High-precision lossless wafer detection mechanism

Abstract

The utility model discloses a high-precision lossless wafer detection mechanism, which comprises an annular hollow turntable, and a plurality of station clamps for clamping crystal oscillation wafers to be detected are arranged on the annular hollow turntable at intervals along the circumferential direction; the driving end of the stepping motor is in driving connection with the annular hollow rotating disc, and the stepping motor is used for driving the annular hollow rotating disc to rotate around the center axis of the stepping motor; the tail end of the crystal oscillation wafer suction cup mechanical arm assembly is provided with a fixed suction cup used for sucking a crystal oscillation wafer to be detected; the multi-station defect detection assembly is arranged in the hollow cavity of the annular hollow rotary table and comprises a plurality of detection tables which are arranged at intervals in the circumferential direction of the annular hollow rotary table; the crystal oscillator wafer classification device is used for classifying qualified crystal oscillator wafers and unqualified crystal oscillator wafers according to the crystal oscillator wafer detection state information transmitted by each detection table; and the reversal structure is arranged in the hollow cavity of the annular hollow turntable and is used for carrying out reversal operation on the crystal oscillator so as to detect the surface defects of the crystal oscillator.

Description

Technical Field

[0001] This utility model belongs to the field of machine vision and automated inspection technology, specifically relating to a high-precision non-destructive wafer inspection mechanism for detecting surface defects in crystal oscillators. Background Technology

[0002] Crystal oscillators, as key industrial components, are widely used in various industrial fields such as vacuum thin film deposition and metal electroplating. Their surface quality directly affects product performance; therefore, detecting surface defects in crystal oscillators is a crucial step in ensuring product quality. Traditional methods for detecting surface defects in crystal oscillators mainly rely on manual visual inspection. While this method has low initial costs, it suffers from low efficiency, and the results are susceptible to the subjective judgment of the inspectors, making consistency and reliability difficult to guarantee. With the expansion of production scale and the increasing demands for product quality, especially in the detection of minute defects, manual inspection methods can no longer meet the high standards of modern industrial production.

[0003] To overcome the shortcomings of manual inspection, the industry has begun to explore automated inspection methods based on machine vision. Machine vision technology, with its high objectivity, efficiency, and reliability, has shown great potential in the inspection of surface defects in crystal oscillators. However, existing machine vision inspection systems still have some design deficiencies, such as insufficiently optimized optical imaging schemes, imprecise detection algorithms, and inflexible hardware architectures, resulting in less than ideal inspection results.

[0004] Therefore, it is necessary to design a new type of non-destructive wafer inspection mechanism to solve the problems existing in the current technology, improve the accuracy and efficiency of surface defect detection of crystal oscillators, and meet the demand of modern industrial production for high-quality inspection. Utility Model Content

[0005] To address the aforementioned shortcomings of existing crystal oscillator surface defect detection technologies, this invention provides a high-precision non-destructive wafer inspection mechanism that is applicable to different types of crystal oscillators and different defect types, exhibiting strong versatility and flexibility.

[0006] The technical solution adopted in this utility model is:

[0007] A high-precision non-destructive wafer inspection mechanism includes a housing (101) and a worktable (102) disposed within the housing (101), characterized in that it further includes:

[0008] A circular hollow turntable (212) is provided with a plurality of workstation fixtures (401) spaced apart along the circumference, and the plurality of workstation fixtures (401) are used to hold the crystal oscillator wafer to be tested;

[0009] A stepper motor (211) is drivingly connected with the annular hollow turntable (212) at a driving end, and is used to drive the annular hollow turntable (212) to rotate around a central axis thereof; the stepper motor serves as a power source to drive the turntable to rotate, so that the workpiece clamps are sequentially moved to the detection stations;

[0010] A crystal oscillator wafer suction disc mechanical arm assembly (204) is provided, and a fixed suction disc (901) for suctioning a crystal oscillator wafer to be detected is mounted at a distal end of the crystal oscillator wafer suction disc mechanical arm assembly (204);

[0011] A multi-station defect detection assembly is arranged in a hollow cavity of the annular hollow turntable (212) and includes a plurality of detection stations arranged at intervals along a circumferential direction of the annular hollow turntable (212);

[0012] A crystal oscillator wafer classification device is used to classify and place qualified crystal oscillator wafers and unqualified crystal oscillator wafers according to crystal oscillator wafer detection state information transmitted by the detection stations;

[0013] A reverse structure (210) is arranged in the hollow cavity of the annular hollow turntable (212) and is used to perform a reverse operation on the crystal oscillator wafer, so as to more comprehensively detect surface defects of the crystal oscillator wafer.

[0014] Further, the multi-station defect detection assembly includes a first detection station (203), a second detection station (214), a third detection station (209), and a fourth detection station (202), each of which is used to perform defect detection by shooting a surface image of the crystal oscillator wafer. The detection stations are switched by rotation of the turntable to realize a continuous and efficient detection process.

[0015] Further, the first detection station (203) and the third detection station (209) are of the same structure, and the second detection station (214) and the fourth detection station (202) are of the same structure, wherein:

[0016] The first detection station (203) and the third detection station (209) each include a first detection station fixed support (208), a first vertical column is vertically mounted on the first detection station fixed support (208), a first camera (506) and a light source (507) are respectively arranged on the first vertical column, and the light source (507) is located below the first camera (506);

[0017] The second detection station (214) and the fourth detection station (202) each include a second detection fixed support, a second vertical column is vertically mounted on the second detection fixed support, a second camera (703) and a ring-shaped light source (702) are arranged on the second vertical column, and the ring-shaped light source (702) is located below the second camera (703).

[0018] Further, the first column is provided with a first camera fixing clamp (501) for fixing the first camera (506), the first camera fixing clamp (501) is installed on the first column through a fixing clamp connector (505), and the installation position of the fixing clamp connector (505) is limited by a fixing clamp limiter (502); the first camera (506) is fixed on the first camera fixing clamp (501) through a fixing piece (509), and the shooting angle of the first camera (506) is downwardly arranged.

[0019] The first column is provided with a light source fixing clamp (504) for fixing the light source (507), the light source (507) is installed on a light source support frame (508), the light source support frame (508) is connected to the first column through the light source fixing clamp (504), and the installation position of the light source (507) is limited by a light source fixing clamp limiter (503).

[0020] Further, the second column is provided with a second camera fixing clamp for fixing the second camera (703), the second camera fixing clamp is installed on the second column through a fixing clamp connector, and the installation position of the fixing clamp connector is limited by a fixing clamp limiter; the second camera (703) is fixed on the second camera fixing clamp through a fixing piece, and the shooting angle of the second camera (703) is downwardly arranged.

[0021] The second column is provided with a ring-shaped light source connecting fixer (701) for fixing the ring-shaped light source (702), and the installation position of the ring-shaped light source (702) is limited by a ring-shaped light source fixing clamp limiter.

[0022] Further, the reverse structure (210) comprises a reverse shaft (601), a reverse clamp (602), a first reverse chuck (603), a second reverse chuck (604) and a reverse clamp connector (606), the reverse clamp (602) is rotatably arranged on the reverse clamp connector (606) through the reverse shaft (601), and the reverse clamp connector (606) is installed on the third column through a reverse clamp fixing limiter (605); the reverse structure (210) is reversed by the crystal oscillator piece on the lower lifting structure clamping station clamp (401). It is helpful to more comprehensively detect the surface defects of the crystal oscillator piece and improve the accuracy and reliability of detection.

[0023] Further, the crystal oscillator wafer chucking mechanical arm assembly (204) comprises a base (903) and a mechanical arm (902) mounted on the base (903), and the fixed chuck (901) is connected to the end of the mechanical arm (902) through a chuck connector (904); a crystal oscillator wafer clamp (206) is arranged on the workbench (102) near the crystal oscillator wafer chucking mechanical arm assembly (204). Wherein, the chuck is used for adsorbing the crystal oscillator wafer to be detected and placing it into the work station clamp on the turntable. The movement path of the mechanical arm is designed to ensure that the crystal oscillator wafer can be accurately and smoothly placed in the specified position.

[0024] Further, the crystal oscillator wafer classification device comprises a wafer limiting clamp (206), according to the crystal oscillator wafer detection state information transmitted by each detection table, the mechanical arm (902) places the qualified crystal oscillator wafer on the left side of the wafer limiting clamp (206), and places the unqualified crystal oscillator wafer on the right side of the wafer limiting clamp (203), which is helpful for subsequent crystal oscillator wafer screening and processing.

[0025] Further, it further comprises a first turntable support frame (205), a second turntable support frame (213) and a third turntable support frame (215) mounted on the workbench (102), used for supporting and fixing the turntable (212).

[0026] Further, the workbench (102) comprises a plane fixed table (216) and a center fixed workbench (217).

[0027] Compared with the prior art, the beneficial effects of the utility model are embodied in:

[0028] 1. High-precision detection: through high-resolution imaging equipment and advanced image processing algorithms, high-precision detection of the surface micro-defects of the crystal oscillator wafer can be realized, meeting the strict requirements of modern industrial production on quality control.

[0029] 2. High efficiency detection: the rapid detection capability of the deep learning model can greatly improve the detection speed, reduce the detection cost and improve the production efficiency.

[0030] 3. Non-destructive testing: the non-contact detection method does not cause any damage to the crystal oscillator wafer, ensuring the integrity and reliability of the product.

[0031] 4. Strong adaptability: the detection mechanism of the utility model can be applied to different types of crystal oscillator wafers and different defect types, and has strong universality and flexibility.

[0032] 5. The utility model turns the crystal oscillator wafer through the reverse structure, which helps to detect the surface defects of the crystal oscillator wafer more comprehensively and further improves the accuracy and reliability of the detection. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 It is the whole structure of the nondestructive wafer detection mechanism of the utility model.

[0034] Figure 2 It is the left and right structure diagram of the rotating disc support frame III.

[0035] Figure 3 It is Figure 1 It is the working area structure diagram of the nondestructive wafer detection mechanism.

[0036] Figure 4 It is Figure 1 It is the outer periphery rotating disc structure in the utility model.

[0037] Figure 5 It is Figure 3 It is the structure diagram of the first detection table and the third detection table in the utility model.

[0038] Figure 6 It is Figure 3 It is the reverse structure diagram in the utility model.

[0039] Figure 7 It is Figure 3 It is the structure diagram of the second detection table and the fourth detection table in the utility model.

[0040] Figure 8 It is Figure 4 It is the structure diagram of the crystal vibration piece deposit fixer in the utility model.

[0041] Figure 9 It is Figure 3 It is the structure diagram of the crystal vibration piece sorting mechanical arm assembly in the utility model.

[0042] Figure 10 It is the mechanism working flow chart.

[0043] Figure 11 It is the detection table fixed support structure diagram.

[0044] Figure 12 It is Figure 11 It is the partial enlarged view of the utility model.

[0045] The reference signs are explained as follows:

[0046] 101-detection device shell; 102-workbench;

[0047] No. 4 detection table; 202 - No. 1 detection table; 203 - crystal wafer classification clamp; 204 - crystal wafer sorting mechanical arm assembly; 205 - first rotary disc support frame; 206 - crystal wafer clamp; 207 - crystal wafer placing fixer; 208 - detection table fixed support; 209 - No. 3 detection table; 210 - crystal wafer reverse clamp; 211 - stepping motor; 212 - crystal wafer clamp fixed rotary disc; 213 - second rotary disc support frame; 214 - No. 2 detection table; 215 - third rotary disc support frame; 216 - plane fixed table; 217 - center fixed workbench;

[0048] 401 - crystal wafer placing fixer; 402 - annular slide rail;

[0049] 501 - camera fixed clamp; 502 - camera fixed clamp limiter; 503 - light source fixed clamp limiter; 504 - light source fixed clamp; 505 - connector; 506 - first camera; 507 - light source; 508 - light source support frame; 509 - fixed part;

[0050] 601 - reverse shaft; 602 - reverse clamp; 603 - first reverse clamp head; 604 - second reverse clamp head; 605 - reverse clamp fixed limiter; 606 - reverse clamp connector; 607 - locking slot;

[0051] 701 - annular light source connection fixer; 702 - annular light source; 703 - second camera;

[0052] 801 - wafer placing clamp fixed plate; 802 - connecting groove; 803 - wafer placing clamp; 804 - fixed plate and rotary disc partially coinciding surface;

[0053] 901 - fixed suction cup; 902 - mechanical arm; 903 - base; 904 - suction cup connector.

[0054] 1201 - motor; 1202 - locking structure. DETAILED DESCRIPTION

[0055] The nondestructive wafer detection mechanism of the utility model is described in detail below in combination with the drawings and specific embodiments.

[0056] Reference Figures 1 to 10 The utility model discloses a high-precision nondestructive wafer detection mechanism, including shell 101 and the worktable 102 of setting in shell 101, still include:

[0057] Annular hollow rotary disc 212, a plurality of work station clamps 401 are arranged at intervals along the circumferential direction of annular hollow rotary disc 212, and a plurality of work station clamps 401 are used to clamp the crystal wafer to be detected;

[0058] A stepper motor 211 is drivingly connected to the annular hollow turntable 212 at a driving end, and is used to drive the annular hollow turntable 212 to rotate around a central axis thereof; the stepper motor serves as a power source to drive the turntable to rotate, so that the workpiece clamps are sequentially moved to each detection station;

[0059] A crystal oscillator wafer suction disc mechanical arm assembly 204 is provided at a distal end thereof with a fixed suction disc 901 used to suction a crystal oscillator wafer to be detected;

[0060] A multi-station defect detection assembly is arranged in a hollow cavity of the annular hollow turntable 212, and includes a plurality of detection stations arranged at intervals along a circumferential direction of the annular hollow turntable 212;

[0061] A crystal oscillator wafer classification device is used to classify and place qualified crystal oscillator wafers and unqualified crystal oscillator wafers according to crystal oscillator wafer detection state information transmitted by each detection station;

[0062] A reverse structure 210 is arranged in the hollow cavity of the annular hollow turntable 212, and is used to perform a reverse operation on the crystal oscillator wafer, so as to more comprehensively detect surface defects of the crystal oscillator wafer.

[0063] In an embodiment, the multi-station defect detection assembly includes a first detection station 203, a second detection station 214, a third detection station 209, and a fourth detection station 202, each of which is used to perform defect detection by shooting a surface image of the crystal oscillator wafer. The detection stations are switched by rotation of the turntable, so as to realize a continuous and efficient detection process.

[0064] In an embodiment, the first detection station 203 and the third detection station 209 have the same structure, and the second detection station 214 and the fourth detection station 202 have the same structure, wherein:

[0065] The first detection station 203 and the third detection station 209 each include a first detection station fixed support 208, a first vertical column is vertically mounted on the first detection station fixed support 208, a first camera 506 and a light source 507 are respectively arranged on the first vertical column, and the light source 507 is located below the first camera 506.

[0066] The second detection station 214 and the fourth detection station 202 each include a second detection fixed support, a second vertical column is vertically mounted on the second detection fixed support, a second camera 703 and a ring-shaped light source 702 are arranged on the second vertical column, and the ring-shaped light source 702 is located below the second camera 703.

[0067] In an embodiment, the first stand is provided with a first camera fixing clamp 501 for fixing the first camera 506, the first camera fixing clamp 501 is installed on the first stand through a fixing clamp connector 505, and the installation position of the fixing clamp connector 505 is limited by a fixing clamp limiter 502; the first camera 506 is fixed on the first camera fixing clamp 501 through a fixing piece 509, and the shooting angle of the first camera 506 is set downward.

[0068] The first stand is provided with a light source fixing clamp 504 for fixing the light source 507, the light source 507 is installed on a light source support frame 508, the light source support frame 508 is connected to the first stand through the light source fixing clamp 504, and the installation position of the light source 507 is limited by a light source fixing clamp limiter 503.

[0069] In an embodiment, the second stand is provided with a second camera fixing clamp for fixing the second camera 703, the second camera fixing clamp is installed on the second stand through a fixing clamp connector, and the installation position of the fixing clamp connector is limited by a fixing clamp limiter; the second camera 703 is fixed on the second camera fixing clamp through a fixing piece, and the shooting angle of the second camera 703 is set downward.

[0070] The second stand is provided with a ring-shaped light source connecting fixer 701 for fixing the ring-shaped light source 702, and the installation position of the ring-shaped light source 702 is limited by a ring-shaped light source fixing clamp limiter.

[0071] In an embodiment, the reverse structure 210 includes a reverse shaft 601, a reverse clamp 602, a first reverse chuck 603, a second reverse chuck 604, and a reverse clamp connector 606, the reverse clamp 602 is rotatably arranged on the reverse clamp connector 606 through the reverse shaft 601, and the reverse clamp connector 606 is installed on the third stand through a reverse clamp fixing limiter 605; the crystal oscillator is reversed by the crystal oscillator piece on the lower lifting structure clamping station clamp (401). It is helpful to more comprehensively detect the surface defects of the crystal oscillator piece and improve the accuracy and reliability of the detection.

[0072] Specific lifting structure is as follows Figure 11 and Figure 12As shown, the lower end of the third column is provided with a locking slot 607, and the detection table fixed support is provided with a locking structure 1202 matched with the locking slot 607, and a motor 1201 is further arranged on the detection table fixed support, the motor 1201 can realize constant time length switching of forward rotation and reverse rotation, and realize lifting conversion. The specific structure of the locking structure 1202 is similar to a spring buckle structure, and the front end of the locking structure 1202 has a sharp end, when installation, the front end sharp corner of the locking structure 1202 enters the locking slot 607 and is locked, and at the same time the motor 1201 rotates, driving the third column to move up and down, and because the moving angle is small, it can be approximately regarded as vertical linear motion.

[0073] In an embodiment, the crystal vibrator wafer chuck mechanical arm assembly 204 comprises a base 903 and a mechanical arm 902 mounted on the base 903, and the fixed chuck 901 is connected to the end of the mechanical arm 902 through a chuck connector 904; and a crystal vibrator wafer clamp 206 is arranged on the workbench 102 close to the crystal vibrator wafer chuck mechanical arm assembly 204. Among them, the chuck is used for adsorbing the crystal vibrator wafer to be detected and placing it into the work station clamp on the turntable. The movement path of the mechanical arm is designed to ensure that the crystal vibrator wafer can be accurately and smoothly placed in the specified position.

[0074] In an embodiment, the crystal vibrator wafer classification device comprises a wafer limiting clamp 203, according to the crystal vibrator wafer detection state information transmitted by each detection table, the mechanical arm 902 places the qualified crystal vibrator wafer on the left side of the wafer limiting clamp 206, and places the unqualified crystal vibrator wafer on the right side of the wafer limiting clamp 206, which is helpful for subsequent crystal vibrator wafer screening and processing.

[0075] In an embodiment, it further comprises a first turntable support frame 205, a second turntable support frame 213 and a third turntable support frame 215 mounted on the workbench 102, for supporting and fixing the turntable 212.

[0076] In an embodiment, as Figure 1 and Figure 3 The workbench 102 comprises a plane fixed table 216 and a center fixed workbench 217.

[0077] The specific working process of the utility model is as follows:

[0078] As Figure 10 shown, the crystal vibrator wafer is adsorbed by the fixed chuck driven by the mechanical arm, and is transferred to the work station clamp 401, the stepping motor rotates intermittently to complete the detection of the first detection table and the second detection table, the reverse structure is turned over, reaches the third detection table and the fourth detection table, after the detection of each detection table is completed, the data is transmitted to the cloud for data comparison and feedback control, and the normal and defective products are screened and placed.

[0079] Specifically, in the initial state, the turntable is stationary, and all station clamps 401 are in an idle state.

[0080] Specifically, the station clamp 401 is composed of a wafer placing clamp fixing plate 801, a connecting groove 802, and a wafer placing clamp 803. The connecting groove 802 has a wafer placing clamp fixing plate 801 and a wafer placing clamp 803 at both ends. The wafer placing clamp fixing plate 801 has four holes through which it is fixed to the turntable. The wafer placing clamp fixing plate and the partial overlapping surface 804 of the turntable are designed in a circular arc shape with the same curvature radius as the crystal wafer clamp fixing turntable 212.

[0081] When the device is started, the stepping motor 211 and the crystal wafer suction disc mechanical arm assembly 204 start working. The crystal wafer suction disc mechanical arm assembly 204 adsorbs the crystal wafer to be detected by the fixed suction disc 901 and then places it on the wafer placing clamp 803 in the station clamp 401 through the mechanical arm path design.

[0082] Specifically, as shown in Figure 9 The suction disc connector 904 at the connection between the fixed suction disc 901 and the mechanical arm is provided with a pipe opening, and the pipe opening is connected to an air pump.

[0083] After the mechanical arm 902 completes a placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0084] Specifically, the stepping motor 211 is fixed to the motor frame and connected to the second turntable support 213. The turntable is provided with an annular moving groove below it. When the first, second, and third turntable supports rotate, they can drive the turntable to rotate together.

[0085] The crystal wafer is detected by the flat fixing table 216.

[0086] Specifically, the station clamp 401 rotates to the first detection table 202. At this time, the station clamp 401 is located directly above the light source 507, and the crystal wafer is detected for light leakage and dirt. The first camera 506 takes a photo and uploads it to the database. The defect detection is performed using the recognition algorithm, the station is marked, and the detection results are uploaded to the crystal wafer suction disc mechanical arm assembly 204 control system.

[0087] After the crystal wafer suction disc mechanical arm assembly 204 completes a placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0088] The crystal wafer is detected by the second detection table 214.

[0089] Specifically, the work station clamp 401 rotates to the second defect detection structure 214, at this time, the work station clamp 401 is located directly above the annular light source 702, the defects of the reflecting point, the surface stain and the polarity difference of the crystal oscillator wafer are detected, the second camera 703 takes a photo and uploads to the database, the defect detection is performed by using the recognition algorithm, the work station is marked, and the detection result is uploaded to the control system of the crystal oscillator wafer suction disc mechanical arm assembly 204.

[0090] The crystal oscillator wafer suction disc mechanical arm assembly 204 completes one placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0091] The specific process of the crystal oscillator wafer through the reversing structure 210 is as follows:

[0092] Specifically, the work station clamp 401 rotates to the reversing structure 210, at this time, the work station clamp 401 is located in the middle position of the reversing clamp 602, the first reversing clamp head 603 and the second reversing clamp head 604 clamp the crystal oscillator wafer on the work station clamp 401 through the lifting structure below, the reversing shaft 601 first retreats, then drives the reversing clamp 602 to rotate one circle, and then extends to the original position to place the crystal oscillator wafer back on the work station clamp 401.

[0093] The mechanical arm 204 completes one placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0094] The specific process of the crystal oscillator wafer through the surface defect detection structure 209 is as follows:

[0095] Specifically, the work station clamp 401 rotates to the third detection table 209, at this time, the work station clamp 401 is located directly below the light source 702, the defects of the reflecting point and the surface stain of the crystal oscillator wafer are detected, the camera 506 takes a photo and uploads to the database, the defect detection is performed by using the recognition algorithm, the work station is marked, and the detection result is uploaded to the control system of the crystal oscillator wafer suction disc mechanical arm assembly 204.

[0096] The mechanical arm 204 completes one placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0097] The work station clamp 401 rotates to the fourth detection table 201, at this time, the work station clamp 401 is located directly above the light source 702, the defects of the reflecting point, the surface stain and the polarity difference of the crystal oscillator wafer are detected, the second camera 703 takes a photo and uploads to the database, the defect detection is performed by using the recognition algorithm, the work station is marked, and the detection result is uploaded to the control system of the crystal oscillator wafer suction disc mechanical arm assembly 204.

[0098] The mechanical arm 204 completes one placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle.

[0099] Through the transmission of the previous station crystal wafer detection state information, the crystal wafer chuck mechanical arm assembly 204 places the preferred crystal wafer on the left side of the wafer limiting clamp 203, and the defective product on the right side of the wafer limiting clamp 203.

[0100] The mechanical arm 204 completes a placement, the stepping motor 211 rotates 12 turns, and the turntable 212 rotates 1 / 6 of a circle. After five rotations, the first detection is completed.

Claims

1. A high-precision non-destructive wafer inspection mechanism comprising a housing (101) and a worktable (102) disposed in the housing (101), characterized in that, Also include: Annular hollow turntable (212), a plurality of work station clamps (401) are arranged in the circumferential direction, a plurality of the work station clamps (401) are used for clamping the crystal vibration piece to be detected; Stepping motor (211), the driving end of the stepping motor (211) is drivingly connected with the annular hollow turntable (212), for driving the annular hollow turntable (212) to rotate around the center axis thereof; Crystal vibration piece suction cup mechanical arm assembly (204), the end of the crystal vibration piece suction cup mechanical arm assembly (204) is provided with a fixed suction cup (901) for adsorbing the crystal vibration piece to be detected; Multi-station defect detection assembly, arranged in the hollow cavity of the annular hollow turntable (212) includes a plurality of detection tables arranged in the circumferential direction of the annular hollow turntable (212); Crystal vibration piece classification device, for classifying the qualified crystal vibration pieces and the unqualified crystal vibration pieces according to the crystal vibration piece detection state information transmitted by each detection table; Reverse structure (210), arranged in the hollow cavity of the annular hollow turntable (212), for performing reverse operation on the crystal vibration piece, so as to more comprehensively detect the surface defects of the crystal vibration piece.

2. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, The multi-station defect detection assembly includes a first detection table (203), a second detection table (214), a third detection table (209) and a fourth detection table (202), each detection table is used for defect detection by shooting the surface image of the crystal vibration piece.

3. The high precision non-destructive wafer inspection mechanism of claim 2, wherein, The first detection table (203) and the third detection table (209) are the same in structure, and the second detection table (214) and the fourth detection table (202) are the same in structure, wherein: The first detection table (203) and the third detection table (209) each include a first detection table fixed support (208), a first column is vertically installed on the first detection table fixed support (208), a first camera (506) and a light source (507) are respectively arranged on the first column, and the light source (507) is located below the first camera (506); The second detection table (214) and the fourth detection table (202) each include a second detection fixed support, a second column is vertically installed on the second detection fixed support, a second camera (703) and a ring light source (702) are arranged on the second column, and the ring light source (702) is located below the second camera (703).

4. The high precision non-destructive wafer inspection mechanism of claim 3, wherein, A first camera fixed clamp (501) for fixing the first camera (506) is arranged on the first column, the first camera fixed clamp (501) is installed on the first column through a fixed clamp connector (505), and the installation position of the fixed clamp connector (505) is limited by a fixed clamp limiter (502); the first camera (506) is fixedly arranged on the first camera fixed clamp (501) through a fixing piece (509), and the shooting angle of the first camera (506) is downwardly arranged; The first column is provided with a light source fixing clamp (504) for fixing the light source (507), the light source (507) is installed on a light source support frame (508), the light source support frame (508) is connected on the first column through the light source fixing clamp (504), and the installation position of the light source (507) is limited by the light source fixing clamp limiter (503).

5. The high precision non-destructive wafer inspection mechanism of claim 3, wherein, The second column is provided with a second camera fixing clamp for fixing the second camera (703), the second camera fixing clamp is installed on the second column through the fixing clamp connector, and the installation position of the fixing clamp connector is limited by the fixing clamp limiter; the second camera (703) is fixed on the second camera fixing clamp through the fixing part, and the shooting angle of the second camera (703) is downwardly arranged; The second column is provided with a ring-shaped light source connecting fixing device (701) for fixing the ring-shaped light source (702), and the installation position of the ring-shaped light source (702) is limited by the ring-shaped light source fixing clamp limiter.

6. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, The reverse structure (210) comprises a reverse shaft (601), a reverse clamp (602), a first reverse clamp head (603), a second reverse clamp head (604) and a reverse clamp connector (606), the reverse clamp (602) is rotatably arranged on the reverse clamp connector (606) through the reverse shaft (601), and the reverse clamp connector (606) is installed on the third column through the reverse clamp fixing limiter (605); the crystal vibration piece is reversed through the crystal vibration piece on the lower lifting structure clamping station clamp (401).

7. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, The crystal vibration piece suction disc mechanical arm assembly (204) comprises a base (903) and a mechanical arm (902) installed on the base (903), and the fixed suction disc (901) is connected to the end of the mechanical arm (902) through a suction disc connector (904); a crystal vibration piece clamp (206) is arranged on the workbench (102) close to the crystal vibration piece suction disc mechanical arm assembly (204).

8. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, The crystal vibration piece classification device comprises a wafer limiting clamp (206) according to the crystal vibration piece detection state information transmitted by each detection table, and the mechanical arm (902) places the qualified crystal vibration piece on the left side of the wafer limiting clamp (206) and places the unqualified crystal vibration piece on the right side of the wafer limiting clamp (203).

9. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, It also comprises a first turntable support frame (205), a second turntable support frame (213) and a third turntable support frame (215) installed on the workbench (102), for supporting and fixing the turntable (212).

10. The high precision non-destructive wafer inspection mechanism of claim 1, wherein, The workbench (102) comprises a plane fixed table (216) and a center fixed workbench (217).

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