Efficient heat conduction copper pipe of computer radiator

Abstract

The utility model provides an efficient heat conduction copper pipe of a computer radiator, which relates to the technical field of heat conduction copper pipes and comprises a group of copper pipe bodies, a vapor chamber arranged between the outer surface walls of the group of copper pipe bodies, a liquid storage tank fixedly sleeved between the outer surface walls of the group of copper pipe bodies, and a temperature sensor fixedly mounted on the inner surface wall of the liquid storage tank. And three groups of water outlet holes are formed in the bottom of the liquid storage tank, and the bottom of the liquid storage tank fixedly communicates with a cooling tank. According to the utility model, the efficient heat conduction performance of the heat conduction copper pipe is ensured under the interaction of all the components of the device, heat generated by the processor can be effectively eliminated even in summer or in high-strength application scenes such as high-performance workstations and game computers, stable heat dissipation support is provided for hardware through continuous cooling water circulation, and the service life of the processor is prolonged. Hardware performance is ensured to be maintained and stable operation is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat conduction copper pipe technical field especially relates to a high -efficient heat conduction copper pipe of computer radiator. BACKGROUND

[0002] Computer radiator is a kind of device for the heat dissipation of computer hardware (such as CPU, GPU), heat is conducted to the heat dissipation fin by heat-conducting material, and then the heat is taken away by air flow accelerated by fan, to ensure the normal operation of hardware.

[0003] During the use of computer radiator, in order to efficiently realize heat transfer to dissipate heat, heat-conducting copper pipe is generally used to conduct heat, and the high-efficiency heat-conducting copper pipe of computer radiator absorbs and releases heat by internal cooling liquid evaporation and liquefaction, and circulates in the copper pipe, so as to quickly conduct heat from the heat source to the heat dissipation fin, and then take away the heat by air flow accelerated by fan.

[0004] However, the high-efficiency heat-conducting copper pipe of existing computer radiator has the following disadvantages:

[0005] In the prior art, the high-efficiency heat-conducting copper pipe of computer radiator is usually matched with heat dissipation fin and fan to accelerate heat dissipation, however, in some high-performance workstations or game computers, because the computer needs to run for a long time under high load, the generated heat is far beyond the normal level, and this heat dissipation method is difficult to fully meet the heat dissipation demand, especially in summer, the ambient temperature is high, and the heat dissipation efficiency is further reduced, resulting in a large amount of heat accumulation in the computer, which eventually leads to performance degradation, unstable operation and even failure of hardware.

[0006] Therefore, we propose a high-efficiency heat-conducting copper pipe of computer radiator to solve the problems in the above background, CONTENT OF THE UTILITY MODEL

[0007] The utility model aims at providing a high-efficiency heat-conducting copper pipe of computer radiator, which places the evaporation end of the copper pipe body inside the liquid storage tank, ensures that the copper pipe body is completely immersed in cooling water, significantly improves the heat exchange efficiency, and the cooling assembly can efficiently cool the cooling water that absorbs heat, and realizes the recycling of cooling water by circulating pump driving, to solve the problems in the above background,

[0008] In order to achieve the above object, the utility model discloses the following technical scheme: a kind of efficient heat-conducting copper pipe of computer radiator, including a group of copper pipe body, a group of the even heating plate being provided between the outer surface wall of copper pipe body, a group of liquid storage tank is fixedly sheathed between the outer surface wall of copper pipe body, temperature sensor is fixedly installed on the inner surface wall of liquid storage tank, three groups of water outlet holes are arranged in the bottom of liquid storage tank, cooling tank is fixedly communicated in the bottom of liquid storage tank, two baffle plates are fixedly connected on the inner surface wall of cooling tank, three groups of cooling plate are fixedly connected between the outer surface wall of two baffle plates, multiple drip holes are arranged in the top of three groups of cooling plate, multiple rectangular ventilation grooves are arranged in the outer wall side of three groups of cooling plate.

[0009] Preferably, the outer wall side of the cooling tank is fixedly installed with a cooling fan, and the bottom of the cooling tank is fixedly installed with three semiconductor refrigeration pieces.

[0010] Preferably, the bottom of the cooling tank is fixedly communicated with a connecting pipe, and the output end of the connecting pipe is fixedly communicated with a water pump.

[0011] Preferably, the output end of the water pump is fixedly communicated with a conveying pipe, and the outer wall side of the liquid storage tank is fixedly communicated with the output end of the conveying pipe, and the outer wall side of the cooling tank is provided with multiple ventilation holes.

[0012] Preferably, the outer wall side of the cooling tank is fixedly installed with a mounting bracket, and the inner surface wall of the mounting bracket is provided with two sliding grooves.

[0013] Preferably, a dust screen is slidingly embedded between the inner surface walls of the two sliding grooves, and the outer wall side of the dust screen is provided with a limiting hole.

[0014] Preferably, a limiting rod is movably inserted into the inner surface wall of the mounting bracket, and the outer wall of the limiting rod is movably inserted into the limiting hole, and a return spring is movably sleeved on the outer wall of the limiting rod.

[0015] Compared with the prior art, the utility model has the advantages and positive effects that,

[0016] 1、In the utility model, through the interaction of each component of the device, the evaporation end of the copper pipe body is placed in the liquid storage tank, ensuring that the copper pipe body is completely immersed in cooling water, thereby significantly improving the heat exchange efficiency, and the cooling assembly can efficiently cool the cooling water that absorbs heat, and the circulation of the cooling water is realized by the circulation pump, which ensures the efficient heat-conducting performance of the heat-conducting copper pipe, effectively removes the heat generated by the processor even in summer or high-performance workstations, game computers and other high-intensity application scenarios, and provides stable cooling support for hardware through continuous cooling water circulation, ensuring that the hardware performance is maintained and stably operated.

[0017] 2. In this utility model, through the interaction of the various components of the device, the dustproof net can effectively block dust and impurities from entering the cooling box, protect the internal components from contamination, and the dustproof net is easy to disassemble, thus improving maintenance efficiency. Attached Figure Description

[0018] Figure 1 This utility model provides a perspective view of the main structure of a high-efficiency heat-conducting copper pipe in a computer heat sink.

[0019] Figure 2 This utility model provides a bottom-view three-dimensional exploded view of a portion of the structure of a high-efficiency heat-conducting copper pipe in a computer heat sink.

[0020] Figure 3 This utility model provides a three-dimensional exploded view of a portion of the structure of a high-efficiency heat-conducting copper pipe in a computer heat sink.

[0021] Figure 4 This utility model presents a partial sectional perspective view of the structure of a high-efficiency heat-conducting copper pipe in a computer heat sink.

[0022] Legend: 1. Copper tube body; 2. Heat spreader; 3. Liquid storage tank; 4. Temperature sensor; 5. Water outlet; 6. Cooling tank; 7. Baffle; 8. Cooling plate; 9. Drip hole; 10. Rectangular ventilation slot; 11. Cooling fan; 12. Semiconductor cooling chip; 13. Connecting pipe; 14. Circulating pump; 15. Delivery pipe; 16. Ventilation hole; 17. Mounting bracket; 18. Slide groove; 19. Dustproof net; 20. Limiting hole; 21. Limiting rod; 22. Return spring. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0024] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0025] Example 1, as shown in the attached document Figure 1 -Appendix Figure 4As shown, the utility model provides a technical scheme: a kind of efficient heat conduction copper pipe of computer radiator, including a group of copper pipe body 1, a group of copper pipe body 1 between the outer wall of setting equalizing plate 2, a group of copper pipe body 1 between the outer wall of fixedly sleeved with liquid storage tank 3, the inner wall of temperature sensor 4 is fixedly installed in liquid storage tank 3, the bottom of liquid storage tank 3 is equipped with three groups of water outlet hole 5, the bottom of liquid storage tank 3 is fixedly communicated with cooling tank 6, the inner wall of cooling tank 6 is fixedly connected with two baffle 7, the outer wall between two baffle 7 is fixedly connected with three groups of cooling plate 8, the top of three groups of cooling plate 8 is all equipped with multiple drip holes 9, the outer wall side of three groups of cooling plate 8 is all equipped with multiple rectangular ventilation flue 10, the outer wall side of cooling tank 6 is fixedly installed with cooling fan 11, the bottom of cooling tank 6 is fixedly installed with three semiconductor refrigeration pieces 12, the bottom of cooling tank 6 is fixedly communicated with connecting pipe 13, the output of connecting pipe 13 is fixedly communicated with circulating pump 14, the output of circulating pump 14 is fixedly communicated with delivery pipe 15, and the outer wall side of liquid storage tank 3 and the output of delivery pipe 15 are fixedly communicated, the outer wall side of cooling tank 6 is equipped with multiple ventilation holes 16,

[0026] The effect achieved by the whole embodiment 1 is that during use, the evaporation end of a group of copper pipe bodies 1 is arranged inside the liquid storage tank 3, so that the copper pipe body 1 completely immersed in the cooling water can more effectively perform heat exchange, in the process, the copper pipe body 1 significantly improves the heat dissipation efficiency, thereby ensuring the stable operation of the computer system and effectively reducing the working temperature, and a large amount of heat absorbed by the cooling water is then slowly dripped into the cooling tank 6 through the three groups of water outlet holes 5, and continues to be cooled there, in the cooling tank 6, the three groups of cooling plates 8 meet the dripping cooling water with their top densely covered with multiple groups of water dripping holes 9, and the cooling plates 8 are carefully made of copper material with excellent heat conduction performance, so that in the process of the cooling water dripping and contacting the cooling plate 8, the cooling plate 8 can efficiently absorb and disperse the heat in the cooling water, at the same time, the start of the cooling fan 11 brings air circulation to the inside of the cooling tank 6, the external cold air not only exchanges heat with the dripping cooling water, but also further increases the heat dissipation area of the cooling plate 8 through the multiple rectangular ventilation grooves 10 opened on one side of the outer wall of the three groups of cooling plates 8, the design of the rectangular ventilation grooves 10 enables the cold air to flow smoothly inside the cooling plate 8, providing additional cooling effect for the cooling plate 8 to ensure that it can continuously and effectively dissipate heat for the cooling water, then, the sufficiently cooled cooling water continues to drip to the bottom of the cooling tank 6 under the action of gravity, at this time, the cooling water after cooling can be pumped back to the liquid storage tank 3 by starting the circulating pump 14 to perform a new round of circulating cooling process, in the hot summer weather or in the scene of heavy use of the computer, if the above cooling process cannot sufficiently reduce the temperature of the cooling water, three semiconductor refrigeration pieces 12 can be used to reduce the temperature of the bottom of the cooling tank 6, the bottom of the cooling tank 6 is made of high-thermal-conductivity copper material, which can effectively conduct the cold produced by the semiconductor refrigeration piece 12 to rapidly cool the cooling water.

[0027] As shown in embodiment 2, Figures 2-4 the outer wall of the cooling tank 6 is fixedly installed with a mounting bracket 17, two sliding grooves 18 are opened on the inner surface wall of the mounting bracket 17, a dust screen 19 is slidingly embedded between the inner surface walls of the two sliding grooves 18, a limiting hole 20 is opened on the outer wall of the dust screen 19, a limiting rod 21 is movably inserted into the inner surface wall of the mounting bracket 17, and the outer surface wall of the limiting rod 21 is movably inserted into the limiting hole 20, and a return spring 22 is movably sleeved on the outer surface wall of the limiting rod 21.

[0028] The effect achieved by the whole embodiment 2 is that: in use, when the heat dissipation assembly performs the heat dissipation task, the external cold air can smoothly enter the inside of the cooling box 6 through the multiple groups of ventilation holes 16, at this time, the dust screen 19 can effectively block the dust and impurities from entering the cooling box 6, and protect the internal components from being contaminated, when it is necessary to clean or replace the dust screen 19, the user only needs to slide one end of the limiting rod 21 out of the corresponding limiting hole 20, so as to release the fixing of the dust screen 19, this way simplifies the disassembly and assembly process, and improves the maintenance efficiency, in addition, in the use process of the dust screen 19, the reset spring 22 provides the limiting rod 21 with reliable elastic restoring force, so as to ensure that the limiting rod 21 can stably remain in the limiting hole 20 when it is not subjected to external force, thereby effectively preventing the dust screen 19 from accidentally falling off or shifting during use.

[0029] The working principle of the whole device is as follows: in use, first, the signal output end of the sensor assembly is connected with the signal receiving end of the computer to ensure correct data transmission, then, an appropriate amount of cooling water is injected into the liquid storage tank 3, and the heat conduction end of the vapor chamber 2 is tightly connected with the heat generating end of the computer processor, since the evaporation end of the copper pipe body 1 is arranged inside the liquid storage tank 3, the copper pipe body 1 fully immersed in the cooling water can more effectively perform heat exchange, thereby significantly improving the heat dissipation efficiency, in the cooling water circulation process, the cooling water absorbing heat slowly drips into the cooling tank 6 through the three groups of water outlet holes 5, then continues to penetrate downward through the groups of water dripping holes 9 on the top of the three groups of cooling plates 8, in this process, the cooling plates 8 can effectively absorb and disperse the heat released when the cooling water drips, at the same time, the cooling fan 11 is started, the airflow generated by the cooling fan 11 forms stable air circulation inside the cooling tank 6, the external cold air not only exchanges heat with the cooling water dripping, but also flows in the groups of rectangular ventilation grooves 10, thereby providing additional cooling effect for the cooling plates 8, ensuring that the cooling plates 8 can continuously and effectively dissipate heat for the cooling water, then, the cooled cooling water drips to the bottom of the cooling tank 6 under the action of gravity, the circulating pump 14 is started, and the cooled cooling water can be pumped back to the liquid storage tank 3 to perform the next round of circulation heat dissipation, in addition, the temperature sensor 4 can monitor the temperature of the cooling water inside the liquid storage tank 3 in real time, when the weather is hot in summer or the computer is heavily used to increase the heat dissipation demand, if the above heat dissipation treatment still cannot sufficiently reduce the temperature of the cooling water, the three semiconductor refrigeration pieces 12 can be started to further reduce the temperature at the bottom of the cooling tank 6, thereby rapidly cooling the cooling water, in the ventilation process of the cooling tank 6, the external cold air enters through the groups of ventilation holes 16, at this time, the dust screen 19 can effectively prevent dust and impurities from entering the inside of the cooling tank 6, by pulling the limiting rod 21, one end of the limiting rod 21 slides out of the corresponding limiting hole 20, the fixing of the dust screen 19 can be easily released, and the dust screen 19 can be quickly disassembled and assembled, at the same time, the reset spring 22 provides stable elastic restoring force for the limiting rod 21, thereby effectively preventing the limiting rod 21 from being accidentally removed from the limiting hole 20, and ensuring the stability and reliability of the dust screen 19 in use.

[0030] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application in other forms, any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still belongs to the protection scope of the technical scheme of the present application.

Claims

1. A high-efficiency heat-conducting copper pipe for a computer heat sink, characterized in that: The system includes a set of copper pipe bodies (1), a heat spreader (2) is provided between the outer walls of the set of copper pipe bodies (1), a liquid storage tank (3) is fixedly sleeved between the outer walls of the set of copper pipe bodies (1), a temperature sensor (4) is fixedly installed on the inner wall of the liquid storage tank (3), three sets of water outlet holes (5) are opened at the bottom of the liquid storage tank (3), a cooling tank (6) is fixedly connected to the bottom of the liquid storage tank (3), two partitions (7) are fixedly connected to the inner wall of the cooling tank (6), three sets of cooling plates (8) are fixedly connected between the outer walls of the two partitions (7), multiple sets of drip holes (9) are opened at the top of the three sets of cooling plates (8), and multiple rectangular ventilation slots (10) are opened on one side of the outer wall of the three sets of cooling plates (8).

2. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 1, characterized in that: A cooling fan (11) is fixedly installed on one side of the outer wall of the cooling box (6), and three semiconductor cooling chips (12) are fixedly installed at the bottom of the cooling box (6).

3. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 2, characterized in that: The bottom of the cooling box (6) is fixedly connected to a connecting pipe (13), and the output end of the connecting pipe (13) is fixedly connected to a water pump (14).

4. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 3, characterized in that: The output end of the water pump (14) is fixedly connected to the delivery pipe (15), and one side of the outer wall of the liquid storage tank (3) is fixedly connected to the output end of the delivery pipe (15). Multiple sets of ventilation holes (16) are opened on one side of the outer wall of the cooling tank (6).

5. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 4, characterized in that: A mounting bracket (17) is fixedly installed on one side of the outer wall of the cooling box (6), and two sliding grooves (18) are opened on the inner surface of the mounting bracket (17).

6. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 5, characterized in that: A dustproof net (19) is slidably embedded between the inner walls of the two grooves (18), and a limiting hole (20) is opened on one side of the outer wall of the dustproof net (19).

7. The high-efficiency heat-conducting copper pipe of a computer heat sink according to claim 6, characterized in that: The inner surface of the mounting bracket (17) is movably inserted with a limiting rod (21), and the outer surface of the limiting rod (21) is movably inserted into the limiting hole (20). The outer surface of the limiting rod (21) is movably sleeved with a return spring (22).

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