking subassembly is used to mark the chips for testing during the testing of the wafer 3000, so as to distinguish them.

[0070] According to the above embodiment, an operation process of the probe station 1000 during work is provided in the embodiment:

[0071] (1) The wafer box is placed in the box adapter, the lifting table drives the wafer seat 2000 to separate from the wafer box, and in this process, the box adapter counts the number of wafers 3000 in the wafer box, and after determining the number of wafers 3000, feeds the number information of the wafers 3000 to the controller.

[0072] (2) The controller sends a command to the manipulator module 14 to pick up the wafer 3000. The loading gripper 1418 in the loading manipulator 141 extends into the wafer holder 2000 to pick up the first wafer 3000 and transfers the first wafer 3000 to the adsorption table 152 in the calibration and identification module 15.

[0073] (3) The scanning head 154 in the calibration and identification module 15 identifies the identity information of the first wafer 3000 and registers it to the computer. Meanwhile, the scanning head 154 identifies the position information of the first wafer 3000 and feeds back the position information to the controller. The controller has a preset image. If the position information does not match the preset image, the adsorption table 152 is rotated to rotate the first wafer 3000 to an angle that matches the preset image.

[0074] (4) The loading manipulator 141 picks up the first wafer 3000 again according to the command of the controller and transfers it to the first test module 22 for testing.

[0075] (5) The loading manipulator 141 returns to the initial position according to the command of the controller and picks up the second wafer 3000. After picking up the second wafer 3000, step (3) is repeated, and then the second wafer 3000 is picked up again and transferred to the second test module 32 for testing.

[0076] (6) The loading manipulator 141 returns to the initial position and picks up the third wafer 3000. After picking up the third wafer 3000, step (3) is repeated, and then the loading manipulator 141 picks up the third wafer 3000 again and transports it to the vicinity of the first cabinet door 211, ready to place the third wafer 3000 into the first test module 22. At the same time, the unloading manipulator 142 also moves to this position and is ready to take the first wafer 3000 out of the first test module 22.

[0077] (7) After the first wafer 3000 is tested, the controller sends a command to the unloading manipulator 142 to unload. At this time, the unloading manipulator 142 takes the first wafer 3000 out of the first test module 22, and then the controller sends a command to the loading manipulator 141 to load. The loading manipulator 141 places the third wafer 3000 in the first test module 22 for testing. In this process, the loading gripper 1418 and the unloading gripper 1428 in the loading manipulator 141 and the unloading manipulator 142 only perform extension and retraction actions and do not need to perform turning actions, thereby saving the time for loading and unloading.

[0078] (8) The unloading mechanical arm 142 places the first wafer 3000 in the wafer seat 2000, and the loading mechanical arm 141 takes out the fourth wafer 3000, and repeats the steps (6) and (7), and places the fourth wafer 3000 in the second test module 32 for testing, and so on, each wafer 3000 is subjected to the steps of taking, calibration, identification, handover, etc., until the wafers 3000 in the wafer seat 2000 are tested completely. At this time, the wafer box can be replaced, and the next batch of wafers 3000 is tested.

[0079] The above merely describes exemplary embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A probe station, characterized in that, The application relates to a conveying device for a wafer test system. The conveying device comprises a housing, a base frame arranged inside the housing, a wafer box connecting module and a mechanical hand module, the wafer box connecting module and the mechanical hand module are both mounted on the base frame, and the wafer box connecting module is used for taking out or returning a wafer seat loaded with wafers from a wafer box. The first test device comprises a first cabinet and a first test module arranged inside the first cabinet. The second test device comprises a second cabinet and a second test module arranged inside the second cabinet. The direction from the wafer box connecting module to the mechanical hand module is defined as a first direction. The housing is provided with the first test device and the second test device on two sides parallel to the first direction. The mechanical hand module comprises a wafer feeding mechanical hand and a wafer discharging mechanical hand, the wafer feeding mechanical hand is used for conveying the wafers to the first test module or the second test module, and the wafer discharging mechanical hand is used for taking out the wafers from the first test module or the second test module.

2. The probe station of claim 1, wherein, The housing is provided with a first wafer conveying opening and a second wafer conveying opening on two sides parallel to the first direction, the first cabinet is provided with a first cabinet door in communication with the first wafer conveying opening, and the second cabinet is provided with a second cabinet door in communication with the second wafer conveying opening. The first wafer conveying opening, the second wafer conveying opening, the first cabinet door and the second cabinet door can be passed through by the wafer feeding mechanical hand and the wafer discharging mechanical hand.

3. The probe station of claim 1, wherein The conveying device further comprises a calibration and identification module, the calibration and identification module is mounted on the base frame and is arranged on a side of the mechanical hand module away from the wafer box connecting module along the first direction, the calibration and identification module is used for identifying identity information of the wafers and calibrating positions of the wafers, the wafers are first conveyed from the wafer seat to the calibration and identification module by the wafer feeding mechanical hand, and then are carried to the first test module or the second test module by the wafer feeding mechanical hand for testing.

4. The probe station of claim 3, wherein, The calibration and identification module comprises a base, a negative pressure driving assembly, an adsorption table, a stand and a scanning head, the base is mounted on the top of the base frame, the negative pressure driving assembly is mounted on the base, the adsorption table is rotatably mounted on the negative pressure driving assembly, and a top surface of the adsorption table is provided with a plurality of vacuum adsorption holes, and the negative pressure driving assembly is internally provided with a negative pressure pipeline, and the vacuum adsorption holes are in communication with the negative pressure pipeline. The stand is mounted on the top surface of the base, the scanning head is mounted on the top of the stand, and a bottom surface of the scanning head is arranged higher than the top surface of the adsorption table, and the scanning head is used for identifying the identity information of the wafers and detecting position information of the wafers.

5. The probe station of claim 1, wherein The mechanical hand module further comprises a support table, a rotary table and a bottom plate, the support table is mounted on the top of the base frame, the rotary table is mounted on the top of the support table, and the bottom plate is mounted on the rotary table, and the rotary table is used for driving the bottom plate to rotate. The wafer feeding mechanical hand and the wafer discharging mechanical hand are both mounted on the top surface of the bottom plate, the wafer feeding mechanical hand comprises a wafer feeding gripper, the wafer discharging mechanical hand comprises a wafer discharging gripper, and the wafer feeding gripper and the wafer discharging gripper can perform telescopic motion relative to the bottom plate.

6. The probe station of claim 5, wherein, The upper feeding manipulator comprises a first upper feeding sliding rail, a first upper feeding sliding block, a first upper feeding driving assembly and a first upper feeding sliding arm, and the lower feeding manipulator comprises a first lower feeding sliding rail, a first lower feeding sliding block, a first lower feeding driving assembly and a first lower feeding sliding arm; The first upper feeding sliding rail and the first lower feeding sliding rail are arranged in parallel along the first direction on the top surface of the bottom plate; The first upper feeding sliding block is slidingly installed on the first upper feeding sliding rail, the first upper feeding driving assembly is used for driving the first upper feeding sliding block to slide, the first upper feeding sliding arm is installed on the top surface of the first upper feeding sliding block, and the upper feeding gripper can move with the first upper feeding sliding arm; The first lower feeding sliding block is slidingly installed on the first lower feeding sliding rail, the first lower feeding driving assembly is used for driving the first lower feeding sliding block to slide, the first lower feeding sliding arm is installed on the top surface of the first lower feeding sliding block, and the lower feeding gripper can move with the first lower feeding sliding arm.

7. The probe station of claim 6, wherein the probe card is mounted on the probe station such that the probe card is positioned above the probe station and the probe card is movable relative to the probe station. The upper feeding manipulator further comprises a second upper feeding sliding rail, a second upper feeding sliding block and a second upper feeding driving assembly, and the lower feeding manipulator further comprises a second lower feeding sliding rail, a second lower feeding sliding block and a second lower feeding driving assembly; The second upper feeding sliding rail is installed in parallel with the first upper feeding sliding rail on the first upper feeding sliding arm, the second upper feeding sliding block is slidingly installed on the second upper feeding sliding rail, the second upper feeding driving member is used for driving the second upper feeding sliding block to slide, the upper feeding gripper is installed on the second upper feeding sliding block and moves synchronously with the second upper feeding sliding block; The second lower feeding sliding rail is installed in parallel with the first lower feeding sliding rail on the first lower feeding sliding arm, the second lower feeding sliding block is slidingly installed on the second lower feeding sliding rail, the second lower feeding driving member is used for driving the second lower feeding sliding block to slide, and the lower feeding gripper is installed on the second lower feeding sliding block and moves synchronously with the second lower feeding sliding block.

8. The probe station of claim 1, wherein, The material box connection module comprises a lifting seat, the wafer seat is placed on the top surface of the lifting seat and synchronously lifts with the lifting seat, the upper feeding manipulator takes out the wafer to be tested from the wafer seat, and the lower feeding manipulator places the wafer that has been tested on the wafer seat.

9. The probe station of any of claims 1 to 8, wherein, The probe station further comprises a main control module, the main control module comprises a human-computer interaction assembly and a controller, the human-computer interaction assembly comprises a display, a computer and an external input device, and the controller is in communication connection with the human-computer interaction assembly, the conveying device, the first testing device and the second testing device.

10. The probe station of any of claims 1 to 8, wherein, The first testing module comprises a first four-axis motion mechanism, a first slide table and a first detection assembly, the first slide table is installed on the first four-axis motion mechanism, and the first detection assembly is used for testing the wafer placed on the surface of the first slide table; The second testing module comprises a second four-axis motion mechanism, a second slide table and a second detection assembly, the second slide table is installed on the second four-axis motion mechanism, and the second detection assembly is used for testing the wafer placed on the surface of the second slide table.

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