Texturing mechanical arm and texturing equipment
By designing a texturing robotic arm to adjust the silicon wafer posture, the problem of silicon wafers sticking to and detaching from the clamping teeth was solved, achieving good separation of silicon wafers and cleaning of the equipment, thereby improving product yield and production efficiency.
Patent Information
- Application Number
- CN202520025248.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-06
AI Technical Summary
In the silicon wafer texturing process, silicon wafers are prone to detaching from the basket chuck teeth, causing them to stick together, which affects the drying effect, contaminates the equipment, and reduces the product yield.
Design a texturing robotic arm, including a rotating bracket, a rotary drive assembly, and a clamping assembly. The rotary drive assembly adjusts the posture of the silicon wafer, causing it to fall back into the clamping teeth under gravity, thus preventing it from sticking together.
It effectively reduces the risk of silicon wafers sticking together, improves product yield, prevents equipment contamination, and enhances production efficiency.
Smart Images
Figure CN223728762U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of photovoltaic process equipment, in particular to a texturing mechanical arm and a texturing device. BACKGROUND
[0002] In the field of photovoltaic, in the texturing process of silicon wafer, a carrier assembly (also known as a flower basket) is often used to hold the silicon wafer, and a mechanical arm is used to move the carrier assembly to realize the transfer of the silicon wafer between various processing links. In the texturing process, the silicon wafer is prone to be separated from the clamping teeth in the flower basket during the reaction with the chemical liquid in the tank and the lifting of the flower basket by the mechanical arm. After entering the drying tank, the protruding silicon wafers are prone to stick together due to the influence of the air blower of the drying tank, and water is accumulated between the two silicon wafers, so that the drying cannot be performed. The liquid-contaminated silicon wafer pollutes the drying tank, resulting in an increase in EL defects. If the liquid-contaminated silicon wafer is not timely picked out and flows into the subsequent process, it will pollute the quartz boat and surrounding silicon wafers after high-temperature diffusion, causing a large amount of rework. If the contaminated quartz boat is not timely taken offline for cleaning, it will cause a large number of EL defects, resulting in a decrease in product yield. SUMMARY
[0003] The purpose of the present application includes providing a texturing mechanical arm and a texturing device, which can adjust the posture of the silicon wafer in the carrier assembly, reduce the mutual sticking of the silicon wafers, and improve the product yield.
[0004] Embodiments of the present application can be implemented as follows:
[0005] In a first aspect, the present application provides a texturing mechanical arm for picking up a carrier assembly, the texturing mechanical arm comprising a rotating support, a rotary drive assembly, and a clamping assembly, the rotary drive assembly being in transmission connection with the rotating support to drive the rotating support to rotate, and the clamping assembly being arranged on the rotating support and being used for clamping the carrier assembly.
[0006] In an optional implementation, the texturing mechanical arm further comprises a support frame, the rotary drive assembly is arranged on the support frame, and the rotating support is in rotational connection with the support frame.
[0007] In an optional implementation, the rotary drive assembly comprises a rotary drive member, the output end of the rotary drive member is provided with a gear, and the rotating support can be provided with a gear ring, the gear being in meshing connection with the gear ring.
[0008] In an optional implementation, the clamping assembly comprises a clamping drive member and a clamping part, the clamping drive member being used for driving the clamping part to clamp the carrier assembly.
[0009] In an optional implementation, the clamping assembly comprises two clamping drive members, the two clamping drive members are respectively in transmission connection with at least one clamping part, and the two clamping drive members are used for driving the at least two clamping parts to move close to each other to clamp the carrier assembly.
[0010] In an optional implementation, the clamping driving member is configured to drive the clamping part to move in the first direction, which is parallel to the rotation axis of the rotating support.
[0011] In an optional implementation, the rotating support includes a base plate having opposite first and second sides, the clamping driving member is arranged on the first side of the base plate, the base plate is provided with a clearance groove, and the clamping assembly further includes a connecting member, the clamping part is in transmission connection with the clamping driving member through the connecting member, and the connecting member passes through the clearance groove.
[0012] In an optional implementation, the first side of the base plate is provided with guide rails extending in the first direction, the two guide rails are arranged on the two sides of the clearance groove in the second direction, the connecting member is in sliding fit with the guide rails, and the second direction is perpendicular to the first direction.
[0013] In an optional implementation, the clamping driving member is configured to drive the clamping part to move in the first direction, and each connecting member is provided with a plurality of clamping parts, and the plurality of clamping parts on the same connecting member are arranged in the second direction, which is perpendicular to the first direction.
[0014] In a second aspect, the present application provides a texturing equipment, which includes the texturing robot of any one of the above first aspect.
[0015] The texturing robot and the texturing equipment provided by the embodiments of the present application have the following beneficial effects:
[0016] The texturing robot provided by the embodiments of the present application includes a rotating support, a rotating driving assembly and a clamping assembly, the rotating driving assembly is in transmission connection with the rotating support to drive the rotating support to rotate, and the clamping assembly is arranged on the rotating support and is configured to clamp the carrying assembly. By arranging the rotating driving assembly, the rotating support can drive the clamping assembly to rotate, and under the driving of the clamping assembly, the carrying assembly carrying the silicon wafers can also adjust the inclination angle. In this way, even if part of the silicon wafers in the carrying assembly cannot be well inserted into the bottom teeth, these silicon wafers can also fall back into the teeth under the action of their own gravity due to the inclination of the carrying assembly, thereby ensuring the good separation between the silicon wafers. Therefore, the texturing robot provided by the embodiments of the present application can reduce the risk of affecting subsequent drying due to the sticking of the silicon wafers, and improve the product yield.
[0017] The texturing equipment provided by the embodiments of the present application includes the above texturing robot, and therefore can improve the product yield. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative effort based on these drawings.
[0019] Figure 1 A schematic view of a wafering robot in an embodiment of the present application when the wafering robot is tilting the carrier assembly;
[0020] Figure 2 A schematic view of a wafering robot in an embodiment of the present application when the wafering robot is tilting the carrier assembly;
[0021] Figure 3 A schematic view of the opening side of the carrier assembly on the wafering robot in an embodiment of the present application;
[0022] Figure 4 An assembly schematic view of the rotating support, the clamping assembly and the rotating driving assembly in an embodiment of the present application;
[0023] Figure 5 A partial view of the rotating support in an embodiment of the present application; Figure 4 An enlarged view of the partial V in an embodiment of the present application;
[0024] Figure 6 A partial view of the clamping assembly in an embodiment of the present application;
[0025] Figure 7 A schematic view of the carrier assembly (accommodating a silicon wafer) and the clamping part in an embodiment of the present application.
[0026] Figure: 100 - support frame; 200 - rotating support; 210 - base plate; 211 - avoiding groove; 212 - guide rail; 300 - rotating driving assembly; 310 - rotating driving member; 320 - rotating platform; 400 - clamping assembly; 410 - clamping driving member; 411 - mounting seat; 420 - clamping part; 421 - limiting protrusion; 430 - connecting member; 10 - carrier assembly; 11 - side rod; 12 - bottom rod; 13 - end plate; 14 - limiting groove; 20 - silicon wafer. DETAILED DESCRIPTION
[0027] In the related art, a bearing assembly (i.e., a flower basket) for bearing silicon wafers has a plurality of clamping teeth, and the edges of each silicon wafer are correspondingly inserted between the clamping teeth, so that the clamping teeth can position and separate each silicon wafer. At present, the single crystal silicon cell industry generally uses a groove type texturing, and due to the characteristics of the groove type texturing, a large amount of bubbles is generated during the reaction of the liquid medicine and the silicon wafer, causing the silicon wafer to float and lead to the phenomenon of wafer floating. The mainstream solution is to use a side-lying flower basket, so that the silicon wafer cannot float. Since the thickness of the silicon wafer on the market is developing towards thinness, the silicon wafer is easily separated from the clamping teeth of the flower basket during the reaction of the liquid medicine and the mechanical arm lifting process, causing two or more silicon wafers to be stuck together, and the rework silicon wafer after secondary texturing is more serious. The silicon wafers separated from the clamping teeth and stuck together will cause the water between the silicon wafers to be difficult to dry, affecting the product yield. Moreover, the liquid silicon wafer will also pollute the drying tank and other process equipment, causing a large number of silicon wafers to be reworked.
[0028] Therefore, the present application provides a texturing mechanical arm, which can rotate the bearing assembly bearing the silicon wafer through the rotation of the driving assembly, so that the silicon wafer originally separated from the clamping teeth can fall into the clamping teeth under the action of gravity, avoiding the sticking of the silicon wafers, thereby improving the product yield. In addition, the present application also provides a texturing device comprising the above-mentioned texturing mechanical arm.
[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.
[0031] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0032] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model is usually placed, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0033] In addition, if the terms "first", "second" and the like appear, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0034] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.
[0035] Figure 1 A schematic view of the wafering robot placing the carrier assembly 10 in a side position in an embodiment of the present application; Figure 2 A schematic view of the wafering robot tilting the carrier assembly 10 in an embodiment of the present application. As shown in Figure 1 and Figure 2 The wafering robot for picking up the carrier assembly 10 provided by the embodiments of the present application includes a rotating support 200, a rotating driving assembly 300 and a clamping assembly 400. The rotating driving assembly 300 is in transmission connection with the rotating support 200 to drive the rotating support 200 to rotate. The clamping assembly 400 is arranged on the rotating support 200, and the clamping assembly 400 includes a clamping driving member 410 and a clamping part 420. The clamping driving member 410 is used to drive the clamping part 420 to clamp the carrier assembly 10. As shown in Figure 1 The carrier assembly 10 is in a side position, that is, the opening of the carrier assembly 10 has a horizontal orientation; Figure 2 In the embodiment, the opening of the carrier assembly 10 is tilted upward, so that the bottom of the carrier assembly 10 is the lower end of the entire carrier assembly 10.
[0036] Further, in the embodiment, the wafering robot further includes a support frame 100, and the rotating support 200 and the rotating driving assembly 300 are arranged on the support frame 100.
[0037] Figure 3 A schematic view of one side of the opening of the carrier assembly 10 on the wafering robot in an embodiment of the present application. As shown in Figure 3As shown, in this embodiment, the support assembly 10 forms a storage space for housing the silicon wafer 20. The support assembly 10 includes a bottom rod 12, a side rod 11, and an end plate 13. The two ends of the bottom rod 12 and the side rod 11 are respectively connected to the two end plates 13. The bottom rod 12 forms the bottom of the storage space, and the side rod 11 forms the sidewall of the storage space. In this embodiment, the opening side of the storage space of the support assembly refers to the side opposite to the storage space. The opening of the storage space allows the silicon wafer 20 to be inserted or removed. In this embodiment, both the side rod 11 and the bottom rod 12 are provided with locking teeth, which are used to limit the silicon wafer 20. The edge of each silicon wafer 20 is inserted into the corresponding locking tooth gap. The end plate 13 can cooperate with the clamping part 420 of the clamping assembly 400, so that the entire support assembly 10 is clamped and fixed by the clamping assembly 400. In this embodiment, the advantage of placing the support assembly 10 on its side is that the blocking effect of the side rod 11 can be used to prevent the silicon wafer 20 from floating. Since the opening side of the side-mounted carrier assembly 10 cannot limit the silicon wafer 20, the silicon wafer 20 may move laterally and disengage from the retaining teeth on the base rod 12 when the carrier assembly 10 is moved, and the silicon wafer 20 may become uneven laterally. To improve this problem, after the carrier assembly 10 and the silicon wafer 20 are removed from the texturing tank, the carrier assembly 10 can be tilted (i.e., the opening tilts upward) using the rotation drive assembly 300, so that each silicon wafer 20 can fall into the gap of the retaining teeth on the base rod 12, thereby making the silicon wafers 20 in the carrier assembly 10 neatly stacked.
[0038] like Figures 1 to 3 As shown, in this embodiment, the fabrication robotic arm includes two gripping components 400, each of which can grip two carrier components 10 simultaneously. Therefore, the fabrication robotic arm can pick up four carrier components 10 at a time. In other embodiments, the fabrication robotic arm can have more gripping components 400, such as three or more; alternatively, it can have only one gripping component 400.
[0039] Figure 4 This is an assembly diagram of the rotating bracket 200, the clamping assembly 400, and the rotating drive assembly 300 in one embodiment of this application; Figure 5 for Figure 4 A magnified view of a local V-shape; Figure 6 This is a partial schematic diagram of the clamping component 400 in one embodiment of this application. Figures 4 to 6 As shown, the clamping assembly 400 includes two clamping drive members 410, which are respectively connected to at least one clamping part 420. The two clamping drive members 410 are used to drive at least two clamping parts 420 to move closer to each other to clamp the carrier assembly 10.
[0040] Further, the clamping driving member 410 is configured to drive the clamping part 420 to extend in a first direction (the direction of arrow ab in the figure), which is parallel to the rotation axis of the rotating support 200. In the embodiment, the etching mechanical arm includes two clamping assemblies 400, which are arranged in the first direction at intervals.
[0041] In the embodiment, the rotating support 200 includes a base plate 210, which has opposite first and second sides. In the embodiment, the first side of the base plate 210 is the upper side, and the second side of the base plate 210 is the lower side. The clamping driving member 410 is arranged on the first side of the base plate 210, and the base plate 210 is provided with an avoiding slot 211. Figure 4
[0042] In the embodiment, the clamping driving member 410 is fixedly arranged on the first side of the base plate 210 through a mounting seat 411. The output end of the clamping driving member 410 can be telescopically translated, and the output end of the clamping driving member 410 is connected with the connecting member 430, so that the connecting member 430 can be pushed and pulled in the first direction, thereby enabling the clamping part 420 to be translated in the first direction. In the process of moving the clamping part 420 and the connecting member 430, the avoiding slot 211 plays an avoiding role and does not interfere with the movement of the connecting member 430. Optionally, the type of the clamping driving member 410 includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, and a linear motor.
[0043] In the embodiment, the guide rail 212 extends in the first direction, and the two guide rails 212 are arranged at intervals on the two sides of the avoiding slot 211 in a second direction, which is perpendicular to the first direction. By arranging the guide rail 212, the translation of the clamping part 420 in the first direction is more stable, and the shaking in other directions is reduced. Moreover, the guide rail 212 simultaneously plays a supporting role.
[0044] In the embodiment, each connecting member 430 is provided with two clamping parts 420, and the two clamping parts 420 on the same connecting member 430 are arranged in the second direction, which is perpendicular to the first direction. The two clamping parts 420 on the same connecting member 430 can simultaneously cooperate with the end plates 13 of two different carrier assemblies 10. Therefore, by arranging more clamping parts 420 on the connecting member 430, more carrier assemblies 10 can be clamped by the clamping assembly 400 at one time, so that more silicon wafers 20 can be transported, and the process efficiency is improved.
[0045] Figure 7 Figure 1 is a schematic view of the clamping assembly 400 in an embodiment of the present application, which clamping assembly 400 is used to clamp the carrier assembly 10 (containing a silicon wafer 20) and the clamping portion 420. Please refer to Figure 6 and Figure 7 In this embodiment, the clamping portion 420 is plate-shaped, and one side of the clamping portion 420 is provided with a limiting protrusion 421 for cooperating with the carrier assembly 10. Correspondingly, the end plate 13 of the carrier assembly 10 is provided with a limiting groove 14; the limiting protrusion 421 on the clamping portion 420 is used to cooperate with the limiting groove 14 on the carrier assembly 10, thereby improving the reliability of the clamping assembly 400 when picking up the carrier assembly 10.
[0046] Specifically, each clamping portion 420 is provided with three limiting protrusions 421, and the shapes of the limiting protrusions 421 can be the same or different. The three limiting protrusions 421 can effectively prevent the carrier assembly 10 from rotating relative to the clamping portion 420. For example, in this embodiment, two limiting protrusions 421 are L-shaped bosses, and one limiting protrusion 421 is a columnar boss; correspondingly, two limiting grooves 14 on the end plate 13 of the carrier assembly 10 are L-shaped, and one limiting groove 14 is circular. By providing multiple limiting protrusions 421 and cooperating with multiple limiting grooves 14, the reliability of the clamping portion 420 when cooperating with the end plate 13 can be improved.
[0047] Please refer again to Figure 4 In this embodiment, the rotary driving assembly 300 includes a rotary driving member 310 and a rotary platform 320. The rotary platform 320 is fixedly connected with the support frame 100, the rotary driving member 310 is fixedly arranged on the rotary platform 320, the rotary support 200 is rotationally connected with the rotary platform 320, and the rotary driving member 310 is used to drive the rotary support 200 to rotate relative to the rotary platform 320. Specifically, the output end of the rotary driving member 310 can be provided with a gear, the rotary driving member 310 provides a torque, the rotary support 200 can be provided with a gear ring, and the gear meshes with the gear ring, so that the rotary driving member 310 can drive the rotary support 200 to rotate. The type of the rotary driving member 310 can be selected as a motor, and specifically can be a stepper motor.
[0048] The maximum rotation amplitude of the rotary support 200 can be set as needed, and can be set to be able to make the silicon wafer 20 in the carrier assembly 10 fall into the tooth gap of the bottom rod 12. For example, taking the case that the opening of the carrier assembly 10 is horizontally oriented as a reference, the rotary support 200 can be rotated by at least 45°, so that the opening of the carrier assembly 10 has an angle of 45° inclined upward, so that the silicon wafer 20 can be neatly stacked under the action of its own gravity.
[0049] In this embodiment, the support frame 100 is provided with a plurality of weight-reducing holes to reduce its own weight.
[0050] The embodiment of the present application further provides a texturing equipment (not shown in the figure) comprising the texturing mechanical arm. The texturing equipment can further comprise other components, such as a mechanical arm driving assembly connected with the support frame 100 of the texturing mechanical arm, so as to drive the texturing mechanical arm to move the carrying assembly 10.
[0051] In summary, the embodiment of the present application provides a texturing mechanical arm comprising a rotating support 200, a rotating driving assembly 300 and a clamping assembly 400. The rotating driving assembly 300 is in transmission connection with the rotating support 200 to drive the rotating support 200 to rotate. The clamping assembly 400 is arranged on the rotating support 200 and is used to clamp the carrying assembly 10. By arranging the rotating driving assembly 300, the rotating support 200 can be driven to rotate together with the clamping assembly 400. Under the driving of the clamping assembly 400, the carrying assembly 10 carrying the silicon wafer 20 can also adjust the inclination angle. In this way, even if part of the silicon wafers 20 in the carrying assembly 10 cannot be well inserted into the bottom teeth, these silicon wafers 20 can also fall back to the gap between the bottom teeth under the action of their own gravity due to the inclination of the carrying assembly 10, so as to ensure the good separation between the silicon wafers 20. Therefore, the texturing mechanical arm provided by the embodiment of the present application can reduce the risk of affecting the subsequent drying due to the sticking between the silicon wafers 20, and improve the product yield.
[0052] The texturing equipment provided by the embodiment of the present application comprises the above-mentioned texturing mechanical arm, so as to improve the product yield.
[0053] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.
Claims
1. A fabrication robotic arm for picking up a carrier component, characterized in that, The fabrication robotic arm includes a rotating bracket, a rotation drive assembly, and a clamping assembly. The rotation drive assembly is connected to the rotating bracket to drive the rotating bracket to rotate. The clamping assembly is disposed on the rotating bracket and is used to clamp the bearing assembly.
2. The fabrication robotic arm according to claim 1, characterized in that, The fabrication robotic arm also includes a support frame, the rotary drive assembly is disposed on the support frame, and the rotating bracket is rotatably connected to the support frame.
3. The fabrication robotic arm according to claim 2, characterized in that, The rotary drive assembly includes a rotary drive component, the output end of which is provided with a gear, and the rotating bracket may be provided with a gear ring, the gear meshing with the gear ring.
4. The fabrication robotic arm according to claim 1, characterized in that, The clamping assembly includes a clamping drive and a clamping part, wherein the clamping drive is used to drive the clamping part to clamp the carrier assembly.
5. The fabrication robotic arm according to claim 4, characterized in that, The clamping assembly includes two clamping drive members, each of which is kinetically connected to at least one clamping part. The two clamping drive members are used to drive at least two clamping parts to move closer to each other to clamp the carrier assembly.
6. The fabrication robotic arm according to claim 4, characterized in that, The clamping drive is used to drive the clamping part to move in a first direction, which is parallel to the rotation axis of the rotating bracket.
7. The fabrication robotic arm according to claim 4, characterized in that, The rotating bracket includes a base plate having a first side and a second side opposite to each other. The clamping drive is disposed on the first side of the base plate. An clearance groove is formed on the base plate. The clamping assembly also includes a connector. The clamping part is connected to the clamping drive through the connector. The connector passes through the clearance groove.
8. The fabrication robotic arm according to claim 7, characterized in that, A guide rail is provided on the first side of the substrate, the guide rail extends in a first direction, two guide rails are spaced apart on both sides of the clearance groove in a second direction, the connector slides with the guide rail, and the second direction is perpendicular to the first direction.
9. The fabrication robotic arm according to claim 7, characterized in that, The clamping drive is used to drive the clamping part to move in a first direction. Each connector is provided with a plurality of clamping parts, and the plurality of clamping parts on the same connector are arranged in a second direction, which is perpendicular to the first direction.
10. A flocking equipment, characterized in that, Includes the fabrication robotic arm as described in any one of claims 1-9.