Sheet conveying device
By combining the design of the transfer structure, rotating components, and lifting components, the problem of inaccurate lifting and lowering of the wafer transfer device was solved, achieving low-cost, high-precision wafer transfer operation while maintaining the airtightness of the vacuum environment.
Patent Information
- Application Number
- CN202423317441.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing wafer transfer devices cannot achieve accurate lifting and lowering of wafers, resulting in the inability to accurately reach the target position for wafer retrieval, and increasing the cost, complexity, and space occupation of the device.
The design employs a combination of a transfer structure, a rotating component, and a lifting component. Through the coordinated operation of the rotating and lifting drives, accurate wafer transfer is achieved, while a retractable sealing structure maintains a vacuum environment.
It achieves accurate wafer transfer, reduces equipment cost and space occupation, while maintaining the sealing of the vacuum environment and wafer transfer accuracy.
Smart Images
Figure CN223693095U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer conveying device. BACKGROUND
[0002] In the manufacturing process of a semiconductor wafer, wafer conveying operation needs to be performed on the wafer, and the wafer conveying operation specifically refers to conveying the wafer to different positions. A dedicated wafer conveying device is usually required to perform the wafer conveying operation in a vacuum environment, so as to ensure the wafer conveying precision and wafer conveying stability.
[0003] In the current wafer conveying device, a mechanical hand used for carrying the wafer can only rotate horizontally to realize the transfer of the wafer between different chambers. However, in this wafer conveying mode, the mechanical hand cannot perform lifting movement, and there is a case that the wafer cannot be accurately reached to be picked up. At present, the support structure for carrying the wafer in the chamber is usually set as a liftable structure. Such a setting not only increases the cost and complexity of the overall device, but also increases the overall height of the device and occupies a larger space. CONTENT OF THE UTILITY MODEL
[0004] The application provides a wafer conveying device, which can realize accurate wafer conveying operation, ensure wafer conveying precision, and has low device cost, low overall height and low space occupation.
[0005] The application provides a wafer conveying device, which comprises a conveying structure having a carrying part for carrying a wafer, a rotating assembly comprising a rotating driving member and a rotating connecting member, a rotating driving end of the rotating driving member being connected to both ends of the rotating connecting member in the height direction, and a lifting assembly comprising a lifting driving member and a lifting connecting member, the lifting driving member being arranged in the horizontal direction and spaced apart from the rotating driving member, and the lifting connecting member being connected between a lifting driving end of the lifting driving member and the rotating assembly to drive the rotating assembly to move in the height direction.
[0006] The wafer conveying device as above further comprises a sealing structure for sealing a wafer containing chamber, the sealing structure being in the form of a tubular structure that is retractable in the height direction, the lifting connecting member is further connected to the sealing structure to drive the sealing structure to retract in the height direction, the sealing structure has a vacuum installation space inside, and at least part of the rotating connecting member is rotatably arranged in the vacuum installation space to pass through the sealing structure and connect the rotating driving end and the conveying structure.
[0007] The chip conveying device as claimed in any of the preceding claims, further comprising a bracket assembly including a bracket base, a movable bracket and a fixed bracket, the movable bracket being slidably mounted on the bracket base in the height direction, and a rotary driving member being arranged on the movable bracket; the fixed bracket being fixedly mounted on the bracket base, and the fixed bracket and the movable bracket being arranged in the horizontal direction, and a lifting driving member being arranged on the fixed bracket, and a lifting driving end of the lifting driving member being in driving connection with the movable bracket through a lifting connecting member to drive the movable bracket and the rotary driving member to move in the height direction.
[0008] The chip conveying device as claimed in any of the preceding claims, wherein the lifting connecting member includes a first connecting part in a plate structure, the first connecting part being connected between the bottom of the movable bracket and the top of the sealing structure, and the first connecting part completely blocking the top opening of the sealing structure of the tubular structure, and the rotary connecting member being sequentially arranged in the first connecting part and the bottom of the movable bracket in the height direction.
[0009] The chip conveying device as claimed in any of the preceding claims, wherein the bracket base includes a sealing base plate and a sliding side plate connected together, the sealing base plate being connected to the bottom of the sealing structure, and the sealing base plate completely blocking the bottom opening of the sealing structure of the tubular structure, and the sliding side plate extending in the height direction, and the lifting connecting member being slidably mounted on the sliding side plate in the height direction to drive the movable bracket to move in the height direction and synchronously drive the sealing structure to stretch and contract in the height direction.
[0010] The chip conveying device as claimed in any of the preceding claims, wherein the fixed bracket includes a first fixed frame and a second fixed frame arranged in the height direction in sequence, the second fixed frame being supported between the first fixed frame and the bracket base, and the lifting driving member being arranged on the first fixed frame, and the lifting driving member and the lifting connecting member being in driving connection through a screw rod, and the lifting connecting member and the screw rod being in driving cooperation in the second fixed frame.
[0011] The chip conveying device as claimed in any of the preceding claims, wherein the rotary assembly further includes a first limiting assembly arranged in the movable bracket, the first limiting assembly including a positioning baffle and a sensing member, the positioning baffle being connected to the outer periphery of the rotary connecting member, and the sensing member being arranged on the inner surface of the movable bracket, and the setting positions of the sensing member and the positioning baffle being at the same height to detect the rotating position of the positioning baffle.
[0012] The chip conveying device as claimed in any of the preceding claims, wherein the rotary assembly further includes a second limiting assembly arranged in the movable bracket, the second limiting assembly including a contact structure and a limiting structure, the contact structure being protruded from the outer periphery of the rotary connecting member, and the contact structure being arranged in the height direction at intervals with the positioning baffle, and the limiting structure being arranged on the inner surface of the movable bracket, and the setting positions of the limiting structure and the contact structure being at the same height to limit the rotation of the contact structure.
[0013] The chip conveying device as claimed in any of the preceding claims, wherein the sealing structure is a bellows structure, and the rotary connecting member is a magnetic flow shaft body structure extending in the height direction.
[0014] The wafer conveying device as above, wherein the conveying structure comprises a conveying connecting part and two bearing parts connected to both sides of the conveying connecting part, one end of the conveying connecting part is connected to the rotating connecting part, and the two bearing parts are vertically connected to the other end of the conveying connecting part, and the end of the bearing part away from the conveying connecting part is in a partial ring structure with an opening to adapt to the shape of the wafer.
[0015] The wafer conveying device comprises a conveying structure, a rotating assembly and a lifting assembly, the rotating drive part of the rotating assembly is connected to the conveying structure through the rotating connecting part, and the rotating drive part can drive the conveying structure to rotate through the rotating connecting part, so as to realize the rotating conveying of the conveying structure; the lifting drive part of the lifting assembly of the wafer conveying device is connected to the rotating drive part through the lifting connecting part to drive the rotating drive part to move along the height direction, so as to realize the adjustment of the rotating drive part and the conveying structure connected to the rotating drive part in the height direction, thereby realizing the lifting movement of the conveying structure, and the wafer can be accurately moved in the height direction and the horizontal direction, and the wafer can be accurately conveyed. And the lifting drive part and the rotating drive part are arranged along the horizontal direction, and the two are connected through the lifting connecting part, so that the setting of the lifting drive part does not increase the overall height of the wafer conveying device, occupies less space, and does not need to be complicatedly changed in structure, and the overall device cost is lower. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. For those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0017] Figure 1 It is a front view of the wafer conveying device of the embodiment of the present application.
[0018] Figure 2 It is a rear view of the wafer conveying device of the embodiment of the present application.
[0019] Figure 3 It is a side view of the wafer conveying device of the embodiment of the present application.
[0020] Figure 4 It is an isometric view of the wafer conveying device of the embodiment of the present application.
[0021] Figure 5 It is a schematic view of the internal structure of the fixing support of the wafer conveying device of the embodiment of the present application.
[0022] Explanation of reference numerals:
[0023] 10, conveying structure; 11, bearing part; 12, conveying connecting part;
[0024] 20, rotating assembly; 21, rotating driving member; 22, rotating connecting member; 23, first limiting assembly; 231, positioning baffle; 232, sensing member; 24, second limiting assembly; 241, contact structure; 242, limiting structure; 25, second coupling;
[0025] 30, sealing structure;
[0026] 40, lifting assembly; 41, lifting driving member; 42, lifting connecting member; 421, first connecting part; 422, second connecting part; 43, screw rod; 44, first coupling;
[0027] 50, bracket assembly; 51, bracket base body; 511, sealing base plate; 512, sliding side plate; 513, sliding rail; 52, movable bracket; 53, fixed bracket; 531, first fixed bracket body; 532, second fixed bracket body. DETAILED DESCRIPTION
[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to explain the present application, but not to limit the present application. The present application can be implemented without some of the specific details described below. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.
[0029] As shown in Figures 1 to 5 , the present application provides a wafer conveying device, wherein the wafer conveying device comprises a conveying structure 10, a rotating assembly 20 and a lifting assembly 40. The conveying structure 10 has a bearing part 11 for bearing a wafer. The rotating assembly 20 comprises a rotating driving member 21 and a rotating connecting member 22. The rotating driving end of the rotating driving member 21 is connected to the two ends of the rotating connecting member 22 in the height direction, respectively. The lifting assembly 40 comprises a lifting driving member 41 and a lifting connecting member 42. The lifting driving member 41 is arranged in the horizontal direction and spaced apart from the rotating driving member 21. The lifting connecting member 42 is connected between the lifting driving end of the lifting driving member 41 and the rotating assembly 20, so as to drive the rotating assembly 20 to move in the height direction.
[0030] The height direction in the present application is the up-down direction in Figure 1 , Figure 2 , Figure 3 and Figure 5 , that is, the height direction during actual use of the wafer conveying device. The horizontal direction is any direction perpendicular to the height direction.
[0031] In specific implementation, the wafer conveying device comprises a conveying structure 10, a rotating assembly 20, and a lifting assembly 40. The rotating driving member 21 of the rotating assembly 20 is connected with the conveying structure 10 through a rotating connecting member 22. The rotating driving member 21 can drive the conveying structure 10 to rotate through the rotating connecting member 22, so as to realize the rotating conveying of the conveying structure 10. The lifting driving member 41 of the lifting assembly 40 of the wafer conveying device is connected with the rotating driving member 21 through a lifting connecting member 42, so as to drive the rotating driving member 21 to move along the height direction, realize the adjustment of the rotating driving member 21 and the conveying structure 10 connected with the rotating driving member 21 in height, and realize the lifting movement of the conveying structure 10. In this way, the wafer can be accurately moved in the height direction and the horizontal direction, and the wafer can be accurately conveyed. In addition, the lifting driving member 41 and the rotating driving member 21 are arranged in the horizontal direction and are connected through the lifting connecting member 42. Therefore, the arrangement of the lifting driving member 41 does not increase the overall height of the wafer conveying device, occupies a small space, and does not need to be complicatedly changed in structure, so that the overall device cost is low.
[0032] In the wafer conveying device, the sealing structure 30 is arranged to seal the accommodating chamber of the wafer. The sealing structure 30 is in a tubular structure which can be extended and retracted along the height direction. The lifting connecting member 42 is further connected with the sealing structure 30, so as to drive the sealing structure 30 to extend and retract along the height direction. The sealing structure 30 has a vacuum installation space inside. At least part of the rotating connecting member 22 is rotatably arranged in the vacuum installation space, so as to pass through the sealing structure 30 and connect the rotating driving end and the conveying structure 10.
[0033] In specific implementation, the wafer conveying device comprises a conveying structure 10, a rotating assembly 20, a sealing structure 30, and a lifting assembly 40. When the wafer conveying device is installed in the accommodating chamber of the wafer, the sealing structure 30 can seal the accommodating chamber. The inside of the sealing structure 30 and the inside of the accommodating chamber are both in a vacuum environment, so as to ensure the sealed connection between the wafer conveying device and the accommodating chamber. The rotating assembly 20 of the wafer conveying device comprises a rotating driving member 21 and a rotating connecting member 22. The rotating driving member 21 is connected with the conveying structure 10 through the rotating connecting member 22. The rotating connecting member 22 is arranged in the vacuum installation space of the sealing structure 30. When the rotating driving member 21 drives the conveying structure 10 to rotate in the vacuum environment, the vacuum environment can be kept in a vacuum sealed state, so as to realize the rotating conveying of the conveying structure 10 in the vacuum environment.
[0034] The lifting assembly 40 of the wafer conveying device comprises a lifting driving member 41 and a lifting connecting member 42. The lifting driving member 41 is connected with the rotating driving member 21 and the sealing structure 30 through the lifting connecting member 42, so as to drive the rotating driving member 21 to move along the height direction, thereby driving the rotating driving member 21, the rotating connecting member 22 and the conveying structure 10 to move along the height direction together. The conveying structure 10 can be adjusted in height, thereby reaching the position of the wafer and carrying and conveying the wafer. When the lifting connecting member 42 moves along the height direction, the sealing structure 30 can be driven to stretch and contract along the height direction. The stretching and contraction of the sealing structure 30 will not change the vacuum state of the vacuum installation space inside the sealing structure 30, thereby ensuring the vacuum sealing state of the vacuum environment of the conveying structure 10, realizing the lifting movement of the conveying structure 10 in the vacuum environment, and further realizing the accurate wafer conveying in the vacuum environment.
[0035] In the embodiment of the present application, the sealing structure 30 is a bellows structure. Under the driving of the lifting connecting member 42, the bellows structure is folded along the height direction, thereby realizing the stretching and contraction. In the folding process, the vacuum state of the vacuum installation space inside the bellows structure will not change, and the vacuum state can be maintained all the time, thereby realizing the sealing effect of the wafer accommodating cavity.
[0036] Alternatively, the sealing structure 30 can also be a two-segment pipe structure connected in a sliding mode. The inside of the pipe structure is also a vacuum installation space. Under the driving of the lifting connecting member 42, one segment of the pipe structure slides relative to the other segment of the pipe structure, and the vacuum state inside will not be affected. It should be noted that the sealing structure 30 is not limited to the above-mentioned form, and can realize the stretching and contraction and ensure the vacuum state inside.
[0037] As shown in FIG. 1, Figures 1 to 5 The wafer conveying device of the embodiment of the present application further comprises a support assembly 50, which comprises a support base 51, a movable support 52 and a fixed support 53. The movable support 52 is slidably mounted on the support base 51 along the height direction. The rotating driving member 21 is arranged in the movable support 52. The rotating driving end of the rotating driving member 21 penetrates through the wall of the movable support 52 and is connected with part of the rotating connecting member 22 in the movable support 52. The fixed support 53 is fixedly mounted on the support base 51. The fixed support 53 and the movable support 52 are arranged along the horizontal direction. The lifting driving member 41 is arranged in the fixed support 53. The lifting driving end of the lifting driving member 41 is drivingly connected with the movable support 52 through the lifting connecting member 42, so as to drive the movable support 52 and the rotating driving member 21 to move along the height direction together.
[0038] In implementation, the fixed support 53 and the movable support 52 are arranged along the horizontal direction on the support base 51, so that the lifting driving element 41 mounted on the fixed support 53 and the rotating driving element 21 mounted on the movable support 52 can be arranged in the horizontal direction, and the lifting driving element 41 and the rotating driving element 21 can be integrated on the support base 51, thereby ensuring the integrity of the wafer conveying device. Therefore, the fixed support 53 and the movable support 52 provide mounting bases for the lifting driving element 41 and the rotating driving element 21, respectively, so that the lifting driving element 41 and the rotating driving element 21 can be stably mounted and stably control the lifting and rotation of the conveying structure 10, and the conveying structure 10 can accurately convey the wafer in the vacuum environment.
[0039] Specifically, the movable support 52 is enclosed by a top plate, a bottom plate and two side plates to form a rectangular frame body, and the rotating driving element 21 is arranged on the top plate of the movable support 52, and the rotating driving end thereof is rotatably arranged on the top plate and extends into the internal space of the movable support 52, and is connected with the end of the rotating connecting element 22 through the second coupling 25, thereby driving the rotating connecting element 22 to rotate. The two side plates of the movable support 52 are used to support the top plate, and the two side plates are fixedly installed with the top plate and the bottom plate, so that the overall structure of the movable support 52 is simple and convenient for assembly production.
[0040] As shown in Figure 4 the wafer conveying device of the embodiment, the lifting connecting element 42 includes a first connecting part 421 in a plate structure, the first connecting part 421 is connected between the bottom of the movable support 52 and the top of the sealing structure 30, and the first connecting part 421 completely blocks the top opening of the sealing structure 30 in the tubular structure, and the rotating connecting element 22 is sequentially arranged on the first connecting part 421 and the bottom of the movable support 52 along the height direction.
[0041] In implementation, the first connecting part 421 of the lifting connecting element 42 is in a plate structure, the top surface of the plate structure is connected with the bottom plate of the bottom of the movable support 52, and the bottom surface of the plate structure is connected with the top opening of the sealing structure 30 and completely blocks the top opening of the sealing structure 30 in the tubular structure, thereby avoiding the internal vacuum space of the sealing structure 30 from being connected with the external atmospheric environment, and ensuring the sealing property of the sealing structure 30. Moreover, the first connecting part 421 is connected between the bottom of the movable support 52 and the top of the sealing structure 30, and can drive the movable support 52 to move along the height direction, thereby driving the rotating connecting element 22 mounted on the movable support 52 to move along the height direction, and the sealing structure 30 can be stretched along the height direction with the movement of the first connecting part 421, and the sealing structure 30 ensures the sealing property of the internal vacuum environment, and does not affect the up-down movement of the first connecting part 421.
[0042] As shown in Figure 1 andFigure 4 As shown, the wafer conveying device in the embodiment of the present application, wherein the support base 51 comprises a sealing base plate 511 and two sliding side plates 512 connected together, the sealing base plate 511 is connected to the bottom of the sealing structure 30, and the sealing base plate 511 completely blocks the opening at the bottom of the sealing structure 30, the sliding side plates 512 extend along the height direction, the fixed support 53 and the two sliding side plates 512 are arranged in the horizontal direction and spaced apart from the top surface of the sealing base plate 511, the two sliding side plates 512 are arranged on the two sides of the sealing structure 30 respectively, and the first connecting part 421 of the lifting connecting part 42 is slidingly installed between the two sliding side plates 512 along the height direction, so as to drive the movable support 52 to move along the height direction and synchronously drive the sealing structure 30 to stretch and contract along the height direction.
[0043] In particular, when the wafer conveying device in the embodiment of the present application is connected with the accommodating cavity of the wafer, the sealing base plate 511 of the support base 51 blocks the opening of the accommodating cavity, so that the internal vacuum environment of the accommodating cavity is isolated from the external atmospheric environment, and the sealing base plate 511 blocks the opening at the bottom of the sealing structure 30, which avoids the communication between the bottom of the sealing structure 30 and the external atmospheric environment, ensures the sealing property of the bottom of the sealing structure 30, and thus forms a vacuum mounting space inside the sealing structure 30, so that the sealing structure 30 can further seal the accommodating cavity of the wafer, and completely ensures the vacuum degree of the wafer accommodating cavity.
[0044] The two sliding side plates 512 are arranged in the horizontal direction and spaced apart from each other, which provides a mounting space for the first connecting part 421, the sealing structure 30 and the movable support 52, so that the first connecting part 421 can be slidingly installed between the two sliding side plates 512, drive the movable support 52 to move along the height direction, and synchronously drive the sealing structure 30 to stretch and contract along the height direction. The connection structure of the two sliding side plates 512 and the sealing base plate 511 is simple, which is convenient for assembly production.
[0045] Specifically, as shown in the drawings, Figure 1 The two sliding side plates 512 are arranged in the horizontal direction and spaced apart from each other, which provides a mounting space for the first connecting part 421, the sealing structure 30 and the movable support 52, so that the first connecting part 421 can be slidingly installed between the two sliding side plates 512, drive the movable support 52 to move along the height direction, and synchronously drive the sealing structure 30 to stretch and contract along the height direction. The connection structure of the two sliding side plates 512 and the sealing base plate 511 is simple, which is convenient for assembly production.
[0046] In this embodiment, the rotating connector 22 is specifically a magnetic flux shaft structure extending along the height direction. The rotating connector 22 is rotatably connected to the first connecting part 421 and the sealing substrate 511 through a magnetic flux sealing ring. Under the action of the magnetic flux sealing ring, the frictional force generated between the rotating connector 22 and the first connecting part 421 and the sealing substrate 511 during rotation is small, and the resulting motion transmission loss is small. Furthermore, the rotating connector 22 can achieve a seal between itself and the first connecting part 421 and the sealing substrate 511 through the magnetic flux sealing ring, thereby preventing vacuum leakage in the sealing structure 30 and affecting the vacuum level inside the wafer accommodating cavity.
[0047] In the transfer device of this application embodiment, the fixed bracket 53 includes a first fixed frame 531 and a second fixed frame 532 arranged sequentially along the height direction. The second fixed frame 532 is supported between the first fixed frame 531 and the bracket base 51. The lifting drive member 41 is disposed in the first fixed frame 531. The lifting drive member 41 and the lifting connecting member 42 are connected by a screw 43. The lifting connecting member 42 and the screw 43 are engaged in transmission within the second fixed frame 532.
[0048] In specific implementation, the first fixed frame 531 provides an installation base for the lifting drive component 41, enabling the lifting drive component 41 to be driven stably; the second fixed frame 532 is supported between the bracket base 51 and the first fixed frame 531, which not only provides support for the first fixed frame 531 and the lifting drive component 41, but also provides space for the transmission cooperation between the lifting connector 42 and the screw 43, thereby improving the transmission stability of the lifting action.
[0049] like Figure 2 and Figure 3 As shown in the embodiment of the present application, the lifting drive member 41 and the lifting connector 42 are connected by a screw 43. The screw 43 extends along the height direction. The lifting drive end of the lifting drive member 41 is connected to the end of the screw 43 to drive the screw 43 to rotate. The lifting connector 42 has a second connecting part 422. The second connecting part 422 is sleeved on the outer surface of the screw 43 and rolls with the screw 43 to convert the rotation of the screw 43 into linear motion of the second connecting part 422 along the height direction.
[0050] In specific implementation, the lifting drive component 41 is a rotary motor. Its lifting drive end can drive the screw 43 to rotate together through the first coupling 44. The screw 43 is rolled in conjunction with the second connecting part 422 sleeved on its outer surface, specifically a ball screw engagement. That is, the outer circumferential surface of the screw 43 has external threads. The inner surface of the hole structure on the second connecting part 422 is engaged with the threaded surface of the screw 43 through the rolling of the balls, so that the rotational motion of the screw 43 can be converted into the linear motion of the second connecting part 422 along the height direction, thereby causing the first connecting part 421 connected to the second connecting part 422 to move along the height direction, and thus driving the transmission structure 10 to move up and down.
[0051] Optionally, the lifting drive component 41 can be a lifting motor, whose lifting drive end can extend and retract along the height direction, thereby directly driving the second connecting part 422 to move in the height direction.
[0052] like Figure 2 and Figure 3 As shown in the embodiment of the present application, in the transfer device, the lifting drive 41 is installed on the top of the first fixed frame 531, the lifting drive end and the end of the screw 43 are fixedly connected in the first fixed frame 531 through the first coupling 44, the threaded part of the screw 43 passes through the bottom of the first fixed frame 531, and is in transmission cooperation with the second connecting part 422 in the second fixed frame 532 to drive the second connecting part 422 to move along the height direction.
[0053] In specific implementation, the lifting drive component 41 is installed on the top of the first fixed frame 531, and its lifting drive end passes through the top of the first fixed frame 531 and is fixedly engaged with the end of the screw 43 in the internal space of the first fixed frame 531. Therefore, the first fixed frame 531 achieves the fixation of the lifting drive component 41, so that the lifting drive component 41 has an installation base and can stably drive the screw 43. The threaded part of the screw 43 passes through the bottom of the first fixed frame 531, that is, the top end of the screw 43 passes through the bottom of the first fixed frame 531, and the bottom end of the screw 43 is rotatably passed through the sealing base plate 511, so that both ends of the screw 43 have a fixed base, thereby achieving stable rotation inside the second fixed frame 532, and converting the rotation into linear motion through the second connecting part 422 to drive the second connecting part 422 to move along the height direction.
[0054] Specifically, the first fixed frame body 531 is formed by a top plate, a bottom plate and two side plates, and the second fixed frame body 532 is formed by two side plates only. The first fixed frame body 531 is separated from the second fixed frame body 532 by the bottom plate of the first fixed frame body 531. The second fixed frame body 532 is provided to have a transmission space between the screw rod 43 and the second connecting portion 422. The two side plates of the first fixed frame body 531 are arranged at the same position as the two side plates of the second fixed frame body 532, which improves the installation stability of the first fixed frame body 531 and ensures the driving stability of the lifting driving member 41.
[0055] As shown in Figure 5 The wafer conveying device of the embodiment of the present application, wherein the rotating assembly 20 further comprises a first limiting assembly 23 arranged in the movable bracket 52. The first limiting assembly 23 comprises a positioning baffle 231 and a sensing member 232. The positioning baffle 231 is connected to the outer periphery of the rotating connecting member 22. The sensing member 232 is arranged on the inner surface of the movable bracket 52. The sensing member 232 and the positioning baffle 231 are arranged at the same height, and the sensing member 232 is used to detect the rotating position of the positioning baffle 231.
[0056] In specific implementation, the positioning baffle 231 of the first limiting assembly 23 is connected to the outer periphery of the rotating connecting member 22. When the positioning baffle 231 of the rotating connecting member 22 rotates to the position of the sensing member 232, the sensing member 232 can detect the positioning baffle 231 and send a signal indicating that the positioning baffle 231 is in place. The operator or the controller can control the rotating driving member 21 to stop rotating according to the detection signal, so that the carrying portion 11 of the conveying structure 10 is in an accurate in-place position, and the conveying accuracy of the wafer is ensured.
[0057] As shown in Figure 5 The wafer conveying device of the embodiment of the present application, wherein the rotating assembly 20 further comprises a second limiting assembly 24 arranged in the movable bracket 52. The second limiting assembly 24 comprises a contact structure 241 and a limiting structure 242. The contact structure 241 protrudes from the outer periphery of the rotating connecting member 22, and the contact structure 241 and the positioning baffle 231 are arranged at the same height in the height direction. The limiting structure 242 is arranged on the inner surface of the movable bracket 52, and the limiting structure 242 and the contact structure 241 are arranged at the same height, and the limiting structure 242 is used to limit the rotation of the contact structure 241.
[0058] In particular embodiments, the contact structure 241 of the second limiting component 24 protrudes from the outer circumferential surface of the rotating connecting piece 22, and when the contact structure 241 rotates to contact the limiting structure 242, the limiting structure 242 can block the contact structure 241, thereby avoiding the rotating connecting piece 22 from continuing to rotate after the wafer on the bearing part 11 is in place. The second limiting component 24 realizes mechanical limiting of the rotating connecting piece 22, and when the sensing part 232 of the first limiting component 23 is disturbed or fails, the second limiting component 24 can also realize limiting, so that the bearing part 11 of the transmission structure 10 is in an accurate in-place position, ensuring the accuracy of wafer transmission.
[0059] In particular, in the embodiments of the present application, the accommodating chamber has two wafers, and the two sliding side plates 512 of the movable support 52 are each provided with a sensing part 232 and a limiting structure 242, so that the rotation angle of the rotating connecting piece 22 is limited to 180°, and after the rotating connecting piece 22 reaches the limiting structure on one side, the bearing part 11 and the wafer carried thereby can be accurately in place. Such a design improves the transmission accuracy and efficiency of the wafer, without the need for positioning and calculation of the rotation angle during transmission.
[0060] As shown in FIG. 1, the wafer transmission device according to an embodiment of the present application includes a transmission structure 10 and a movable support 52. Figure 4 As shown in FIG. 1, the wafer transmission device according to an embodiment of the present application includes a transmission structure 10 and a movable support 52.
[0061] In particular embodiments, the rotating connecting piece 22 is driven to rotate, the rotating connecting piece 22 can drive the transmission connecting part 12 to rotate, and in turn, the two bearing parts 11 rotate around the transmission connecting part 12, and the wafer carried by the bearing part 11 is transferred from one accommodating chamber to another accommodating chamber. Moreover, the end of the bearing part 11 is in a partial ring structure with an opening, the wafer can be loaded from the opening, which facilitates the bearing part 11 to carry the wafer, and the end of the bearing part 11 is adapted to the shape of the wafer, so that the wafer can be stably carried on the top of the bearing part 11 and will not fall off the bearing part 11.
[0062] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0063] The above description is merely illustrative of the application, and not restrictive. Various modifications can be made by those skilled in the art without departing from the scope of the application. Thus, it is intended that the scope of the application should be determined by the appended claims and their equivalents.
Claims
1. A wafer transfer device, comprising: The application relates to a wafer conveying device. The conveying device comprises a conveying structure for carrying wafers; a rotating assembly comprising a rotating driving member and a rotating connecting member, the rotating driving end of the rotating driving member being connected to the rotating connecting member at two ends in the height direction respectively; and a lifting assembly comprising a lifting driving member and a lifting connecting member, the lifting driving member being arranged in the horizontal direction and spaced apart from the rotating driving member, and the lifting connecting member being connected between the lifting driving end of the lifting driving member and the rotating assembly to drive the rotating assembly to move in the height direction. The application further comprises a sealing structure for sealing a wafer accommodating chamber, the sealing structure being a tubular structure that can be extended and retracted in the height direction, and the lifting connecting member being further connected to the sealing structure to drive the sealing structure to extend and retract in the height direction; the sealing structure has a vacuum installation space inside, and at least part of the rotating connecting member is rotatably arranged in the vacuum installation space to pass through the sealing structure and connect the rotating driving end and the conveying structure. The application further comprises a support assembly comprising a support base, a movable support and a fixed support, the movable support being slidably arranged on the support base in the height direction, and the rotating driving member being arranged on the movable support; the fixed support being fixedly arranged on the support base and arranged in the horizontal direction with the movable support, and the lifting driving member being arranged on the fixed support, and the lifting driving end of the lifting driving member being drivingly connected to the movable support through the lifting connecting member to drive the movable support and the rotating driving member to move in the height direction together.
2. The sheet transport apparatus according to claim 1, wherein The lifting connecting member comprises a first connecting part in the form of a plate structure, the first connecting part being connected between the bottom of the movable support and the top of the sealing structure, and the first connecting part completely blocking the top opening of the sealing structure of the tubular structure, and the rotating connecting member being arranged in the first connecting part and the bottom of the movable support in the height direction in sequence. The support base comprises a sealing base plate and a sliding side plate connected together, the sealing base plate completely blocking the bottom opening of the sealing structure of the tubular structure, and the sliding side plate extending in the height direction, and the lifting connecting member being slidably arranged on the sliding side plate in the height direction to drive the movable support to move in the height direction and synchronously drive the sealing structure to extend and retract in the height direction.
3. The sheet transport apparatus according to claim 2, wherein The fixed support comprises a first fixed frame body and a second fixed frame body arranged in the height direction in sequence, the second fixed frame body being supported between the first fixed frame body and the support base, the lifting driving member being arranged on the first fixed frame body, the lifting driving member and the lifting connecting member being drivingly connected through a screw rod, and the lifting connecting member and the screw rod being drivingly connected in the second fixed frame body. 4. The sheet transport apparatus according to claim 3, wherein 5. The sheet transport apparatus according to claim 3, wherein 6. The sheet transport apparatus according to claim 3, wherein 7. The sheet transport apparatus according to claim 3, wherein The rotating assembly further comprises a first limiting assembly arranged in the movable support, the first limiting assembly comprises a positioning baffle and a sensing element, the positioning baffle is connected to the outer circumferential surface of the rotating connecting element, the sensing element is arranged on the inner surface of the movable support, the sensing element and the positioning baffle are arranged at the same height along the height direction, and the sensing element is used for detecting the rotating position of the positioning baffle.
8. The sheet transport apparatus according to claim 7, wherein The rotating assembly further comprises a second limiting assembly arranged in the movable support, the second limiting assembly comprises a contact structure and a limiting structure, the contact structure protrudes from the outer circumferential surface of the rotating connecting element, and the contact structure is arranged at a position spaced apart from the positioning baffle along the height direction, the limiting structure is arranged on the inner surface of the movable support, the limiting structure and the contact structure are arranged at the same height, and the limiting structure is used for limiting the rotation of the contact structure.
9. The sheet transport apparatus according to claim 2, wherein The sealing structure is a bellows structure, and the rotating connecting element is a magnetic flow shaft body structure extending along the height direction.
10. The wafer transfer device of claim 1, wherein, The transmission structure comprises a transmission connecting part and two bearing parts connected to two sides of the transmission connecting part, one end of the transmission connecting part is connected to the rotating connecting element, and the other end of the transmission connecting part is perpendicularly connected to two bearing parts, and the end of the bearing part away from the transmission connecting part is in a partial ring structure with an opening to adapt to the shape of the wafer.