Modularized refill module structure

Abstract

The utility model discloses a modularized refill module structure. The modularized refill module structure comprises a refill body, a first signal circuit layer (14), a second signal circuit layer (13) and a third signal circuit layer (15) are arranged on the front face and the back face of the top of the PCB (1) respectively; the screw tooth copper piece (4) is used for fixing the PCB (1), improving the mechanical strength and playing a role in shielding external electromagnetic interference; and the first plastic layer (2) and the second plastic layer (5) are coated outside the PCB (1) through an injection molding process. According to the modularized refill module structure provided by the utility model, accurate conduction between the circuit layer and the external electroplated layer is realized through a process that the plastic layer is coated outside the PCB and the electroplated layer is formed after laser etching, activation and segmentation are carried out on the surface of the plastic layer; the problems of unstable signal transmission, complex assembly and the like existing in a lead welding or single-sided PCB (Printed Circuit Board) connection mode in a traditional capacitive pen refill module are avoided, and the stability and the consistency of signal transmission are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of capacitive pens, more specifically to a modularized refill module structure. BACKGROUND

[0002] With the wide application of capacitive touch technology, as an important touch input device, capacitive pen is widely used in the field of electronic products such as tablet computers and smart phones. The performance of capacitive pen directly affects the user experience, especially the signal transmission stability, energy consumption control and modular assembly capability, which has become the key direction of capacitive pen product optimization design.

[0003] The existing capacitive pen refill module structure usually adopts traditional wire welding or single-layer PCB board combined with metal shell to realize the transmission of capacitive pen signal. However, this structure has the following disadvantages:

[0004] The traditional wire connection method has the problems of multiple manual welding steps, high precision requirement and low assembly efficiency, which is not conducive to large-scale automated production.

[0005] The existing capacitive pen refill body is easily affected by welding quality in circuit connection, leading to unstable signal transmission and affecting touch performance.

[0006] Due to insufficient consideration of electromagnetic shielding design in some capacitive pens, electromagnetic interference easily leads to signal drift, and the energy consumption is large during long-term use, which is not conducive to improving the endurance time.

[0007] The existing capacitive pen refill module design generally has large volume, which is not conducive to the development trend of product thinness, and cannot fully meet the demand of portable devices for capacitive pen miniaturization and integration. SUMMARY

[0008] In order to solve the above problems, the utility model provides a modularized refill module structure, which optimizes the signal transmission path by adopting PCB board, plastic layer, laser engraving activation, electroplating process and tungsten tooth copper shielding design, realizes modular and integrated assembly, so as to improve production efficiency, reduce power consumption, enhance signal stability and realize miniaturization.

[0009] The utility model is realized by the following technical solutions: a modularized refill module structure, comprising:

[0010] The core body;

[0011] The PCB board has signal one circuit layer, signal two circuit layer and signal three circuit layer on the top front and back surface respectively;

[0012] Tungsten tooth copper piece is used to fix the PCB board, improve the mechanical strength and play the role of shielding external electromagnetic interference;

[0013] The first plastic layer and the second plastic layer are coated outside the PCB board through an injection molding process;

[0014] The electroplated layer comprises a signal one electroplated layer, a signal two electroplated layer and a signal three electroplated layer, wherein:

[0015] The signal one electroplated layer is annularly wrapped outside the second plastic layer and is in communication connection with the signal one circuit layer;

[0016] The signal two electroplated layer is annularly wrapped outside the first plastic layer, the upper end of the signal two electroplated layer is provided with a first tapered hole, the bottom of the signal two electroplated layer is provided with a second tapered hole, the first tapered hole is free of electroplating, the second tapered hole is connected with the PCB board through electroplating, and the signal two circuit layer is in communication connection with the signal two electroplated layer;

[0017] The signal three electroplated layer is provided with a third tapered hole at the upper end and a fourth tapered hole at the bottom, the third tapered hole is electroplated to be connected with the PCB board, the fourth tapered hole is free of electroplating, and the signal three circuit layer is in communication connection with the signal three electroplated layer through the third tapered hole.

[0018] As a preferred technical scheme, the first plastic layer and the second plastic layer are activated and divided in local areas requiring conduction through laser engraving processing, so as to form the electroplated layer, and accurate conduction between the circuit layer and the external electroplated layer is ensured.

[0019] As a preferred technical scheme, the PCB board adopts a multi-layer structure, and the signal circuit layers are distributed on different layers.

[0020] As a preferred technical scheme, the radish-shaped copper piece is connected with the PCB board and the plastic layer through a threaded connection mode.

[0021] As a preferred technical scheme, the first tapered hole and the third tapered hole are free of electroplating treatment to avoid short circuit or signal interference, and the second tapered hole and the fourth tapered hole are electrically connected with the PCB board through electroplating.

[0022] As a preferred technical scheme, the signal two circuit layer and the signal three circuit layer adopt a vertical interconnection structure and are connected with the tapered holes through the electroplated layer.

[0023] The module pen core module structure has the advantages that the circuit layer and the external electroplated layer are accurately connected through the plastic layer coated outside the PCB board and the electroplated layer formed after laser engraving and activation division on the surface of the plastic layer, signal transmission instability and complex assembly problems existing in the traditional capacitor pen pen core module are avoided, the stability and consistency of signal transmission are improved, and the module pen core module structure is stable and reliable in use.

[0024] Meanwhile, the electrical communication between the signal two circuit pin and the signal three circuit pin and the corresponding plating layer is realized through the tapered hole plating layer structure, the signal path is more compact and reasonable, the internal wiring is simplified, the miniaturized design of the module is facilitated, and through the tapered hole design, the laser engraving activation is facilitated throughout the inner wall and the bottom of the hole, so that the metal can be plated, and the straight hole cannot be plated;

[0025] In addition, through the cooperation and fixation of the copper tooth and the PCB board, the mechanical strength of the module as a whole is improved, the electromagnetic interference from the outside is shielded, the power consumption of the capacitive pen is effectively reduced, and the problem of touch failure or signal drift caused by external electromagnetic signal interference is avoided.

[0026] The utility model discloses a whole adopts modular structure, and each circuit pin cooperates with the shape of PCB board, is convenient for and capacitive pen rear end circuit welding connection, further simplifies assembly procedure, improves production efficiency, adapts to the market demand of current capacitive pen product to light and thin, integration direction development. DRAWINGS

[0027] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will be briefly introduced to the drawing needed to be used in the embodiment or prior art description, obviously, the drawing in the following description only some embodiments of the utility model, for ordinary skilled person in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings.

[0028] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0029] Figure 2 It is a plane structure schematic view of the utility model;

[0030] Figure 3 It is a sectional structure schematic view of the utility model. DETAILED DESCRIPTION

[0031] All features disclosed in this specification, or all steps of any methods or processes disclosed, can be combined in any manner, except where features or steps are mutually exclusive.

[0032] Any feature disclosed in this specification, unless stated otherwise, can be replaced by any equivalent or similar feature, or by a feature with the same function. That is, each feature is only one example of a range of equivalent or similar features.

[0033] As Figure 1 And Figure 2As shown, the utility model relates to a modularized refill module structure, including core body, PCB board 1, copper piece 4 of rong tooth, first plastic layer 2, second plastic layer 5 and electroplating layer. Wherein, the top front and back of PCB board 1 are provided with signal one circuit layer 14, signal two circuit layer 13 and signal three circuit layer 15 respectively. Copper piece 4 of rong tooth is used for fixing PCB board 1, improves the mechanical strength of whole, shielding the function of outside electromagnetic interference simultaneously. First plastic layer 2 and second plastic layer 5 are coated in the outside of PCB board 1 through injection molding process to provide protection and ensure the stability of module.

[0034] In the structure, electroplating layer includes signal one electroplating layer 10, signal two electroplating layer 6 and signal three electroplating layer 12. Wherein, signal one electroplating layer 10 is annularly wrapped in the outside of second plastic layer 5 and is connected in communication with signal one circuit layer 14. Signal two electroplating layer 6 is annularly wrapped in the outside of first plastic layer 2, is provided with first taper hole 8 on its upper end, is provided with second taper hole 11 at the bottom, first taper hole 8 is not electroplated, and second taper hole 11 is connected with PCB board 1 through electroplating mode, so that signal two circuit layer 13 is connected in communication with signal two electroplating layer 6. The upper end of signal three electroplating layer 12 is provided with third taper hole 3, and the bottom is provided with fourth taper hole 16, third taper hole 3 is electroplated and connected with PCB board 1, and fourth taper hole 16 is not electroplated, so that signal three circuit layer 15 is connected in communication with signal three electroplating layer 12 through third taper hole 3.

[0035] In the manufacturing process, first plastic layer 2 and second plastic layer 5 are activated and divided in the area needing conduction locally through laser engraving treatment to form electroplating layer. The laser engraving activation and division technology can ensure the accurate conduction between circuit layer and external electroplating layer, avoid the unstable signal transmission problem caused by wire welding or single-sided PCB board connection mode, and improve the stability and consistency of signal. Meanwhile, the method can also reduce internal wiring, so that the overall structure is more compact.

[0036] PCB board 1 adopts a multilayer structure, and signal circuit layers are distributed on different layers, so that circuit wiring is more optimized, and signal path is shorter, thereby reducing signal loss and improving transmission efficiency. The multilayer PCB structure design not only improves the performance of the capacitive pen, but also provides support for subsequent miniaturization.

[0037] Copper piece 4 of rong tooth is connected with PCB board 1 and plastic layer through threaded connection mode, so that the overall module has high mechanical stability, can effectively shield external electromagnetic signal interference, reduce capacitive pen power consumption, prevent touch failure or signal drift phenomenon caused by external electromagnetic signal influence. Meanwhile, threaded connection mode makes the module more convenient in the assembly process, and improves production efficiency.

[0038] In order to optimize the transmission path of the signal, the first taper hole 8 and the third taper hole 3 are treated by non-electroplating to avoid short circuit or signal interference, and the second taper hole 11 and the fourth taper hole 16 are electrically connected with the PCB board by electroplating. Through this design, the signal circuit layers can be reliably connected to the corresponding electroplated layers, while ensuring efficient transmission of the signal and avoiding signal attenuation problems caused by welding or other connection methods.

[0039] The signal two circuit layer 13 and the signal three circuit layer 15 adopt a vertical interconnection structure, which is connected with the taper hole through the electroplated layer to realize efficient transmission of the signal. The use of the vertical interconnection structure makes the signal path more compact and reasonable, reduces the horizontal wiring on the PCB board, improves the space utilization of the circuit design, and makes the whole module smaller, which meets the needs of the development of modern capacitive pen products in the direction of lightness and integration. In addition, this structure design can also improve the production consistency, reduce the assembly error, and make the product maintain high quality stability in batch production.

[0040] The utility model discloses a plastic layer is coated on the PCB board, and the electroplated layer is formed after the surface of plastic layer is carried out laser carving activation segmentation, makes the accurate conduction between the circuit layer and the external electroplated layer, avoids the problem of unstable signal transmission, complex assembly and other problems of traditional capacitor pen core module adopting the wire welding or single-sided PCB board connection mode, improves the stability and consistency of signal transmission. At the same time, through the taper hole electroplated layer structure, the electrical communication of signal two circuit pin and signal three circuit pin and corresponding electroplated layer is realized, the signal path is more compact and reasonable, and the internal wiring is simplified, which is helpful to the miniaturization design of the module. In addition, through the cooperation and fixation of the laser tooth copper piece and the PCB board, not only the mechanical strength of the module is improved, but also the function of shielding external electromagnetic interference is played, the power consumption of the capacitive pen is effectively reduced, and the problem of touch failure or signal drift caused by external electromagnetic signal interference is avoided. The utility model discloses a modular structure as a whole, the circuit pin is matched with the shape of the PCB board, is convenient for welding connection with the capacitive pen rear-end circuit, further simplifies the assembly process, improves the production efficiency, and meets the market demand of the development of the capacitive pen product in the direction of lightness and integration.

[0041] The above is only a specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any change or replacement without creative labor should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited to the protection scope defined in the claims.

Claims

1. A modular pen refill module structure, characterized in that, include: Core; The PCB board (1) has a signal circuit layer (14), a signal circuit layer (13) and a signal circuit layer (15) on its top front and back sides respectively; The screw copper parts (4) are used to fix the PCB board (1), improve mechanical strength and shield external electromagnetic interference; The first plastic layer (2) and the second plastic layer (5) are coated on the outside of the PCB board (1) by injection molding process; The electroplated layers include a signal-first electroplated layer (10), a signal-second electroplated layer (6), and a signal-third electroplated layer (12), wherein: The signal electroplating layer (10) is wrapped in a ring around the outside of the second plastic layer (5) and is communicatively connected to the signal circuit layer (14); The second electroplated layer (6) is wrapped in a ring around the outside of the first plastic layer (2). It has a first conical hole (8) at the top and a second conical hole (11) at the bottom. The first conical hole (8) is not electroplated, and the second conical hole (11) is connected to the PCB board (1) through electroplating, so that the second circuit layer (13) and the second electroplated layer (6) are connected in communication. The signal three-electroplated layer (12) has a third conical hole (3) at its upper end and a fourth conical hole (16) at its bottom. The third conical hole (3) is electroplated to connect to the PCB board (1), while the fourth conical hole (16) is not electroplated, so that the signal three-circuit layer (15) can communicate with the signal three-electroplated layer (12) through the third conical hole (3).

2. The modular pen refill module structure according to claim 1, characterized in that: The first plastic layer (2) and the second plastic layer (5) are activated and segmented in the local area that needs to be conductive by laser engraving to form the electroplated layer, ensuring precise conduction between the circuit layer and the external electroplated layer.

3. The modular pen refill module structure according to claim 1, characterized in that: The PCB board (1) adopts a multi-layer structure, with its signal circuit layers distributed on different layers.

4. The modular pen refill module structure according to claim 1, characterized in that: The threaded copper component (4) is connected to the PCB board (1) and the plastic layer by means of threaded connection.

5. The modular pen refill module structure according to claim 1, characterized in that: The first conical hole (8) and the third conical hole (3) are electroless to avoid short circuits or signal interference, while the second conical hole (11) and the fourth conical hole (16) are electrically connected to the PCB board by electroplating.

6. The modular pen refill module structure according to claim 1, characterized in that: The signal second circuit layer (13) and the signal third circuit layer (15) adopt a vertical interconnection structure and are connected to the tapered hole through an electroplated layer.

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