Photoetching alignment device for manufacturing integrated circuit chip

Abstract

The utility model discloses a photoetching alignment device for manufacturing integrated circuit chips, and relates to the technical field of integrated circuit chip processing, the photoetching alignment device comprises a concave plate and two groups of clamping mechanisms, the upper end of the concave plate is provided with an alignment exchange mechanism, the alignment exchange mechanism comprises a fixed plate, one side of the fixed plate is provided with an air cylinder in a penetrating manner, and the air cylinder is provided with an air outlet; a guide rail is fixedly mounted at the bottom end of the interior of the concave plate, two sliding seats are slidably mounted on the outer wall of the guide rail, a first toothed plate is fixedly mounted at one ends of the two sliding seats, a stable shaft seat is fixedly mounted at the bottom end of the interior of the concave plate, and a gear is rotatably mounted on the outer wall of the stable shaft seat. According to the utility model, the integrated circuit chip can be always arranged below the photoetching machine, so that the photoetching machine is prevented from being stopped after photoetching is finished every time, a large amount of time can be saved, and the processing efficiency of the photoetching machine on the integrated circuit chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit chip processing technical field especially relates to a kind of photoetching alignment device for integrated circuit chip manufacturing. BACKGROUND

[0002] Integrated circuit chip manufacturing is the process that the designed integrated circuit layout is constructed with specific function micro electronic component and interconnection line on semiconductor wafer finally forms integrated circuit chip by a series of advanced process technology.It involves the knowledge and technology of physics, chemistry, material science, electronic engineering and other multidisciplinary fields, and is the core of modern electronic information industry.Integrated circuit chip manufacturing photoetching alignment device is the extremely critical equipment in chip manufacturing process.Photoetching alignment device is a kind of equipment for accurately aligning photoetching mask and silicon wafer in integrated circuit chip manufacturing photoetching process.

[0003] As the patent announcement No.CN114879453A discloses a kind of silicon chip double-sided photoetching fine alignment device, including concave plate, two movable plates are symmetrically arranged on the top surface of concave plate, step motor is installed on the side wall of movable plate far from the center of concave plate and close to the top surface, step motor output shaft is fixedly connected with shaft, shaft other end is all through movable plate and is movably connected with it, shaft is close to the center of concave plate and is provided with positioning mechanism, silicon wafer is arranged between two movable plates, drive adjusting mechanism is arranged on the bottom surface of movable plate, auxiliary support mechanism is arranged at the center of the top surface of concave plate.

[0004] But in prior art, such as the above patent, although it can be realized, according to the size of silicon wafer, replace the pre-alignment structure, increase its range of use, while according to the demand, pre-alignment is carried out to one or two silicon wafers, a large amount of processing time is saved due to the replacement of silicon wafer and alignment, but there are still the following shortcomings, the device can only align single silicon wafer each time, after photoetching is completed each time, integrated circuit chip is installed to alignment device, meanwhile, clamping process will delay a lot of time, affect the processing efficiency of integrated circuit chip of photoetching machine. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the problem that in prior art, integrated circuit chip is installed to alignment device after photoetching is completed each time, meanwhile, photoetching machine is in stop state, clamping process will delay a lot of time, affect the processing efficiency of integrated circuit chip of photoetching machine, and proposes a kind of photoetching alignment device for integrated circuit chip manufacturing.

[0006] In order to achieve the above object, the utility model discloses the following technical scheme: a kind of photoetching alignment device for integrated circuit chip manufacturing, including concave plate and two groups of clamping mechanism, the upper end of the concave plate is provided with alignment exchange mechanism, the alignment exchange mechanism includes fixed plate, air cylinder is installed on the side of the fixed plate, the inside bottom end of the concave plate is fixedly installed with guide rail, two groups of slide block are slidably installed on the outer wall of the guide rail, one end of two groups of the slide block is fixedly installed with first toothed plate, the inside bottom end of the concave plate is fixedly installed with stable shaft seat, gear is rotatably installed on the outer wall of the stable shaft seat, the outer wall of the gear is engaged with second toothed plate, the teeth of the first toothed plate are engaged with the outer wall of the gear, one side of the second toothed plate is fixed with the extension end of the air cylinder.

[0007] Preferably, the side of the concave plate is provided with a guide groove, and the concave block is slidably installed in the guide groove.

[0008] Preferably, one end of the fixed plate is fixed with one end of the concave plate.

[0009] Preferably, the other protruding part of the concave block is fixed with one end of the second toothed plate.

[0010] Preferably, the upper side of the concave plate is provided with a first placing table, and the upper side of the concave plate is provided with a second placing table.

[0011] Preferably, the upper end of the first placing table and the second placing table and located at both side edge positions are fixedly installed with arc-shaped baffle, and the lower end of the two groups of clamping mechanisms are respectively fixed with the upper end of the first placing table and the second placing table.

[0012] Preferably, the lower end of the first placing table is fixed with the upper end of one of the slide blocks, and the lower end of the second placing table is fixed with the upper end of the other slide block.

[0013] Compared with the prior art, the utility model has the advantages and positive effects that:

[0014] 1、In the utility model, by setting up alignment adjustment mechanism, can move away first placing table from original position, and second placing table moves to the position of original first placing table, can move away integrated circuit chip after processing, and the integrated circuit chip that has not been processed will move to the lower side of photoetching machine, so that the lower side of photoetching machine can have integrated circuit chip all the time, prevent stopping photoetching machine operation after each photoetching, can save a lot of time, and improve the processing efficiency of photoetching machine to integrated circuit chip, simultaneously still can make integrated circuit chip align in the lower side of photoetching machine all the time.

[0015] 2、The utility model discloses in the cooperation of concave joint and guide groove, when the second tooth plate moves, the second tooth plate will drive concave joint to move, and one of the protruding parts of concave joint will slide in the inside of guide groove, and then can guide concave joint, thereby can improve the stability when the second tooth plate moves, prevent the second tooth plate from deviating when moving. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A three-dimensional structural schematic diagram of a photoetching alignment device for integrated circuit chip manufacturing is provided for the utility model;

[0017] Figure 2 A side view of a photoetching alignment device for integrated circuit chip manufacturing is provided for the utility model;

[0018] Figure 3 A partial three-dimensional view of an alignment exchange mechanism in a photoetching alignment device for integrated circuit chip manufacturing is provided for the utility model;

[0019] Figure 4 A structure schematic diagram of a first placement table, a second placement table and a sliding seat in a photoetching alignment device for integrated circuit chip manufacturing is provided for the utility model.

[0020] Legend: 1, concave plate; 11, first placement table; 12, second placement table; 13, arc-shaped baffle; 14, clamping mechanism; 2, alignment exchange mechanism; 21, fixed plate; 22, air cylinder; 23, guide rail; 24, sliding seat; 25, first tooth plate; 26, stable shaft seat; 27, gear; 28, second tooth plate; 29, guide groove; 210, concave joint. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model is further described below in combination with the drawings and examples. It should be explained that, in the case of no conflict, the examples and features in the examples of the present application can be combined with each other.

[0022] In the following description, a lot of specific details are set forth in order to facilitate a full understanding of the utility model, but the utility model can also be implemented in other ways different from the description herein, therefore, the utility model is not limited to the specific examples disclosed in the following disclosure.

[0023] Example one: as Figure 1 - Figure 4The utility model provides a photoetching alignment device for integrated circuit chip manufacturing, including concave board 1 and two groups of clamping mechanism 14, the upper end of concave board 1 is provided with alignment exchange mechanism 2, and alignment exchange mechanism 2 includes fixed plate 21, and the side of fixed plate 21 is installed through air cylinder 22, and the inside bottom end of concave board 1 is fixedly installed with guide rail 23, and the outer wall of guide rail 23 is slidably installed with two groups of sliding seat 24, and one end of two groups of sliding seat 24 is fixedly installed with no.

[0024] The upper side of concave board 1 is provided with no. 1 placing table 11, and the upper side of concave board 1 is provided with no. 2 placing table 12, and the upper end of no. 1 placing table 11 and no. 2 placing table 12 and located at both side edge positions are fixedly installed with arc baffle 13, and the lower end of two groups of clamping mechanism 14 is fixed with the upper end of no. 1 placing table 11 and no. 2 placing table 12 respectively, and the lower end of no. 1 placing table 11 is fixed with the upper end of one group of sliding seat 24, and the lower end of no. 2 placing table 12 is fixed with the upper end of another group of sliding seat 24.

[0025] The specific settings and effects of the embodiment will be described below, start air cylinder 22, and the extension end of air cylinder 22 drives no. 2 toothed plate 28 to rotate, no. 2 toothed plate 28 drives gear 27 to rotate on the outer wall of stable shaft seat 26, gear 27 drives no. 1 toothed plate 25 to move, and no. 1 toothed plate 25 drives sliding seat 24 to slide on the outer wall of guide rail 23, and simultaneously two groups of sliding seat 24 drive no. 1 placing table 11 and no. 2 placing table 12 to move, so that no. 1 placing table 11 can be moved away from the original position, and no. 2 placing table 12 is moved to the position of original no. 1 placing table 11, the processed integrated circuit chip can be removed, and the unprocessed integrated circuit chip is moved to the lower side of photoetching machine, so that the integrated circuit chip can be kept on the lower side of photoetching machine, preventing photoetching machine from stopping running after each photoetching, saving a large amount of time, improving the processing efficiency of photoetching machine on integrated circuit chip, and keeping the integrated circuit chip aligned on the lower side of photoetching machine, and through the contraction of air cylinder 22, no. 2 placing table 12 can be moved away from the lower side of photoetching machine, and no. 1 placing table 11 is moved to the position of original no. 2 placing table 12, so that the above two steps can be repeated to continuously process integrated circuit chip.

[0026] When the second toothed plate 28 moves, the second toothed plate 28 drives the concave connecting block 210 to move, and one of the protruding parts of the concave connecting block 210 slides in the guide groove 29, thereby guiding the concave connecting block 210, so that the stability of the second toothed plate 28 during movement can be improved, and deviation of the second toothed plate 28 during movement can be prevented.

[0027] Embodiment two: as shown in Figure 1 and Figure 4 One side of the concave plate 1 is provided with a guide groove 29, the guide groove 29 is internally slidably installed with a concave connecting block 210, and the other protruding part of the concave connecting block 210 is fixed to one end of the second toothed plate 28.

[0028] The effect of the whole embodiment is that by installing two groups of arc-shaped baffles 13 on the upper ends of the first placing table 11 and the second placing table 12, the integrated circuit chips can be blocked and positioned at the same time, and by installing two groups of clamping mechanisms 14 on the upper ends of the first placing table 11 and the second placing table 12, the integrated circuit chips on the first placing table 11 and the second placing table 12 can be clamped and fixed to prevent the photolithography machine from processing them.

[0029] The working principle and method of using the device are as follows: first, install the concave plate 1 on the processing table of the photolithography machine, and align the first placing table 11 with the processing head of the photolithography machine during installation. Before starting, place the integrated circuit chip on the upper end of the first placing table 11, fix the integrated circuit chip on the upper end by one of the clamping mechanisms 14, process the integrated circuit chip by operating the photolithography machine, and during this period, the worker needs to assemble the integrated circuit chip to be processed on the second placing table 12, and then fix it on the upper surface of the second placing table 12 by the other clamping mechanism 14. Finally, after processing the integrated circuit chip on the first placing table 11, the cylinder 22 needs to be started, the extending end of the cylinder 22 drives the second toothed plate 28 to rotate, the second toothed plate 28 drives the gear 27 to rotate on the outer wall of the stable shaft seat 26, the gear 27 drives the first toothed plate 25 to move, the first toothed plate 25 drives the sliding seat 24 to slide on the outer wall of the guide rail 23, and at the same time, the two groups of sliding seats 24 drive the first placing table 11 and the second placing table 12 to move, thereby moving the first placing table 11 away from the original position, and moving the second placing table 12 to the position of the original first placing table 11, so that the processed integrated circuit chip can be removed, and the unprocessed integrated circuit chip can be moved to the lower side of the photolithography machine, and then the photolithography machine is operated to process the integrated circuit chip below, and the process can be repeated to continuously process the integrated circuit chip.

[0030] The above are only the preferred embodiments of the present application, and are not intended to limit the present application in other forms, and any skilled person in the art can change or modify the above disclosed technology content to equivalent embodiments with equivalent changes applied to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical scheme of the present application still fall within the protection scope of the present application.

Claims

1. A photolithographic alignment apparatus for manufacturing integrated circuit chips, comprising a concave plate (1) and two sets of clamping mechanisms (14), characterized in that: The upper end of the concave plate (1) is provided with an alignment and adjustment mechanism (2). The alignment and adjustment mechanism (2) includes a fixed plate (21). A cylinder (22) is installed through one side of the fixed plate (21). A guide rail (23) is fixedly installed at the inner bottom end of the concave plate (1). Two sets of slide blocks (24) are slidably installed on the outer wall of the guide rail (23). A first tooth plate (25) is fixedly installed at one end of the two sets of slide blocks (24). A stabilizing shaft seat (26) is fixedly installed at the inner bottom end of the concave plate (1). A gear (27) is rotatably installed on the outer wall of the stabilizing shaft seat (26). A second tooth plate (28) meshes with the outer wall of the gear (27). The teeth of the first tooth plate (25) mesh with the outer wall of the gear (27). One side of the second tooth plate (28) is fixed to the protruding end of the cylinder (22).

2. The photolithographic alignment apparatus for integrated circuit chip manufacturing according to claim 1, characterized in that: A guide groove (29) is provided through one side of the concave plate (1), and a concave block (210) is slidably installed inside the guide groove (29).

3. The photolithographic alignment apparatus for integrated circuit chip manufacturing according to claim 1, characterized in that: One end of the fixing plate (21) is fixed to one end of the concave plate (1).

4. The photolithography alignment apparatus for integrated circuit chip manufacturing according to claim 2, characterized in that: Another protrusion of the concave block (210) is fixed to one end of the second toothed plate (28).

5. The photolithographic alignment apparatus for integrated circuit chip manufacturing according to claim 1, characterized in that: A first placement platform (11) is provided above the concave plate (1), and a second placement platform (12) is provided above the concave plate (1).

6. The photolithography alignment apparatus for integrated circuit chip manufacturing according to claim 5, characterized in that: Arc-shaped baffles (13) are fixedly installed at the upper end of the first placement platform (11) and the second placement platform (12) and at the two side edges. The lower ends of the two sets of clamping mechanisms (14) are fixed to the upper ends of the first placement platform (11) and the second placement platform (12), respectively.

7. The photolithography alignment apparatus for integrated circuit chip manufacturing according to claim 5, characterized in that: The lower end of the first placement platform (11) is fixed to the upper end of one of the slides (24), and the lower end of the second placement platform (12) is fixed to the upper end of another slide (24).

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