Interlayer insulation structure of multilayer circuit board

Abstract

The utility model discloses an interlayer insulation structure of a multilayer circuit board, which comprises an insulation substrate, two sides of the insulation substrate are respectively provided with a conductive layer and an insulation layer, the conductive layer is arranged between the insulation substrate and the insulation layer, a heat conduction plate is arranged in the insulation substrate, the heat conduction plate is symmetrically provided with extension plates extending out of two ends of the insulation substrate, and the extension plates are arranged on the insulation substrate. Cooling fins are arranged on the extending plate in a linear array mode. According to the interlayer insulation structure of the multilayer circuit board provided by the utility model, the heat-conducting plate is arranged between the insulation substrates, when the interior of the conductive layer works to generate heat, the heat-conducting plate can conduct the heat, absorbed by the conductive layer, on the insulation substrates to the extension plate, and the heat on the heat-conducting plate is dissipated through the extension plate and the heat dissipation fins; therefore, the heat dissipation effect of the insulating substrate between the two conductive layers is improved, the problem that the conductive layers are damaged due to heat accumulation on the insulating substrate is avoided, and the working stability of the conductive layers is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of multilayer circuit board, concretely relates to an interlayer insulation structure of multilayer circuit board. BACKGROUND

[0002] The multilayer circuit board is usually composed of conductive layers (such as copper foil), insulating layers (such as epoxy resin), and through holes (such as metalized holes) connecting the layers. The conductive layers are used to realize the connection of the circuit, the insulating layers play the role of isolating the conductive layers, and the through holes are used to connect the circuits between different layers.

[0003] According to the announcement number CN202121857U, the announcement date is: 2012.01.18, a kind of multilayer flexible circuit board is disclosed, relating to flexible circuit board.It includes insulating substrate, as the conductive layer of printed circuit and surface insulating layer, at least two insulating substrates and at least two conductive layers from bottom to top in the order of insulating substrate, conductive layer superimposed, surface insulating layer is covered on the uppermost layer of the conductive layer, except the lowermost layer of the insulating substrate, through hole is provided on other insulating substrate, and in the through hole, rivet columnar metal needle, the metal needle is electrically connected with the conductive layer of the insulating substrate above and below. Its beneficial effect lies in: in the through hole, rivet columnar metal needle, simple structure, convenient operation in processing. Rivet columnar metal needle, combination firm, can improve the reliability of flexible circuit board work. It is beneficial to reduce the manufacturing cost of flexible circuit board.

[0004] In the prior art including the above-mentioned patent, an insulating layer is provided between two conductive layers for insulation. However, during use, the conductive layers generate heat, causing the temperature of the insulating layer at the middle position to rise and generate heat accumulation, which in turn causes the conductive layers to be damaged due to the high temperature of the heat accumulation. SUMMARY

[0005] The utility model discloses a kind of interlayer insulation structures of multilayer circuit board, for solving the above problems.

[0006] To achieve the above object, the utility model provides the following technical scheme: an interlayer insulation structure of multilayer circuit board, including the both sides of insulating substrate are provided with conductive layer and insulating layer, the conductive layer is located between insulating substrate and insulating layer, the heat conduction plate is provided in the insulating substrate, the heat conduction plate is symmetrically provided with the extension plate projecting the both ends of insulating substrate, linear array is arranged on the extension plate and has radiating fin.

[0007] As preferred, the heat conduction plate is symmetrically linearly arranged with extension plate located in the insulating substrate.

[0008] As preferred, the insulation layer is provided with a mounting groove, and the heat dissipation plates are linearly arranged in the mounting groove and protrude out of the mounting groove.

[0009] As preferred, the heat dissipation plates are arranged obliquely relative to the insulation layer.

[0010] As preferred, the mounting groove is provided with mounting grooves to form partition portions, and the storage sacs for storing the fire-retardant liquid are arranged in the mounting grooves.

[0011] As preferred, the heat dissipation plates are provided with protruding spikes which protrude into the partition portions and face the storage sacs.

[0012] As preferred, the heat conduction plates are ceramic pieces.

[0013] In the above technical solution, the multi-layer circuit board interlayer insulation structure has the following advantages: the heat conduction plates are arranged between the insulation substrates, when the conductive layers generate heat, the heat conduction plates can conduct the heat absorbed by the conductive layers on the insulation substrates to the protruding plates, and the heat on the heat conduction plates is dissipated through the protruding plates and the heat dissipation fins, thereby improving the heat dissipation effect of the insulation substrates between the two conductive layers, avoiding the damage of the conductive layers caused by the heat accumulation on the insulation substrates, and improving the working stability of the conductive layers. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0015] Figure 1 The overall structure and cross-sectional view of the embodiment of the present application is provided.

[0016] Figure 2 The overall structure and cross-sectional view of the embodiment of the present application is provided. Figure 1 The local enlarged view of A in the embodiment of the present application is provided.

[0017] Figure 3 The local enlarged view of A in the embodiment of the present application is provided. Figure 2 The structure cross-sectional view of the insulation layer in the embodiment of the present application is provided.

[0018] Explanation of reference signs:

[0019] 1, insulating substrate; 2, conductive layer; 3, insulating layer; 31, installation groove; 311, installation groove; 32, partition; 4, heat conduction plate; 41, extension plate; 42, heat dissipation fin; 43, extension plate; 5, heat dissipation plate; 51, extension spike; 6, storage bag; 9, conductive column. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme of the embodiments of the present disclosure will be described clearly and completely below in combination with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the scope of protection of the present disclosure.

[0021] As shown in Figures 1-3 , an interlayer insulation structure of a multilayer circuit board, including the two sides of the insulating substrate 1 are provided with conductive layers 2 and insulating layers 3, the conductive layer 2 is located between the insulating substrate 1 and the insulating layer 3, the insulating substrate 1 is provided with a heat conduction plate 4, the heat conduction plate 4 is symmetrically provided with an extension plate 41 extending out of both ends of the insulating substrate 1, and the extension plate 41 is linearly arrayed with heat dissipation fins 42.

[0022] Specifically, as shown in Figure 1 , the conductive layer 2 and the insulating layer 3 are respectively arranged on both sides of the insulating substrate 1, and the conductive layer 2 is located between the insulating substrate 1 and the insulating layer 3, and a conductive column 9 is further arranged on the insulating substrate 1 to electrically connect the conductive layers 2 to each other, and the heat conduction plate 4 is arranged between the insulating substrate 1, when the conductive layer 2 works and generates heat, the heat conduction plate 4 can conduct the heat absorbed by the conductive layer 2 on the insulating substrate 1 to the extension plate 41, and dissipate the heat on the heat conduction plate 4 through the extension plate 41 and the heat dissipation fin 42, thereby improving the heat dissipation effect of the insulating substrate 1 between the two conductive layers 2, avoiding the damage of the conductive layer 2 caused by the heat accumulation on the insulating substrate 1, and improving the working stability of the conductive layer 2. Secondly, the extension plate 41 extends to the outside of both ends of the insulating substrate 1, thereby avoiding the damage of the circuit board caused by the impact on the end of the circuit board formed by the insulating substrate 1, the conductive layer 2 and the insulating layer 3, and improving the service life of the circuit board.

[0023] In the above technical solution, a heat-conducting plate 4 is disposed between the insulating substrates 1. When the conductive layer 2 generates heat during operation, the heat-conducting plate 4 can conduct the heat absorbed by the conductive layer 2 on the insulating substrate 1 to the protruding plate 41. The heat on the heat-conducting plate 4 is then dissipated through the protruding plate 41 and the heat dissipation fins 42, thereby improving the heat dissipation effect on the insulating substrate 1 between the two conductive layers 2, avoiding the problem of damage to the conductive layer 2 caused by heat accumulation on the insulating substrate 1, and improving the working stability of the conductive layer 2. Secondly, the protruding plate 41 extends to the outer ends of both ends of the insulating substrate 1, thereby avoiding the problem of damage to the circuit board formed by the insulating substrate 1, conductive layer 2 and insulating layer 3 due to impact, and improving the service life of the circuit board.

[0024] As a further embodiment provided in this utility model, an extension plate 43 located within an insulating substrate 1 is arranged in a symmetrical linear array on the heat-conducting plate 4.

[0025] Specifically, such as Figure 1 As shown, the heat-conducting plate 4 is provided with a plurality of extension plates 43 located within the insulating substrate 1. The plurality of extension plates 43 can increase the contact area between the heat-conducting plate 4 and the insulating substrate 1, thereby improving the heat conduction efficiency between the insulating substrate 1 and the heat-conducting plate 4 and improving the overall heat dissipation efficiency.

[0026] As a further embodiment of this utility model, an installation groove 31 is provided on the insulating layer 3, and a heat dissipation plate 5 with its end extending out of the outside of the installation groove 31 is arranged in a linear array within the installation groove 31.

[0027] Specifically, such as Figure 1 As shown, several heat sinks 5 are disposed in the mounting groove 31 of the insulating layer 3, with one end of the heat sink 5 disposed on the insulating layer 3 and the other end of the heat sink 5 extending out of the mounting groove 31. The heat sinks 5 are used to absorb and dissipate heat from the insulating layer 3, thereby further improving the heat dissipation efficiency of the conductive layer 2 and ensuring the working stability of the conductive layer 2.

[0028] As a further embodiment provided in this utility model, the heat sink 5 is arranged at an angle relative to the insulating layer 3.

[0029] Specifically, such as Figure 1 As shown, the heat sink 5 is arranged at an angle relative to the insulating layer 3. When the circuit board is fully installed, if the circuit board is subjected to pressure perpendicular to the conductive layer 2, the end of the heat sink 5 that extends obliquely out of the mounting groove 311 will be compressed, which will cause the heat sink 5 to be compressed and deform the insulating layer 3, and cause the heat sink 5 to deflect closer to the bottom of the mounting groove 311. The deformation of the insulating layer 3 causes the heat sink 5 to move and deflect to buffer the pressure on the circuit board, preventing the conductive layer 2 in the circuit board from being damaged by pressure perpendicular to the conductive layer 2, and improving the service life and safety of the circuit board.

[0030] As further provided by the utility model, the linear array in the installation groove 31 is provided with mounting grooves 311 to form the partition 32, and the mounting grooves 311 are provided with storage capsules 6 for storing the fire-retardant liquid, and the partition 32 is located between the storage capsules 6.

[0031] Specifically, as shown in Figure 2 The storage capsules 6 are arranged in the mounting grooves 311 of the installation groove 31, and the storage capsules 6 store the fire-retardant liquid, and when the circuit board assembly is used, if the conductive layer 2 generates high temperature due to accidental heat accumulation or short circuit, the storage capsules 6 can melt to release the fire-retardant liquid, and the storage capsules 6 and the fire-retardant liquid can realize cooling treatment of the damaged circuit board assembly, and the fire-retardant liquid can avoid direct combustion of the circuit board assembly, and improve the use safety of the circuit board assembly.

[0032] As further provided by the utility model, the heat dissipation plate 5 is provided with protruding spikes 51 extending into the partition 32 to face the storage capsules 6.

[0033] Specifically, as shown in Figure 2 The heat dissipation plate 5 is provided with protruding spikes 51 extending into the partition 32 to face the storage capsules 6, when the circuit board assembly is extruded in the direction perpendicular to the conductive layer 2, the end of the heat dissipation plate 5 extending out of the mounting groove 311 is extruded, so that the heat dissipation plate 5 is extruded to extrude the insulation layer 3, and the heat dissipation plate 5 is deflected to be close to the bottom of the mounting groove 311, the heat dissipation plate 5 is deflected to make the protruding spikes 51 pierce the storage capsules 6 to release the fire-retardant liquid, and realize cooling and protection of the circuit board assembly, and avoid combustion problem of the circuit board assembly due to damage caused by extrusion.

[0034] As further provided by the utility model, the heat conduction plate 4 is a ceramic piece.

[0035] Specifically, the heat conduction plate 4 is a ceramic piece to improve the heat conduction efficiency of the heat conduction plate 4.

[0036] The above only describes certain exemplary embodiments of the utility model by way of illustration, without doubt, for ordinary skilled in the art, without departing from the spirit and scope of the utility model, the described embodiments can be modified in various ways. Therefore, the above drawings and description are illustrative in nature, and should not be understood as limiting the scope of protection of the utility model claims.

Claims

1. An interlayer insulation structure of a multilayer circuit board, characterized by, The both sides of the insulating substrate (1) are provided with conductive layer (2) and insulating layer (3), the conductive layer (2) is between the insulating substrate (1) and the insulating layer (3), the insulating substrate (1) is provided with heat-conducting plate (4), the heat-conducting plate (4) is symmetrically provided with the extension plate (41) extending out of the both ends of the insulating substrate (1), the extension plate (41) is linearly arranged with the heat-dissipation fins (42).

2. An interlayer insulation structure for a multilayer circuit board according to claim 1, wherein The heat-conducting plate (4) is linearly arranged with the extension plate (43) in the insulating substrate (1).

3. An interlayer insulation structure for a multilayer circuit board according to claim 1, wherein The insulating layer (3) is provided with the installation groove (31), the installation groove (31) is linearly arranged with the heat-dissipation plate (5) with the end extending out of the installation groove (31).

4. An interlayer insulation structure for a multilayer circuit board according to claim 3, wherein The heat-dissipation plate (5) is inclinedly arranged relative to the insulating layer (3).

5. An interlayer insulation structure for a multilayer circuit board according to claim 4, wherein The installation groove (31) is linearly provided with the installation slot (311) to form the separation part (32), the installation slot (311) is provided with the storage bag (6) for storing the fire-retardant liquid, and the separation part (32) is between the storage bags (6).

6. An interlayer insulation structure for a multilayer circuit board according to claim 5, wherein The heat-dissipation plate (5) is provided with the extension thorn (51) extending into the separation part (32) to face the storage bag (6).

7. An interlayer insulation structure for a multilayer circuit board according to claim 1, wherein The heat-conducting plate (4) is a ceramic piece.

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