Temperature measuring structure for semiconductor equipment

Abstract

The utility model discloses a temperature measurement structure used for semiconductor equipment. The temperature measurement structure comprises a thermocouple, an installation assembly and two connection terminals. The mounting assembly is detachably connected to a furnace body of the semiconductor equipment, and a first through hole is formed in the central area of the mounting assembly; the connecting terminal is in insulated connection with the edge area of the mounting assembly; the thermocouple is provided with a hot end and a cold end which are opposite, and the hot end is arranged at a measured point in the furnace body; the cold end penetrates through the first through hole so as to extend out of the mounting assembly and is in threaded connection with the mounting assembly; the cold end of the thermocouple is provided with two wires which are respectively connected with the two connecting terminals; the connecting terminal is also connected with an acquisition system, so that a signal of the thermocouple is transmitted to the acquisition system through the connecting terminal; wherein the length of the cold end, extending out of the mounting assembly, of the thermocouple is adjustable, so that the position of the thermocouple is adjusted; the temperature measuring structure of the utility model can adjust the temperature measuring position of the thermocouple, thereby more accurately measuring the temperature of the semiconductor device.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature measurement field, concretely relates to a temperature measurement structure for semiconductor equipment. BACKGROUND

[0002] In the semiconductor processing process, the temperature of various semiconductor equipment will affect the process effect, and the temperature needs to be measured, for example, diffusion furnace, CVD (chemical vapor deposition) furnace, annealing furnace and the like. The length of the current temperature measuring device is not adjustable, and only the temperature of the fixed position can be measured, and there is a use limitation.

[0003] Therefore, it is necessary to propose a length-adjustable semiconductor equipment temperature measurement structure. UTILITY MODEL CONTENT

[0004] The utility model discloses a temperature measurement structure for semiconductor equipment, and the length can be adjusted, so that the temperature of different positions can be measured.

[0005] To achieve the above object, the utility model provides a temperature measurement structure for semiconductor equipment, which comprises a thermocouple, a mounting assembly and two connecting terminals.

[0006] The mounting assembly is detachably connected to the furnace body of the semiconductor equipment, and the central region of the mounting assembly has a first through hole.

[0007] The connecting terminal is insulatedly connected with the edge region of the mounting assembly.

[0008] The thermocouple has opposite hot end and cold end, the hot end is arranged at the measured point in the furnace body, the cold end passes through the first through hole and extends out of the mounting assembly, and is screw-connected on the mounting assembly, the cold end of the thermocouple has two wires, and the two wires are connected with two connecting terminals respectively.

[0009] The connecting terminal is also connected with the acquisition system, so that the signal of the thermocouple is transmitted to the acquisition system through the connecting terminal.

[0010] The length of the cold end of the thermocouple extending out of the mounting assembly is adjustable, so that the position of the hot end of the thermocouple is adjusted.

[0011] Optionally, the cold end of the thermocouple has external threads, the mounting assembly comprises a mounting plate and a nut, the central region of the mounting plate is provided with the first through hole, the nut is matched with the external threads of the cold end of the thermocouple, and the cold end of the thermocouple is fixed on the mounting plate through the nut.

[0012] Optionally, the mounting assembly comprises two nuts; the two nuts are arranged at the cold end of the thermocouple and are respectively located at two sides of the first through hole, and the position of the thermocouple is fixed through the threaded connection between the nuts and the thermocouple.

[0013] Optionally, the first through hole is a threaded hole, the mounting assembly comprises one nut, the first through hole and the nut are matched with the external thread of the cold end of the thermocouple; the nut is located at any side of the first through hole, and the thermocouple is fixed on the mounting plate through the threaded matching relationship between the first through hole and the thermocouple and the locking effect of the nut.

[0014] Optionally, the position of the hot end of the thermocouple is adjusted by changing the connecting position of the nut on the thermocouple.

[0015] Optionally, the edge region of the mounting plate is provided with at least two uniformly distributed second through holes corresponding to the blind holes on the furnace body of the semiconductor device, and the mounting plate is fixed on the furnace body of the semiconductor device through the second through holes.

[0016] Optionally, the two connecting terminals are insulatedly connected with the edge region of the mounting assembly through two insulating pieces.

[0017] Optionally, the mounting plate has two first threaded blind holes, the first end of the insulating piece is provided with an external thread and is matched with the first threaded blind hole, and the first end of the two insulating pieces is respectively threadedly connected in the two first threaded blind holes; the second end of the insulating piece is provided with a second threaded blind hole, the connecting terminal is provided with an external thread, and the two connecting terminals are respectively threadedly connected in the two second threaded blind holes.

[0018] Optionally, the connecting terminal and the nut are made of insulating material.

[0019] Optionally, the mounting plate is made of stainless steel, aluminum alloy, magnesium alloy or titanium alloy.

[0020] Compared with the prior art, the technical scheme of the temperature measuring structure for the semiconductor device has the following advantages and beneficial effects:

[0021] The temperature measuring structure for the semiconductor device comprises a thermocouple, a mounting assembly and two connecting terminals, the mounting assembly is detachably connected on the furnace body of the semiconductor device, the thermocouple is movably arranged on the mounting assembly, the length of the cold end of the thermocouple extending out of the mounting assembly is adjustable, so that the position of the hot end of the thermocouple is adjusted, the temperature of the measured point can be more accurately measured, and the thermocouple can also be prevented from being damaged when the measured part expands, the structure of the technical scheme is compact, the mounting is convenient, and the later maintenance and replacement are facilitated.

[0022] The connecting terminal is fixed on the mounting assembly through the insulating piece, so that the thermocouple is prevented from being directly electrically connected with the furnace body, and the accuracy of the acquisition result of the acquisition system is avoided from being affected.

[0023] The mounting plate is made of high-strength material such as stainless steel, so that the strength is improved, and the cost is reduced compared with ceramic material. BRIEF DESCRIPTION OF DRAWINGS

[0024] Fig. 1 It is a schematic view of a temperature measurement structure for a semiconductor device according to an embodiment of the present application;

[0025] Fig. 2 It is a schematic view of another temperature measurement structure for a semiconductor device according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] The technical scheme of the embodiment of the present application will be described in detail below. Figs. 1-2 The technical scheme, structural features, achieved purposes and effects of the embodiment of the present application will be described in detail.

[0027] It should be noted that the drawings are greatly simplified and use non-precise scales, and are only used to conveniently and clearly assist in explaining the purpose of the embodiment of the present application, and are not used to limit the scope of the present application, so they do not have substantial technical significance, and any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.

[0028] It should be noted that in the present application, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes the explicitly listed elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device.

[0029] The utility model discloses a kind of temperature measurement structures for semiconductor equipment, thermocouple is used to measure the temperature of the furnace body of semiconductor equipment, the extension length of the thermocouple is adjustable, so that temperature measurement structure can measure the temperature at different positions of furnace body. The technical scheme of the present application will be described in detail below in conjunction with specific embodiments and drawings.

[0030] As shown in the drawings, Fig. 1The utility model discloses a temperature measurement structure for semiconductor equipment for measuring the temperature of measured point A in semiconductor equipment, which comprises a thermocouple 101, a mounting assembly 102 and a connecting terminal 103. The mounting assembly 102 is detachably connected to the furnace body of the semiconductor equipment, and the central region of the mounting assembly 102 has a first through hole 104 for mounting the thermocouple 101. The thermocouple 101 has opposite hot and cold ends. The hot end of the thermocouple 101 is arranged at the measured point A in the furnace body, and the cold end of the thermocouple 101 extends out of the mounting assembly 102 through the first through hole 104 and is fixed on the mounting assembly 102 by screw connection. Two connecting terminals 103 are respectively insulatedly connected to the edge regions of the mounting assembly 102 through two insulating members 105. The cold end of the thermocouple 101 also has two wires, which are respectively connected to the two connecting terminals 103. The two connecting terminals 103 are also connected to a collection system. Thus, the thermoelectric potential signal of the thermocouple 101 is transmitted to the collection system through the connecting terminals 103. The collection system obtains the temperature of the measured point A according to the thermoelectric potential signal. The measured point A can be a specific position or a certain component. The length of the cold end of the thermocouple 101 extending out of the mounting assembly 102 is adjustable, so as to adjust the position of the hot end of the thermocouple 101. It should be noted that the temperature measurement accuracy of the hot end of the thermocouple 101 is affected by the distance between the hot end and the measured point A. When the distance is 0, the measurement result is the most accurate, and the temperature of the measured position or component can be accurately measured. The farther the distance, the lower the measurement accuracy. However, since the temperature rise will cause thermal expansion of the measured component, if the distance between the hot end and the measured component is 0, there is a risk of damaging the thermocouple 101 or the measured component. Therefore, it is particularly important to adjust the position of the hot end of the thermocouple 101 to select a suitable measurement distance.

[0031] The cold end of the thermocouple 101 is externally threaded, the mounting assembly 102 comprises a mounting plate 106 and two nuts 107, the nuts 107 match the external threads of the cold end of the thermocouple 101, and the cold end of the thermocouple 101 is fixed on the mounting plate 106 through the nuts 107. Specifically, the central region of the mounting plate 106 is provided with the first through hole 104, and the two nuts 107 are arranged on the cold end of the thermocouple 101 and located on the two sides of the first through hole 104 respectively. After the cold end of the thermocouple 101 passes through the first through hole 104, the two nuts 107 are tightened on the cold end of the thermocouple 101, and the position of the thermocouple 101 is fixed through the threaded connection between the nuts 107 and the thermocouple 101. When it is necessary to adjust the position of the thermocouple 101, the connection positions of the nuts 107 on the thermocouple 101 are changed. Specifically, the two nuts 107 are loosened, the thermocouple 101 can be moved, the thermocouple 101 is moved forward or backward, and after the position of the hot end of the thermocouple 101 is adjusted, the two nuts 107 are tightened to fix the thermocouple 101.

[0032] The edge region of the mounting plate 106 is provided with at least two second through holes 108 which are uniformly distributed and correspond to the blind holes on the furnace body of the semiconductor equipment. The mounting plate 106 is fixed on the furnace body of the semiconductor equipment by bolts passing through the second through holes 108.

[0033] The mounting plate 106 has two first threaded blind holes 109 which are arranged in the region between the second through holes 108 and the first through hole 104. The first end of each of the two insulating members 105 is externally threaded and matches the first threaded blind holes 109, and the first ends of the two insulating members 105 are threadedly connected in the two first threaded blind holes 109 respectively. The second end of the insulating member 105 is threadedly connected with the connecting terminal 103. Specifically, the second end of the insulating member 105 is provided with a second threaded blind hole, the connecting terminal 103 is externally threaded, and the two connecting terminals 103 are threadedly connected in the two second threaded blind holes respectively.

[0034] The connecting terminal 103 is made of insulating material, which prevents the thermocouple 101 from being directly electrically connected with the furnace body through the mounting plate 106, thereby avoiding affecting the accuracy of the acquisition results of the acquisition system.

[0035] The nuts 107 are also made of insulating material, for example, ceramic.

[0036] The mounting plate 106 is made of material with certain high-temperature resistance and certain strength, for example, stainless steel, aluminum alloy, magnesium alloy, titanium alloy, etc. Compared with the ceramic structure, the mounting plate 106 has higher strength and lower cost.

[0037] The temperature measuring structure for the semiconductor equipment of the embodiment has adjustable length, compact overall structure, convenient installation, and is convenient for subsequent maintenance and replacement.

[0038] As Fig. 2 shown, it is another temperature measuring structure for semiconductor device of the utility model, the difference between this embodiment and the above-mentioned embodiment lies in, the first through hole 104 in this embodiment is the threaded hole, and the outer thread of the cold end of thermocouple 101 is matched, and the mounting assembly 102 includes the mounting plate 106 and a nut 107.In the assembly of thermocouple 101 to the mounting plate 106, the cold end of thermocouple 101 is passed through the first through hole 104, and the nut 107 is arranged on either side of the first through hole 104, and the position of thermocouple 101 is fixed by the threaded fit between the first through hole 104 and the cold end of thermocouple 101, combined with the locking effect of nut 107;when the relative distance of thermocouple 101 and mounting plate 106 is adjusted, loosen the nut 107, and then adjust the position of thermocouple 101.

[0039] Although the content of the utility model has been introduced in detail by the above preferred embodiment, it should be recognized that the above description should not be considered as the limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A temperature measurement structure for semiconductor devices, characterized in that, The utility model relates to a thermocouple, mounting assembly and two connecting terminals, and relates to a semiconductor device temperature measurement system. The mounting assembly is detachably connected to the furnace body of the semiconductor device, and the central region of the mounting assembly has a first through hole. The connecting terminals are insulatedly connected to the edge region of the mounting assembly. The thermocouple has opposite hot and cold ends, the hot end is arranged at a measurement point in the furnace body, the cold end extends out of the mounting assembly through the first through hole and is screwed to the mounting assembly, the cold end of the thermocouple has two wires that are respectively connected to the two connecting terminals. The connecting terminals are also connected to a collection system, so that the signal of the thermocouple is transmitted to the collection system through the connecting terminals. The length of the cold end of the thermocouple extending out of the mounting assembly is adjustable, so as to adjust the position of the hot end of the thermocouple. The cold end of the thermocouple has external threads, the mounting assembly includes a mounting plate and a nut, the central region of the mounting plate is provided with the first through hole, the nut matches the external threads of the cold end of the thermocouple, and the cold end of the thermocouple is fixed to the mounting plate through the nut.

2. The temperature measuring structure for a semiconductor device according to Claim 1, wherein The mounting assembly includes two nuts, the two nuts are arranged at the cold end of the thermocouple and are respectively located on the two sides of the first through hole, and the position of the thermocouple is fixed through the threaded connection between the nuts and the thermocouple.

3. The temperature measuring structure for a semiconductor device according to Claim 2, wherein The first through hole is a threaded hole, the mounting assembly includes one nut, the first through hole and the nut match the external threads of the cold end of the thermocouple, the nut is located on either side of the first through hole, and the thermocouple is fixed to the mounting plate through the threaded matching relationship between the first through hole and the thermocouple and the locking effect of the nut.

4. The temperature measuring structure for a semiconductor device according to Claim 2, wherein The position of the hot end of the thermocouple is adjusted by changing the connection position of the nut on the thermocouple.

5. The temperature measuring structure for a semiconductor device according to claim 3 or 4, wherein The edge region of the mounting plate is provided with at least two second through holes that are uniformly distributed and correspond to blind holes on the furnace body of the semiconductor device, and the mounting plate is fixed to the furnace body of the semiconductor device through the second through holes.

6. The temperature measuring structure for a semiconductor device according to Claim 2, wherein The two connecting terminals are insulatedly connected to the edge region of the mounting assembly through two insulating members.

7. The temperature measuring structure for a semiconductor device according to Claim 2, wherein The mounting plate has two first threaded blind holes, the first end of the insulating member is provided with external threads and matches the first threaded blind holes, the first end of the two insulating members is respectively screwed into the two first threaded blind holes, the second end of the insulating member is provided with a second threaded blind hole, the connecting terminal is provided with external threads, and the two connecting terminals are respectively screwed into the two second threaded blind holes.

8. The temperature measurement structure for a semiconductor device according to claim 7, wherein The connecting terminal and the nut are made of insulating material.

9. The temperature measuring structure for a semiconductor device according to Claim 2, wherein The mounting plate is made of stainless steel, aluminum alloy, magnesium alloy or titanium alloy.

10. The temperature measurement structure for a semiconductor device according to Claim 2, wherein ​

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