Thickness measuring and lettering all-in-one machine

Abstract

The utility model discloses a thickness measuring and lettering all-in-one machine which comprises a machine table, a feeding belt arranged on the machine table, a copper foil thickness measuring device, a laser lettering device and a laser thickness measuring device. The copper foil thickness measuring device, the laser lettering device and the laser thickness measuring device are sequentially arranged in the conveying direction of the feeding belt. The feeding belt enables a plate to be measured and lettered to pass through the working areas of the copper foil thickness measuring device, the laser lettering device and the laser thickness measuring device in sequence. According to the utility model, through the integrated design, the automatic copper foil thickness measurement, laser thickness measurement and laser lettering work of the PCB can be satisfied, the overall work efficiency can be effectively improved, automation can be realized, the labor cost can be saved, the space occupation rate of the overall equipment can be saved, and the arrangement, maintenance and inspection costs of the equipment can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board automatic production and processing equipment technical field especially relates to a thickness measuring and lettering all -in -one. BACKGROUND

[0002] When carrying out the pressing work of PCB board, need to use PP film to bond and insulate the inner layer CORE through high temperature, simultaneously, the outer layer needs to use copper foil for the processing of outer layer circuitry. In order to prevent PP film, copper foil material error, generally will carry out the measurement of plate thickness, copper foil thickness after pressing, and inscribe characters on PCB board, to avoid the occurrence of the mixing condition. However, in the prior art, this to the measurement of plate thickness, the measurement of copper foil thickness and laser lettering are carried out on different equipment, therefore, need to adopt multiple equipment to carry out the operation, and the land area is large, and the cost is high, and the equipment cannot be connected in line operation between the equipment, and the efficiency is low.

[0003] Therefore, the prior art has defects and needs to be improved. UTILITY MODEL CONTENTS

[0004] The utility model aims at overcoming the insufficient of prior art, provide a thickness measuring and lettering all -in -one.

[0005] The utility model discloses a technical scheme as follows: provide a thickness measuring and lettering all -in -one, include: bench, set up on the feeding belt of bench, copper foil thickness measuring device, laser lettering device and laser thickness measuring device are set along the conveying direction of feeding belt in proper order, the plate material of waiting measurement and lettering passes through the working area of copper foil thickness measuring device, laser lettering device and laser thickness measuring device in proper order from feeding belt.

[0006] Further, the copper foil thickness measuring device includes a measurement mounting frame erected on the bench, and a plurality of copper foil thickness gauges arranged on the measurement mounting frame.

[0007] Further, the measurement mounting frame is made of aluminum profile.

[0008] Further, the copper foil thickness measuring device further includes a plurality of copper foil thickness gauges arranged below the feeding belt.

[0009] Further, the laser thickness measuring device includes a thickness measuring mounting frame erected on the bench, and a moving module arranged at both ends of the thickness measuring mounting frame.

[0010] Further, a lifting blocking mechanism is arranged below the laser marking device, and the lifting blocking mechanism comprises a lifting cylinder and a blocking plate arranged on the output end of the lifting cylinder.

[0011] Further, a plate beating positioning mechanism is arranged at the front end of the copper foil thickness measuring device in the feeding direction of the feeding belt, and the plate beating positioning mechanism comprises a plate beating driving mechanism arranged below the feeding belt, a plate beating support connected with the output end of the plate beating driving mechanism, a lifting driving mechanism arranged below the feeding belt, and a whole plate guide wheel arranged on the output end of the lifting driving mechanism.

[0012] Further, a feeding sensor is arranged in the feeding direction of the feeding belt.

[0013] By the above scheme, the automatic copper foil thickness measurement, laser thickness measurement and laser marking work of the PCB board are satisfied by the integrated design, the overall work efficiency is effectively improved, the automation is realized, the labor cost is saved, the space occupancy rate of the overall equipment is saved, and the setting and maintenance cost of the equipment is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a structural schematic view of the utility model.

[0015] Figure 2 It is a top view of the utility model. DETAILED DESCRIPTION

[0016] The utility model is described in detail below in combination with the drawings and specific embodiments.

[0017] Please refer to Figure 1 、 Figure 2 The utility model provides a thickness measuring and marking all-in-one machine, which comprises a machine table 1, a feeding belt 2 arranged on the machine table 1, a copper foil thickness measuring device 3, a laser marking device 4 and a laser thickness measuring device 5 arranged in sequence along the conveying direction of the feeding belt 2, and the feeding belt 2 sequentially passes the work area of the copper foil thickness measuring device 3, the laser marking device 4 and the laser thickness measuring device 5.

[0018] In operation, the plate to be measured and engraved is placed or conveyed onto the feeding belt 2, and the plate is conveyed forward by the feeding belt 2. When the plate moves below the copper foil thickness measuring device 3, the front edge of the plate is located at the engraving area of the laser engraving device 4, and the laser engraving device 4 and the copper foil thickness measuring device 3 are started to engrave the corresponding marks and characters on the edge of the plate, and at the same time, the copper foil thickness on the plate is measured by the copper foil thickness measuring device 3 to obtain the corresponding copper foil thickness data and upload to the control system. Then the feeding belt 2 continues to convey the plate forward, so that the plate moves below the laser thickness measuring device 5 to measure the overall thickness of the plate by the laser thickness measuring device 5.

[0019] In some embodiments, the copper foil thickness measuring device 3 comprises a measuring mount 31 arranged on the machine table 1, and a plurality of copper foil thickness gauges 32 arranged on the measuring mount 31, and the measuring mount 31 is suspended above the feeding belt 2. By arranging the measuring mount, the copper foil thickness gauges 32 are suspended above the feeding belt 2 to measure the thickness of the copper foil on the plate conveyed by the feeding belt 2, and the measured data is uploaded to the control system for the operator to check and save the corresponding measurement data.

[0020] In some embodiments, the measuring mount 31 is made of aluminum profile to facilitate processing and forming, and can meet the movement of the copper foil thickness gauges 32 along the groove on the aluminum profile to adapt to the testing needs of plates of different specifications and sizes, and can simultaneously test the thickness of the copper foil from different points on the plate to avoid deviation of the measurement results due to errors on the surface of the plate or the copper foil.

[0021] In some embodiments, the copper foil thickness measuring device 3 further comprises a plurality of copper foil thickness gauges 32 arranged below the feeding belt 2. By arranging the copper foil thickness gauges 32 on the measuring mount and below the feeding belt 2, the thickness of the copper foil on the surface and the bottom of the plate is measured respectively, effectively improving the overall measurement efficiency and avoiding repeated measurement work.

[0022] In some embodiments, the laser thickness measuring device 5 comprises a thickness measuring mount 51 arranged on the machine table 1, and a moving module 52 arranged at both ends of the thickness measuring mount 51, and a laser measuring head 53 is arranged at the center position of the thickness measuring mount 51 and the moving end of the moving module 52 respectively. The laser measuring head 53 arranged at the center position of the thickness measuring mount 51 measures the thickness of the center position of the plate, and at the same time, the moving module 52 adjusts the measurement position according to the width size of the plate and measures the thickness of the points on both sides of the plate, so as to calculate the actual thickness size of the plate according to the data of multiple points to avoid affecting the actual measurement result due to the measurement point being located at the uneven place on the surface of the plate.

[0023] In some embodiments, a lifting blocking mechanism 11 is arranged below the laser marking device 4, which includes a lifting cylinder and a baffle arranged on the output end of the lifting cylinder. The lifting cylinder drives the baffle to reciprocate up and down. When the plate is transported, the lifting cylinder is started to lift the baffle, thereby limiting the movement of the plate, so that the plate stays at the corresponding position of the baffle, thereby facilitating the laser marking of the edge position of the plate by the laser marking device 4. At the same time of laser marking, the copper foil thickness measuring device 3 measures the thickness of the copper foil attached on the plate, thereby improving the overall measurement and marking efficiency. After completing the copper foil thickness measurement and laser marking work, the lifting cylinder is reset to drive the baffle to move downward, so that the plate can continue to move forward under the transportation of the feeding belt 2.

[0024] In some embodiments, a clapper positioning mechanism 12 is arranged at the front end of the copper foil thickness measuring device 3 in the incoming direction of the feeding belt 2, which includes a clapper driving mechanism 121 arranged below the feeding belt 2, a clapper support 122 connected with the output end of the clapper driving mechanism 121, a lifting driving mechanism arranged below the feeding belt 2, and a whole plate guide wheel 123 arranged on the output end of the lifting driving mechanism. The clapper driving mechanism 121 drives the clapper support 122 to move from both sides of the feeding belt 2 to the middle direction, and the lifting driving mechanism drives the whole plate guide wheel 123 to move up and down from the gap of the feeding belt 2. The running direction of the whole plate guide wheel 123 is perpendicular to the feeding direction of the feeding belt 2. When the plate moves to the corresponding position of the clapper positioning mechanism 12, the lifting driving mechanism is started to lift the plate from the feeding belt 2, so that the plate is separated from the feeding belt 2. Then the clapper driving mechanism 121 is started to drive the clapper supports 122 on both sides to move synchronously towards the middle, thereby positioning the plate in the middle. When the plate is positioned in the middle, the plate slides on the whole plate guide wheel 123, effectively protecting the bottom surface of the plate from being scratched due to hard friction, and ensuring that the yield of the plate is not affected.

[0025] In some embodiments, a feeding sensor 13 is arranged in the incoming direction of the feeding belt 2. When the plate moves or is placed on the incoming end of the feeding belt 2, the feeding sensor 13 detects the plate in place and sends a corresponding signal to the control system. According to the size and conveying speed of the plate, the specific position of the plate in the moving process is calculated, thereby sequentially starting the clapper positioning mechanism 12, the lifting blocking mechanism 11, the copper foil thickness measuring device 3, the laser marking device 4, and the laser thickness measuring device 5, to complete the automatic measurement and marking work of the plate, reducing the manual participation.

[0026] In summary, this utility model, through its integrated design, enables automated copper foil thickness measurement, laser thickness measurement, and laser engraving of PCB boards, effectively improving overall work efficiency, achieving automation, saving labor costs, and reducing the overall space occupied by the equipment, thereby lowering the setup and maintenance costs.

[0027] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A thickness measuring and engraving integrated machine, characterized in that, include: The machine includes a feeding belt mounted on the machine, a copper foil thickness measuring device, a laser engraving device, and a laser thickness measuring device arranged sequentially along the conveying direction of the feeding belt. The feeding belt sequentially passes the board to be measured and engraved through the working areas of the copper foil thickness measuring device, the laser engraving device, and the laser thickness measuring device.

2. The thickness measuring and engraving integrated machine according to claim 1, characterized in that, The copper foil thickness measuring device includes: a measuring mounting frame mounted on the machine base, and several copper foil thickness gauges mounted on the measuring mounting frame, wherein the measuring mounting frame is suspended above the feeding belt.

3. The thickness measuring and engraving integrated machine according to claim 2, characterized in that, The measuring mounting bracket is made of aluminum profile.

4. The thickness measuring and engraving integrated machine according to claim 2, characterized in that, The copper foil thickness measuring device also includes several copper foil thickness gauges disposed below the feed belt.

5. The thickness measuring and engraving integrated machine according to claim 1, characterized in that, The laser thickness measuring device includes: a thickness measuring mounting frame mounted on the machine base, and a movable module disposed at both ends of the thickness measuring mounting frame. A laser measuring head is respectively disposed at the center of the thickness measuring mounting frame and at the moving end of the movable module.

6. The thickness measuring and engraving integrated machine according to claim 1, characterized in that, The laser engraving device is provided with a lifting and blocking mechanism below it. The lifting and blocking mechanism includes a lifting cylinder and a baffle plate disposed on the output end of the lifting cylinder. The lifting cylinder drives the baffle plate to move up and down reciprocally.

7. The thickness measuring and engraving integrated machine according to claim 1, characterized in that, A clapper positioning mechanism is provided at the front end of the copper foil thickness measuring device in the feeding direction of the feeding belt. The clapper positioning mechanism includes: a clapper driving mechanism disposed below the feeding belt, a clapper bracket connected to the output end of the clapper driving mechanism, a lifting driving mechanism disposed below the feeding belt, and a whole plate guide wheel disposed on the output end of the lifting driving mechanism. The clapper driving mechanism drives the clapper bracket to move from both sides of the feeding belt towards the middle, and the lifting driving mechanism drives the whole plate guide wheel to move up and down from the gap of the feeding belt. The direction of the whole plate guide wheel is perpendicular to the feeding direction of the feeding belt.

8. The thickness measuring and engraving integrated machine according to claim 1, characterized in that, A feed sensor is installed in the direction of material arrival of the feed belt.

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