Fan frame and cooling fan with same

By designing stress-relief structures and connections at the edge of the cooling fan's base plate, the problems of base deformation and noise were solved, achieving flatness and stable operation of the base plate, reducing airflow leakage and vibration, and improving the fan's service life and efficiency.

CN223724936UActive Publication Date: 2025-12-26TAICANG HUAYING ELECTRONIC MATERIALS CO LTD
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Patent Information

Application Number
CN202422739515.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-11
Publication Date
2025-12-26
Estimated Expiration
2034-11-11

AI Technical Summary

Technical Problem

Existing cooling fans deform due to uneven stress distribution on the base in narrow spaces, affecting flatness. Furthermore, the thinner design reduces the gap between the fan wheel and the base, causing noise and unbalanced operation. Additionally, there are issues with airflow leakage and side wall misalignment and vibration.

Method used

The fan frame design employs a stress-relief structure. By sealing the gaps in the stress-relief structure at the edge extension and connection of the substrate, and combining the extension with the frame integrally molded, substrate deformation is prevented and noise is reduced, ensuring stable connection of the side wall.

Benefits of technology

It improves the flatness of the substrate, reduces noise generation, prevents airflow leakage and sidewall misalignment vibration, and improves the lifespan and operating efficiency of the fan.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a fan frame and a cooling fan with the fan frame. The fan frame comprises a substrate, a fan frame and a fan cover, the frame is formed on the edge of the substrate in an injection molding manner and extends upwards, the frame is provided with at least one stress release structure, and the frame is divided into a plurality of side wall parts by taking the at least one stress release structure as a boundary; and the connecting part is used for at least integrally connecting the upper half parts of the two parts of side wall parts on the two sides of the stress release structure in the vertical direction, and is used for improving the stress deformation of the substrate, improving the flatness of the substrate and reducing the generation of noise at the same time.
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Description

TECHNICAL FIELD

[0001] The present application relates to a fan frame and a cooling fan with the same. BACKGROUND

[0002] A centrifugal fan is a commonly used cooling device, which is often applied to electronic devices (such as notebook computers, etc.) with narrow space and side outlet. In the design and production, a frame is usually injection molded on a metal base. The space surrounded by the frame can be provided with a fan wheel, and an upper cover can be combined with the upper edge of the frame to accommodate the fan wheel.

[0003] However, the cooling fan for narrow space must be thin and light, which causes the base to be stressed and extruded by the frame during injection molding of the frame. Due to the temperature change of the molten plastic forming the frame, the stress distribution of the base is uneven, which causes the deformation of the base and finally leads to the unevenness of the plane of the base. In addition, the thin fan limits the configuration space of the fan wheel, which makes the gap size between the fan wheel and the base and the upper cover in the axial direction smaller. If the plane of the base is uneven, the fan wheel will collide with the base when rotating, which causes noise and unbalanced operation of the fan, shortens the service life of the existing cooling fan, and reduces the operation efficiency of the fan.

[0004] To solve the above technical problems, the existing technology CN215719808U patent (existing technology one) proposes a technical solution, which is to injection mold a plurality of side wall parts at the outer periphery of the base plate. The plurality of side wall parts are discontinuous, and the plurality of side wall parts have a gap between each other. The gap provides a certain flexibility for the injection molded side wall parts, which can prevent the extrusion of the base plate caused by the thermal expansion and contraction of the material after the side wall parts are injection molded, and effectively reduces the wrapping force generated by the plastic wrapping and the deformation of the base plate. However, this will produce new technical problems. Problem one: the gap directly connects the internal air flow channel with the outside, which will cause the problem of fan air leakage. Problem two: due to the discontinuous of the plurality of side wall parts, the upper ends of the two side wall parts at the gap position are completely independent. When the upper plate is assembled to the upper edge of the side wall part, the upper edges of the two side wall parts at the gap position are prone to misalignment in the thickness direction. In addition, when the fan wheel rotates at high speed, the upper edges of the two side wall parts at the gap position are prone to vibration and noise.

[0005] Therefore, another solution appears in the existing technology, such as CN221144831U patent (existing technology two), which mainly tries to solve the above problem one in the existing technology one. The existing technology two proposes two technical solutions. Solution one is to design the gap as a non-straight through staggered slot (refer to the patent attached Figures 1 to 9The second solution is to bend the edge of the upper cover to extend a bent portion, the bent portion is located corresponding to the gap, and the gap is shielded by the bent portion to solve the problem of air leakage of the gap. However, the first solution of the second prior art only slightly improves the gap leakage problem, but does not completely solve the problem, and also has the problems of misalignment of the adjacent side wall portions at the gap position and running vibration. In addition, although the second solution of the second prior art can better solve the problem of air leakage of the gap, since the upper cover is generally assembled to the side wall portion, there is a tolerance (such as assembly tolerance, design tolerance, etc.) between the combined position surface of the bent portion and the side wall portion, which aggravates the problem of running vibration, and also cannot solve the misalignment problem of the adjacent side wall portions at the gap position, especially the misalignment vibration problem of the upper end edges of the adjacent side wall portions at the gap position.

[0006] Therefore, it is necessary to improve the fan frame of the heat dissipation fan. Content of the utility model

[0007] The purpose of the present application is to provide a fan frame and a heat dissipation fan with the fan frame, which can improve the deformation of the substrate under stress, improve the flatness of the substrate, and reduce noise.

[0008] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0009] A fan frame, characterized in that it comprises:

[0010] a substrate;

[0011] a frame, which is injection molded on the edge of the substrate and extends upward, and has at least one stress release structure, which divides the frame into several side wall portions.

[0012] a connecting portion, which integrally connects two side wall portions located on the upper half of the upper and lower directions on both sides of the stress release structure.

[0013] Further, it further comprises:

[0014] an extension portion, which is located on the edge of the substrate;

[0015] The extension portion extends to cover at least part of the position of the stress release structure, and the extension portion and the connecting portion block the inner side and the outer side of the frame.

[0016] Further, the stress release structure is a gap structure that disconnects the frame;

[0017] The two side edges of the extension part are combined with the side wall part by injection molding, and the extension part and the connecting part seal the gap structure of the stress release structure.

[0018] Further, in the up-down direction, the height of the connecting part is not greater than half of the height of the side frame on both sides of the connecting part.

[0019] In the up-down direction, the thickness of the substrate is not greater than one fourth of the height of the side frame.

[0020] Further, the side frame is combined with the extension part by injection molding.

[0021] In the up-down direction, the height of the extension part is the same as the height of the side frame at the positions on both sides of the extension part, and the connecting part is formed by a thin wall layer attached to the outer surface of the extension part.

[0022] The stress release structure is a groove formed by the side frame being recessed inward at the position of the extension part.

[0023] Further, in the up-down direction, the height of the extension part is less than the height of the side frame at the positions on both sides of the extension part, and the connecting part is combined with the upper edge of the extension part and flush with the upper edge of the side wall part.

[0024] Further, the outer surface of the connecting part further extends outward to form a thickened part, and the thickened part covers at least the outer surface of the upper end edge of the extension part.

[0025] Further, the inner side surface of the extension part is flush with the inner side surface of the side frame.

[0026] In the up-down direction, the height of the extension part, the height of the thin wall layer, and the height of the side frame at the positions on both sides of the extension part are the same.

[0027] Further, the thickness of the thin wall layer is not greater than one half of the thickness of the side frame on both sides of the extension part.

[0028] Further, the thickness of the thin wall layer is not less than 0.2 mm and not greater than 0.5 mm, and the thickness of the side frame at the positions on both sides of the extension part is not less than 1 mm.

[0029] To achieve the above-mentioned purpose, the application adopts the following technical solutions:

[0030] A heat dissipation fan, comprising: the fan frame according to any one of the above, the substrate being a base of the heat dissipation fan;

[0031] A fan wheel located in the fan frame, and the rotation axis of the fan wheel being perpendicular to the plane of the substrate;

[0032] An upper cover combined with the end edge of the side frame away from the substrate.

[0033] an air inlet, formed through the upper cover and located directly above the fan wheel, the air inlet being open along the axial direction of the fan wheel;

[0034] an air outlet, formed between the upper cover and the base plate at one side, the air outlet being open along the radial direction of the fan wheel.

[0035] The application has the advantages of improving the deformation of the substrate under stress, improving the flatness of the substrate, and reducing noise. BRIEF DESCRIPTION OF DRAWINGS

[0036] The application will be further described below in conjunction with the drawings and examples.

[0037] Figure 1 is a perspective view of the first embodiment of the heat dissipation fan of the application.

[0038] Figure 2 is Figure 1 a top view of the heat dissipation fan.

[0039] Figure 3 is Figure 1 a partially exploded view of the heat dissipation fan, specifically showing a perspective view of the upper cover separated from the side plate.

[0040] Figure 4 is Figure 1 a partially exploded view of the heat dissipation fan, specifically showing a perspective view of the upper cover separated from the side plate and the side plate separated from the bottom plate.

[0041] Figure 5 is a sectional view of the first embodiment of the application along the A-A line, specifically showing the position of one of the stress release structures on the side plate. Figure 2

[0042] Figure 6 is Figure 5 an enlarged view of the structure within the dashed box.

[0043] Figure 7 is Figure 4 an enlarged view of the structure within the dashed box.

[0044] Figure 8 is a partially exploded view of the second embodiment of the heat dissipation fan of the application, specifically showing a perspective view of the upper cover separated from the side plate and the side plate separated from the bottom plate.

[0045] Figure 9 is a sectional view of the second embodiment of the heat dissipation fan of the application, the angle and position of the section being the same as those of the first embodiment. Figure 2

[0046] Figure 10 is​​Figure 9 Enlarged view of the structure in the dashed-dotted box.

[0047] Figure 11 Figure 10 Variation of the second embodiment.

[0048] Figure 12 Partially exploded view of the third embodiment of the heat dissipation fan, specifically showing a perspective view of the upper cover separated from the side plate and the side plate separated from the bottom plate.

[0049] Figure 13 Cross-sectional view of the third embodiment of the heat dissipation fan, the angle and position of the cross section being the same as those of Figure 2

[0050] Figure 14 Figure 13 Enlarged view of the structure in the dashed-dotted box.

[0051] Figure 15 Figure 14 Variation of the third embodiment. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the present application clearer, further detailed description will be made to the present application in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0053] Please refer to Figures 1 to 7 for a schematic view of the first embodiment of the heat dissipation fan disclosed by the present application. Specifically, the heat dissipation fan comprises a fan frame (not shown), a fan wheel 3 rotatably assembled in the fan frame and a stator assembly (not shown). The fan frame comprises a base plate 1 (preferably a base of the heat dissipation fan, the base plate 1 is preferably a metal plate), a frame 2 integrally combined with the outer peripheral edge of the base plate 1 by injection molding and an upper cover 4 arranged at the upper end edge position of the frame 2. An air inlet 41 is formed through the upper cover 4, and an air outlet 201 is formed at one side position between the upper cover 4 and the base plate 1. The fan wheel 3 is located directly below the air inlet 41, and the stator assembly is located directly below the fan wheel 3. A magnetic induction gap is formed between the stator assembly and the fan wheel 3. When in use, the stator assembly generates a magnetic field after being energized, which magnetically couples with the fan wheel 3 and drives the fan wheel 3 to rotate. The fan wheel 3 drives air to be sucked in through the air inlet 41 and blown out through the air outlet 201 after rotating, so as to realize the function of driving wind and dissipating heat. In the present application, the heat dissipation fan is a centrifugal fan, the rotating shaft (not numbered) of the fan wheel 3 is perpendicular to the plane of the base plate 1, the air inlet 41 is opened along the axial direction of the fan wheel 3, and the air outlet 201 is opened along the radial direction of the fan wheel 3.

[0054] ​​​​The outer peripheral edge of the substrate 1 extends upward to form an extension 11. The extension 11 is embeddedly combined into the frame 2 (achieved at the same time of injection molding the frame 2). Preferably, the inner surface of the extension 11 is flush with the inner surface of the frame 2. The outer surface of the frame 2 is formed with a stress release structure 21 at the position corresponding to the extension 11. The frame 2 is divided into two parts by the stress release structure 21, i.e. two side wall portions 20. The stress release structure 21 can provide a deformation allowance for the injection molded frame 2, so as to prevent the frame 2 from being stressed and squeezed by the substrate 1 due to the condensation shrinkage of the molten plastic material (hot melt material forming the frame 2) after injection molding, so that the stress of the frame 2 when being molded on the substrate 1 can be dispersed, thereby reducing the influence of the flatness of the frame 2 on the substrate 1 after injection molding and condensation, and improving the flatness of the substrate 1.

[0055] Please refer to Figures 1 to 7 In the first embodiment shown in the drawings, the stress release structure 21 is a gap structure disconnecting the frame 2. The lower end portion of the gap structure of the stress release structure 21 is blocked by the extension 11. In the up-down direction, the height of the extension 11 is less than the height of the frame 2 at the positions on both sides of the extension 11. The upper end edge of the extension 11 is blocked by a connecting portion 22, and the connecting portion 22 integrally connects the two side wall portions 20 on both sides of the stress release structure 21. The connecting portion 22 is formed synchronously when the frame 2 is injection molded. The extension 11 and the connecting portion 22 block the inner side and the outer side of the frame 2, so as to avoid the situation that air flow leaks to the outside of the heat dissipation fan through the gap structure of the stress release structure 21. The connecting portion 22 can prevent the upper end edges of the two side wall portions 20 on both sides of the stress release structure 21 from being dislocated in the thickness direction, avoid the upper end edges of the side wall portions 20 from being peeled off (in the radial direction of the fan wheel 3) from the two sides of the extension 11, and prevent the upper end edges of the two side wall portions 20 on both sides of the stress release structure 21 from vibrating (in the radial direction of the fan wheel 3) and generating noise during use of the heat dissipation fan. In addition, in the present application, the extension 11 is formed on the substrate 1, and the substrate 1 and the extension 11 are directly injection molded and combined with the frame 2, so as to avoid that the extension 11 is not tightly matched with the frame 2, make the extension 11 more firmly combined with the frame 2, and further avoid or reduce the vibration noise of the extension 11.

[0056] Please refer to Figures 1 to 7As shown, in theory, the connecting portion 22 is not provided, and the two parts of the side wall portion 20 on both sides of the stress release structure 21 are completely disconnected (completely physically disconnected), which is the best solution to improve the stress deformation of the substrate 1. However, the two parts of the side wall portion 20 are completely disconnected, which will cause the technical problems described in the background art. Therefore, in the preferred embodiment of the present application, the height of the connecting portion 22 in the up-down direction is not greater than half the height of the corresponding position of the frame 2 (that is, the frame 2 at the connecting position of the connecting portion 22) in the up-down direction. In this way, while ensuring that the stress release structure 21 has a good effect on stress dispersion of the substrate 1, it can also prevent the side wall portion 20 from vibrating and generating noise. In this way, a balance is achieved, which can effectively improve the flatness of the substrate 1 while solving the technical problems described in the prior art to meet customer needs.

[0057] Figures 1 to 7 In the embodiment shown, the thickness of the connecting portion 22 is the same as that of the extension portion 11, the inner surface of the connecting portion 22 corresponds to the inner surface of the extension portion 11 and the inner surface of the frame 2, and the outer surface of the connecting portion 22 corresponds to the outer surface of the extension portion 11.

[0058] Please refer to Figures 8 to 10 The second embodiment of the present application is different from the first embodiment (as shown in Figures 1 to 7 The only difference between the second embodiment and the first embodiment is the stress release structure 21. The second embodiment actually adds a thin wall layer 222 structure to the first embodiment. The thin wall layer 222 covers the outer surface of the connecting portion 22 and the outer surface of the extension portion 11. In the up-down direction, the height of the thin wall layer 222 is the same as the height of the frame 2 at the position on both sides of the extension portion 11. The thin wall layer 222 structure helps to prevent the side wall portion 20 from vibrating and the side wall portion 20 from peeling off the connecting portion 22, but to some extent, it will affect the stress dispersion effect of the stress release structure 21 on the substrate 1. Therefore, preferably, the thickness of the thin wall layer 222 is not greater than half the thickness of the frame 2 at the position on both sides of the extension portion 11. In the second embodiment, the extension portion 11, the connecting portion 22, and the thin wall layer 222 separate the inner side and the outer side of the frame 2. Preferably, the thickness of the thin wall layer 222 is not less than 0.2 mm and not greater than 0.5 mm, and the thickness of the frame 2 at the position on both sides of the extension portion 11 is not less than 1 mm.

[0059] Please refer to 11, which is the second embodiment of the present application Figures 8 to 10) is optimized so that the thin-wall layer 222 only covers the outer surface of the connecting portion 22 and the outer surface of the upper end edge of the extending portion 11, and the outer surface of the lower end edge of the extending portion 11 is not covered by the thin-wall layer 222, so that the same technical effects as the second embodiment can be achieved. In this variant, the thin-wall layer 222 is also referred to as the thickened portion 221 (see Figure 11 In this variant, the extending portion 11, the connecting portion 22 and the thin-wall layer 222 separate the inner side and the outer side of the frame 2.

[0060] Please refer to Figures 12 to 14 for the third embodiment of the present application, in which the height of the extending portion 11 is the same as the height of the frame 2 on both sides of the extending portion 11 in the up-down direction (or the upper edge of the extending portion 11 is flush with the upper edge of the frame 2 on both sides of the extending portion 11), and the connecting portion 22 is formed by the thin-wall layer 222 attached to the outer surface of the extending portion 11. Compared with the second embodiment, the connecting portion 22 above the upper end edge of the extending portion 11 in the second embodiment is cancelled, and the extending portion 11 is continued to be extended upward to be flush with the upper edge of the frame 2. In the third embodiment, preferably, the thickness of the thin-wall layer 222 is not greater than half of the thickness of the frame 2 on both sides of the extending portion 11. Preferably, the thickness of the thin-wall layer 222 is not less than 0.2 mm and not greater than 0.5 mm, and the thickness of the frame 2 on both sides of the extending portion 11 is not less than 1 mm. In the third embodiment, the stress release structure 21 is a groove formed by the frame 2 being concave inward from the outer side at the position of the extending portion 11 and not penetrating through. In the third embodiment, the height of the extending portion 11, the height of the thin-wall layer 222 and the height of the frame 2 on both sides of the extending portion 11 are the same in the up-down direction. Of course, in order to achieve better effects, the upper end edge position of the thin-wall layer 222 (the position adjacent to the upper cover 4) can be designed to be thicker, and the upper end edge position of the thin-wall layer 222 can be designed to be thinner (because the stress extrusion of the frame 2 to the substrate 1 is mainly concentrated at the lower end position of the frame 2). In the third embodiment, the extending portion 11 and the thin-wall layer 222 separate the inner side and the outer side of the frame 2.

[0061] Please refer to Figure 15 for the third embodiment of the present application, in which the height of the extending portion 11 is the same as the height of the frame 2 on both sides of the extending portion 11 in the up-down direction (or the upper edge of the extending portion 11 is flush with the upper edge of the frame 2 on both sides of the extending portion 11), and the connecting portion 22 is formed by the thin-wall layer 222 attached to the outer surface of the extending portion 11. Compared with the second embodiment, the connecting portion 22 above the upper end edge of the extending portion 11 in the second embodiment is cancelled, and the extending portion 11 is continued to be extended upward to be flush with the upper edge of the frame 2. In the third embodiment, preferably, the thickness of the thin-wall layer 222 is not greater than half of the thickness of the frame 2 on both sides of the extending portion 11. Preferably, the thickness of the thin-wall layer 222 is not less than 0.2 mm and not greater than 0.5 mm, and the thickness of the frame 2 on both sides of the extending portion 11 is not less than 1 mm. In the third embodiment, the stress release structure 21 is a groove formed by the frame 2 being concave inward from the outer side at the position of the extending portion 11 and not penetrating through. In the third embodiment, the height of the extending portion 11, the height of the thin-wall layer 222 and the height of the frame 2 on both sides of the extending portion 11 are the same in the up-down direction. Of course, in order to achieve better effects, the upper end edge position of the thin-wall layer 222 (the position adjacent to the upper cover 4) can be designed to be thicker, and the upper end edge position of the thin-wall layer 222 can be designed to be thinner (because the stress extrusion of the frame 2 to the substrate 1 is mainly concentrated at the lower end position of the frame 2). In the third embodiment, the extending portion 11 and the thin-wall layer 222 separate the inner side and the outer side of the frame 2. Figures 12 to 14In a modified embodiment of the third embodiment, the lower end position part of the thin wall layer 222 (i.e. the connecting part 22) is cancelled, and only the upper end position part of the thin wall layer 222 is retained. In this modified embodiment, the extension part 11 and the thin wall layer 222 (connecting part 22) separate the inner side and the outer side of the frame 2. In this modified embodiment, the thickness of the thin wall layer 222 is preferably not more than half the thickness of the frame 2 on both sides of the extension part 11. The thickness of the thin wall layer 222 is preferably not less than 0.2 mm and not more than 0.5 mm, and the thickness of the frame 2 on both sides of the extension part 11 is not less than 1 mm.

[0062] It should be noted that in some use scenarios, the extension part 11 can be cancelled, and only the connecting part 22 is formed, without considering the leakage of air flow through the gap structure forming the stress release structure 21 to the outside of the heat dissipation fan, which is more conducive to improving the stress deformation of the substrate 1.

[0063] In addition, in other modified embodiments, the extension part 11 can be arranged on the upper cover 4, but the upper cover 4 and the substrate 1 are fixed together by assembly, so there is a problem that the extension part 11 is not tightly combined with the frame 2. However, in this modified embodiment, due to the arrangement of the connecting part 22, the problem of vibration of the upper end edges of the two part side wall parts 20 on both sides of the stress release structure 21 to generate noise can also be solved.

[0064] It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and it is intended to encompass all changes falling within the meaning and range of equivalents of the claims.

[0065] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A fan frame, characterized in that, include: substrate(1); The frame (2) is injection molded on the edge of the substrate (1) and extends upward. The frame (2) has at least one stress relief structure (21) and divides the frame (2) into several sidewall portions (20) by the at least one stress relief structure (21). The connecting part (22) integrally connects at least the two side wall parts (20) located on both sides of the stress relief structure (21) in the upper half of the vertical direction.

2. The sector frame as described in claim 1, characterized in that, Also includes: An extension (11) is located at the edge of the substrate (1); The extension (11) extends to cover at least a portion of the stress relief structure (21), and the extension (11) and the connecting portion (22) separate the inner and outer sides of the frame (2).

3. The sector frame as described in claim 2, characterized in that: The stress relief structure (21) is a gap structure that breaks the frame (2); The two sides of the extension (11) are injection molded to be combined with the sidewall (20), and the extension (11) and the connecting part (22) seal the gap structure of the stress relief structure (21).

4. The sector frame as described in claim 1, characterized in that: Along the vertical direction, the height of the connecting part (22) is not greater than half the height of the frame (2) on both sides of the connecting part (22); Along the vertical direction, the thickness of the substrate (1) is no more than one-quarter of the height of the frame (2).

5. The sector frame as described in claim 2 or 3, characterized in that: The frame (2) is combined with the extension (11) by injection molding; Along the vertical direction, the height of the extension (11) is the same as the height of the frame (2) on both sides of the extension (11), and the connecting part (22) is formed by a thin wall layer (222) that adheres to the outer surface of the extension (11). The stress relief structure (21) is a groove formed by the inward indentation of the frame (2) at the location of the extension (11).

6. The sector frame as described in claim 2 or 3, characterized in that: Along the vertical direction, the height of the extension (11) is less than the height of the frame (2) on both sides of the extension (11), and the connecting part (22) is attached to the upper edge of the extension (11) and is flush with the upper edge of the side wall part (20).

7. The sector frame as described in claim 6, characterized in that: The outer surface of the connecting portion (22) is further extended outward to form a thickened portion (221), which at least covers the outer surface of the upper edge of the extension portion (11).

8. The sector frame as described in claim 5, characterized in that: The inner side of the extension (11) is flush with the inner side of the frame (2); Along the vertical direction, the height of the extension (11), the height of the thin-walled layer (222), and the height of the frame (2) on both sides of the extension (11) are all the same.

9. The sector frame as described in claim 5, characterized in that: The thickness of the thin-walled layer (222) is no more than half the thickness of the frame (2) on both sides of the extension (11).

10. The sector frame as described in claim 9, characterized in that: The thickness of the thin-walled layer (222) is not less than 0.2 mm and not more than 0.5 mm, and the thickness of the frame (2) on both sides of the extension (11) is not less than 1 mm.

11. A cooling fan, characterized in that, include: The fan frame as described in any one of claims 1 to 10, wherein the base plate (1) is the base of the cooling fan; The fan wheel (3) is located inside the fan frame, and the axis of rotation of the fan wheel (3) is perpendicular to the plane of the base plate (1); The top cover (4) is attached to the edge of the frame (2) away from the substrate (1); An air inlet (41) is formed through the upper cover (4) and located directly above the fan wheel (3). The air inlet (41) opens along the axial direction of the fan wheel (3). An air outlet (201) is formed on one side between the upper cover (4) and the base plate (1), and the air outlet (201) opens radially along the fan wheel (3).

Citation Information

Patent Citations

  • Centrifugal fan frame structure

    CN215719808U

  • Fan frame and fan with same

    CN221144831U