Buffering equipment capable of carrying wafer box

Abstract

The utility model relates to temporary storage equipment capable of carrying wafer cassettes, which can keep the wafer cassettes stable in the carrying process and comprises a machine table, a lifting module, a first swinging module, a second swinging module and a clamping mechanism, wherein the lifting module and the first swinging module are used for driving the clamping mechanism to move so as to pick up or release a wafer box; the second swing module is used for enabling the clamping mechanism to reversely rotate relative to the swing arm of the first swing module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor conveying equipment, in particular to a wafer box conveying buffer device. BACKGROUND

[0002] In the related art, an aerial transport vehicle is used to convey a wafer box to a loading and unloading port of a wafer processing device for loading.

[0003] Since the aerial transport vehicle has a long stroke, a buffer device is added between the aerial transport vehicle and the loading and unloading port to save loading time. The aerial transport vehicle first places the wafer box on the buffer device, and then the buffer device conveys the wafer box to the loading and unloading port for loading, so as to save the waiting time of the aerial transport vehicle and improve the production efficiency.

[0004] The precision requirement of the wafer is high. Therefore, during the conveying process of the wafer box by the buffer device, the wafer box needs to be kept stable to avoid shaking and affecting the precision of the wafer. How to stably convey the wafer box is a problem that has been concerned in the field. CONTENT OF THE INVENTION

[0005] Therefore, it is necessary to provide a wafer box conveying buffer device to solve the problem of how to stably convey the wafer box.

[0006] According to an aspect of the present application, a wafer box conveying buffer device is provided to convey a wafer box to a wafer processing device, comprising: a machine table provided with a table module for placing a wafer box; a lifting module provided on the machine table, the lifting module comprising a lifting plate and a lifting driving assembly for driving the lifting plate to lift; a first swing module, the first swing module comprising a first swing driving assembly provided on the lifting plate and a swing arm, the bottom end of the swing arm being in transmission connection with the first swing driving assembly and being able to swing relative to the machine table under the driving of the first swing driving assembly; a second swing module provided on the swing arm, the second swing module comprising a second swing driving assembly; and a clamping mechanism, the clamping mechanism being rotatably provided at the top end of the swing arm, the clamping mechanism comprising a clamping driving assembly and a clamping jaw driven to open and close by the clamping driving assembly, the clamping mechanism being able to rotate reversely relative to the swing arm under the driving of the second swing driving assembly.

[0007] In some embodiments, the machine table comprises a base and a protective cover, the table module is provided on the top of the base, the protective cover is provided outside the table module, the top of the protective cover and one side of the protective cover in the swing direction of the swing arm are respectively provided with openings; the top end of the swing arm and the clamping mechanism are located in the protective cover; the top of the protective cover is provided with a detector, and the detector is used to detect whether the aerial transport vehicle is located in the protective cover.

[0008] In some embodiments, the lifting module further comprises a mounting plate fixed to the machine table, and the lifting plate and the lifting driving assembly are arranged on the mounting plate.

[0009] In some embodiments, in the lifting direction of the lifting plate, the mounting plate is sequentially provided with an upper limit sensor, a first origin sensor, a first arrival sensor and a lower limit sensor from top to bottom, the upper limit sensor and the lower limit sensor are used to indicate the upper and lower limit positions of the lifting plate; the lifting module, the first swing driving assembly, the second swing driving assembly and the clamping driving assembly are configured to: when picking up the wafer box from the table module, the first swing driving assembly controls the swing arm to rotate by a first angle when the first origin sensor is triggered by the lifting plate rising, the second swing driving assembly controls the clamping mechanism to rotate reversely by the first angle; when the first arrival sensor is triggered, the clamping mechanism performs the action of picking up the wafer box.

[0010] In some embodiments, the lifting plate is provided with a second origin sensor and a second arrival sensor; the second origin sensor is used to indicate the swing initial position of the swing arm; the lifting module, the first swing driving assembly, the second swing driving assembly and the clamping driving assembly are further configured to: when providing the wafer box to the wafer processing equipment, the second swing driving assembly controls the clamping mechanism to rotate reversely by a second angle when the second arrival sensor is triggered by the first swing driving assembly controlling the swing arm to rotate by the second angle, the first swing driving assembly controls the swing arm to stop swinging and the lifting module controls the lifting plate to descend; when the first arrival sensor is triggered by the lifting plate descending, the clamping mechanism performs the action of releasing the wafer box.

[0011] In some embodiments, the lifting driving assembly comprises a lead screw, a sliding rail, a lifting servo motor and a lifting speed reducer, all fixed to the mounting plate, the lead screw is rotatably connected to the mounting plate, and the lifting speed reducer is drivingly connected to the lifting servo motor and the lead screw; the lifting plate is slidingly connected to the sliding rail, and the lifting plate is connected with a lead screw nut, the lead screw nut is sleeved on the lead screw and can be lifted and lowered under the driving of the lead screw.

[0012] In some embodiments, the first swing driving assembly comprises a first swing motor and a first swing reducer mounted on the lifting plate, the first swing reducer is drivingly connected with the first swing motor and the swing arm, wherein the swing arm is fixed on an output shaft of the first swing reducer; and / or, the second swing module comprises a second swing motor, a second swing reducer, a connecting arm, the second swing reducer is drivingly connected with the second swing motor and the connecting arm, the connecting arm is fixed on an output shaft of the second swing reducer; the clamping mechanism is connected to the connecting arm.

[0013] In some embodiments, the output rotation speed of the first swing module and the second swing module is the same, so that the rotation speed of the swing arm and the clamping mechanism is the same.

[0014] In some embodiments, an inclination sensor is mounted on the second swing module, the inclination sensor is used to detect the angle of the clamping mechanism relative to the horizontal plane, and the second swing module is further configured to: control the rotation of the clamping mechanism according to the detection result of the inclination sensor, so that the clamping mechanism is kept in a horizontal state.

[0015] In some embodiments, a first sensor is arranged on the clamping driving assembly, a second sensor and a third sensor are arranged on the clamping jaw, the first sensor is used to detect the opening and closing state of the clamping jaw; the second sensor is used to detect whether the clamping jaw clamps a wafer box; and the third sensor is used to detect whether the wafer box is at a predetermined position.

[0016] The above-mentioned wafer box storage device, the lifting module and the first swing module are used to drive the clamping mechanism to move in the vertical direction and the horizontal direction, so that the clamping mechanism can pick up a wafer box or place a picked-up wafer box to the upper and lower loading ports of the table module or the wafer processing device. The second swing module is used to make the clamping mechanism rotate reversely relative to the swing arm, so that the angle of the clamping mechanism relative to the horizontal plane in space is unchanged, thereby keeping the wafer box stable during the wafer box carrying process. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A perspective view of a wafer box storage device according to an embodiment of the present application is provided.

[0018] Figure 2 A perspective view of a wafer box storage device according to an embodiment of the present application is provided. Figure 1 A perspective view of a wafer box storage device according to an embodiment of the present application is provided.

[0019] Figure 3 A perspective view of a wafer box storage device according to an embodiment of the present application is provided. Figure 1 A perspective view of a wafer box storage device according to an embodiment of the present application is provided.

[0020] Figure 4An isometric view of the lift module of an embodiment of the present application.

[0021] Figure 5 A lower axonometric view of the lift module of an embodiment of the present application.

[0022] Figure 6 A schematic view of the connection of the second swing module and the clamping mechanism to the swing arm of an embodiment of the present application.

[0023] Figure 7 A front view of the first swing module of an embodiment of the present application, with the lift plate hidden.

[0024] Figure 8 A schematic view of the clamping mechanism when it is above the wafer cassette.

[0025] Figure 9 A front view of the loading state of the buffer device for carrying the wafer cassette provided by an embodiment of the present application.

[0026] Figure 10 An isometric view of the clamping mechanism of an embodiment of the present application.

[0027] Figure 11 A lower axonometric view of the clamping mechanism.

[0028] BRIEF DESCRIPTION OF THE DRAWINGS

[0029] 100, cache device; 10, machine table; 110, base; 120, shield; 121, probe; 130, table module; 131, pressing sensor; 140, left mechanical limit; 150, right mechanical limit; 20, lifting module; 210, lifting plate; 211, screw nut; 212, second origin sensor; 213, second arrival sensor; 220, lifting drive assembly; 221, screw rod; 222, slide rail; 223, lifting motor; 224, lifting speed reducer; 225, synchronous belt; 230, mounting plate; 231, upper limit sensor; 232, first origin sensor; 233, first arrival sensor; 234, lower limit sensor; 240, upper mechanical limit; 250, lower mechanical limit; 30, first swing module; 310, first swing drive assembly; 311, first swing motor; 312, first swing speed reducer; 313, flange; 320, swing arm; 330, inclination sensor; 40, second swing module; 410, second swing motor; 420, second swing speed reducer; 430, connecting arm; 50, clamping mechanism; 510, clamping drive assembly; 520, clamping jaw; 521, first clamping jaw; 522, second clamping jaw; 523, guide groove; 5231, guide surface; 524, limiting structure; 530, first sensor; 540, second sensor; 550, third sensor; 200, wafer box; 201, extraction part; 2011, neck part; 2012, ear part. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application.

[0031] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0032] In addition, the terms "first", "second", and the like, if any, are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or identifying the number of the indicated technical features. Thus, a feature defined with "first" or "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0033] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0035] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.

[0036] Reference Figures 1 to 11The present application provides a wafer box transfer device 100, which can be used to transfer wafer boxes 200 and realize the exchange of wafer boxes 200 between an aerial transport vehicle and a wafer processing device (not shown). The wafer processing device does not have a specific process. For the sake of simplicity, the action of the wafer box transfer device 100 transferring the wafer box 200 from the wafer box transfer device 100 to the loading and unloading port of the wafer processing device is called loading, and the loading process includes taking the wafer box 200 from the wafer box transfer device 100 and placing the wafer box 200 to the loading and unloading port. The action of the wafer box transfer device 100 transferring the wafer box 200 from the loading and unloading port of the wafer processing device to the wafer box transfer device 100 is called unloading, and the unloading process includes taking the wafer box 200 from the loading and unloading port and placing the wafer box 200 to the wafer box transfer device 100. Further, in other embodiments, the transfer device of the present application is not limited to transferring wafer boxes 200, but can also transfer any object to be transferred.

[0037] The following describes the technical solutions provided by the embodiments of the present application by taking the wafer box 200 as an example.

[0038] In the present application, as shown in Figure 1 X, Y, and Z directions represent three perpendicular directions. Specifically, X and Y are horizontal directions, and Z is the vertical direction, which is also the height direction of the wafer box transfer device 100. At the same time, when referring to the movement of an element in a certain direction, if no specific description is given, it means that the element has the ability to move to both sides in that direction.

[0039] As shown in Figures 1 to 4 The wafer box transfer device 100 provided by an embodiment of the present application includes a machine table 10, a lifting module 20, a first swing module 30, a second swing module 40, and a clamping mechanism 50. The lifting module 20 and the first swing module 30 are used to drive the clamping mechanism 50 to move to pick up or release the wafer box 200. The second swing module 40 is used to keep the clamping mechanism 50 stable during movement. The following will be described in further detail.

[0040] The machine table 10 is the installation basis of other components. The machine table 10 is used to place the wafer box 200. When the wafer box transfer device 100 is in use, the machine table 10 is placed on one side of the wafer processing device, providing the wafer box transfer function between the aerial transport vehicle and the wafer processing device. Specifically, the machine table 10 is provided with a table module 130 for placing the wafer box 200. The machine table 10 is open at the top in the Z direction to be able to dock with the aerial transport vehicle; and open on one side in the Y direction to be able to dock with the wafer processing device. The clamping mechanism 50 can transfer the wafer box 200 on the table module 130 to the loading and unloading port of the wafer processing device, or vice versa.

[0041] As shown in Figure 4 and Figure 5As shown, the lifting module 20 is arranged on the machine table 10. The lifting module 20 includes a lifting plate 210 and a lifting driving assembly 220 configured to drive the lifting plate 210 to lift. The lifting plate 210 is capable of lifting relative to the machine table 10 in the Z direction, thereby driving the first swing module 30, the second swing module 40 and the clamping mechanism 50 to lift together. The specific type and structure of the lifting driving assembly 220 are not limited, as long as it can drive the lifting plate 210 to lift.

[0042] As shown in Figure 3 , Figure 4 , the first swing module 30 includes a first swing driving assembly 310 arranged on the lifting plate 210 and a swing arm 320. The bottom end of the swing arm 320 is in transmission connection with the first swing driving assembly 310 and is capable of swinging relative to the machine table 10 under the driving of the first swing driving assembly 310. Specifically, the swing arm 320 is capable of swinging to both sides in the Y direction.

[0043] Optionally, referring to Figure 1 and Figure 2 , the machine table 10 in the present application includes a base 110 and a shroud 120. A table module 130 is arranged on the top of the base 110. The table module 130 is configured to place a wafer box 200. The shroud 120 is arranged outside the table module 130, and the top of the shroud 120 and one side of the shroud 120 in the swing direction of the swing arm 320 are respectively provided with openings, and the top end of the swing arm 320 and the clamping mechanism 50 extend into the shroud 120.

[0044] In the present application, the bottom end of the swing arm 320 is hidden in the base 110. The top end of the swing arm 320 extends above the base 110 and is located in the shroud 120. The swing arm 320 and the table module 130 are arranged along the X direction. As shown in the placement angle shown in Figure 2 and Figure 3 , when the swing arm 320 is in the initial position, the clamping mechanism 50 is located on the left side of the table module 130 in the X direction. The swing arm 320 swings left and right in the Y direction, so that the clamping mechanism 50 changes position in the Y direction to move above or to the right of the table module 130. When the swing arm 320 swings, it can also extend out of the shroud 120 from the opening on one side of the shroud 120 (see Figure 9 ), so that the clamping mechanism 50 can place the wafer box 200 on the loading and unloading port of the wafer processing equipment or pick up the wafer box 200 from the loading and unloading port.

[0045] The second swing module 40 is arranged on the swing arm 320. The second swing module 40 is configured to drive the clamping mechanism 50 to rotate. The specific type of the second swing module 40 is not limited.

[0046] The clamping mechanism 50 is rotatably arranged at the top end of the swing arm 320. The clamping mechanism 50 is in transmission connection with the second swing module 40 and can be driven to rotate reversely with the swing arm 320 by the second swing module 40. The reverse rotation of the clamping mechanism 50 with the swing arm 320 means that the clamping mechanism 50 and the swing arm 320 rotate towards different sides in the Y direction. For example, when the swing arm 320 rotates towards the right side, the clamping mechanism 50 rotates towards the left side. In this application, when the first swing module 30 drives the swing arm 320 to swing, the control system of the buffer device 100 controls the second swing module 40 to control the clamping mechanism 50 to rotate reversely with the swing arm 320 synchronously.

[0047] As shown in Figure 2 , the clamping mechanism 50 includes a clamping driving assembly 510 and a clamping jaw 520 driven to open and close by the clamping driving assembly 510. The clamping jaw 520 includes a first clamping jaw 521 and a second clamping jaw 522, which are used to pick up or release the wafer box 200. The type of the clamping driving assembly 510 is not limited. Optionally, the clamping driving assembly 510 is an electric clamp.

[0048] The above-mentioned buffer device 100, the lifting module 20 and the first swing module 30 are used to drive the clamping mechanism 50 to move in the Y direction and the Z direction, so that the clamping mechanism 50 can pick up the wafer box 200 or place the picked wafer box 200 to the table module 130 or the loading and unloading port of the wafer processing device; or carry the wafer box 200 on the loading and unloading port to the table module 130. The second swing module 40 is used to make the clamping mechanism 50 rotate reversely relative to the swing arm 320, so that the angle of the clamping mechanism 50 relative to the horizontal plane in the space does not change, thereby keeping the wafer box 200 stable during the carrying process.

[0049] In some embodiments, referring to Figure 1 and Figure 3 , the top of the shield 120 is provided with a detector 121, which is used to detect whether the air transport vehicle is in the shield 120. In this way, when the air transport vehicle enters the shield 120 from the opening at the top of the shield 120 and places the wafer box 200 to the table module 130, the detector 121 can detect the air transport vehicle; and when the air transport vehicle leaves the buffer device 100 from the opening at the top of the shield 120, the detector 121 can also detect the air transport vehicle. Therefore, the control system can take the detection result of the detector 121 as one of the bases for controlling the first swing module 30, the second swing module 40 and the clamping mechanism 50.

[0050] The detector 121 is any type of element that can be used to detect or identify moving objects, such as an ultrasonic sensor, an infrared sensor, etc. Optionally, the detector 121 is specifically arranged on the inner side wall of the top of the shield 120.

[0051] In some embodiments, referring to Figure 2And Figure 3 The mesa module 130 is provided with a pressing sensor 131. The pressing sensor 131 is used to sense whether the wafer box 200 is placed on the mesa module 130, and then the control system can control the lifting module 20, the first swing module 30, the second swing module 40 and the clamping mechanism 50 to work according to the detection result of the pressing sensor 131.

[0052] Specifically, after the aerial transport vehicle places the wafer box 200 on the mesa module 130, the pressing sensor 131 senses the wafer box 200 and can send a signal representing the placement state of the wafer box 200 to the control system; then, when the detector 121 senses that the aerial transport vehicle leaves, the control system controls the lifting module 20, the first swing module 30, the second swing module 40 and the clamping mechanism 50 to work, and performs the loading action.

[0053] Some embodiments, with reference to Figure 4 And Figure 5 The lifting module 20 further includes a mounting plate 230 fixed to the machine table 10, and the lifting plate 210 and the lifting drive assembly 220 are arranged on the mounting plate 230. By using the mounting plate 230 as a mounting base, the mounting structure for positioning the lifting drive assembly 220 in the machine table 10 is not needed, and the structure inside the machine table 10 is simplified.

[0054] Optionally, some embodiments, with reference to Figure 4 And Figure 5 The lifting drive assembly 220 includes a lead screw 221, a sliding rail 222, a lifting motor 223 and a lifting speed reducer 224, which are all fixed to the mounting plate 230. The lead screw 221 is rotationally connected to the mounting plate 230. The lifting speed reducer 224 is drivingly connected to the lifting motor 223 and the lead screw 221. The lifting plate 210 is slidingly connected to the sliding rail 222. The lifting plate 210 is connected with a lead screw nut 211, which is sleeved on the lead screw 221 and can be lifted under the driving of the lead screw 221.

[0055] The lifting drive assembly 220 and the swing arm 320 are arranged on both sides of the mounting plate 230. The mounting plate 230 is fixed in the base 110 of the machine table 10. The axial direction of the lead screw 221 is along the Z direction. The output shaft of the lifting speed reducer 224 is connected to the lead screw 221 through a synchronous belt 225. The lifting motor 223 drives the lead screw 221 to drive the lead screw nut 211 and the lifting plate 210 to lift, and then drives the first swing module 30 and the clamping mechanism 50 to move up and down by the lifting plate 210.

[0056] Some embodiments, with reference to Figure 5The first swing driving assembly 310 includes a first swing motor 311 and a first swing speed reducer 312 mounted on the lifting plate 210. The first swing speed reducer 312 is drivingly connected to the first swing motor 311 and a swing arm 320, wherein the swing arm 320 is fixed to an output shaft of the first swing speed reducer 312.

[0057] In the embodiment, the swing arm 320 is fixed to the output shaft of the first swing speed reducer 312, and the output shaft of the first swing speed reducer 312 rotates to drive the swing arm 320 to rotate synchronously, thereby increasing the accuracy and stability of the swing arm 320. Optionally, the output shaft of the first swing speed reducer 312 is provided with a flange 313, and the flange 313 is connected to the bottom end of the swing arm 320.

[0058] In some embodiments, referring to Figures 4 to 6 As shown in the figure, the second swing module 40 includes a second swing motor 410, a second swing speed reducer 420, and a connecting arm 430. The second swing speed reducer 420 is drivingly connected to the second swing motor 410 and the connecting arm 430, and the connecting arm 430 is fixed to an output shaft of the second swing speed reducer 420. The clamping mechanism 50 is connected to the connecting arm 430.

[0059] In the embodiment, the connecting arm 430 is fixed to the output shaft of the second swing speed reducer 420, and the output shaft of the second swing speed reducer 420 rotates to drive the clamping mechanism 50 to rotate synchronously, thereby increasing the accuracy and stability of the clamping mechanism 50.

[0060] Optionally, the second swing motor 410 and the second swing speed reducer 420 are arranged on one side of the swing arm 320 in the X direction, and the connecting arm 430 is arranged on the other side of the swing arm 320 in the X direction and extends along the X direction. The connecting arm 430 is a rectangular frame structure. The clamping mechanism 50 is connected to the bottom of the connecting arm 430.

[0061] In the embodiment of the application, the output rotation speeds of the first swing module 30 and the second swing module 40 are the same, so that the rotation speeds of the swing arm 320 and the clamping mechanism 50 are the same. In this way, when the swing arm 320 rotates, the clamping mechanism 50 can rotate reversely synchronously at the same speed, thereby ensuring the balance during the handling of the wafer box 200.

[0062] Specifically, the parameters of the first swing motor 311 and the second swing motor 410 are the same, and the reduction ratios of the first swing speed reducer 312 and the second swing speed reducer 420 are the same. Therefore, the rotation speeds of the swing arm 320 and the clamping mechanism 50 can be the same.

[0063] In some embodiments, referring to Figure 5 and Figure 7As shown, in the lifting direction of the lifting plate 210, the mounting plate 230 is sequentially provided with an upper limit sensor 231, a first origin sensor 232, a first arrival sensor 233 and a lower limit sensor 234 from top to bottom, the upper limit sensor 231 and the lower limit sensor 234 are used to indicate the upper and lower limit positions of the lifting plate. The lifting module 20, the first swing driving assembly 310, the second swing driving assembly and the clamping driving assembly 510 are configured to: when the first origin sensor 232 is triggered when the lifting plate 210 is lifted to pick up the wafer box 200 from the table module 130, the first swing driving assembly 310 controls the swing arm 320 to rotate by a first angle, and the second swing driving assembly controls the clamping mechanism 50 to rotate reversely by the first angle; when the first arrival sensor 233 is triggered, the clamping mechanism 50 performs the action of picking up the wafer box 200.

[0064] As shown in FIG. 1, the first swing driving assembly 310 is arranged on the lifting plate 210, and the second swing driving assembly is arranged on the table module 130. Figure 7 As shown, in the Z direction, from top to bottom, there are an upper limit sensor 231, a lower limit sensor 234, a first origin sensor 232 and a first arrival sensor 233. It should be noted that the above-mentioned sensors can be arranged in a straight line or staggered in the Z direction.

[0065] When the upper limit sensor 231 or the lower limit sensor 234 is triggered, the control system can know that the lifting plate 210 and the swing arm 320 thereon are in the upper limit position or the lower limit position in the Z direction. Further, in the Z direction, the two sides of the lifting plate 210 are also respectively provided with an upper mechanical limit 240 and a lower mechanical limit 250 of the machine table 10. The upper mechanical limit 240 and the lower mechanical limit 250 are respectively used to physically limit the position of the lifting plate 210.

[0066] The first origin sensor 232 is used to prompt the timing of starting the swing of the swing arm 320 during the picking process. In this way, the control system can make the swing arm 320 start swinging from the same position each time, so as to accurately control its movement stroke. The first arrival sensor 233 is used to prompt the timing of starting the action of clamping the wafer box 200 by the clamping mechanism 50.

[0067] With the above-mentioned sensors, the clamping mechanism 50 can be accurately controlled to pick up the wafer box 200 from the cache device 100 of the present application, i.e. from the table module 130. Details are described below.

[0068] Referring to FIG. 1, the first swing driving assembly 310 is arranged on the lifting plate 210, and the second swing driving assembly is arranged on the table module 130. Figure 8, first of all, a wafer box 200 structure which can be used with the cache device 100 of the present application is described. The wafer box 200 is provided with an extraction part 201. The extraction part 201 includes a neck part 2011 connected to the top of the wafer box 200, and an ear part 2022 connected to the neck part 2011 and parallel to the top of the wafer box 200, the width of the ear part 2022 being greater than the width of the neck part 2011. The pair of clamping jaws 520 of the clamping mechanism 50 is used to clamp the neck part 2011 of the extraction part 201 from both sides.

[0069] As shown in Figure 1 , Figure 2 and 5 , it is the initial state of the device, the lifting plate 210 is in the lower limit position, the clamping mechanism 50 is located on the left side of the table module 130, the clamping mechanism 50 is above the wafer box 200 in the Z direction and on the left side of the wafer box 200 in the Y direction.

[0070] The process of taking materials from the cache device 100 of the present application is as follows:

[0071] Referring to Figure 5 , Figure 7 and Figure 8 , when the wafer box 200 is placed on the table module 130, the lifting drive assembly 220 drives the lifting plate 210 to rise. When the first origin sensor 232 is triggered, the control system controls the swing arm 320 to rotate the clamping mechanism 50 towards the right table module 130 by a first angle β1 through the first swing drive assembly 310. During this process, the second swing module 40 drives the clamping mechanism 50 to rotate in the opposite direction by the first angle β1, so that the clamping mechanism 50 moves smoothly to the upper left of the wafer box 200 on the table module 130 and is in a horizontal state.

[0072] Then, the lifting drive assembly 220 drives the lifting plate 210 to descend. When the first arrival sensor 233 is triggered, the pair of clamping jaws 520 of the clamping mechanism 50 is located on both sides of the extraction part 201 respectively. The control system controls the pair of clamping jaws 520 of the clamping mechanism 50 to close, thereby clamping the extraction part 201.

[0073] Then, the lifting drive assembly 220 drives the lifting plate 210 to rise back to the position where the first origin sensor 232 is triggered; during this process, when the table module 130 is provided with a pressing sensor 131, the wafer box 200 leaves the pressing sensor 131, and the pressing sensor 131 can feedback to the control system that the wafer box 200 has left the table module 130.

[0074] Further, referring to Figure 7In some embodiments, the second origin sensor 212 and the second end-of-travel sensor 213 are provided on the lifting plate 210. The second origin sensor 212 is used to indicate the initial position of the swing arm 320. The lifting module 20, the first swing drive assembly 310, the second swing drive assembly, and the clamping drive assembly 510 are further configured to: when the first swing drive assembly 310 controls the swing arm 320 to rotate by the second angle so that the second end-of-travel sensor 213 is triggered, the second swing drive assembly controls the clamping mechanism 50 to rotate reversely by the second angle, the first swing drive assembly 310 controls the swing arm 320 to stop swinging, and the lifting module 20 controls the lifting plate 210 to descend; when the lifting plate 210 descends so that the first end-of-travel sensor 233 is triggered, the clamping mechanism 50 performs the action of releasing the FOUP 200.

[0075] Optionally, referring to Figure 7 The lower end of the swing arm 320 is provided with a detection piece (not labeled) on each of the left and right sides in the Y direction. The second origin sensor 212 and the second end-of-travel sensor 213 are provided on the lifting plate 210 on the two sides of the swing arm 320. When the right detection piece triggers the second origin sensor 212, it indicates that the current position of the swing arm 320 is the origin position.

[0076] In this application, when the second origin sensor 212 is triggered, it indicates that the swing arm 320 returns to the initial position of swinging. In this way, after the equipment completes one loading and unloading, through the detection of the first origin sensor 232 and the second origin sensor 212, the swing arm 320 can return to its initial position in the Z direction and the Y direction, so as to perform the next operation. That is, after the equipment completes the operation of transporting the FOUP 200 to the wafer processing equipment, the swing arm 320 and the lifting module 20 are reset to the origin, so as to wait for the next FOUP 200.

[0077] Further, referring to Figure 7 The base 110 of the machine table 10 is provided with a left mechanical limit 140 and a right mechanical limit 150 on the two sides of the swing arm 320 in the Y direction. The left mechanical limit 140 and the right mechanical limit 150 can also be provided with limit position sensors. When the swing arm 320 rotates to the left mechanical limit 140 or the right mechanical limit 150, the edge of the swing arm 320 triggers the corresponding limit position sensor, and the control system can know that the swing arm 320 is in the limit position in the Y direction, so as to timely adjust the position of the swing arm 320 or issue an alarm.

[0078] By using the above-mentioned sensors, the loading and unloading ports of the wafer processing equipment can be accurately controlled. The unloading process is as follows:

[0079] Referring to Figure 7 and Figure 9, it is assumed that the wafer processing equipment is located on the right side of the equipment. As described above, after the clamping mechanism 50 picks up the wafer on the mesa module 130, the swing arm 320 rotates by a first angle β1 relative to its initial swing position, and the lifting plate 210 is raised to a position where the first home sensor 232 is triggered.

[0080] At this time, the control system controls the swing arm 320 to rotate by a second angle β2 towards the right side through the first swing driving assembly 310, so that the swing arm 320 moves to a position where the second position sensor 213 is triggered. During this process, the second swing module 40 drives the clamping mechanism 50 to rotate reversely by the second angle β2, so that the clamping mechanism 50 moves above the loading and unloading port of the wafer processing equipment.

[0081] Then, the first driving module drives the lifting plate 210 to descend. When the first position sensor 233 is triggered, the control system controls the clamping jaw 520 of the clamping mechanism 50 to open, so as to place the picked wafer box 200 on the loading and unloading port.

[0082] As described above, the lifting module 20, the first swing module 30, the second swing module 40 and the clamping mechanism 50 of the present application work cooperatively to realize the transportation of the wafer box 200 from the buffer device 100 to the wafer processing equipment. The process of transporting the wafer box 200 from the wafer processing equipment to the buffer device 100 is the reverse process of the foregoing process, which will not be described again.

[0083] In some embodiments, with reference to Figure 6 and Figure 7 The application further comprises an inclination sensor 330 installed on the second swing module 40, which is used to detect the angle of the clamping mechanism 50 relative to the horizontal plane, and the second swing module 40 is further configured to control the clamping mechanism 50 to keep it in a horizontal state according to the detection result of the inclination sensor 330.

[0084] During the swing process of the swing arm 320, the inclination sensor 330 can feedback in real time whether the wafer box 200 is inclined through the angle of the clamping mechanism 50. When it is detected that the wafer box 200 is inclined, the control system controls the clamping mechanism 50 to swing through the second swing module 40, so that the wafer box 200 is in a horizontal state.

[0085] Optionally, the inclination sensor 330 is arranged on the connecting arm 430 of the second swing module 40. When the clamping mechanism 50 clamps the wafer box 200, the inclination sensor 330 is located on one side of the wafer box 200, and the inclination sensor 330 can sense the inclination angle of the side of the wafer box 200 and then judge whether the wafer box 200 is in a horizontal state.

[0086] In some embodiments, with reference to Figure 10 and Figure 11As shown, the first sensor 530 is arranged on the clamping driving assembly 510, and the second sensor 540 and the third sensor 550 are arranged on the clamping jaw 520. The first sensor 530 is used to detect the opening and closing state of the clamping jaw 520. The second sensor 540 is used to detect whether the clamping jaw 520 clamps the wafer box 200. The third sensor 550 is used to detect whether the wafer box 200 is at a predetermined position.

[0087] Optionally, the first sensor 530 includes a light signal generator and a light signal receiver arranged on the first clamping jaw 521 and the second clamping jaw 522 respectively. When the clamping jaw 520 is opened and closed, the light signal receiver receives a signal mutation, thereby indicating the opening and closing state of the clamping jaw 520.

[0088] Optionally, the second sensor 540 can be a pressure sensor arranged on the first clamping jaw 521 and the second clamping jaw 522. After the first clamping jaw 521 and the second clamping jaw 522 clamp the wafer box 200, the ear portion 2012 behind the wafer box 200 presses the pressure sensor, thereby the pressure sensor indicates that the clamping jaw 520 clamps the wafer box 200.

[0089] Optionally, the third sensor 550 can be a photoelectric switch arranged on the first clamping jaw 521 or the second clamping jaw 522. The photoelectric switch is used to sense the side surface of the wafer box 200. When the wafer box 200 is clamped correctly, the side surface moves to a position that can trigger the photoelectric switch.

[0090] In some embodiments, referring to Figure 7 In order to enable the clamping jaw 520 to clamp the wafer box 200 correctly, the clamping jaw 520 is provided with a guide groove 523. Specifically, the first clamping jaw 521 and the second clamping jaw 522 are both provided with the guide groove 523, and the two guide grooves 523 are used to guide the ear portion 2012 of the wafer box 200 on both sides to cooperate with the first clamping jaw 521 and the second clamping jaw 522. The upper and lower groove walls of the guide groove 523 in the Z direction are both guide surfaces 5231.

[0091] Further, referring to Figure 11 The first clamping jaw 521 and the second clamping jaw 522 are both further provided with a limiting structure 524. The limiting structure 524 is used to limit the wafer box 200 after the ear portion 2012 of the wafer box 200 enters the guide groove 523. The limiting structure 524 is specifically a protrusion arranged on the inner wall of the guide groove 523. The limiting structure 524 can cooperate with the groove on the ear portion 2012 of the wafer box 200.

[0092] Finally, it should be noted that the technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0093] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A buffer apparatus for a transportable wafer cassette for transporting a wafer cassette to a wafer processing apparatus, characterized by, The machine table comprises: a table top module for placing a wafer box; a lifting module arranged on the machine table, the lifting module comprising a lifting plate and a lifting driving assembly for driving the lifting plate to lift; a first swing module, the first swing module comprising a first swing driving assembly arranged on the lifting plate and a swing arm, the bottom end of the swing arm being in transmission connection with the first swing driving assembly and capable of swinging relative to the machine table under the driving of the first swing driving assembly; a second swing module arranged on the swing arm, the second swing module comprising a second swing driving assembly; and a clamping mechanism, the clamping mechanism being rotatably arranged at the top end of the swing arm, the clamping mechanism comprising a clamping driving assembly and a clamping jaw driven to open and close by the clamping driving assembly, the clamping mechanism being capable of rotating reversely relative to the swing arm under the driving of the second swing driving assembly. The machine table comprises a base and a shield, the table top module is arranged on the top of the base, the shield is arranged outside the table top module, the top of the shield and one side of the shield in the swing direction of the swing arm are respectively provided with an opening; the top end of the swing arm and the clamping mechanism are located in the shield; the top of the shield is provided with a detector for detecting whether an air transport vehicle is located in the shield.

2. The transportable wafer cassette buffer apparatus of claim 1, wherein, The lifting module further comprises a mounting plate fixed to the machine table, the lifting plate and the lifting driving assembly are arranged on the mounting plate.

3. The transportable wafer cassette buffer apparatus of claim 1, wherein, In the lifting direction of the lifting plate, the mounting plate is sequentially provided from top to bottom with an upper limit sensor, a first origin sensor, a first arrival sensor and a lower limit sensor, the upper limit sensor and the lower limit sensor being used to indicate the upper and lower limit positions of the lifting plate; 4. The transportable cassettes buffer apparatus according to claim 3, wherein, The lifting module, the first swing driving assembly, the second swing driving assembly and the clamping driving assembly are configured as follows: when picking up a wafer box from the table top module, the first swing driving assembly controls the swing arm to rotate by a first angle when the first origin sensor is triggered by the upward movement of the lifting plate, the second swing driving assembly controls the clamping mechanism to rotate reversely by the first angle; when the first arrival sensor is triggered, the clamping mechanism performs the action of picking up the wafer box. The lifting plate is provided with a second origin sensor and a second arrival sensor; the second origin sensor is used to indicate the initial swing position of the swing arm; 5. The transportable wafer cassette buffer apparatus of claim 4, wherein, The lifting module, the first swing driving assembly, the second swing driving assembly and the clamping driving assembly are further configured as follows: when providing a wafer box to the wafer processing equipment, the second swing driving assembly controls the clamping mechanism to rotate reversely by a second angle when the second arrival sensor is triggered by the rotation of the swing arm by the second angle controlled by the first swing driving assembly, the first swing driving assembly controls the swing arm to stop swinging and the lifting module controls the lifting plate to descend; when the first arrival sensor is triggered by the downward movement of the lifting plate, the clamping mechanism performs the action of releasing the wafer box. ​ 6. The transportable wafer cassette buffer apparatus of claim 3, wherein, The lifting driving assembly comprises a screw rod, a sliding rail fixed to the mounting plate, a lifting servo motor and a lifting speed reducer, the screw rod is rotationally connected to the mounting plate, and the lifting speed reducer is drivingly connected to the lifting servo motor and the screw rod; the lifting plate is slidingly connected to the sliding rail, and the lifting plate is connected with a screw rod nut, the screw rod nut is sleeved on the screw rod and can be lifted and lowered under the driving of the screw rod.

7. The transportable wafer cassette buffer apparatus of claim 1, wherein, The first swing driving assembly comprises a first swing motor and a first swing speed reducer mounted on the lifting plate, the first swing speed reducer is drivingly connected to the first swing motor and the swing arm, and the swing arm is fixed to the output shaft of the first swing speed reducer. The second swing module comprises a second swing motor, a second swing speed reducer, a connecting arm, the second swing speed reducer is drivingly connected to the second swing motor and the connecting arm, the connecting arm is fixed to the output shaft of the second swing speed reducer, and the clamping mechanism is connected to the connecting arm.

8. The transportable wafer cassette buffer apparatus of claim 1, wherein, The output rotation speeds of the first swing module and the second swing module are the same, so that the rotation speeds of the swing arm and the clamping mechanism are the same.

9. The transportable wafer cassette buffer apparatus of claim 1, wherein, The second swing module is further provided with an inclination sensor mounted thereon, the inclination sensor is used to detect the angle of the clamping mechanism relative to the horizontal plane, and the second swing module is further configured to control the rotation of the clamping mechanism according to the detection result of the inclination sensor, so that the clamping mechanism is kept in a horizontal state.

10. The equipment for buffering of transportable cassettes of wafers according to claim 1, characterized in that, The clamping driving assembly is provided with a first sensor, the clamping jaw is provided with a second sensor and a third sensor, the first sensor is used to detect the opening and closing state of the clamping jaw, the second sensor is used to detect whether the clamping jaw clamps a wafer box, and the third sensor is used to detect whether the wafer box is in a predetermined position. ​

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