Multi-compatible redundancy control fan board card and heat dissipation equipment
By designing a fan board with multi-compatible redundant control, and combining pluggable and non-pluggable fans, the problems of cumbersome maintenance and poor compatibility of traditional fan boards are solved, achieving convenient maintenance and high compatibility, and making it suitable for high-performance computing and data center scenarios.
Patent Information
- Application Number
- CN202422180267.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-09-05
AI Technical Summary
Existing fan board designs are inadequate in terms of maintenance convenience and compatibility. Traditional designs are cumbersome and have poor compatibility with pluggable fans, limiting their widespread application.
Design a multi-compatible redundant control fan board containing multiple fan groups, each including pluggable and non-pluggable fans, which are uniformly controlled by a fan controller, and an FFC connector is used to simplify signal connection.
It enables convenient maintenance and high compatibility of the fan board, and is suitable for a variety of devices, especially for environments with high requirements for stability and fast response, such as data centers.
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Figure CN223728206U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to fan control technical field especially, relate to a kind of fan board card and heat dissipation equipment of multi-compatible redundancy control. BACKGROUND
[0002] With the rapid development of information technology, the performance of computer hardware has been significantly improved, especially in the field of high-performance computing (HPC), data centers and various embedded systems, the computing power and data processing speed of hardware has reached an unprecedented level. However, the high power consumption and high heat generation that follows also poses a serious challenge to the thermal management of the system, and the efficiency of the heat dissipation system is directly related to the stability and life of the hardware equipment. Among them, the fan board card, as a key component in the heat dissipation solution, its design and performance optimization is particularly important.
[0003] Currently, the commonly used method in heat dissipation system design is to increase the speed and air volume of the fan to improve the heat dissipation efficiency. This strategy can effectively remove more heat and keep the system temperature within a safe range, thereby ensuring the continuous and efficient operation of the hardware. However, the traditional fan board card design often ignores the maintenance convenience, and the replacement process is tedious and time-consuming once the fan fails. This is a clear shortcoming in the data center environment where stability and availability are extremely high. Secondly, although the pluggable fan technology provides convenience for fan replacement, the compatibility of such board cards is poor, and they can usually only be applied to specific types of products, limiting their widespread application.
[0004] In summary, how to ensure the maintenance convenience of the board card while improving its compatibility has become a technical problem to be solved in the field. INVENTION CONTENTS
[0005] The main purpose of the utility model is to provide a kind of multi-compatible redundancy control fan board card, to solve the technical problem of how to ensure the maintenance convenience of the board card while improving its compatibility.
[0006] To achieve the above purpose, the utility model provides a kind of multi-compatible redundancy control fan board card, the fan board card includes multiple groups of fans, and each group of fans includes multiple pluggable fans and unplugable fans.
[0007] Optionally, each group of fans includes a fan controller.
[0008] Optionally, the fan controller is used to control multiple pluggable fans and multiple unplugable fans in the group.
[0009] Optionally, the multi-compatible redundancy control fan board card further includes multiple FFC connectors.
[0010] In addition, to achieve the above object, the application further provides a heat dissipation device, which comprises the multi-compatible redundant control fan board card.
[0011] Optionally, the heat dissipation device further comprises a logic device, a power supply and a central processing unit.
[0012] The power supply, the fan board card, the logic device and the central processing unit are sequentially connected.
[0013] Optionally, the power supply is connected to each fan controller of the fan board card.
[0014] The first end of the logic device is connected to each fan controller, and the second end is connected to each pluggable fan and each non-pluggable fan of the fan board card.
[0015] Optionally, the power supply is used for supplying power to the fan board card.
[0016] The logic device is used for adjusting the duty cycle through PWM and SENSOR control signals to control the rotating speed of each pluggable fan and each non-pluggable fan and obtain fan rotating speed information, and is used for controlling the switching of each fan controller through an enable control signal.
[0017] The central processing unit is used for controlling the logic device through an I2C bus.
[0018] Optionally, all signals on the fan board card are connected through an FFC connector.
[0019] Optionally, the heat dissipation device further comprises a temperature sensor.
[0020] The temperature sensor is used for detecting the board card temperature of the fan board card.
[0021] The central processing unit reads the board card temperature and controls the logic device according to the board card temperature.
[0022] In the technical scheme of the utility model, the multi-compatible redundant control fan board card comprises multiple groups of fans, each group of fans comprises multiple pluggable fans and multiple non-pluggable fans, when a fan fails, the pluggable fan can be maintained to ensure the operation of the fan, and the device using the non-pluggable fan can be compatible, the maintenance convenience of the fan board card is ensured, and the compatibility of the fan board card is improved. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described below only constitute some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in the drawings without creative labor.
[0024] Figure 1 The structural diagram of the heat dissipation device related to the present application;
[0025] Figure 2 The module frame diagram of the heat dissipation device related to the present application;
[0026] Figure 3 The specific structural diagram of the heat dissipation device related to the present application.
[0027] Explanation of the reference signs:
[0028] Reference Name Reference Name 10 Fan board 20 POWER 30 CPLD 40 CPU
[0029] The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0031] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.
[0032] In addition, if the description of "first", "second" and the like is involved in the embodiments of the utility model, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one feature. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary technical personnel, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.
[0033] With the rapid development of information technology, the performance of computer hardware has been significantly improved, especially in the field of high-performance computing (HPC), data center and various embedded systems, the computing power and data processing speed of hardware have reached an unprecedented level. However, the high power consumption and high heat generation that follow also pose a severe challenge to the thermal management of the system, and the efficiency of the heat dissipation system is directly related to the stability and life of the hardware device, among which, the fan board card as a key component in the heat dissipation solution, its design and performance optimization is particularly important.
[0034] At present, the commonly used method in the design of heat dissipation system is to increase the speed and air volume of the fan to improve the heat dissipation efficiency. This strategy can effectively take away more heat and keep the system temperature within a safe range, thereby ensuring the continuous and efficient operation of the hardware. However, the traditional fan board card design often ignores the maintenance convenience, and once the fan fails, the replacement process is tedious and time-consuming, which is a obvious shortcoming in the data center environment with high requirements for stability and availability. Secondly, although the pluggable fan technology provides convenience for fan replacement, the compatibility of such board cards is poor, and they can usually only be applied to specific types of products, limiting their possibility of widespread application.
[0035] In summary, how to ensure the maintenance convenience of the board card while improving the compatibility of the board card has become a technical problem to be solved in the field.
[0036] In view of the above problems, in the technical scheme of the utility model, a multi-compatible redundant control fan board card is designed, which includes multiple groups of fans, each group of fans includes multiple pluggable fans and multiple non-pluggable fans. When a fan fails, the pluggable fan can be maintained to ensure the operation of the fan, and the device using the non-pluggable fan can be compatible, which not only ensures the maintenance convenience of the fan board card, but also improves the compatibility of the fan board card.
[0037] Referring to Figure 1 , as shown in Figure 1The utility model provides a kind of circuit framework schematic diagram of fan board card of multiple compatible redundancy control, the fan board card includes multiple groups of fans, and each group of fans includes multiple pluggable fans and unplugable fan.
[0038] Optionally, each group of the fans includes a fan controller.
[0039] Optionally, the fan controller is configured to control the plurality of pluggable fans and the plurality of unplugable fans in the group.
[0040] In the present embodiment, the fan board card integrates multiple groups of fans, each group of fans is composed of pluggable fans and unplugable fans, aiming to provide flexible and efficient cooling capacity. The pluggable board card is designed as a modular unit, which can be easily inserted or pulled out without shutting down the entire system, greatly simplifying the maintenance and replacement process. This design is particularly suitable for data centers and other environments that require quick response and minimal downtime. The pluggable fans are usually equipped with standard interfaces, which are easy to be compatible with other hardware, and they may have independent monitoring and control functions.
[0041] On the contrary, the unplugable fans are fixedly installed on the fan board card, and although they are not as easy to replace as the pluggable fans, they usually have more stable mechanical structures and higher heat dissipation efficiency.
[0042] In order to optimize fan performance and ensure intelligent management of system heat dissipation, each group of fans can be equipped with a fan controller.
[0043] Optionally, the fan board card further includes a plurality of FFC connectors.
[0044] In the present embodiment, there are many fan board card signals on the market, and many cables are used. The use of FFC connectors can make the design simple and solve the problem of complex cables.
[0045] In addition, the present application also provides a heat dissipation device including the fan board card 10.
[0046] Further, please refer to Figure 2 , the module connection of the heat dissipation device is shown as Figure 2 , and the heat dissipation device further includes a logic device 30 (CPLD), a power supply 20 (POWER) and a central processing unit 40 (CPU).
[0047] The power supply, the fan board card, the logic device and the central processing unit are connected in sequence.
[0048] Further, please refer to Figure 3 , Figure 3A specific module connection diagram of the heat dissipation device is shown, and the power supply is connected to each fan controller of the fan card;
[0049] The first end of the logic device is connected to each fan controller, and the second end is connected to each pluggable fan and each un-pluggable fan of the fan card.
[0050] In the embodiment, as shown in the figure, two fan groups are taken as an example, the external power supply is connected to two fan controllers, the fan controllers are respectively connected to the pluggable fans (FAN) and the un-pluggable fans under their control, the enable signal of the CPLD is connected to the two fan controllers, the PWM and SENSOE control signals are connected to the pluggable fans and the un-pluggable fans, and the CPU is connected to the CPLD through the I2C. Figure 3
[0051] Further, the power supply is used to supply power to the fan card;
[0052] The logic device is used to adjust the duty cycle through the PWM and SENSOR control signals to control the rotating speed of each pluggable fan and each un-pluggable fan and obtain the rotating speed information of the fans, and is also used to control the switching of each fan controller through the enable control signal.
[0053] The central processing unit is used to control the logic device through the I2C bus.
[0054] In the embodiment, the CPU controls the CPLD through the I2C bus; the CPLD adjusts the duty cycle through the PWM and SENSOR control signals to control the rotating speed of the fans and obtain the rotating speed information of the fans; the CPLD controls the switching of the fan controller through the ENABLE control signal; there are two fan controllers on the fan card, each of which controls two hot-pluggable fans or two un-pluggable fans; the fan controller has an overcurrent protection function to prevent surge current generated during hot-plugging of the fans from damaging the card; the FAN is a hot-pluggable fan, and the fan card supports a total of four pluggable fans or four un-pluggable fans; the signals connected to the fan card, such as the PWM, SENSOR, ENABLE, and I2C signals, are all linked through the FFC connector; the power supply of the fan card is taken from the motherboard POWER.
[0055] Optionally, the signals on the fan card are all connected through the FFC connector.
[0056] In the embodiment, the fan card on the market has a large number of signals and uses a large number of cables, and the use of the FFC connector for connection can make the design simple and solve the problem of complex cables.
[0057] Optionally, the heat dissipation device further comprises a temperature sensor.
[0058] The temperature sensor is used for detecting a board card temperature of the fan board card.
[0059] The central processing unit reads the board card temperature and controls the logic device according to the board card temperature.
[0060] In the embodiment, the temperature sensor can be arranged in the fan controller to monitor the board card temperature.
[0061] It is to be noted that, in this document, the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article or system including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article or system. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of another identical element in the process, method, article or system including the element.
[0062] The above-mentioned embodiment serial numbers of the utility model only serve for description, and do not represent the advantages and disadvantages of the embodiments.
[0063] Through the above description of the embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be realized by means of software and necessary general hardware platforms, of course, they can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the utility model can be embodied in the form of a software product, which is stored in a storage medium (such as a ROM / RAM, a magnetic disk, an optical disk) and includes a plurality of instructions for making a terminal device (which can be a mobile phone, a computer, a server, or a network device) execute the methods described in the various embodiments of the utility model.
[0064] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation made by using the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.
Claims
1. A multi-compatible redundant control fan board card, comprising: The fan board card comprises multiple groups of fans, multiple FFC connectors, each group of fans comprising multiple pluggable fans and un-pluggable fans and a fan controller; the fan controller is used to control the multiple pluggable fans and the multiple un-pluggable fans in the group; signals on the fan board card are connected through the FFC connectors.
2. A heat dissipating apparatus characterized by comprising: The heat dissipation device comprises the multi-compatible redundant control fan board card according to claim 1.
3. The heat dissipating apparatus of claim 2, wherein The heat dissipation device further comprises a logic device, a power supply and a central processing unit. The power supply, the fan board card, the logic device and the central processing unit are sequentially connected.
4. The heat dissipating apparatus of claim 3, wherein The power supply is connected to each fan controller of the fan board card. A first end of the logic device is connected to each fan controller, and a second end of the logic device is connected to each pluggable fan and each un-pluggable fan of the fan board card.
5. The heat dissipating apparatus of claim 4, wherein The power supply is used to supply power to the fan board card. The logic device is used to adjust the duty cycle through PWM and SENSOR control signals to control the rotation speed of each pluggable fan and each un-pluggable fan and obtain fan rotation speed information, and is also used to control the switching of each fan controller through an enable control signal. The central processing unit is used to control the logic device through an I2C bus.
6. The heat dissipating apparatus of claim 5, wherein The heat dissipation device further comprises a temperature sensor. The temperature sensor is used to detect the board card temperature of the fan board card. The central processing unit reads the board card temperature and controls the logic device according to the board card temperature.