Wafer etching chassis adjusting mechanism

Abstract

The utility model discloses a wafer etching chassis adjusting mechanism, which relates to the technical field of wafer etching and comprises a base, a clamping groove is arranged in the middle of the base, an input conveyor belt and an output conveyor belt are respectively arranged on the left side and the right side of the base, and symmetrical telescopic cavities are fixedly arranged on the base and positioned on the front side and the rear side of the clamping groove. The telescopic cavities are connected with fixing clamps through sliding mechanisms, the two fixing clamps are provided with inclined clamping rods, the front ends of the inclined clamping rods are bent to form pushing rods, through channels are formed in the left side and the right side of the base, the clamping grooves are flush with the input conveying belt, the output conveying belt and the through channels in height, and a sliding rail is fixedly arranged on the side, located on the input conveying belt, of the base. A push plate is arranged on the sliding rail through a sliding mechanism, the lower end of the push plate is flush with the input conveying belt, and two symmetrical clamping blocks are fixedly arranged at the two ends of the push plate. The wafer feeding device is simple in structure, capable of automatically feeding a wafer to an etching position and fixing the wafer at the etching position, high in practicability and suitable for popularization, and the position of the fixing mechanism can be adjusted to adapt to wafers of different sizes.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer etching technical field, concretely relates to a wafer etching bottom disc adjusting mechanism. BACKGROUND

[0002] Silicon wafer is processed from silicon ingot, and millions of transistors can be etched on the silicon wafer through special process, so that the silicon wafer is widely applied to the manufacture of integrated circuits. The processing procedure of the wafer includes doping, melting, cutting, grinding, etching and cleaning, and the silicon wafer needs to be manually fed and discharged during etching, and the wafer needs to be fixed.

[0003] The manual feeding and discharging mode is low in working efficiency, and the fixing mechanism of the wafer etching bottom disc can only be applied to fixing wafers of fixed size, so that the adaptability is low. UTILITY MODEL CONTENT

[0004] The utility model discloses a wafer etching bottom disc adjusting mechanism, simple structure can be automatically put to the etching place to the wafer, and the wafer is fixed at the etching place, the fixing mechanism can adjust the position, adapts to the wafer of different size, and the practicality is strong, is suitable for promoting.

[0005] The utility model provides the following technical scheme: a kind of wafer etching bottom disc adjusting mechanism, including base, the middle part of the base is equipped with clamping groove, the left and right sides of the base are equipped with input conveying belt and output conveying belt respectively, the front and back sides of the base are fixedly provided with the telescopic cavity of symmetry relative in clamping groove, the telescopic cavity is connected with fixed clamp by sliding mechanism, two the fixed clamp is equipped with the oblique clamping rod of outwardly inclined extension, the oblique clamping rod front end forms bending and constitutes push rod;

[0006] The base is equipped with through passage on the left and right sides of clamping groove, the height of clamping groove, input conveying belt, output conveying belt, through passage is flush, the slide rail that extends outward is fixed on the side of the base in input conveying belt, the push plate is equipped on the slide rail by sliding mechanism, the push plate lower end is flush with input conveying belt, and two symmetrical clamping blocks are fixedly arranged at both ends.

[0007] Preferably, support spring is fixedly arranged in telescopic cavity, sliding frame is arranged through in the side of telescopic cavity towards clamping groove, the sliding frame is fixedly connected with fixed clamp, stabilizing block is arranged at the connection position of sliding frame and fixed clamp, sliding groove is arranged on clamping groove, and stabilizing block is slidably connected with sliding groove.

[0008] Preferably, two push rods are inclined from the outside to the center point of clamping groove, the oblique clamping rod is V-shaped, and the vertex of V-shaped is located at sliding frame.

[0009] Preferably, a motorized telescopic rod is fixedly arranged on the base, and a pulling rod is connected to an output end of the motorized telescopic rod, the pulling rod is located below the slide rail, and a pushing rod located above the slide rail is connected to the pulling rod through a support, and the support penetrates through the slide rail and is slidably connected to the slide rail.

[0010] Preferably, an upper pressing plate is fixedly arranged at an upper end of the pushing plate, and a smooth chamfer is arranged at a front end of the clamping block, and a blocking rod is fixedly arranged at one side of the pushing plate above the input conveying belt.

[0011] The wafer can be automatically put into the etching position, and the wafer is fixed at the etching position, the fixing mechanism can be adjusted in position, different sizes of wafers can be adapted, and the utility model has high practicability, and the specific embodiments are as follows:

[0012] (1), the utility model discloses a clamping groove, when the wafer is fixed in the clamping groove, the wafer is pressed to the fixed clamp from the through channel, first contact with the two fixed clamps of the extrusion rod, because the extrusion rod is inwardly inclined, when the wafer is extruded, the inclined surface of the extrusion rod is extruded, and the fixed clamp is opened to both sides, after the wafer passes the extrusion rod, it enters the V-shaped inclined clamp rod, under the push of the supporting spring, the wafer is clamped at the center of the clamping groove, so that different sizes of wafers can be adapted, and the output of the etching machine can be adjusted when the wafer is clamped.

[0013] (2), the utility model discloses a pushing plate, when the device is running, the input conveying belt transports the wafer, and the wafer is blocked at the blocking rod and is aligned with the through channel, at this time, the motorized telescopic rod drives the pushing plate to move to the clamping groove, the clamping block of the pushing plate contacts the wafer on the input conveying belt, and the wafer is pushed to extrude the extrusion rod and press into the inclined clamp rod, after etching is completed, the pushing plate continues to push the wafer, because the wafer is clamped by the inclined clamp rod, when the wafer is pushed, the inclined surface of the inclined clamp rod is extruded, the fixed clamp is opened to both sides, the wafer passes through, and is pushed to the output conveying belt and is transported away, so that automatic feeding during etching is realized. BRIEF DESCRIPTION OF DRAWINGS

[0014] The drawings are used to provide further understanding of the utility model and constitute a part of the specification, are used together with the embodiments of the utility model to explain the utility model, and do not constitute the limitation to the utility model.

[0015] Figure 1 It is the overall schematic view of the utility model;

[0016] Figure 2 It is the sectional view of the utility model;

[0017] Figure 3 It is the top view of the utility model;

[0018] Marked as: 1, base; 2, card slot; 3, input conveyor belt; 4, output conveyor belt; 5, through channel; 6, fixed clamp; 7, telescopic cavity; 8, sliding frame; 9, inclined clamp rod; 10, push rod; 11, stop rod; 12, slide rail; 13, electric telescopic rod; 14, pull rod; 15, push rod; 16, push plate; 17, clamping block; 18, upper pressing plate; 19, supporting spring; 20, sliding groove; 21, stabilizing block; 22, wafer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model; obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments; based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0020] In the description of the utility model, it needs to be explained that the terms 'upper', 'lower', 'inner', 'outer', 'top / bottom end' and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0021] In the description of the utility model, it needs to be explained that, unless otherwise explicitly specified and limited, the terms'mounting', 'provided with','sleeved / connected', 'connected' and the like should be understood broadly, for example, 'connected' can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0022] The structural features of the utility model will be described in detail in combination with the drawings in the description.

[0023] Referring to Figures 1-3The utility model provides a wafer etching bottom disc adjusting mechanism, including base 1, the middle part of base 1 is equipped with the clamping groove 2, the left and right sides of base 1 are equipped with input conveying belt 3 and output conveying belt 4 respectively, to automatically transport wafer 22, the front and rear sides of base 1 are fixedly equipped with the symmetrical telescopic cavity 7 in the clamping groove 2, the telescopic cavity 7 is connected with fixed clamp 6 through sliding mechanism, and wafer 22 is fixed in the clamping groove 2 through fixed clamp 6, two fixed clamps 6 are equipped with the oblique clamping rod 9 of outwardly inclined extension, the oblique clamping rod 9 front end forms the bending and constitutes push rod 10, two push rods 10 are inclined from the outside to the center point of clamping groove 2, and wafer 22 extrudes the inclined surface of push rod 10, makes fixed clamp 6 open to both sides, the oblique clamping rod 9 is V-shaped, and the vertex of V-shaped is located at sliding frame 8, so that four oblique clamping rods 9 are contacted with wafer 22, and wafer 22 is clamped, when wafer 22 is pushed, the inclined surface of extruding oblique clamping rod 9 makes fixed clamp 6 open to both sides.

[0024] Referring to Figures 1-2 , the left and right sides of base 1 are equipped with through channel 5, the height of clamping groove 2, input conveying belt 3, output conveying belt 4 and through channel 5 are flush, the side of input conveying belt 3 of base 1 is fixedly equipped with the sliding rail 12 of outward extension, the sliding rail 12 is equipped with push plate 16 through sliding mechanism, the lower end of push plate 16 is flush with input conveying belt 3, and the both ends are fixedly equipped with two symmetrical clamping blocks 17, wafer 22 is pushed through push plate 16, the front end of clamping block 17 is equipped with smooth chamfer, wafer 22 is mostly circular, and two clamping blocks 17 can be located at the front and rear sides of wafer 22 and push, so that wafer 22 cannot roll on push plate 16, the upper end of push plate 16 is fixedly equipped with upper pressing plate 18 on clamping block 17, to prevent wafer 22 from warping, the side of push plate 16 above input conveying belt 3 of base 1 is fixedly equipped with stop rod 11, so that wafer 22 stops at the position of clamping block 17 and is convenient to push, and the upper end of base 1 is fixedly equipped with electric telescopic rod 13, the output end of electric telescopic rod 13 is connected with pull rod 14, pull rod 14 is located below sliding rail 12, and is connected with propelling rod 15 located above sliding rail 12 through support, the support penetrates sliding rail 12 and is slidably connected with sliding rail 12, so that pull rod 14 keeps stable when driving propelling rod 15 to move.

[0025] Referring to Figure 2 , the inside of telescopic cavity 7 is fixedly equipped with supporting spring 19, the clamping force of fixed clamp 6 is provided through supporting spring 19, the side of telescopic cavity 7 towards clamping groove 2 is equipped with sliding frame 8, sliding frame 8 is fixedly connected with fixed clamp 6, and the connecting place of sliding frame 8 and fixed clamp 6 is equipped with stabilizing block 21, clamping groove 2 is equipped with sliding groove 20, and stabilizing block 21 is slidably connected with sliding groove 20, so that sliding frame 8 keeps stable when sliding.

[0026] The wafer etching bottom disc adjusting mechanism of the utility model has simple structure, can automatically put wafer to etching place, and fixes wafer at etching place, the position of fixed mechanism can be adjusted, is suitable for wafer of different size, has high practicality, and is suitable for promotion.

[0027] In particular use, refer to Figures 2-3 When the wafer is fixed at the clamping groove 2, the wafer 22 is pressed from the through channel 5 to the fixing clamp 6, and first contacts the pushing rod 10 of the two fixing clamps 6. When the wafer 22 is pushed, the inclined surface of the pushing rod 10 is pressed, so that the fixing clamp 6 is opened to both sides. After the wafer 22 passes through the pushing rod 10, it enters the V-shaped inclined clamp rod 9. Under the pushing of the supporting spring 19, the wafer 22 is clamped at the center of the clamping groove 2. In this way, wafers 22 of different sizes can be accommodated, and the output of the etching machine can be adjusted when the wafer 22 is clamped.

[0028] Referring to Figures 1-3 When the device is in operation, the input conveyor belt 3 transports the wafer 22, which is blocked at the blocking rod 11 and aligned at the through channel 5. At this time, the electric telescopic rod 13 drives the push plate 16 to move towards the clamping groove 2. The clamping block 17 of the push plate 16 contacts the wafer 22 on the input conveyor belt 3 and pushes it to press the pushing rod 10 into the inclined clamp rod 9. After etching is completed, the push plate 16 continues to push the wafer 22. Since the wafer 22 is clamped by the inclined clamp rod 9, when it is pushed, it presses the inclined surface of the inclined clamp rod 9, so that the fixing clamp 6 is opened to both sides, allowing the wafer 22 to pass through and be pushed onto the output conveyor belt 4 for automatic feeding.

[0029] The above only describes preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer etching platen adjustment mechanism comprising a base (1), characterised in that, The middle of the base (1) is provided with a clamping groove (2), the left and right sides of the base (1) are respectively provided with an input conveyor belt (3) and an output conveyor belt (4), the front and back sides of the base (1) located in the clamping groove (2) are fixedly provided with symmetrical telescopic cavities (7), the telescopic cavities (7) are connected with fixed clamps (6) through sliding mechanisms, the two fixed clamps (6) are provided with outwardly inclined extension inclined clamping rods (9), the front ends of the inclined clamping rods (9) are bent to form pushing rods (10). The left and right sides of the base (1) located in the clamping groove (2) are provided with through channels (5), the heights of the clamping groove (2), the input conveyor belt (3), the output conveyor belt (4) and the through channels (5) are flush, the side of the base (1) located in the input conveyor belt (3) is fixedly provided with an outwardly extending sliding rail (12), the sliding rail (12) is provided with a push plate (16) through a sliding mechanism, the lower end of the push plate (16) is flush with the input conveyor belt (3), and both ends of the push plate (16) are fixedly provided with two symmetrical clamping blocks (17).

2. The wafer etch platen adjustment mechanism of claim 1, wherein, The telescopic cavities (7) are fixedly provided with supporting springs (19), the telescopic cavities (7) are provided with sliding frames (8) penetrating towards the side of the clamping groove (2), the sliding frames (8) are fixedly connected with the fixed clamps (6), the connecting positions of the sliding frames (8) and the fixed clamps (6) are provided with stabilizing blocks (21), the clamping groove (2) is provided with sliding grooves (20), and the stabilizing blocks (21) are slidably connected with the sliding grooves (20).

3. The wafer etch platen adjustment mechanism of claim 2, wherein, The two pushing rods (10) are inclined from the outside to the center point of the clamping groove (2), the inclined clamping rods (9) are V-shaped, and the apexes of the V-shaped inclined clamping rods (9) are located at the sliding frames (8).

4. The wafer etch platen adjustment mechanism of claim 1, wherein, The base (1) is fixedly provided with an electric telescopic rod (13), the output end of the electric telescopic rod (13) is connected with a pulling rod (14), the pulling rod (14) is located below the sliding rail (12) and is connected with a pushing rod (15) located above the sliding rail (12) through a support, and the support penetrates through the sliding rail (12) and is slidably connected with the sliding rail (12).

5. The wafer etch platen adjustment mechanism of claim 1, wherein, The push plate (16) is fixedly provided with an upper pressing plate (18) on the upper end of the clamping block (17), the front end of the clamping block (17) is provided with a smooth chamfer, and the base (1) is fixedly provided with a blocking rod (11) on the side of the push plate (16) above the input conveyor belt (3).

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