Heat-insulating film and window structure

Abstract

The utility model provides a heat insulation film and a window structural body. The heat insulation film comprises a base material layer and a heat insulation layer, and a heat insulating layer disposed on the base material layer and including conductive patterns arranged apart from each other and separation regions between the conductive patterns, the sum of the length of one side of the conductive patterns and the width of the separation regions adjacent to the one side of the conductive patterns being 50 [mu] m to 250 [mu] m, the area of the separation region is larger than 3% of the total area of the heat insulating layer in the planar direction and is 20% or less of the total area.

Description

TECHNICAL FIELD

[0001] The present utility model relates to a heat-insulating film and a window structure. BACKGROUND

[0002] Recently, in order to improve the refrigeration and heating efficiency and energy efficiency, low-emissivity glass having high heat-insulating property is used for the outer wall of a building, a window, a window of a vehicle, etc. However, since the Low-E glass includes a metal coating layer formed on the surface of the glass, the movement of an electric wave can be interfered and shielded, thereby increasing the electric wave loss.

[0003] For example, as the information society develops, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are being applied or built into image display devices, electronic devices, buildings, Internet of Things (IoT), self-driving vehicles, etc. In addition, recently, as mobile communication technologies evolve, antennas for performing communication in a high frequency or ultra-high frequency band are being widely used. For example, Wi-Fi operating in a 2.4 GHz, 5 GHz, etc. band, Bluetooth operating in a 2.45 GHz band, and a 5G (5th-generation) communication system operating in a high frequency band (e.g., 28 GHz or more) are being commonly used.

[0004] However, electromagnetic waves in a high frequency or ultra-high frequency band have a high transmission speed and a short wavelength, and the electromagnetic waves can be lost, attenuated, or dissipated while passing through a window or a car glass, etc. Accordingly, the signal efficiency and coverage of an antenna can be reduced. When an electromagnetic wave penetration area is provided or formed on the Low-E glass to compensate for signal loss, the heat-insulating property can be reduced.

[0005] Therefore, it is necessary to design a heat-insulating film for suppressing the loss of electromagnetic waves radiated from an antenna or a radar while ensuring heat-insulating property. For example, a heat-insulating film is disclosed in Korean Patent Laid-Open Publication No. 10-2013-0048132, but the permeability of electromagnetic waves is not considered. SUMMARY

[0006] An object of the present utility model is to provide a heat-insulating film having improved electric wave permeability and heat-insulating property.

[0007] An object of the present utility model is to provide a window structure having improved electric wave permeability and heat-insulating property.

[0008] In order to solve the above problems, the technical scheme of the present application is as follows.

[0009] The heat insulation film comprises: a base material layer; and a heat insulation layer arranged on the base material layer and comprising electrically conductive patterns arranged separately from each other and separation areas between the electrically conductive patterns, the sum of the length of one side of the electrically conductive patterns and the width of the separation area adjacent to the one side of the electrically conductive patterns being 50 μm to 250 μm, and the area of the separation area being more than 3% and less than or equal to 20% of the total area of the heat insulation layer in the planar direction.

[0010] The area of the separation area is 5% to 20% of the total area of the heat insulation layer in the planar direction.

[0011] The sum of the length of one side of the electrically conductive patterns and the width of the separation area adjacent to the one side of the electrically conductive patterns is 100 μm to 250 μm.

[0012] The electrically conductive patterns have an island pattern shape in which the electrically conductive patterns are physically spaced apart from each other.

[0013] Each of the electrically conductive patterns independently has a polygonal shape.

[0014] The electrically conductive patterns comprise: a first electrically conductive pattern column comprising first electrically conductive patterns arranged in a column direction; and a second electrically conductive pattern column comprising second electrically conductive patterns arranged in the column direction.

[0015] The first electrically conductive pattern column and the second electrically conductive pattern column are alternately and repeatedly arranged in a row direction.

[0016] The first electrically conductive patterns and the second electrically conductive patterns have polygonal shapes different from each other.

[0017] The sum of the internal angles of the first electrically conductive patterns and the second electrically conductive patterns adjacent to each other in the row direction is 180°.

[0018] The first electrically conductive patterns comprise first patterns and second patterns alternately and repeatedly arranged in the column direction, and the second electrically conductive patterns comprise third patterns and fourth patterns alternately and repeatedly arranged in the column direction.

[0019] The second patterns have shapes in which the first patterns are flipped in the column direction, and the fourth patterns have shapes in which the third patterns are flipped in the column direction.

[0020] The opening ratio represented by the following formula 1 is 0.5 to 1.4.

[0021] [Formula 1]

[0022] Openness = GW / AR

[0023] In formula 1, GW is a value of a width of the separation region, the unit of the width is μm, and AR is a value of a percentage of an area of the separation region in a total area of the heat insulation layer.

[0024] The conductive pattern has a solid structure.

[0025] The heat insulation layer includes an electrode layer including the conductive pattern and the separation region, a lower insulating layer disposed between the substrate layer and the electrode layer, and an upper insulating layer disposed on the electrode layer.

[0026] The electrode layer includes a transparent conductive oxide.

[0027] The heat insulation layer further includes a bonding layer disposed between the substrate layer and the lower insulating layer.

[0028] In addition, the utility model also provides a window structure body, include: lower base plate, upper base plate is configured with the lower base plate interval, and heat insulation layer is configured on the lower base plate, and includes the separation region between conductive pattern and the conductive pattern of each other separation arrangement, the sum of the length of one side of the conductive pattern and the width of the separation region adjacent to the one side of the conductive pattern is 50 μm to 250 μm, the area of the separation region is more than 3% of the total area of the heat insulation layer in the plane direction and is below 20% of the total area.

[0029] The window structure body further includes an air layer formed between the lower base plate and the upper base plate.

[0030] The window structure body further includes an interlayer insulating layer sandwiched between the lower base plate and the upper base plate.

[0031] The utility model has the following effects.

[0032] The heat insulation film of the embodiment of the utility model can include a heat insulation layer, which can include a plurality of conductive patterns and separation regions between the conductive patterns. The period of the conductive pattern and the area of the separation region can be adjusted to a predetermined range. Therefore, while improving the thermal resistance and heat insulation of the heat insulation film, the optical performance and electromagnetic wave transmission performance can also be improved.

[0033] The ratio of the area of the separation region to the width of the separation region can be adjusted to a predetermined range. Accordingly, while suppressing the flow and transfer of heat through the separation region, the reflection and destructive interference of electromagnetic waves are suppressed, and thus the electromagnetic wave transmittance can be increased. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a schematic plan view of a heat shield film illustrating an exemplary embodiment.

[0035] Figure 2 is a schematic sectional view of a heat shield film illustrating an exemplary embodiment.

[0036] Figure 3 is a schematic plan view of an A region of Figure 1 enlarged.

[0037] Figure 4 is a schematic plan view of a heat shield film illustrating an exemplary embodiment.

[0038] Figure 5 is a schematic plan view of a heat shield film illustrating an exemplary embodiment.

[0039] Figure 6 is a schematic plan view of a heat shield film illustrating an exemplary embodiment.

[0040] Figure 7 is a schematic plan view of a heat shield film illustrating an exemplary embodiment.

[0041] Figure 8 and Figure 9 are schematic sectional views of window structures, respectively, illustrating exemplary embodiments.

[0042] Figure 10 is a graph showing the electromagnetic wave transmittance of an embodiment. DETAILED DESCRIPTION

[0043] Embodiments of the present application provide a heat shield film including a conductive pattern.

[0044] Embodiments of the present application will now be described in more detail with reference to the accompanying drawings. However, the accompanying drawings attached to the present specification show preferred embodiments of the present application, and together with the foregoing content of the present application, serve to further understand the technical idea of the present application, and therefore the present application should not be construed only as matters described in such drawings.

[0045] The terms "upper", "lower", "top", "bottom", and the like used in the present application indicate the relative positions of the components, and do not mean absolute up-down relationships.

[0046] Figure 1is a schematic plan view of a heat-insulating film illustrating an exemplary embodiment. Figure 2 is a schematic cross-sectional view of a heat-insulating film illustrating an exemplary embodiment.

[0047] Referring to Figure 1 and Figure 2 , the heat-insulating film can include a substrate layer 100, and a heat-insulating layer 105 disposed on the substrate layer 100.

[0048] The substrate layer 100 can include, for example, a resin substance. For example, the substrate layer 100 can include a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate, or the like; a cellulose-based resin such as diacetyl cellulose, triacetyl cellulose, or the like; a polycarbonate-based resin; an acrylic-based resin such as poly(methyl) methacrylate, poly(ethyl) methacrylate, or the like; a styrene-based resin such as polystyrene, acrylonitrile-styrene copolymer, or the like; a polyolefin-based resin such as polyethylene, polypropylene, polyolefin having a cyclic structure or norbornene structure, ethylene-propylene copolymer, or the like; a vinyl chloride-based resin; an amide-based resin such as nylon, aromatic polyamide, or the like; an imide-based resin; a polyether sulfone-based resin; a sulfone-based resin; a polyether ether ketone-based resin; a polyphenylene sulfide-based resin; a vinyl alcohol-based resin; a vinylidene chloride-based resin; a vinyl butyral-based resin; an allyl-based resin; a polyformaldehyde-based resin; an epoxy-based resin; a polyurethane-based or acrylic polyurethane-based resin; a silicon-based resin; or the like. These can be used alone or in combination of two or more.

[0049] In some embodiments, the substrate layer 100 can include an inorganic insulating substance such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0050] The heat-insulating layer 105 can include an electrode layer 120. The electrode layer 120 can include conductive patterns 121, and separation regions 125 between the conductive patterns 121.

[0051] The conductive patterns 121 can be periodically arranged. For example, the conductive patterns 121 can be arranged along a column direction (second direction) and a row direction (first direction) parallel to the upper surface of the substrate layer 100 of the conductive patterns 121.

[0052] The conductive patterns 121 can be physically spaced apart from each other. For example, the conductive patterns 121 can have an island pattern shape physically separated from each other. Accordingly, the separation regions 125 separating the conductive patterns 121 from each other can be formed between the conductive patterns 121.

[0053] The separation region 125 can be formed between the conductive patterns 121, thereby increasing the transmittance of electromagnetic waves. For example, in the process in which electromagnetic waves pass through the metal layer, the metal component can increase the absorption or reflection of electromagnetic waves. In addition, in a high frequency or super high frequency band such as 4G / 5G, the wavelength of electromagnetic waves is short, and diffraction is difficult, which can further increase the loss of electromagnetic waves.

[0054] According to an exemplary embodiment, by the separation region 125, the extinction and reflection of electromagnetic waves can be reduced, and the transmittance can be increased. Accordingly, the transmission loss and reduction can be prevented even in a high frequency band, and the signal strength can be increased.

[0055] The area of the separation region 125 can be 20% or less of the total area of the heat insulation layer 105 in a planar direction (third direction). For example, the total area of the conductive patterns 121 can be 80% or more of the total area of the heat insulation layer 105.

[0056] Within the above range, the electromagnetic wave transmittance of the heat insulation film can be increased while further improving the heat insulation. For example, when the area of the separation region 125 exceeds 20%, the thermal energy passing through the separation region 125 can increase, and the thermal resistance and heat insulation of the heat insulation layer 105 can decrease.

[0057] The area of the separation region 125 can exceed 3% of the total area of the heat insulation layer 105. When the area of the separation region 125 is 3% or less, the electromagnetic wave transmittance can decrease.

[0058] In some embodiments, the area of the separation region 125 can be 5% to 20% of the total area of the heat insulation layer 105, preferably 5% to 15%, and more preferably 5% to 10%. Within the above range, the electromagnetic wave transmittance passing through the separation region 125 can be increased while reducing the heat transfer and radiation. Accordingly, the electromagnetic wave transmittance and the heat insulation of the heat insulation film can be further improved.

[0059] Figure 3 is a schematic plan view of an A region of Figure 1 amplification.

[0060] According to an exemplary embodiment, the sum of the length PW of one side of the conductive pattern 121 and the width GW of the separation region 125 adjacent to the one side of the conductive pattern 121 can be 50 μm to 250 μm. For example, the width GW can refer to the width of the separation region 125 in the extension direction of the one side of the conductive pattern 121. Hereinafter, the sum of the length PW of one side of the conductive pattern 121 and the width GW of the separation region 125 can be referred to as the period of the conductive pattern 121.

[0061] Within the above range, the heat insulating layer 105 can block the radiation of the infrared or far infrared region while increasing the transmittance of electromagnetic waves in the high frequency or ultra-high frequency band.

[0062] For example, when the pitch of the conductive pattern 121 exceeds 250 μm, the size of the conductive pattern 121 increases, which can increase the reflection and destructive interference of electromagnetic waves, and the electromagnetic wave transmittance of the heat insulating film can decrease. For example, when the pitch of the conductive pattern 121 is less than 50 μm, etching failure can occur due to a substantially fine pitch, or the conductive patterns 121 can be electrically connected to each other. Accordingly, electromagnetic interference can occur during the passage of electromagnetic waves, and the transmittance characteristics can decrease.

[0063] In some embodiments, the pitch of the conductive pattern 121 can be 50 μm to 200 μm, preferably 100 μm to 250 μm, and more preferably more than 100 μm and 200 μm or less. Within the above range, electrical isolation between the conductive patterns 121 can be ensured, and the electromagnetic wave transmittance can be further improved while suppressing an increase in thermal conductivity and thermal emissivity.

[0064] In some embodiments, the opening ratio of the heat insulating layer represented by Formula 1 can be 0.5 to 1.4.

[0065] [Formula 1]

[0066] Opening ratio = GW / AR

[0067] In Formula 1, GW is the value of the width (μm) of the separation region, and AR is the value of the ratio of the area of the separation region in the total area of the heat insulating layer (percentage, %). For example, GW is the value excluding the unit of the width of the separation region measured in μm, and AR is the value excluding the unit of the area of the separation region measured in % of the total area of the heat insulating layer.

[0068] The width of the separation region can be appropriately adjusted according to the opening ratio AR of the heat insulating layer within the range, and thus the transmittance of electromagnetic waves can be increased while preventing a decrease in heat insulating properties. For example, even if the opening ratio is the same, as the width of the separation region increases, the thermal emissivity can increase, and as the width of the separation region decreases, the electromagnetic wave transmittance characteristics can decrease.

[0069] In an embodiment, the opening ratio represented by Formula 1 can be 0.5 to 1.4, and preferably more than 1.0 and 1.4 or less. Within the above range, the pattern can be more easily designed and manufactured while increasing the electromagnetic wave transmittance.

[0070] In some embodiments, the conductive pattern 121 can include a solid structure. Thus, the thermal resistance of the conductive pattern 121 can be higher, and adjusting the open area within the heat-insulating film can allow the heat-insulating film to have a lower thermal emissivity and thermal conductivity.

[0071] In some embodiments, the electrode layer 120 can include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These can be used alone or in combination of two or more.

[0072] In an embodiment, the electrode layer 120 can include silver (Ag) or a silver alloy (e.g., silver palladium copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., copper calcium (CuCa) alloy).

[0073] In some embodiments, the electrode layer 120 can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), indium gallium oxide (IGO).

[0074] In some embodiments, the electrode layer 120 can include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, can have a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer.

[0075] The metal layer can include the above-described metal or alloy. The transparent conductive oxide layer can include the above-described transparent conductive oxide. The metal layer can improve heat insulation, and the transparent conductive oxide layer can improve corrosion resistance, transparency.

[0076] In some embodiments, the heat-insulating layer 105 can further include a lower insulating layer 130 disposed between the base material layer 100 and the electrode layer 120, and / or an upper insulating layer 140 disposed on the electrode layer 120.

[0077] The lower insulating layer 130 can be provided as a base layer or a buffer layer of the electrode layer 120. Through the lower insulating layer 130, mechanical properties such as crack resistance and stability of the electrode layer 120 can be improved.

[0078] The upper insulating layer 140 can be provided as a passivation layer or a protective film. Through the upper insulating layer 140, oxidation and corrosion of metal or metal oxide included in the electrode layer 120 can be prevented.

[0079] In an embodiment, the lower insulating layer 130 and the upper insulating layer 140 can include an organic insulating substance such as an epoxy resin, an acrylic resin, an imide-based resin, or the like, or an inorganic insulating substance such as silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0080] In an embodiment, a transparent insulating resin can be provided as the lower insulating layer 130 and the upper insulating layer 140. For example, the transparent insulating resin can include a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate, or the like; a cellulose-based resin such as diacetyl cellulose, triacetyl cellulose, or the like; a polycarbonate-based resin; an acrylic-based resin such as poly(methyl)acrylate, poly(ethyl)acrylate, or the like; a styrene-based resin such as polystyrene, acrylonitrile-styrene copolymer, or the like; a polyolefin-based resin such as polyethylene, polypropylene, a polyolefin having a ring structure or a norbornene structure, ethylene-propylene copolymer, or the like; a vinyl chloride-based resin; an amide-based resin such as nylon, aromatic polyamide, or the like; an imide-based resin; a polyether sulfone-based resin; a sulfone-based resin; a polyether ether ketone-based resin; a polyphenylene sulfide-based resin; a vinyl alcohol-based resin; a vinylidene chloride-based resin; a vinyl butyral-based resin; an allyl-based resin; a polyformal-based resin; an epoxy-based resin; a polyurethane-based or acrylic polyurethane-based resin, or the like. These can be used alone or in combination of two or more.

[0081] In some embodiments, the dielectric constant of the lower insulating layer 130 and the upper insulating layer 140 can be adjusted to a range of about 2 to 12, respectively. Within the above range, transmission loss due to refraction and reflection of electromagnetic waves can be suppressed.

[0082] According to an exemplary embodiment, the heat insulation layer 105 can further include a bonding layer 110. The bonding layer 110 can be formed on a side that is in contact with the base material layer 100 of the heat insulation layer 105.

[0083] In some embodiments, the bonding layer 110 can include a bonding film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0084] In some embodiments, the heat insulation film can be manufactured by a method described below.

[0085] A preliminary electrode layer can be formed on the upper face of the substrate layer 100. For example, the preliminary electrode layer can be formed by a vacuum deposition method, a physical vapor deposition method, a chemical vapor deposition method, a plasma deposition method, a plasma polymerization method, a thermal deposition method, a thermal oxidation method, an anodization method, a cluster ion beam deposition method, a screen printing method, a gravure printing method, a flexographic printing method, an offset printing method, an inkjet coating method, a dispensing printing method, a photolithography method, or the like.

[0086] In one embodiment, the preliminary electrode layer can be formed by a plasma deposition method, such as a sputtering process.

[0087] In one embodiment, a lower insulating layer 130 and / or an adhesive layer 110 can be formed on the substrate layer 100 before the preliminary electrode layer is formed. For example, the lower insulating layer 130 and / or the adhesive layer 110 can be formed by applying an insulating resin on the upper face of the substrate layer 100.

[0088] A photoresist layer can be formed by applying a photoresist composition on the upper face of the preliminary electrode layer.

[0089] The photoresist layer can be exposed to form exposed portions and unexposed portions. A mask can be disposed on the unexposed portions before the photoresist layer is exposed.

[0090] In one embodiment, a photoresist pattern can be formed by selectively removing one of the exposed portions or the unexposed portions by a developing process. For example, when the photoresist composition is positive type, the exposed portions are removed by the developing process, and the unexposed portions can remain as the photoresist pattern. For example, when the photoresist composition is negative type, the unexposed portions are removed by the developing process, and the exposed portions can remain to form the photoresist pattern.

[0091] In one embodiment, the developing process can be performed using a developer having strong alkalinity. For example, the developer can include an ammonium-based solution such as tetramethylammonium hydroxide (TMAH).

[0092] The preliminary electrode layer can be etched using the photoresist pattern as a mask. The photoresist pattern can have the same shape as the conductive pattern 121. By etching the preliminary electrode layer, an electrode layer 120 including the conductive pattern 121 and the separation region 125 can be formed.

[0093] In one embodiment, the etching process of the preliminary electrode layer can be performed using an etchant solution. The etchant solution can include an acidic solution, for example, can include phosphoric acid, nitric acid, hydrochloric acid, hydrogen peroxide, and / or acetic acid.

[0094] In some embodiments, the photoresist remaining on the electrode layer 120 can be removed by a strip process or an ashing process.

[0095] In an embodiment, the upper insulating layer 140 can be formed by coating and curing an insulating resin on the upper surface of the electrode layer 120.

[0096] According to an exemplary embodiment, the conductive pattern 121 can have a polygonal shape such as a triangular shape, a quadrangular shape, a diamond shape, a parallelogram shape, a pentagonal shape, a hexagonal shape, etc. For example, referring to Figure 3 , the conductive pattern 121 can be a solid pattern having a square shape.

[0097] Figure 4 and Figure 5 are schematic plan views showing the heat-insulating film of an exemplary embodiment.

[0098] Referring to Figure 4 , the conductive pattern 121 can have a triangular shape. For example, the conductive pattern 121 of a triangular shape can be arranged such that the period of the conductive pattern 121 satisfies the above-described range.

[0099] Referring to Figure 5 , the conductive pattern 121 can have a hexagonal shape. For example, the conductive pattern 121 of a hexagonal shape can be arranged such that the period of the conductive pattern 121 satisfies the above-described range.

[0100] In an embodiment, the sum of the internal angles of the vertices of the conductive patterns 121 facing each other can be 360°. Accordingly, the conductive patterns 121 can be arranged more densely, and the aperture ratio of the heat-insulating film can be reduced, thereby improving the heat-insulating property.

[0101] For example, in Figure 4 , the sum of the internal angles θ1, θ2, θ3, θ4, θ5, and θ6 of the conductive patterns 121 of a triangular shape facing each other can be 360°. For example, in Figure 5 , the sum of the internal angles θ1, θ2, and θ3 of the conductive patterns 121 of a hexagonal shape facing each other can be 360°.

[0102] Figure 6 and Figure 7 are schematic plan views showing the heat-insulating film of an exemplary embodiment.

[0103] Referring to Figure 6 and Figure 7 , the conductive pattern 121 can include a first conductive pattern 122 and a second conductive pattern 123 alternately arranged in a row direction (a first direction).

[0104] In some embodiments, the first conductive patterns 122 can be arranged in the column direction (second direction) to define first conductive pattern columns 121a. The second conductive patterns 123 can be arranged in the column direction to define second conductive pattern columns 121b.

[0105] The sum of the length PW1 of one side of the first conductive pattern 122 and the width GW of the separation region 125, and the sum of the length PW2 of one side of the second conductive pattern 123 and the width GW of the separation region 125 can satisfy the above-described ranges, respectively.

[0106] In some embodiments, the first conductive pattern columns 121a and the second conductive pattern columns 121b can be alternately and repeatedly arranged in the row direction. For example, the first conductive patterns 122 and the second conductive patterns 123 can be arranged in the row direction in such a manner that the periods of the first conductive patterns 122 and the second conductive patterns 123 satisfy the above-described ranges, respectively.

[0107] In some embodiments, the first conductive patterns 122 and the second conductive patterns 123 can have polygonal shapes different from each other. For example, the first conductive patterns 122 can have a hexagonal shape, and the second conductive patterns 123 can have a triangular shape (see FIG. 1B). Figure 6 For example, the first conductive patterns 122 can have a parallelogram shape, and the second conductive patterns 123 can have a triangular shape.

[0108] The conductive patterns 121 having different shapes from each other are alternately arranged, and thus it is possible to suppress the occurrence of moire fringes and the visibility of patterns due to regular and repetitive arrangement of the same pattern shape.

[0109] In some embodiments, the sum of the internal angle of the first conductive pattern 122 and the internal angle of the second conductive pattern 123 adjacent in the row direction can be 180°.

[0110] For example, in the Figure 6 , the sum of the internal angle θ1 of the first conductive pattern 122 and the internal angle θ2 of the second conductive pattern 123 adjacent in the row direction can be 180°. In addition, the sum of the internal angle θ3 of the first conductive pattern 122 and the internal angle θ4 or θ5 of the second conductive pattern 123, and the sum of the internal angle θ6 of the first conductive pattern 122 and the internal angle θ4 or θ5 of the second conductive pattern 123 can be 180°, respectively.

[0111] For example, in the Figure 7 , the sum of the internal angle θ2 of the first conductive pattern 122 and the internal angle θ1 of the second conductive pattern 123 adjacent in the row direction can be 180°. In addition, the sum of the internal angle θ3 and θ5 of the first conductive pattern 122 and the internal angle θ4 of the second conductive pattern 123 adjacent in the row direction can be 180°.

[0112] The sum of the inner angles of the conductive patterns 121 adjacent in the row direction is adjusted to 180°, so that the conductive patterns 121 can be arranged in engagement with each other, and the aperture ratio of the electrode layer 120 and the width of the separation area 125 can be easily adjusted.

[0113] In some embodiments, the first conductive patterns 122 can include first patterns 122a and second patterns 122b alternately and repeatedly arranged in the column direction.

[0114] In an embodiment, the second patterns 122b can have shapes in which the first patterns 122a are flipped in the column direction. For example, the first patterns 122a and the second patterns 122b can have shapes symmetrical to each other.

[0115] In some embodiments, the second conductive patterns 123 can also include third patterns 123a and fourth patterns 123b alternately and repeatedly arranged in the column direction.

[0116] In an embodiment, the third patterns 123a and the fourth patterns 123b can have shapes symmetrical to each other, for example, the fourth patterns 123b can have shapes in which the third patterns 123a are flipped in the column direction.

[0117] The window structure of the embodiment of the present application can include the above-described thermal insulation layer.

[0118] Figure 8 and Figure 9 are schematic cross-sectional views showing the window structure of an exemplary embodiment.

[0119] Referring to Figure 8 and Figure 9 , the window structure can include a substrate 90 and a thermal insulation layer 105 arranged on the substrate 90.

[0120] For example, the thermal insulation layer 105 can be separated from the base material layer 100 of the thermal insulation film. The thermal insulation layer 105 separated from the base material layer 100 can be attached to the substrate 90 through the adhesive layer 110.

[0121] The substrate 90 can include, for example, glass and / or a transparent flexible high polymer. Examples of the transparent flexible high polymer can include cycloolefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cycloolefin copolymer (COC), polymethyl methacrylate (PMMA), etc.

[0122] According to an embodiment, the glass substrate can be provided as a substrate 90 of a window structure. For example, a glass substrate of an object to which the window structure is applied can be provided as the substrate 90. The glass substrate can include, for example, a window on an outer wall of a building, a window included in a home appliance, or a glass of an automobile, etc.

[0123] In an embodiment, the glass substrate can have a thickness of 2t to 10t, but is not limited thereto, and can be appropriately adjusted according to a design purpose and a target object.

[0124] The position and size of the area in which the thermal insulation layer 105 is formed on the substrate 90 can be designed or adjusted in consideration of a peripheral environment or a driving condition of an antenna. For example, the indoor and outdoor temperatures, humidity, the thickness and dielectric constant of the substrate, a peripheral structure, the dielectric constant and physical properties of the structure, the height of the window structure and a signal transmission path, the frequency of an electromagnetic wave, an incident angle, and a transmission distance, etc. can be considered.

[0125] Through the thermal insulation layer 105, heat energy such as heat radiation lines passing through the window structure can be blocked, thereby improving the thermal insulation of the window structure. In addition, since the thermal insulation layer 105 has a high electromagnetic wave transmittance, transmittance loss caused by the thermal insulation layer 105 can be suppressed.

[0126] In an embodiment, the thermal conductivity of the window structure can be 3.90 kcal / m 2 h℃ or less. Preferably, the thermal conductivity of the window structure can be 3.70 kcal / m 2 h℃ or less, and more preferably 3.50 kcal / m 2 h℃ to 3.60 kcal / m 2 h℃.

[0127] In some embodiments, the window structure can further include an upper substrate 92. The upper substrate 92 can be disposed apart from the substrate 90. For example, the window structure can have a pair glass form.

[0128] In an embodiment, the window structure can further include a spacer formed between the substrate 90 and the upper substrate 92. Through the spacer, a distance between the substrate 90 and the upper substrate 92 can be maintained.

[0129] In an embodiment, an air layer 200 can be formed between the substrate 90 and the upper substrate 92. The air layer 200 can include air or argon (Ar) gas. The air layer 200 can further suppress heat flow through conduction and convection.

[0130] The heat insulation layer 105 may be formed on the side facing the air layer 200 of the substrate 90. In one embodiment, the heat insulation layer 105 may be formed on the opposite side of the side facing the air layer 200 of the substrate 90.

[0131] In one embodiment, an insulating resin may be filled between the substrate 90 and the upper substrate 92. For example, the window structure may also include an interlayer insulating layer 300 sandwiched or embedded between the substrate 90 and the upper substrate 92.

[0132] The insulating resin may be the aforementioned organic insulating material and / or inorganic insulating material; the interlayer insulating layer 300 may be a transparent insulating film.

[0133] The aforementioned window structure can be applied to various structures and objects such as windows in public transportation (buses, subways), buildings, vehicles, decorative features, and directional signs (e.g., directional signs, emergency exit signs, emergency lights). Through this window structure, thermal insulation and energy efficiency are improved, while simultaneously increasing the signal efficiency of antennas or radar.

[0134] Preferred embodiments will be shown below to aid in understanding the present invention. However, these embodiments are merely illustrative and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications can be made to the embodiments within the scope of the present invention and its technical concept, and such changes and modifications naturally fall within the scope of the appended claims.

[0135] Experimental Example

[0136] Examples and Comparative Examples

[0137] As the window structure, a glass substrate with an insulating film was used. Specifically, on the glass substrate (4.8t thick) as follows... Figure 1 The diagram shows a heat insulation layer including a conductive pattern and separation regions. The heat insulation layer is formed as a three-layer structure: a lower insulating layer, an electrode layer (IZO / APC / IZO), and an upper insulating layer. The heat insulation layer is bonded to the glass substrate via an OCA (5 μm thick).

[0138] Conductive patterns are formed to have Figure 3 The morphology of the electrode layer, the period of the conductive pattern, and the width (μm) of the separation region are set as shown in Tables 1 and 2 below.

[0139] The aperture ratio of the electrode layer was calculated as a percentage (%) of the area of the separation region in the total area of the electrode layer, and the period (μm) of the conductive pattern was calculated as the sum of the length PW of one side of the conductive pattern and the width GW of the adjacent separation region. The aperture ratio was calculated by Equation 1.

[0140] In Comparative Example 1, the electrode layer was coated on the entire glass substrate without the separation region. In Comparative Example 2, the glass substrate was not formed with the heat insulation layer.

[0141] [Table 1]

[0142]

[0143]

[0144] [Table 2]

[0145]

[0146]

[0147] Evaluation of radio wave transmission loss

[0148] The amount of radio wave transmission of the window structure was evaluated. The radio wave transmission loss was measured as a relative value with respect to the transmission amount in the air in the frequency range of 3 GHz to 4.5 GHz (Sub-65G) and the frequency range of 27 GHz to 29 GHz (n257 5G).

[0149] Evaluation of thermal insulation

[0150] The emissivity of the window structure was measured according to Korean Standard KS L 2514 by an infrared spectrometer (FT-IR). The thermal conductivity of the window structure was measured according to Korean Standard KS L 2003:2013 using the measured emissivity.

[0151] The evaluation results are shown together in Tables 3 and 4 below.

[0152] [Table 3]

[0153]

[0154]

[0155] [Table 4]

[0156]

[0157]

[0158] With reference to Tables 1 to 4, in the case of the examples, the window structure has a lower thermal emissivity and thermal conductivity, and has a higher electric wave transmittance.

[0159] However, in the case of the comparative examples, the period and aperture ratio of the conductive pattern do not satisfy the above range, and the transmittance loss increases. Further, in the case of the comparative examples, the transmittance loss in the ultra-high frequency band increases more sharply than in the examples.

[0160] Experimental Example

[0161] As the window structure, a glass substrate to which a heat-insulating film was attached was used. Specifically, a heat-insulating layer including a conductive pattern and a separation region was attached to a glass substrate (thickness 4.8 t) as shown in FIG. 1. The heat-insulating layer was formed in a three-layer structure of a lower insulating layer-electrode layer (IZO / APC / IZO)-upper insulating layer. The conductive pattern was formed in a form having a period of 100 μm, 150 μm, 300 μm, 400 μm, and 500 μm, and an aperture ratio of 10%. Figure 1 Figure 3 The heat-insulating layer was joined to the glass substrate by OCA (thickness 5 μm).

[0162] The aperture ratio of the electrode layer was adjusted to 10%. The period (μm) of the conductive pattern was adjusted to 100 μm, 150 μm, 300 μm, 400 μm, and 500 μm, and the electric wave transmittance corresponding to each period was measured.

[0163] The electric wave transmittance was measured as a relative value with respect to the transmittance in air in a frequency range of 27 GHz to 30 GHz (n257 5G).

[0164] Figure 10 is a graph showing the electric wave transmittance of the examples.

[0165] With reference to Figure 10 Even when the aperture ratio is the same, when the period of the conductive pattern is 300 μm or more, the transmittance loss of the electric wave in the ultra-high frequency band increases. However, in the examples in which the period of the conductive pattern is 100 μm and 150 μm, the transmittance loss of the electric wave was shown to be substantially similar to the glass substrate.​

Claims

1. A thermal insulation film, characterized by, Comprising: a base material layer; and a heat insulating layer disposed on the base material layer and including electrically conductive patterns arranged apart from each other and separation regions between the electrically conductive patterns, a sum of a length of one side of the electrically conductive pattern and a width of the separation region adjacent to the one side of the electrically conductive pattern is 50 μm to 250 μm, an area of the separation region is greater than 3% and less than or equal to 20% of a total area of the heat insulating layer in a planar direction.

2. The heat insulating film according to claim 1, wherein the area of the separation region is 5% to 20% of the total area of the heat insulating layer in the planar direction.

3. The heat insulating film according to claim 1, wherein a sum of a length of one side of the electrically conductive pattern and a width of the separation region adjacent to the one side of the electrically conductive pattern is 100 μm to 250 μm.

4. The heat insulating film according to claim 1, wherein the electrically conductive patterns have an island pattern shape in which the electrically conductive patterns are physically spaced apart from each other.

5. The heat insulating film according to claim 4, wherein the electrically conductive patterns each independently have a polygonal shape.

6. The heat insulating film according to claim 1, wherein the electrically conductive patterns include: a first electrically conductive pattern column including first electrically conductive patterns arranged in a column direction; and a second electrically conductive pattern column including second electrically conductive patterns arranged in the column direction.

7. The heat insulating film according to claim 6, wherein the first electrically conductive pattern column and the second electrically conductive pattern column are alternately and repeatedly arranged in a row direction.

8. The heat insulating film according to claim 7, wherein the first electrically conductive patterns and the second electrically conductive patterns have polygonal shapes different from each other.

9. The heat insulating film according to claim 8, wherein a sum of an internal angle of the first electrically conductive pattern and an internal angle of the second electrically conductive pattern adjacent to each other in the row direction is 180°.

10. The heat insulating film according to claim 8, wherein the first electrically conductive patterns include a first pattern and a second pattern alternately and repeatedly arranged in the column direction, the second electrically conductive patterns include a third pattern and a fourth pattern alternately and repeatedly arranged in the column direction.

11. The heat insulating film according to claim 10, wherein the second pattern has a shape in which the first pattern is flipped in the column direction, and the fourth pattern has a shape in which the third pattern is flipped in the column direction.

12. The heat insulating film according to claim 1, wherein an opening ratio represented by the following formula 1 is 0.5 to 1.4: [Formula 1] Opening ratio = GW / AR In formula 1, GW is a value of a width of the separation region, the unit of the width being μm, and AR is a value of a percentage % of an area of the separation region in a total area of the heat insulating layer.

13. The heat insulating film according to claim 1, wherein the electrically conductive patterns have a solid structure.

14. The heat insulating film according to claim 1, wherein The heat-insulating layer includes an electrode layer including the conductive patterns and the separation regions, a lower insulating layer disposed between the base material layer and the electrode layer, and an upper insulating layer disposed on the electrode layer.

15. The heat-insulating film according to claim 14, wherein The electrode layer includes a transparent conductive oxide.

16. The heat-insulating film according to claim 14, wherein The heat-insulating layer further includes a bonding layer disposed between the base material layer and the lower insulating layer.

17. A window structure, characterized by includes: a lower substrate; an upper substrate disposed apart from the lower substrate; and a heat-insulating layer disposed on the lower substrate and including conductive patterns arranged apart from each other and separation regions between the conductive patterns, the sum of the length of one side of the conductive pattern and the width of the separation region adjacent to the one side of the conductive pattern is 50 μm to 250 μm, the area of the separation region is greater than 3% and less than or equal to 20% of the total area of the heat-insulating layer in a planar direction.

18. The window structure of claim 17, wherein, further includes: an air layer formed between the lower substrate and the upper substrate.

19. The window structure of claim 17, wherein, further includes: an interlayer insulating layer interposed between the lower substrate and the upper substrate.

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