Semiconductor cleaning device

Abstract

The utility model discloses a semiconductor cleaning device which comprises a cleaning barrel, a blow-off pipe is installed on one side of the bottom of the cleaning barrel, a servo motor is installed in the center of the bottom face of the cleaning barrel, an installation frame is fixedly installed at the tail end of an output shaft of the servo motor, and a bottom positioning groove is formed in the bottom face of the inner side of the installation frame. Supporting wheels are rotatably mounted on the bottom face of the outer side of the mounting frame, a rail window is formed in the side wall of the mounting frame, a locking bolt is mounted in the rail window, a locking nut is mounted at one end of the locking bolt, the other end of the locking bolt is fixedly connected with the side face of a locking plate, and the locking plate is arranged in the mounting frame. And locking grooves are formed in the top surface and the bottom surface of the locking plate. According to the semiconductor cleaning device, the novel structural design is adopted, wafers of different sizes can be stably fixed, the positioning mechanism can stably rotate and cooperate with the flushing mechanism, comprehensive cleaning of the wafers is achieved, meanwhile, soaking cleaning can be conducted, and the cleaning effect is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, concretely is semiconductor cleaning device. BACKGROUND

[0002] The main purpose of semiconductor cleaning is to remove various contaminants on the wafer surface, maintain the cleanliness and electrical properties of the wafer surface, and ensure that subsequent processes such as photolithography, ion implantation, and deposition can be performed on a clean surface. The principle mainly includes physical cleaning and chemical cleaning.

[0003] The existing semiconductor cleaning device can only clean a small amount of wafers at a time, and the cleaning efficiency is low. It only has a single way of flushing or soaking, and cannot perform multi-angle cleaning of the wafers, resulting in poor cleaning effect. Therefore, a semiconductor cleaning device needs to be designed to solve the above problems. SUMMARY

[0004] The utility model discloses a semiconductor cleaning device to solve the above-mentioned background art that the existing semiconductor cleaning device can only clean a small amount of wafers at a time, and the cleaning efficiency is low. It only has a single way of flushing or soaking, and cannot perform multi-angle cleaning of the wafers, resulting in poor cleaning effect.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a semiconductor cleaning device, comprising a cleaning barrel, a sewage pipe is installed on one side of the bottom of the cleaning barrel, a servo motor is installed at the center of the bottom surface of the cleaning barrel, an installation frame is fixedly installed at the end of the output shaft of the servo motor, a bottom positioning groove is formed in the inner bottom surface of the installation frame, a supporting wheel is rotatably installed on the outer bottom surface of the installation frame, a track window is formed in the side wall of the installation frame, a locking bolt is installed in the track window, a locking nut is installed at one end of the locking bolt, the other end of the locking bolt is connected and fixed with the side surface of a locking plate, the locking plate is arranged in the installation frame, locking grooves are formed in the top surface and the bottom surface of the locking plate, a clamping plate is installed on the top of the side wall of the cleaning barrel, a positioning bolt is threadedly installed at the end of the clamping plate outside the cleaning barrel, the end of the positioning bolt is connected with a positioning hole, the positioning hole is formed in the top of the outer wall of the cleaning barrel, a flushing pipe is fixedly installed on the surface of the clamping plate inside the cleaning barrel, and a spray head is installed on the flushing pipe.

[0006] Preferably, the side view shape of the installation frame is a "n" shape, and supporting wheels are installed at equal intervals on the bottom of the outer wall of the installation frame.

[0007] Preferably, the locking bolt is connected with the track window in a sliding manner, the front view shape of the track window is a "U" shape, and the locking bolts are symmetrically distributed about the center of the locking plate.

[0008] Preferably, the locking slots are symmetrically distributed about the center of the locking plate, the overall front view of the locking plate and the locking slots is in the shape of "H", the side of the locking plate is attached to the inner wall of the mounting frame, and the center of the locking slots is in the same vertical plane as the center of the bottom positioning slot.

[0009] Preferably, the front view of the clamping plate is in the shape of an inverted "J", and the top view of the clamping plate is in the shape of a sector.

[0010] Preferably, the center of the clamping plate, the positioning bolt, the positioning hole and the flushing pipe are in the same vertical plane, the positioning holes are equally angularly distributed on the top of the outer wall of the cleaning barrel about the center of the cleaning barrel, and the flushing pipe is provided with spray heads at equal intervals.

[0011] Compared with the prior art, the semiconductor cleaning device has the beneficial effects that: the novel structure design can stably fix different sizes of wafers, the positioning mechanism can stably rotate, the flushing mechanism is matched, the overall cleaning of the wafers is realized, soaking cleaning can also be performed, and the cleaning effect is guaranteed.

[0012] 1. The locking slots on the locking plate are matched with the mounting frame and the bottom positioning slot, so that multiple wafers can be vertically positioned, the servo motor can stably drive the mounting frame to rotate with the wafers, the flushing angle can be changed, and the cleaning effect is improved.

[0013] 2. The clamping plate, the positioning bolt and the positioning hole can be used to install multiple groups of flushing pipes and spray heads, the flushing effect on the wafers is guaranteed by matching the rotating mounting frame, and the wafers can be soaked and cleaned by quickly accumulating cleaning liquid in the cleaning barrel. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view structural schematic diagram of the utility model;

[0015] Figure 2 It is a front view structural schematic diagram of the utility model;

[0016] Figure 3 It is a side view structural schematic diagram of the utility model;

[0017] Figure 4 It is a top view structural schematic diagram of the utility model.

[0018] In the drawing: 1, cleaning barrel; 2, sewage pipe; 3, servo motor; 4, mounting frame; 5, bottom positioning slot; 6, supporting wheel; 7, track window; 8, locking bolt; 9, locking nut; 10, locking plate; 11, locking slot; 12, clamping plate; 13, positioning bolt; 14, positioning hole; 15, flushing pipe; 16, spray head. DETAILED DESCRIPTION

[0019] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, apparently, the described embodiment is only a part of the embodiment of the utility model, and is not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of protection of the utility model.

[0020] Please refer to Figures 1-4 The utility model provides a technical scheme: semiconductor cleaning device, including cleaning bucket 1, blow -off pipe 2, servo motor 3, installation frame 4, bottom positioning groove 5, support wheel 6, track window 7, locking bolt 8, locking nut 9, locking plate 10, locking groove 11, clamping plate 12, positioning bolt 13, positioning hole 14, flush pipe 15 and spray head 16, cleaning bucket 1 bottom one side is installed blow -off pipe 2, and the bottom surface center of cleaning bucket 1 is installed servo motor 3, and the output shaft end of servo motor 3 is fixedly installed installation frame 4, and the bottom surface of the inboard of installation frame 4 is provided with bottom positioning groove 5, and the bottom surface of the outboard of installation frame 4 is rotatably installed support wheel 6, and the side wall of installation frame 4 is provided with track window 7, and track window 7 is installed locking bolt 8, and locking bolt 8 one end is installed locking nut 9, and locking bolt 8 other end is connected with locking plate 10 side fixedly, and locking plate 10 sets up in installation frame 4, and locking plate 10 top surface and bottom surface are provided with locking groove 11, and the top of the side wall of cleaning bucket 1 is installed clamping plate 12, and the end of clamping plate 12 on the outside of cleaning bucket 1 is screw-mounted positioning bolt 13, and positioning bolt 13 end is connected with positioning hole 14, and positioning hole 14 is set up in the top of the outer wall of cleaning bucket 1, and the surface of clamping plate 12 on the inside of cleaning bucket 1 is fixedly installed flush pipe 15, and flush pipe 15 is installed spray head 16.

[0021] The side view shape of the installation frame 4 of the example is "N" type, and the support wheels 6 are installed at equal intervals on the bottom of the outer wall of the installation frame 4. The above structure design enables the inside structure of the installation frame 4 to be stably installed, and the installation frame 4 can stably rotate under the support of the support wheels 6.

[0022] The locking bolt 8 and the track window 7 are in sliding connection, the front view shape of the track window 7 is "U" type, and the locking bolt 8 is symmetrically distributed about the center of the locking plate 10. The above structure design enables the locking plate 10 to be conveniently disassembled and installed and the working height to be adjusted through the locking bolt 8 and the track window 7.

[0023] Locking slots 11 are symmetrically distributed on the center of locking plate 10, the overall front view of locking plate 10 and locking slots 11 is "H" shape, the side of locking plate 10 is in contact with the inner wall of mounting frame 4, and the center of locking slots 11 is in the same vertical plane as the center of bottom positioning groove 5. The above structure design enables bottom positioning groove 5 and locking slots 11 to stably and vertically position the wafer and stably mount it in the inner side of mounting frame 4.

[0024] The front view of clamping plate 12 is an inverted "J" shape, and the top view of clamping plate 12 is a fan shape. The above structure design enables clamping plate 12 to stably contact the top of cleaning barrel 1.

[0025] The center of clamping plate 12, positioning bolt 13, positioning hole 14 and flushing pipe 15 is in the same vertical plane, and positioning hole 14 is symmetrically distributed on the top of the outer wall of cleaning barrel 1. Nozzle 16 is installed at equal intervals on flushing pipe 15. The above structure design enables clamping plate 12 and flushing pipe 15 to be stably and multi-point installed.

[0026] When using the device, according to the cleaning requirements, a proper number of clamping plates 12 and flushing pipes 15 are taken out, clamping plate 12 is clamped and installed on the top of cleaning barrel 1, positioning bolt 13 is aligned with positioning hole 14, positioning bolt 13 is rotationally connected with positioning hole 14, and the positions of clamping plate 12 and flushing pipe 15 are locked.

[0027] Then all the locking plates 10 are moved up, the locking plates 10 with locking bolts 8 slide off from the top of track window 7, the wafers are clamped into bottom positioning groove 5, rubber protective pads are installed on the inner walls of bottom positioning groove 5 and locking slots 11 to avoid damaging the wafers, then locking bolts 8 at the ends of locking plates 10 are slid into track window 7, the locking plates 10 are pushed down, the locking slots 11 on the bottom surface of locking plates 10 are in contact with the top of the wafers to limit the wafers, then new wafers are clamped into the locking slots 11 on the top surface of locking plates 10, and so on. New locking plates 10 are installed from the top again, after the wafers are placed, locking nuts 9 are rotated to press the outer wall of mounting frame 4 and the locking plates 10 to be in contact and fixed, and the positions of locking plates 10 and wafers are fixed.

[0028] The external cleaning pump connected with flushing pipe 15 is started to spray cleaning liquid to the wafers through nozzle 16 to flush the wafers, and at the same time, servo motor 3 is controlled to drive mounting frame 4 to stably rotate, so that the wafers are fully flushed. The sewage pipe 2 can also be closed to accumulate cleaning liquid in cleaning barrel 1 to soak and clean the wafers. After cleaning, the sewage pipe 2 is opened to discharge sewage, and then the locking plates 10 and wafers are disassembled in turn. This is the working principle of the semiconductor cleaning device.

[0029] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor cleaning apparatus, comprising a cleaning tank (1), characterized in that: One side of the bottom of the cleaning bucket (1) is provided with a sewage discharge pipe (2). The center of the bottom surface of the cleaning bucket (1) is provided with a servo motor (3). The end of the output shaft of the servo motor (3) is fixedly installed with a mounting frame (4). A bottom positioning groove (5) is formed on the inner bottom surface of the mounting frame (4). A support wheel (6) is rotatably installed on the outer bottom surface of the mounting frame (4). A track window (7) is formed on the side wall of the mounting frame (4). A locking bolt (8) is installed in the track window (7). One end of the locking bolt (8) is installed with a locking nut (9). The other end of the locking bolt (8) is fixedly connected to the side surface of a locking plate (10). The locking plate (10) is arranged inside the mounting frame (4). Locking grooves (11) are formed on the top and bottom surfaces of the locking plate (10). The top of the side wall of the cleaning bucket (1) is provided with a clamping plate (12). A positioning bolt (13) is threadedly installed at the end of the clamping plate (12) located outside the cleaning bucket (1). The end of the positioning bolt (13) is connected to a positioning hole (14). The positioning hole (14) is formed at the top of the outer wall of the cleaning bucket (1). A flushing pipe (15) is fixedly installed on the surface of the clamping plate (12) located inside the cleaning bucket (1). Sprayers (16) are installed on the flushing pipe (15).

2. The semiconductor cleaning apparatus according to claim 1, characterized in that: The side view shape of the mounting frame (4) is "U" shaped, and support wheels (6) are equidistantly installed at the bottom of the outer wall of the mounting frame (4).

3. The semiconductor cleaning apparatus according to claim 1, characterized in that: The locking bolt (8) is slidably connected to the track window (7). The front view shape of the track window (7) is "U" shaped, and the locking bolts (8) are symmetrically distributed about the center of the locking plate (10).

4. The semiconductor cleaning apparatus according to claim 1, characterized in that: The locking grooves (11) are symmetrically distributed up and down about the center of the locking plate (10). The front view sectional shape of the whole locking plate (10) and the locking grooves (11) is "H" shaped. The side surface of the locking plate (10) is fitted to the inner side wall of the mounting frame (4). The centers of the locking grooves (11) and the bottom positioning groove (5) are on the same vertical plane.

5. The semiconductor cleaning apparatus according to claim 1, characterized in that: The front view shape of the clamping plate (12) is an inverted "J" shape, and the top view shape of the clamping plate (12) is a sector shape.

6. The semiconductor cleaning apparatus according to claim 1, characterized in that: The centers of the clamping plate (12), the positioning bolt (13), the positioning hole (14), and the flushing pipe (15) are on the same vertical plane. The positioning holes (14) are equiangularly distributed about the center of the cleaning bucket (1) at the top of the outer wall of the cleaning bucket (1). Sprayers (16) are equidistantly installed on the flushing pipe (15).

Images