Movement mechanism of wafer reaction cavity and wafer reaction equipment

Abstract

The utility model relates to the field of semiconductor generation equipment, and provides a movement mechanism of a wafer reaction cavity and wafer reaction equipment, and the movement mechanism comprises at least two lifting devices and a floating connection device. The floating connecting device comprises a first connecting body and a second connecting body, the first connecting body comprises a floating sleeve, and the floating sleeve is connected with the moving tail end of the lifting device; the second connecting body is arranged in the floating sleeve, the second connecting body is connected with the cavity body of the wafer reaction cavity, and the second connecting body is in floating connection with the floating sleeve. In the embodiment of the invention, when the movement tail ends of the lifting devices on the two sides do not completely synchronize, due to the gravity of the cavity and the combined action of floating connection between the first connecting body and the second connecting body, the horizontal heights of the tail ends of the second connecting bodies on the two sides of the cavity can be the same, and therefore when the at least two lifting devices synchronously move, the horizontal heights of the tail ends of the second connecting bodies on the two sides of the cavity can be identical. According to the floating connection device provided by the embodiment of the invention, the levelness of the cavity can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor generating equipment, in particular to a motion mechanism of a wafer reaction cavity and a wafer reaction equipment. BACKGROUND

[0002] Before the wafer reaction cavity performs a process reaction, the wafer reaction cavity needs to be moved, mainly to adjust the height of the wafer reaction cavity, for example, by two electric cylinders to adjust the height of the wafer reaction cavity, so that the wafer placed at the bottom of the wafer reaction cavity is moved to the process reaction position along with the cavity, thereby performing a film plating reaction on the wafer.

[0003] During the film plating reaction on the wafer, the levelness of the wafer when it reaches the process reaction position directly affects the effect and success rate of the wafer film plating, so it is crucial to ensure the levelness of the cavity when it moves. However, during the synchronous movement of the two electric cylinders, it is inevitable that the movement ends of the two electric cylinders are not completely synchronized. Although the movement ends of the two electric cylinders are not completely synchronized, the movement amount is small and there is no large distance out of synchronization, but the small amount of movement out of synchronization still causes the movement of the two sides of the wafer reaction cavity to deviate, thereby causing the wafer to move horizontally or affecting the change in the levelness of the wafer due to the slight tilt of the wafer reaction cavity, thereby affecting the levelness of the wafer when it reaches the process reaction position. CONTENT OF THE INVENTION

[0004] The embodiments of the present application provide a motion mechanism of a wafer reaction cavity and a wafer reaction equipment to avoid the problem of the movement ends of the two electric cylinders not being completely synchronized, affecting the levelness of the wafer when it reaches the process reaction position.

[0005] The embodiments of the present application provide a motion mechanism of a wafer reaction cavity, comprising at least two lifting devices, further comprising: a floating connection device;

[0006] The floating connection device comprises a first connecting body and a second connecting body, the first connecting body comprises a floating sleeve, and the floating sleeve is connected to the movement end of the lifting device;

[0007] The second connecting body is arranged in the floating sleeve, and the second connecting body is connected to the cavity of the wafer reaction cavity, and the second connecting body is floatingly connected with the floating sleeve to improve the levelness of the cavity when the at least two lifting devices move synchronously.

[0008] In one implementation, the second connecting body comprises a first connecting column and a sliding column, the cross-sectional size of the first connecting column is smaller than the cross-sectional size of the sliding column; one end of the first connecting column is connected to the sliding column, and the other end extends out of the floating sleeve and is connected to the cavity;

[0009] The sliding column is slidably arranged in the floating sleeve, and a first elastic body is sleeved on the first connecting column, one end of the first elastic body abutting against the sliding column, and the other end abutting against the outer edge of the lower end of the floating sleeve.

[0010] In an implementation manner, the second connecting body further comprises a second connecting column connected with the sliding column, a second elastic body is sleeved on the second connecting column, one end of the second elastic body abutting against the sliding column, and the other end abutting against the outer edge of the upper end of the floating sleeve.

[0011] In an implementation manner, the first connecting body further comprises a connecting piece, one end of the connecting piece being connected with the floating sleeve, and the other end being connected with the movement end of the lifting device.

[0012] In an implementation manner, a cavity is arranged in the floating sleeve, so that the two connecting bodies can move relative to the floating sleeve in the axial direction.

[0013] In an implementation manner, at least one guide groove is arranged on the sliding column, and a guide body abutting against the inner wall of the floating sleeve is nested in the guide groove.

[0014] In an implementation manner, when the number of the guide grooves is more than one, a first exhaust passage is arranged between two adjacent guide grooves.

[0015] The first exhaust passage is communicated with the first cavity, the upper end of the floating sleeve is provided with a second exhaust passage communicated with the first cavity, the second exhaust passage is communicated with the outside of the floating sleeve, and the first cavity is a cavity formed between the sliding column and the upper end of the floating sleeve.

[0016] In an implementation manner, the diameter of the sliding column is greater than the diameter of the first connecting column and the second connecting column.

[0017] In an implementation manner, the at least two lifting devices are fixedly connected with the upper cover plate of the wafer reaction cavity, and the at least two lifting devices are symmetrically distributed relative to the vertical axis of the upper cover plate.

[0018] The embodiment of the present application further provides a wafer reaction device, which comprises a wafer reaction cavity, and further comprises the movement mechanism of the wafer reaction cavity.

[0019] The motion mechanism of the wafer reaction cavity and the wafer reaction equipment provided by the embodiment of the present application, the motion mechanism comprises at least two lifting devices and a floating connection device corresponding to the lifting devices; the floating connection device comprises a first connecting body and a second connecting body, the first connecting body comprises a floating sleeve, and the floating sleeve is connected to the motion end of the lifting device; the second connecting body is arranged in the floating sleeve, and the second connecting body is connected to the cavity of the wafer reaction cavity; the second connecting body and the floating sleeve are floatingly connected, so that the levelness of the end of the corresponding floating connection device is improved when the at least two lifting devices move synchronously. In the embodiment of the present application, when the motion ends of the two lifting devices do not move completely synchronously, due to the gravity of the cavity and the floating connection between the first connecting body and the second connecting body, the ends of the second connecting bodies on both sides of the cavity have the same horizontal height, so that the floating connection device provided by the embodiment of the present application can improve the levelness of the cavity when the at least two lifting devices move synchronously. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the present application, the drawings needed in the embodiments will be briefly introduced as follows: obviously, other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0021] Figure 1 The overall structure schematic diagram of the wafer reaction equipment provided by the embodiment of the present application is shown in the figure.

[0022] Figure 2 The cross-sectional structure schematic diagram of the wafer reaction equipment provided by the embodiment of the present application is shown in the figure. Figure 1

[0023] Figure 3 The structure schematic diagram of the first connecting body provided by the embodiment of the present application is shown in the figure.

[0024] Figure 4 The structure schematic diagram of the floating connection device provided by the embodiment of the present application is shown in the figure.

[0025] Figure 5 The structure schematic diagram of the second connecting body provided by the embodiment of the present application is shown in the figure.

[0026] Figure 6 The motion demonstration schematic diagram of the floating connection device provided by the embodiment of the present application is shown in the figure.

[0027] Figure 7 The structure schematic diagram of the floating connection device provided by the embodiment of the present application is shown in the figure.

[0028] Figure 8 The structure schematic diagram of the second connecting body provided by the embodiment of the present application is shown in the figure. ​

[0029] Figure 9 Another motion demonstration schematic view of the floating connection device provided by the embodiment of the present application;

[0030] Figure 10 A structural schematic view of the exhaust passage provided by the embodiment of the present application;

[0031] Figure 11 Another structural schematic view of the exhaust passage provided by the embodiment of the present application.

[0032] In the figure: 1-lifting device, 2-floating connection device, 21-first connecting body, 211-floating sleeve, 212-connector, 22-second connecting body, 221-first connecting column, 222-sliding column, 2221-guide groove, 223-second connecting column, 23-first elastic body, 24-second elastic body, 3-guide body, 4-first exhaust passage, 5-second exhaust passage, 100-cavity, 200-upper cover plate. DETAILED DESCRIPTION

[0033] In the process of controlling the reaction cavity of the wafer reaction equipment to move in the vertical direction, in order to avoid the problem that the motion ends of the two cylinders are not completely synchronized, causing the wafer to move horizontally, and then affecting the levelness of the wafer when reaching the process reaction position, the embodiment of the present application provides a motion mechanism of a wafer reaction cavity and a wafer reaction equipment.

[0034] The embodiment of the present application provides a motion mechanism of a wafer reaction cavity, which comprises at least two lifting devices 1, the at least two lifting devices 1 are fixedly connected to an upper cover plate 200 of the wafer reaction cavity, and the at least two lifting devices 1 are symmetrically distributed relative to a vertical axis of the upper cover plate 200. As shown in Figure 1 and Figure 2 The number of the lifting devices 1 is two, and then the two lifting devices 1 are symmetrically fixed on both sides of a cavity 100 of the wafer reaction cavity.

[0035] Specifically, the motion mechanism further comprises: a floating connection device 2; as shown in Figure 2 The floating connection device 2 comprises a first connecting body 21 and a second connecting body 22, as shown in Figure 3 The first connecting body 21 comprises a floating sleeve 211.

[0036] The floating sleeve 211 is connected to the motion end of the lifting device 1, the second connecting body 22 is arranged in the floating sleeve 211, and the second connecting body 22 is connected to the cavity 100 of the wafer reaction cavity. Wherein, the first connecting body 21 and the second connecting body 22 are floatingly connected.

[0037] Taking the number of the lifting devices 1 as two as an example, the number of the floating connecting devices 2 is also two, and the two floating connecting devices 2 are respectively arranged at the ends of the lifting devices 1. In this way, the lifting devices 1 at both sides of the cavity 100 move synchronously, but during the movement, the movement ends of the two lifting devices 1 at both sides are inevitably not completely synchronous, and the movement ends of the two lifting devices 1 are at different heights. At this time, if the movement ends of the lifting devices 1 are directly connected to the cavity 100, the cavity 100 will be lifted or lowered in a non-horizontal state, thereby affecting the horizontal position of the wafer placed in the cavity 100.

[0038] In the embodiment of the present application, when the movement ends of the lifting devices 1 at both sides are not completely synchronous, due to the gravity of the cavity 100 and the joint action of the floating connection between the first connecting body 21 and the second connecting body 22, the ends of the second connecting bodies 22 at both sides of the cavity 100 can be at the same height. In this way, when at least two lifting devices 1 move synchronously, the floating connecting device 2 provided by the present application can improve the levelness of the ends of the at least two floating connecting devices 2, thereby improving the levelness of the cavity 100.

[0039] In one implementation mode, as shown in Figure 4 and Figure 5 , the second connecting body 22 includes a first connecting column 221 and a sliding column 222, and the cross-sectional size of the first connecting column 221 is smaller than that of the sliding column 222; wherein one end of the first connecting column 221 is connected to the sliding column 222, and the other end of the first connecting column 221 extends out of the floating sleeve 211 and is connected to the cavity 100.

[0040] As shown in Figure 4 , the sliding column 222 is slidingly arranged in the floating sleeve 211, the first connecting body 21 extends out of the lower end of the floating sleeve 211, a first elastic body 23 is sleeved on the first connecting column 221, and one end of the first elastic body 23 abuts against the sliding column 222, and the other end of the first elastic body 23 abuts against the outer edge of the lower end of the floating sleeve 211. It should be noted that in the working state, the first elastic body 23 is in a compressed state, so that when the first connecting body 21 is connected to the cavity 100, the floating connection is formed between the first connecting body 21 and the second connecting body 22 in the case that the force acting on the first connecting body 21 of the cavity 100 changes.

[0041] , the outer edge refers to a flange of the inner wall of the floating sleeve 211 extending in the axial direction, and the first elastic body 23 abuts against the inner side wall of the flange.

[0042] Taking the number of lifting devices 1 as two as an example, in the movement process, if the lifting device 1 drives the cavity 100 to move downward, and the movement ends of the two lifting devices 1 are not completely synchronized, for example, the movement speed of the lifting device 1 on the first side is relatively fast, and the movement speed of the lifting device 1 on the second side is relatively slow, at this time, as shown in Figure 6 , the height of the movement end of the lifting device 1 on the first side is lower than the height of the movement end of the lifting device 1 on the second side, under the comprehensive stress of the two first elastic bodies 23, the compression amount of the first elastic body 23 on the first side becomes smaller, that is, the size of the first elastic body 23 on the first side becomes larger, and the compression amount of the first elastic body 23 on the second side becomes larger, that is, the size of the first elastic body 23 on the second side becomes smaller, so as to ensure that the movement strokes of the movement ends of the first connecting bodies 21 on the two sides are the same, and then ensure that the horizontal degrees of the two floating connecting devices 2 are the same.

[0043] In an implementation manner, in order to improve the stability of the floating connection between the first connecting body 21 and the second connecting body 22, in the actual application process, one elastic structure is not limited to be arranged, and two elastic structures can also be arranged. For example, as shown in Figure 7 , on the basis of being sleeved with the first elastic body 23, as shown in Figure 7 and Figure 8 , the second connecting body 22 further includes a second connecting column 223, and the second connecting column 223 is connected with the sliding column 222.

[0044] As shown in Figure 7 , the second connecting column 223 is sleeved with a second elastic body 24, one end of the second elastic body 24 abuts against the sliding column 222, and the other end abuts against the outer edge of the upper end portion of the floating sleeve 211. It should be noted that in the working state, the second elastic body 24 is in a compressed state. In this way, when the cavity 100 is connected with the first connecting body 21, and the force of the first connecting body 21 on the cavity 100 changes, the floating connection is formed between the first connecting body 21 and the second connecting body 22, and the first elastic body 23 and the second elastic body 24 are arranged at the upper and lower ends of the sliding column 222, so as to improve the stability of the floating connection between the first connecting body 21 and the second connecting body 22.

[0045] Taking the number of lifting devices 1 as two as an example, in the movement process, if the lifting device 1 drives the cavity 100 to move downward, and the movement ends of the two lifting devices 1 are not completely synchronized, for example, the movement speed of the lifting device 1 on the first side is relatively fast, and the movement speed of the lifting device 1 on the second side is relatively slow. At this time, as shown in Figure 9As shown, the height of the movement end of the lifting device 1 on the first side is lower than the height of the movement end of the lifting device 1 on the second side. Under the comprehensive stress, the compression amount of the first elastic body 23 on the first side is small, that is, the size of the first elastic body 23 on the first side is large, the compression amount of the second elastic body 24 on the first side is large, that is, the size of the second elastic body 24 on the first side is small; the compression amount of the first elastic body 23 on the second side is large, that is, the size of the first elastic body 23 on the second side is small, the compression amount of the second elastic body 24 on the second side is small, that is, the size of the second elastic body 24 on the second side is large, so as to ensure that the movement stroke of the movement end of the first connecting body 21 on both sides is the same, and then ensure that the levelness of the ends of the two floating connecting devices 2 is the same.

[0046] It should be noted that the first connecting column 221, the sliding column 222 and the second connecting column 223 are integrally formed, for example, integrally formed by casting technology, and for example, formed by machining process from a bar material.

[0047] In actual application, in order to facilitate the installation and fixation of the floating connecting device 2, as shown in Figure 4 and Figure 7 As shown, the first connecting body 21 further comprises a connecting piece 212, one end of the connecting piece 212 is connected with the floating sleeve 211, and the other end is connected with the movement end of the lifting device 1. Taking the case of simultaneously arranging the first elastic body 23 and the second elastic body 24 as an example, the first elastic body 23 and the second connecting body 22 are first put into the upper end of the floating sleeve 211, then the second elastic body 24 is placed from the upper end of the floating sleeve 211, and the upper end of the floating sleeve 211 is connected by using the connecting piece 212 to block the opening of the upper end of the floating sleeve 211, wherein the lower end of the connecting piece 212 is connected with the floating sleeve 211 by a bolt, and the upper end of the connecting piece 212 is threadedly connected with the movement end of the lifting device 1.

[0048] The diameter of the sliding column 222 is greater than the diameter of the first connecting column 221 and the second connecting column 223. It should be noted that in actual application, in order to facilitate the installation of the second elastic body 24, the upper end of the second elastic body 24 can be arranged to abut against the bottom of the connecting piece 212.

[0049] In actual application, a cavity is arranged in the floating sleeve 211, so that the second connecting column 223 can move relative to the floating sleeve 211 in the axial direction.

[0050] In some embodiments, as shown in Figure 5 and Figure 8As shown, the sliding column 222 is provided with at least one guide groove 2221; the guide groove 2221 is nested with a guide body 3 abutting the inner wall of the floating sleeve 211. In this way, the guide body 3 is in contact with the inner wall of the floating sleeve 211, so that the guide body 3 floats up and down more smoothly.

[0051] In some embodiments, a plurality of guide grooves 2221 can be provided, and a same number of guide bodies 3 are correspondingly provided, so that the inclination of the second connecting body 22 in the floating sleeve 211 caused by a single guide body 3 can be avoided.

[0052] As shown in FIGS. 1 and 2, when the number of guide grooves 2221 is greater than one, for example, Figure 5 and Figure 8 As shown, when the number of guide grooves 2221 is two, a closed space is formed between the two guide grooves 2221 due to the guide bodies 3, and it is easier to form a closed space between the two guide grooves 2221 when the guide bodies 3 are provided as air-tight sealing rings. Figure 10 and Figure 11 As shown in FIGS. 1 and 2, in the embodiments of the present application, a first exhaust passage 4 is arranged between the two adjacent guide grooves 2221; the first exhaust passage 4 communicates with the first chamber, as shown in FIGS. 1 and 2, Figure 3 、 Figure 10 and Figure 11 As shown, the upper end of the floating sleeve 211 is provided with a second exhaust passage 5 communicating with the first chamber, so that the first chamber is in communication with the space outside the floating sleeve 211. The first chamber is a chamber formed between the sliding column 222 and the upper end of the floating sleeve 211. In this way, when the space where the floating connecting device 2 is arranged is set as a vacuum, the gas inside the floating sleeve 211 can be exhausted, so that a sealed space where gas is retained in the vacuum environment can be avoided.

[0053] It should be noted that a second chamber is formed between the sliding column 222 and the lower end of the floating sleeve 211, and in actual application, the position where the first connecting column 221 extends out of the floating sleeve 211 is a gap, so that the gas in the second chamber can be exhausted through the gap at the position where the first connecting column 221 extends out of the floating sleeve 211.

[0054] The embodiments of the present application also provide a wafer reaction device, which comprises a wafer reaction chamber, and further comprises a movement mechanism of the wafer reaction chamber.

[0055] The motion mechanism of the wafer reaction cavity and the wafer reaction equipment provided by the embodiment of the application include at least two lifting devices 1 and a floating connection device 2 corresponding to the lifting devices 1; the floating connection device 2 includes a first connecting body 21 and a second connecting body 22, the first connecting body 21 includes a floating sleeve 211, and the floating sleeve 211 is connected to the motion end of the lifting device 1; the second connecting body 22 is arranged in the floating sleeve 211, and the second connecting body 22 is connected to the cavity 100 of the wafer reaction cavity; the second connecting body 22 and the floating sleeve 211 are floatingly connected, so that the levelness of the end of the corresponding floating connection device 2 is improved when the at least two lifting devices 1 move synchronously. In the embodiment of the application, when the motion ends of the lifting devices 1 on both sides do not move completely synchronously, due to the gravity of the cavity 100 and the joint action of the floating connection between the first connecting body 21 and the second connecting body 22, the end level of the second connecting body 22 on both sides of the cavity 100 can be the same, so that the floating connection device 2 provided by the embodiment of the application can improve the levelness of the cavity 100 when the at least two lifting devices 1 move synchronously.

[0056] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been described in detail in order to not obscure the understanding of this description. Like reference numerals refer to like elements throughout. Where certain embodiments of the application can not be described with a specific combination of elements, it is understood that no combination of elements is meant to imply a preference or requirement for such combination.

[0057] It is noted that the foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present application. While the application has been described with reference to preferred embodiments thereof, it is understood that the application is not limited thereto and modifications can be made by those skilled in the art. Any reference signs in the claims should not be construed as limiting the scope of the claims. The word "comprising" does not exclude the presence of elements or steps other than those listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and the latter is preferably implemented by a computer program. In the unit claim enumerating several means, several of these means can be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. The references in the specification to "one embodiment", "an embodiment", "exemplary embodiment", "one specific embodiment" or the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

Claims

1. A motion mechanism for a wafer reaction chamber, comprising at least two lifting devices (1), characterized in that, Also include: Floating connection device (2); The floating connection device (2) comprises a first connecting body (21) and a second connecting body (22), the first connecting body (21) comprises a floating sleeve (211), and the floating sleeve (211) is connected with the movement end of the lifting device (1); The second connecting body (22) is arranged in the floating sleeve (211), and the second connecting body (22) is connected with the cavity (100) of the wafer reaction cavity, and the second connecting body (22) is floatingly connected with the floating sleeve (211), so that the levelness of the cavity (100) is improved when at least two lifting devices (1) move synchronously.

2. The motion mechanism of a wafer reaction cavity according to claim 1, wherein, The second connecting body (22) comprises a first connecting column (221) and a sliding column (222), the cross-sectional size of the first connecting column (221) is smaller than that of the sliding column (222); one end of the first connecting column (221) is connected with the sliding column (222), and the other end extends out of the floating sleeve (211) and is connected with the cavity (100); The sliding column (222) is slidingly arranged in the floating sleeve (211), and a first elastic body (23) is sleeved on the first connecting column (221), one end of the first elastic body (23) abuts against the sliding column (222), and the other end abuts against the outer edge of the lower end of the floating sleeve (211).

3. The motion mechanism of a wafer reaction cavity according to claim 2, wherein, The second connecting body (22) further comprises a second connecting column (223), the second connecting column (223) is connected with the sliding column (222), a second elastic body (24) is sleeved on the second connecting column (223), and one end of the second elastic body (24) abuts against the sliding column (222), and the other end abuts against the outer edge of the upper end of the floating sleeve (211).

4. The motion mechanism of a wafer reaction cavity according to claim 1, wherein, The first connecting body (21) further comprises a connecting piece (212), one end of the connecting piece (212) is connected with the floating sleeve (211), and the other end is connected with the movement end of the lifting device (1).

5. The motion mechanism of a wafer reaction cavity according to claim 1, wherein, A cavity is formed in the floating sleeve (211), so that the second connecting body (22) can move relative to the floating sleeve (211) in the axial direction.

6. The motion mechanism of a wafer reaction cavity according to claim 2 or 3, wherein, The sliding column (222) is provided with at least one guide groove (2221); The guide groove (2221) is nested with a guide body (3) abutting against the inner wall of the floating sleeve (211).

7. The motion mechanism of a wafer reaction cavity according to claim 6, wherein, When the number of the guide grooves (2221) is more than one, a first exhaust channel (4) is arranged between adjacent two guide grooves (2221); The first exhaust channel (4) communicates with a first chamber, and the upper end of the floating sleeve (211) is provided with a second exhaust channel (5) communicating with the first chamber, so that the second exhaust channel (5) communicates with the outside of the floating sleeve (211), and the first chamber is a chamber formed between the sliding column (222) and the upper end of the floating sleeve (211).

8. The motion mechanism of a wafer reaction cavity according to claim 3, wherein, The diameter of the sliding column (222) is greater than that of the first connecting column (221) and the second connecting column (223).

9. The motion mechanism of a wafer reaction cavity according to claim 1, wherein, The at least two lifting devices (1) are fixedly connected to the upper cover plate (200) of the wafer reaction cavity, and the at least two lifting devices (1) are symmetrically distributed relative to the vertical axis of the upper cover plate (200).

10. A wafer reaction apparatus characterized by comprising: The wafer reaction equipment comprises a wafer reaction cavity, and further comprises the motion mechanism of the wafer reaction cavity according to any one of claims 1-9.

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