Injection mold frame with positioning function

Abstract

The utility model relates to the technical field of injection mold frames, and discloses an injection mold frame with a positioning function, which comprises a base, a heat dissipation mechanism is fixedly arranged in the middle of the upper end of the base, telescopic rods are fixedly arranged at four corners of the upper end of the base, and a top plate is fixedly arranged at the upper ends of the telescopic rods. Mounting frames are fixedly arranged at the positions, close to the two sides, of the middle of the upper end of the base, guide rods are fixedly arranged at the four corners of the upper ends of the mounting frames, a plurality of limiting holes are formed in the two sides of the upper ends of the mounting frames and the top plate, and heat dissipation fin plates are fixedly arranged in the middles of the mounting frames through threads; and a semiconductor refrigeration box is fixedly arranged on one side of the water tank. According to the device, the guide rod is matched with the bearing for use, and the four telescopic rods drive the top plate to stably lift, so that the upper mold and the lower mold can be accurately positioned in the mold opening and closing process, the accuracy of injection molding production is guaranteed, and the product quality is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to injection mold frame technical field especially, relates to a kind of injection mold frame with positioning function. BACKGROUND

[0002] Injection mold frame is the important component indispensable in injection molding process, and its size standard has direct influence on the performance of mould and the quality of molding product, the selection of injection mold frame needs to consider multiple factors, including the type, size and material of mold frame.

[0003] Traditional injection mold frame with positioning function is all formulated according to upper and lower mould model, cannot replace module when using, replace plastic shape, not adapt to more use environment, inconvenient to use, practicality is weak, can not satisfy people's demand.

[0004] Therefore, the person skilled in the art provides an injection mold frame with positioning function to solve the problems raised in the background. SUMMARY

[0005] The utility model aims at solving the shortcoming in prior art, and provides an injection mold frame with positioning function, the device is used in cooperation with bearing by guide rod, and four telescopic rods drive top plate stable lifting, so that the upper and lower moulds can be accurately positioned during mold opening and closing, ensuring the accuracy of injection molding production, effectively improving product quality, the mounting bracket and the upper end of top plate of the device are provided with a plurality of limiting holes, which can meet the installation needs of different models of moulds, enterprises do not need to frequently replace mold frame for different moulds, reduce cost, enhance the practicality of mold frame, and facilitate people to use.

[0006] To achieve the above object, the utility model provides the following technical scheme: an injection mold frame with positioning function, including base, the upper end middle part position of base is fixedly arranged with heat dissipation mechanism, the upper end four corner positions of base are fixedly arranged with telescopic rod, the upper end of telescopic rod is fixedly arranged with top plate, the upper end middle part of base is fixedly arranged with mounting bracket on both sides, the upper end four corner places of mounting bracket are fixedly arranged with guide rod, the upper end both sides of mounting bracket and top plate are provided with a plurality of limiting holes;

[0007] The mounting bracket middle part is fixedly provided with heat dissipation fin through screw thread, the heat dissipation mechanism includes water tank, one side of water tank is fixedly arranged with semiconductor refrigeration tank, the inner bottom surface other side position of water tank is fixedly arranged with water pump, the output end of water pump is fixedly arranged with water inlet pipe, the other side of water inlet pipe is fixedly arranged with coiled pipe, the other side of coiled pipe is fixedly arranged with water outlet pipe.

[0008] Further, the upper end middle part position of water tank is fixedly arranged with mounting plate, the other side of semiconductor refrigeration tank is fixedly arranged with refrigeration pipe.

[0009] Further, the middle position of the lower end of the top plate is provided with an upper mold fixed by screwing, and the middle position of the upper end of the mounting frame is provided with a lower mold fixed by screwing.

[0010] Further, the four corners of the lower end of the base are fixedly provided with supporting legs, and the middle position of the lower end of the base is fixedly provided with a plurality of spring dampers.

[0011] Further, the middle position of the upper end of the top plate is fixedly provided with a feeding pipe, and the lower end of the feeding pipe is fixedly provided with a discharging port.

[0012] Further, the four corners of the lower end of the upper mold are fixedly provided with limit rods.

[0013] Further, the four corners of the inside of the top plate are fixedly provided with a plurality of bearings.

[0014] The utility model has the advantages of the following beneficial effects:

[0015] 1. The injection mold frame with positioning function disclosed by the utility model can be precisely positioned during mold opening and closing through the cooperation of the guide rod and the bearing and the stable lifting of the top plate driven by the four telescopic rods, the precision of injection molding production is ensured, the product quality is effectively improved, the mounting frame and the upper end of the top plate of the device are provided with a plurality of limiting holes, the installation requirements of different types of molds can be met, enterprises do not need to frequently replace the mold frame for different molds, the cost is reduced, the practicality of the mold frame is enhanced, and the device is convenient for people to use.

[0016] 2. The injection mold frame with positioning function disclosed by the utility model is provided with a special heat dissipation mechanism, water is stored in the water tank, the semiconductor refrigeration tank is refrigerated, the water pump pressurizes the cold water to circulate through the serpentine pipe, the mold heat absorbed by the heat dissipation fin plate is taken away, the mold cooling is accelerated, the injection molding cycle is shortened, the production efficiency is improved, the cooperation of the water inlet pipe, the serpentine pipe and the water outlet pipe realizes the recycling of water, and the waste of water resources is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic view of the shaft side of the utility model;

[0018] Figure 2 It is a schematic view of the side view of the shaft side of the utility model;

[0019] Figure 3 It is a schematic view of the front view of the shaft side of the utility model;

[0020] Figure 4 It is a schematic view of the front view of the water tank of the utility model.

[0021] LEGEND:

[0022] 1, base; 2, telescopic rod; 3, top plate; 4, mounting frame; 5, lower mold; 6, guide rod; 7, bearing; 8, heat dissipation mechanism; 9, limiting hole; 10, support leg; 11, feed pipe; 12, heat dissipation fin; 13, spring damper; 14, upper mold; 801, water tank; 802, semiconductor refrigeration tank; 803, mounting plate; 804, water outlet pipe; 805, water inlet pipe; 806, water pump; 807, coiled pipe; 808, refrigeration pipe. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] Referring to Figures 1-3 An embodiment provided by the utility model: a injection mold frame with positioning function, including base 1, the upper end four corner positions of base 1 are fixedly provided with telescopic rod 2, the upper end of telescopic rod 2 is fixedly provided with top plate 3, the upper end middle part of base 1 is fixedly provided with mounting frame 4 near both sides, the upper end four corner places of mounting frame 4 are fixedly provided with guide rod 6, a plurality of limiting holes 9 are formed in the upper end both sides of mounting frame 4 and top plate 3, heat dissipation fin 12 is fixedly arranged in the middle part of mounting frame 4 through screw, upper mold 14 is fixedly arranged in the middle part of the lower end of top plate 3 through screw, lower mold 5 is fixedly arranged in the middle part of the upper end of mounting frame 4 through screw, support leg 10 is fixedly arranged in the lower end four corner places of base 1, a plurality of spring dampers 13 are fixedly arranged in the middle part of the lower end of base 1, feed pipe 11 is fixedly arranged in the middle part of the upper end of top plate 3, discharge port is fixedly arranged in the lower end of feed pipe 11, limiting rod is fixedly arranged in the lower end four corner places of upper mold 14, a plurality of bearings 7 are fixedly arranged in the four corner places inside top plate 3;

[0025] Specifically, the base 1 is conducive to the fixed installation of the telescopic rod 2, the four telescopic rods 2 are conducive to driving the top plate 3 to stably rise and fall, the top plate 3 is conducive to the threaded installation of the upper mold 14, the mounting frame 4 is conducive to the threaded installation of the lower mold 5, the top plate and the upper end of the mounting frame 4 are provided with a plurality of limiting holes 9, which is conducive to meeting the installation of molds of different models and improving the applicability of the device, the heat dissipation fin 12 is conducive to absorbing the heat generated during mold injection, and the heat dissipation mechanism 8 is used to take away the heat on the mold, accelerate the mold cooling, the lower end of the supporting leg 10 is provided with a shock pad, which is conducive to the use of the spring damper 13, which is conducive to supporting the entire device and buffering the vibration generated during the use of the device, the feeding pipe 11 is conducive to the entry of the injection material, the discharge port at the lower end of the feeding pipe 11 is aligned with the feeding port at the upper end of the upper mold 14, which facilitates the injection of the material into the mold, and the guide rod 6 is used in cooperation with the bearing 7, which is conducive to the accurate positioning of the mold.

[0026] Referring to Figures 3-4 The upper end of the base 1 is fixedly provided with a heat dissipation mechanism 8, the heat dissipation mechanism 8 comprises a water tank 801, one side of the water tank 801 is fixedly provided with a semiconductor refrigeration tank 802, the other side of the inner bottom surface of the water tank 801 is fixedly provided with a water pump 806, the output end of the water pump 806 is fixedly provided with an inlet pipe 805, the other side of the inlet pipe 805 is fixedly provided with a coiled pipe 807, the other side of the coiled pipe 807 is fixedly provided with an outlet pipe 804, and the upper end of the water tank 801 is fixedly provided with a mounting plate 803, and the other side of the semiconductor refrigeration tank 802 is fixedly provided with a refrigeration pipe 808.

[0027] Specifically, the water tank 801 is conducive to the storage of water source, the semiconductor refrigeration tank 802 is used in cooperation with the refrigeration pipe 808, which is conducive to the refrigeration of the water in the water tank 801, the water pump 806 is conducive to the pressurization of the water in the water tank 801 and the delivery of the water to the coiled pipe 807 through the inlet pipe 805, the coiled pipe 807 is in contact with the lower end of the heat dissipation fin 14, and the heat absorbed by the heat dissipation fin 12 can be taken away, so as to facilitate the rapid cooling of the mold, the outlet pipe 804 is arranged on the other side of the coiled pipe 807, and the water body enters the water tank 801 again through the outlet pipe 804, realizing the circulation use, and the mounting plate 803 is conducive to the fixed installation of the coiled pipe 807.

[0028] Working principle: when using the injection mold frame, first place the device in the appropriate work site, support leg 10 and its lower end of the shock pad contact with the ground, with spring damper 13 to support the entire device and damping buffer effect, when the need for injection operation, through the top plate 3 upper end of the middle of the feed pipe 11 into the material, the material into the upper mold 14 feed pipe 11 lower end of the discharge port into the feed port, start injection process, during injection, the mold will produce heat, the heat on the lower mold 5 on the heat dissipation fin plate 12 installed in the middle of the heat sink 4, at this time, the cooling mechanism 8 starts to work, the water in the water tank 801 is cooled under the action of semiconductor refrigeration tank 802 and refrigeration pipe 808, water pump 806 pressurized to make the cold water through the water inlet pipe 805 to the serpentine pipe 807, the serpentine pipe 807 because of the contact with the lower end of the heat dissipation fin plate 12, so as to take away the heat absorbed by the heat dissipation fin plate 12, the heated water backflow to the water tank 801 through the water outlet pipe 804, realize the water circulation, accelerate the mold cooling;

[0029] Secondly, in the mold installation, the installation frame 4 and the top plate 3 upper end of both sides of the plurality of limiting hole 9, can meet the installation requirements of different models of mold, improve the applicability of the device, and in the mold opening and closing process, four telescopic rod 2 driven top plate 3 stable lifting, at the same time, the guide rod 6 cooperate with the bearing 7 in the four corners of the top plate 3, let the upper mold 14 and the lower mold 5 can be accurately positioned, guarantee the precision and stability of injection molding production.

[0030] Finally, it should be pointed out that: the above described only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing detailed description of the present application, for those skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.

Claims

1. An injection mold base with positioning function, comprising a base (1), characterized in that: A heat dissipation mechanism (8) is fixedly installed at the middle of the upper end of the base (1). Telescopic rods (2) are fixedly installed at the four corners of the upper end of the base (1). A top plate (3) is fixedly installed at the upper end of the telescopic rods (2). A mounting bracket (4) is fixedly installed at the middle of the upper end of the base (1) near both sides. A guide rod (6) is fixedly installed at the four corners of the upper end of the mounting bracket (4). Multiple limiting holes (9) are opened at the upper sides of the mounting bracket (4) and the top plate (3). The mounting bracket (4) is fixedly provided with a heat dissipation fin plate (12) by threads in the middle. The heat dissipation mechanism (8) includes a water tank (801). A semiconductor cooling box (802) is fixedly provided on one side of the water tank (801). A water pump (806) is fixedly provided on the other side of the bottom surface of the water tank (801). A water inlet pipe (805) is fixedly provided at the output end of the water pump (806). A serpentine pipe (807) is fixedly provided on the other side of the water inlet pipe (805). A water outlet pipe (804) is fixedly provided on the other side of the serpentine pipe (807).

2. The injection mold base with positioning function according to claim 1, characterized in that: An installation plate (803) is fixedly installed at the middle of the upper end of the water tank (801), and a refrigeration pipe (808) is fixedly installed on the other side of the semiconductor refrigeration box (802).

3. The injection mold base with positioning function according to claim 1, characterized in that: The upper mold (14) is fixedly installed at the lower middle position of the top plate (3) by threads, and the lower mold (5) is fixedly installed at the upper middle position of the mounting bracket (4) by threads.

4. The injection mold base with positioning function according to claim 1, characterized in that: Support legs (10) are fixedly installed at the four corners of the lower end of the base (1), and multiple spring dampers (13) are fixedly installed at the middle of the lower end of the base (1).

5. The injection mold base with positioning function according to claim 1, characterized in that: A feed pipe (11) is fixedly installed at the middle of the upper end of the top plate (3), and a discharge port is fixedly installed at the lower end of the feed pipe (11).

6. The injection mold base with positioning function according to claim 3, characterized in that: Limiting rods are fixedly installed at the four corners of the lower end of the upper mold (14).

7. The injection mold base with positioning function according to claim 1, characterized in that: Multiple bearings (7) are fixedly installed at the four corners inside the top plate (3).

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