Heat dissipation structure and circuit board applied to FTTR product

Abstract

The utility model relates to electronic equipment, in particular to a heat dissipation structure and a circuit board applied to an FTTR product, the heat dissipation structure is used for heat dissipation of an electronic device and comprises a back glue layer, a heat conduction film and a supporting body, the heat conduction film is of a closed-loop structure, and the inner wall of the heat conduction film is attached to the outer wall of the supporting body; the density of the support body is less than 1.0 g / cm < 3 >, and the back adhesive layer is arranged on the heat-conducting film and has viscosity. According to the utility model, heat dissipation can be carried out on electronic devices of the circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment field especially, a kind of heat dissipation structure and the circuit board applied on FTTR product. BACKGROUND

[0002] At present, the electric energy lost by electronic equipment during work is mainly converted into heat energy, causing the temperature of electronic equipment to rise and the thermal stress to increase, which seriously affects the reliability and service life of electronic equipment, so a radiator is needed to dissipate the residual heat energy as soon as possible. Not only the heat dissipation requirement of industrial electronic products is high, but also the heat dissipation requirement of household electronic products is gradually increasing, especially the FTTR related products. In order to ensure the high-speed internet access service, the heat dissipation requirement of FTTR related products is gradually increasing in the industry. The heat dissipation materials on the market are mainly metal materials, which have high thermal conductivity and easy forming characteristics. However, metal heat dissipation fins also have their drawbacks. The density of the heat dissipation piece made of metal material is large, and the weight of the heat sink made of metal is generally large, which makes the inertia of the heat dissipation piece large. When the heat dissipation piece is applied to the circuit board, the vibration resistance and impact resistance of the circuit board as a whole are poor. SUMMARY

[0003] The utility model embodiment provides a kind of heat dissipation structure and the circuit board applied on FTTR product, to solve the weight of the heat dissipation piece of metal material is large, and the vibration resistance and impact resistance of circuit board are poor.

[0004] On the one hand, the utility model embodiment discloses a heat dissipation structure for heat dissipation of electronic devices, comprising an adhesive layer, a heat-conducting film and a support body, the heat-conducting film has a closed loop structure, and the inner wall of the heat-conducting film is attached to the outer wall of the support body; the density of the support body is less than 1.0 g / cm³,

[0005] The adhesive layer is arranged on the insulating layer, and the adhesive layer has adhesion.

[0006] Optionally, the heat-conducting film comprises, in sequence from inside to outside, an adhesive layer, a heat-conducting layer and an insulating layer, the adhesive layer is used for bonding the heat-conducting layer and the support body; and the adhesive layer is arranged on the insulating layer.

[0007] Optionally, the heat dissipation structure further comprises a fixing member and a heat-conducting plate, the heat-conducting plate is in contact with a heat source of the electronic device, the adhesive layer bonds the heat-conducting plate, and the fixing member is used for connecting the heat-conducting plate and the electronic device.

[0008] Optionally, the heat dissipation structure further comprises a boss, the boss is arranged on the side surface of the heat-conducting plate close to the electronic device, and the boss is used for being inserted into a recess of the electronic device.

[0009] Optionally, the fixing member comprises a plurality of bolts and a plurality of supports, the plurality of supports are arranged on the side of the heat-conducting plate close to the electronic device, the supports are provided with through holes, the bolts pass through the through holes, and threaded segments of the bolts are threadedly connected with the electronic device.

[0010] Optionally, the heat-conducting plate is a metal plate.

[0011] Optionally, the heat-conducting plate has a thickness of 0.2-4 mm.

[0012] Optionally, the support body comprises a substrate and a plurality of protrusions, the plurality of protrusions are arranged on the side of the substrate away from the adhesive layer, and exposed surfaces of the protrusions and an exposed surface of the substrate constitute an outer wall of the support body.

[0013] Optionally, the heat-conducting layer is one of graphite, graphene, copper foil, aluminum foil and copper foil graphene; and the adhesive layer is heat-conducting double-sided adhesive or double-sided adhesive.

[0014] In another aspect, the utility model discloses a circuit board applied to FTTR product, which comprises a PCB and the heat dissipation structure.

[0015] The heat dissipation structure and the circuit board are provided, the heat on the chip is conducted to the heat-conducting layer through the adhesive layer and the insulating layer, and the heat is radiated outward from the part of the heat-conducting layer close to the chip and is also transferred to the other part of the heat-conducting layer far away from the chip. Compared with the single-layer heat dissipation film, the heat dissipation area of the heat dissipation structure is large, and compared with the heat-conducting body made of metal material, the mass of the heat dissipation structure is light, the high-thermal-conductivity heat-conducting layer can also ensure the heat-conducting effect, when the circuit board collides, the mass of the heat dissipation structure is light, the inertia is small, and the influence on the circuit board is small. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the utility model embodiment, the following will be briefly introduced the drawings needed to be used in the description of the utility model embodiment, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0017] Figure 1 It is the plan view of the heat dissipation structure in the embodiment of the utility model after the heat dissipation film is attached to the support body.

[0018] Figure 2 It is Figure 1 the sectional view of A-A in

[0019] Figure 3 It isFigure 2 Enlarged view of the middle C portion;

[0020] Figure 4 is an exploded view of the heat dissipation structure in an embodiment of the present application;

[0021] Figure 5 is a front view of the heat dissipation structure in an embodiment of the present application;

[0022] Figure 6 is an exploded view of the heat dissipation structure in an embodiment of the present application;

[0023] Figure 7 is a top view of the heat conduction plate of the heat dissipation structure in an embodiment of the present application.

[0024] BRIEF DESCRIPTION OF DRAWINGS: 1, support body; 11, base plate; 12, convex tooth; 2, heat conduction film; 21, adhesive layer; 22, heat conduction layer; 23, insulating layer; 3, back adhesive layer; 4, heat conduction plate; 41, boss; 42, support column. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical schemes and beneficial effects solved by the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0026] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0027] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] REFERENCE Figures 1 to 4The utility model discloses an embodiment of a heat dissipation structure for the heat dissipation of electronic devices, comprising a back adhesive layer 3, a heat conducting film 2 and a support body 1, the heat conducting film 2 is closed loop structure, the inner wall of heat conducting film 2 is attached on the outer wall of support body 1, the heat conducting film 2 comprises bonding layer 21, heat conducting layer 22 and insulating layer 23 in turn from inside to outside, bonding layer 21 is used for bonding heat conducting layer 22 and support body 1, back adhesive layer 3 is arranged on insulating layer 23, and back adhesive layer 3 has viscosity.

[0029] Referring to Figures 1 to 3 The heat dissipation mechanism of the embodiment is that the heat conducting film 2 is attached on the outer surface of the support body 1, the heat conducting film 2 is at least closed loop structure, that is, the heat conducting film 2 wraps around the support body 1, and then the whole formed by the heat conducting film 2 and the support body 1 is bonded on the heat source through the back adhesive layer 3.

[0030] In other embodiments, the heat conducting film 2 can even be a completely closed structure, that is, the heat conducting film 2 is attached on all the outer surfaces of the support body 1, so that the heat conducting film 2 completely wraps the support body 1, but the cost of such a completely closed heat conducting film 2 is relatively high.

[0031] The heat dissipation structure disclosed in the embodiment is generally applied to the PCB board, for example, to dissipate heat from the chip on the PCB board. The heat dissipation structure for the chip on the PCB will be explained in detail. When installing, the back adhesive layer 3 is provided on the outer wall of the heat conducting film 2 or on the chip in advance, and then the whole formed by the heat conducting film 2 and the support body 1 is pressed on the surface of the chip. Such an installation method is fast and low in cost.

[0032] In the embodiment, the material of the support body 1 can be foam, sponge or the like, the density of the support body 1 is less than 1.0 g / cm3, and the support body 1 mainly plays a role in supporting the shape of the heat conducting film 2, so the support body 1 is a solid material with a stable shape without external force, but the support body 1 can deform when subjected to external force. Of course, in other embodiments, the shape of the support body 1 is stable and will not deform when subjected to external force. However, the support body 1 does not need to play a role in heat dissipation in the embodiment, so the thermal conductivity coefficient of the support body 1 is not limited.

[0033] In the embodiment, the heat dissipation principle is as follows: the heat on the chip is conducted to the heat conducting layer 22 through the back adhesive layer 3 and the insulating layer 23, and the heat is radiated outward from the part of the heat conducting layer 22 closer to the chip while being transferred to the other part of the heat conducting layer 22 farther away from the chip. Compared with the single-layer heat dissipation film, the heat dissipation area of the heat dissipation structure of the embodiment is large.

[0034] Compared with the metal heat conductor, the heat dissipation structure of the embodiment has lighter weight, and the high-thermal-conductivity heat conducting layer 22 can ensure the heat conducting effect, so that the heat dissipation structure of the embodiment has small weight and low cost. Moreover, the heat dissipation mode of the metal heat conductor is that heat is conducted to each surface of the metal heat conductor through internal heat conduction; and the heat dissipation mode of the embodiment is that heat is uniformly conducted to each heat conducting layer 22 through surface heat conduction of the heat conducting layer 22, and finally heat exchange with the environment is performed.

[0035] The embodiment has the following advantages. First, cost can be saved. For pure metal heat dissipation fins, such as copper, aluminum and alloy materials, the price is generally high. The prices of the heat conducting layer 22, the insulating layer 23 and the glue are low, and the manufacturing process is simple.

[0036] Second, the weight is light. The low-density solid material is used as the support body 1, so that the use amount of metal is greatly reduced, and thus the weight is light. Moreover, due to the light weight, the inertia of the heat dissipation structure is small, and the heat dissipation structure is resistant to vibration and impact. When the circuit board collides, the mass of the heat dissipation structure is light, the inertia is small, and the influence on the circuit board is small.

[0037] The heat dissipation structure in the embodiment is applied to many electronic products in many fields, especially FTTR related products, such as optical terminal and FTTR optical gateway in the FTTR field. Specifically, the heat dissipation structure in the embodiment is attached to the main heating components in the FTTR related product device through the adhesive layer 3 itself, heat transfer is realized by the heat conducting layer 22 and air, and heat dissipation is performed.

[0038] Referring to Figure 3 In the embodiment, the insulating layer 23 mainly plays an insulating protection role, is attached to the outer wall of the heat conducting layer 22, and is generally an insulating film with a thickness in the range of 0.001-0.1 mm. The material must be an insulating material. In practical application, the insulating layer 23 is generally a non-metal material, and has high thermal emissivity. Preferably, the thermal emissivity is not less than 0.7.

[0039] Referring to Figure 3 As an example, the heat conducting layer 22 is one of graphite, graphene, copper foil, aluminum foil and copper foil graphene. In the embodiment, graphite is mainly used. The graphite can be natural graphite or artificial graphite. The price of the graphite is low, and the thermal conductivity is greater than 200 W / mk, which is a high-thermal-conductivity material and has good heat conducting effect.

[0040] Referring to Figure 3 and Figure 4As an example, the back adhesive layer 3 is a heat-conductive double-sided adhesive tape or double-sided adhesive tape. The adhesive layer 21 can be formed by glue or double-sided adhesive tape. In this embodiment, the back adhesive layer 3 is one of the links for heat conduction, and therefore it is suggested that the back adhesive layer 3 is preferably a heat-conductive double-sided adhesive tape, so as to ensure the heat conduction effect. However, since the support body 1 does not require good heat dissipation effect, the adhesive layer 21 can be formed by low-cost glue, and the adhesive layer 21 is formed after the glue is solidified.

[0041] With reference to Figures 5 to 7 As an example, the support body 1 includes a substrate 11 and a plurality of teeth 12, and the plurality of teeth 12 are arranged on the side of the substrate 11 away from the back adhesive layer 3. The exposed surface of the teeth 12 and the exposed surface of the substrate 11 form the outer wall of the support body 1. If the substrate 11 is arranged without the teeth 12 in this embodiment, the heat dissipation surface of the support body 1 is small. The plurality of teeth 12 as heat dissipation teeth increase the heat dissipation area and can improve the heat exchange efficiency.

[0042] With reference to Figure 5 and Figure 6 In an embodiment, the heat dissipation structure further includes a fixing member and a heat-conductive plate 4. The heat-conductive plate 4 is in contact with the heat source of the electronic device, the back adhesive layer 3 is used to bond the heat-conductive plate 4, and the fixing member is used to connect the heat-conductive plate 4 and the electronic device. Specifically, the heat-conductive plate 4 is a metal plate, and the thickness of the heat-conductive plate 4 is 0.2 mm-4 mm. The thickness of the heat-conductive plate 4 can be 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, or 4 mm.

[0043] Different from the previous embodiment, the back adhesive layer 3 bonds the heat-conductive film 2 and the heat-conductive plate 4, and the heat-conductive plate 4 is directly in contact with the heat source. The heat-conductive plate 4 made of metal is used as the heat-conductive member, and the heat generated by the chip is quickly conducted to the heat-conductive layer 22, and then the heat is dissipated to the surrounding air through the heat-conductive layer 22. Specifically, the fixing member includes a plurality of bolts and a plurality of supports 42. The plurality of supports 42 are arranged at intervals on the side of the heat-conductive plate 4 close to the electronic device, and the supports 42 are provided with through holes. The bolts pass through the through holes, and the threaded segments of the bolts are threadedly connected to the electronic device.

[0044] In this embodiment, the bolts pass through the supports 42, and the threaded segments of the bolts are screwed into the threaded holes on the PCB, so as to fix the heat-conductive plate 4 on the PCB and ensure that the heat-conductive plate 4 is always in contact with the heat source. Then, the whole formed by the support body 1 and the heat-conductive film 2 is bonded to the heat-conductive plate 4 by the back adhesive layer 3.

[0045] Reference is made to Figure 5 and Figure 6 The heat dissipation structure further comprises a boss 41 arranged on the side surface of the heat conduction plate 4 close to the electronic device, and the boss 41 is arranged to be inserted into the recess of the electronic device. The number and size of the boss 41 correspond to the number and size of the recess on the chip.

[0046] Preferably, the boss 41 and the heat conduction plate 4 are integrally formed. In other embodiments, the boss 41 is welded on the surface of the heat conduction plate 4.

[0047] The embodiment has the following advantages:

[0048] Firstly, the embodiment increases the heat conduction plate 4 made of metal, and the whole formed by the support body 1 and the heat conduction film 2 is bonded to the heat conduction plate 4 through the adhesive layer 3, thereby improving the structural strength of the whole heat dissipation device without increasing the weight.

[0049] Secondly, the reason why the metal plate is selected and the boss 41 is arranged on the metal plate is as follows: in actual production, if the support body 1 of the embodiment is made of foam or sponge, it is difficult to cut the support body 1 to form a boss similar to the boss 41 matching the size of the chip, and the heat conduction film 2 needs to be bonded to the support body 1, and it is not possible to control whether the size of the “boss 41” formed by the heat conduction film 2 and the support body 1 is accurate, and it is not necessarily possible to insert the boss 41 into the recess of the chip. However, by using the heat conduction plate 4 made of metal and the boss 41 fixed on the heat conduction plate 4, the boss 41 can be inserted into the chip as much as possible.

[0050] Thirdly, the cost is low. Compared with the whole metal heat conduction part, the amount of metal material and the processing amount in the embodiment are small, the processing time is reduced, and the processing cost and the process cost are reduced.

[0051] In an embodiment, the embodiment further discloses a circuit board applied to an FTTR product, comprising a PCB board and the heat dissipation structure in any one of the above embodiments, and the heat dissipation structure is mounted on the PCB board. The circuit board in the embodiment is commonly applied to related products in the FTTR field.

[0052] Specifically, the heat dissipation structure of the embodiment comprises a heat conduction film 2, a support body 1 and an adhesive layer 3, and the whole formed by the support body 1 and the heat conduction film 2 is bonded to the chip on the PCB board by the adhesive layer 3.

[0053] Alternatively, the heat dissipation structure of the embodiment comprises a heat conduction plate 4, a boss 41 arranged on the heat conduction plate 4, a support column 42, a bolt, a heat conduction film 2, a support body 1 and an adhesive layer 3, the whole formed by the support body 1 and the heat conduction film 2 is bonded to the heat conduction plate 4 by the adhesive layer 3, the heat conduction plate 4 and the support column 42 are integrally formed, and the heat conduction plate 4 is connected to the PCB board by the bolt.

[0054] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A heat dissipating structure, characterized by comprising: A heat dissipation structure for electronic devices, comprising a back adhesive layer, a heat conductive film and a support body, the heat conductive film is in a closed loop structure, the inner wall of the heat conductive film is attached to the outer wall of the support body; the density of the support body is less than 1.0 g / cm3, the back adhesive layer is arranged on the heat conductive film, and the back adhesive layer has adhesion.

2. The heat dissipating structure according to claim 1, wherein The heat conductive film comprises, in sequence from inside to outside, an adhesive layer, a heat conductive layer and an insulating layer, the adhesive layer is used for bonding the heat conductive layer and the support body. The back adhesive layer is arranged on the insulating layer.

3. The heat dissipating structure according to claim 2, wherein Further comprising a fixing member and a heat conductive plate, the heat conductive plate is in contact with a heat source of the electronic device, the back adhesive layer bonds the heat conductive plate, and the fixing member is used for connecting the heat conductive plate and the electronic device.

4. The heat dissipating structure according to claim 3, wherein Further comprising a boss, the boss is arranged on the side surface of the heat conductive plate close to the electronic device, and the boss is used for being inserted into a recess of the electronic device.

5. The heat dissipating structure according to claim 3, wherein The fixing member comprises a plurality of bolts and a plurality of supports, the plurality of supports are arranged at intervals on the side of the heat conductive plate close to the electronic device, the supports are provided with through holes, the bolts pass through the through holes, and the threaded segments of the bolts are threadedly connected with the electronic device.

6. The heat dissipating structure according to claim 3, wherein The heat conductive plate is a metal plate.

7. The heat dissipating structure according to claim 3, wherein The thickness of the heat conductive plate is 0.2-4 mm.

8. The heat dissipating structure according to claim 1, wherein The support body comprises a base plate and a plurality of protrusions, the plurality of protrusions are arranged on the side of the base plate away from the back adhesive layer, and the exposed surface of the protrusions and the exposed surface of the base plate constitute the outer wall of the support body.

9. The heat dissipating structure according to claim 2, wherein The heat conductive layer is one of graphite, graphene, copper foil, aluminum foil and copper foil graphene. The back adhesive layer is a heat conductive double-sided adhesive or double-sided adhesive.

10. A circuit board applied on an FTTR product, characterized in that, A PCB board and the heat dissipation structure according to any one of claims 1-9, the heat dissipation structure is mounted on the PCB board.

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