Efficient heat dissipation mechanism for thermal imaging monitoring equipment

By combining a liquid cooling system with a fan, the problem of poor heat dissipation in thermal imaging monitoring equipment has been solved, achieving efficient heat dissipation and convenient installation and disassembly, thus improving the equipment's heat dissipation performance and maintenance efficiency.

CN223730174UActive Publication Date: 2025-12-26SHENZHEN DIAMANTE TECH CO LTD
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Patent Information

Application Number
CN202520236612.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2025-12-26
Estimated Expiration
2035-02-13

AI Technical Summary

Technical Problem

Existing thermal imaging monitoring equipment has poor wind-powered cooling mechanisms and is inconvenient to disassemble and install, which affects the equipment's cooling performance and maintenance efficiency.

Method used

The system employs a liquid cooling system combined with fan cooling. Through the combined design of a cooler, temperature guide plate, delivery pipe, pump body and cooling fan, the liquid is circulated and cooled. The connection method of threaded rod and clamping plate simplifies installation and disassembly.

Benefits of technology

It improves heat dissipation, enhances the equipment's heat dissipation capacity, simplifies the installation and disassembly process, and improves the ease of use and maintenance efficiency of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an efficient heat dissipation mechanism for thermal imaging monitoring equipment, belongs to the field of heat dissipation equipment, and aims to solve the problem of inconvenience in convenient connection and use. The efficient heat dissipation mechanism comprises a bottom box, a material pipe is fixedly connected to the bottom box, a refrigerator is mounted on the bottom box, and a clamping plate is fixedly connected to a connecting frame. According to the thermal imaging monitoring device, through the arranged positioning plate, when a thermal imaging monitoring body needs to be installed for connection, the thermal imaging monitoring body can be placed on the bottom box, rotating discs on the supporting boxes on the two sides are rotated, the rotating discs drive threaded rods to rotate, the threaded rods can push engaged connecting frames to move outwards, and when the connecting frames move, installed clamping plates can be inserted into the positioning plate; the thermal imaging monitoring body is limited and fixed, the situation of falling off and shaking is avoided, when subsequent disassembly is needed, only the threaded rods on the two sides need to be driven in the opposite direction to rotate, the clamping plate can be taken out of the positioning plate to be disassembled, and the assembly and disassembly efficiency is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of heat dissipation equipment, and concretely relates to a high -efficient heat dissipation mechanism for thermal imaging monitoring equipment. BACKGROUND

[0002] Thermal imaging monitoring equipment utilizes infrared thermal imaging technology, measures the temperature distribution of the object surface through non-contact mode, and converts it into visual image. This equipment has wide application in the field of security monitoring, industrial detection, medical diagnosis, etc. The thermal imaging monitoring equipment is prone to high temperature during operation, and needs to be cooled and protected by high -efficient heat dissipation mechanism. The design of heat dissipation mechanism aims to ensure that the thermal imaging monitoring equipment can maintain stable performance and heat dissipation effect during long time and high load work.

[0003] However, most of the high -efficient heat dissipation mechanisms for thermal imaging monitoring equipment have the following problems:

[0004] The existing high -efficient heat dissipation mechanism for thermal imaging monitoring equipment, when dissipating heat, mostly dissipates heat through the installation of fan, and the wind power dissipation effect is poor. If the ambient air temperature is high, the temperature of the wind transported by the fan is high, which can easily affect the heat dissipation effect, and it is inconvenient to carry out convenient heat dissipation treatment. At the same time, when installing the heat dissipation mechanism, it is mostly installed on the thermal imaging monitoring equipment through multiple bolts or welding. If the heat dissipation mechanism needs to be disassembled and repaired, it is troublesome to disassemble, and it needs to be disassembled according to multiple bolts, or the welding part is cut, which is time -consuming and labor -intensive to disassemble and install, and it is inconvenient to use conveniently.

[0005] Therefore, we improve it and propose a high -efficient heat dissipation mechanism for thermal imaging monitoring equipment. UTILITY MODEL CONTENT

[0006] The utility model aims at: the problem of inconvenient heat dissipation treatment and inconvenient connection use.

[0007] In order to achieve the above purpose, the utility model provides the following technical scheme:

[0008] The high -efficient heat dissipation mechanism for thermal imaging monitoring equipment is used to improve the above problems.

[0009] The application is as follows:

[0010] Including the bottom box, the bottom box is fixedly connected with the material pipe, the bottom box is installed with the refrigeration device, the refrigeration device is installed with the temperature guide plate, the temperature guide plate is fixedly connected with the flow guide plate, the bottom box is fixedly connected with the support box, the bottom box is fixedly connected with the conveying pipe, the conveying pipe is installed with the pump body, the support box is fixedly connected with the filter screen, the support box is provided with the heat dissipation fan, the bottom box is provided with the thermal imaging monitoring body, the thermal imaging monitoring body is fixedly connected with the positioning plate, the support box is rotatably connected with the threaded rod, the threaded rod is fixedly connected with the rotating disc, the threaded rod is threadedly connected with the connecting frame, and the connecting frame is fixedly connected with the clamping plate.

[0011] As a preferred technical scheme of the application, the flow guide plates are equidistantly distributed on the temperature guide plate, and the middle cross section of the conveying pipe is in continuous "S" shape.

[0012] As a preferred technical scheme of the application, the conveying pipes are symmetrically distributed on the left and right sides of the bottom box, and the conveying pipes are one-to-one corresponding to the pump bodies through the support boxes.

[0013] As a preferred technical scheme of the application, the rotating disc is fixedly connected to the center of one side of the threaded rod, and the end surface of one end of the connecting frame is attached to the inner surface of the support box.

[0014] As a preferred technical scheme of the application, the clamping plates are symmetrically distributed on the left and right sides of the positioning plate, and the clamping plates are one-to-one corresponding to the threaded rods through the connecting frames.

[0015] As a preferred technical scheme of the application, the threaded rod is connected to the middle part of the connecting frame, and the connecting frame is limitingly and slidingly connected in the support box.

[0016] Compared with the prior art, the application has the following beneficial effects:

[0017] In the scheme of the application:

[0018] 1. When the heat dissipation of the thermal imaging monitoring body is performed, the liquid is added to the bottom box through the material pipe, the refrigeration device is started to cool through the temperature guide plate, the pump body can transport the liquid through the conveying pipe, the conveying pipe can emit cold air when conveying the liquid, the liquid transported back to the bottom box through the conveying pipe can be guided through the flow guide plate when the other end of the conveying pipe absorbs the liquid, the liquid can be conveyed in "S" shape, the time of the liquid staying in the bottom box is prolonged, the cooling is sufficient, the conveying and cold air emission are facilitated, the air conveying is performed in cooperation with the heat dissipation fan, the cold air can be fully dissipated and cooled, and the operation of the thermal imaging monitoring body is not affected by high temperature.

[0019] 2. Through the positioning plate arranged, when the thermal imaging monitoring body needs to be installed and connected, the thermal imaging monitoring body can be placed on the bottom box, the turntable on the support box on the two sides is rotated, the turntable drives the threaded rod to rotate, the threaded rod can drive the meshed connecting frame to move outward, the connecting frame can insert the installed clamping plate into the positioning plate when moving, the thermal imaging monitoring body is fixed in position, the situation of falling and shaking is avoided, and when disassembly is required subsequently, only the threaded rods on the two sides are driven to rotate in the reverse direction, the clamping plate can be taken out from the positioning plate for disassembly, and the installation and disassembly efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The overall three-dimensional structure schematic diagram of the efficient heat dissipation mechanism for the thermal imaging monitoring equipment is provided for the present application.

[0021] Figure 2 The bottom box side view structure schematic diagram of the efficient heat dissipation mechanism for the thermal imaging monitoring equipment is provided for the present application.

[0022] Figure 3 The support box top view structure schematic diagram of the efficient heat dissipation mechanism for the thermal imaging monitoring equipment is provided for the present application.

[0023] Figure 4 The guide plate side view structure schematic diagram of the efficient heat dissipation mechanism for the thermal imaging monitoring equipment is provided for the present application.

[0024] Figure 5 The connecting frame top view structure schematic diagram of the efficient heat dissipation mechanism for the thermal imaging monitoring equipment is provided for the present application.

[0025] Indicated in the figure: 1, bottom box; 2, pipe; 3, refrigerator; 4, temperature guide plate; 5, flow guide plate; 6, support box; 7, conveying pipe; 8, pump body; 9, filter screen; 10, heat dissipation fan; 11, thermal imaging monitoring body; 12, positioning plate; 13, turntable; 14, threaded rod; 15, connecting frame; 16, clamping plate. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments.

[0027] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but only represents some embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0028] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Example 1:

[0032] like Figures 1-5 As shown, this embodiment proposes a high-efficiency heat dissipation mechanism for thermal imaging monitoring equipment, including a base box 1, a feed pipe 2 fixedly connected to the base box 1, a cooler 3 installed on the base box 1, a temperature guiding plate 4 installed on the cooler 3, a flow guide plate 5 fixedly connected to the temperature guiding plate 4, a support box 6 fixedly connected to the base box 1, a conveying pipe 7 fixedly connected to the base box 1, a pump body 8 installed on the conveying pipe 7, a filter screen 9 fixedly connected to the support box 6, a cooling fan 10 installed inside the support box 6, a thermal imaging monitoring body 11 installed on the base box 1, a positioning plate 12 fixedly connected to the thermal imaging monitoring body 11, a threaded rod 14 rotatably connected to the support box 6, a turntable 13 fixedly connected to the threaded rod 14, a connecting frame 15 threadedly connected to the threaded rod 14, and a clamping plate 16 fixedly connected to the connecting frame 15.

[0033] Example 2:

[0034] The solution in Example 1 will be further described below with reference to its specific working method.

[0035] like Figure 4 As shown, in a preferred embodiment, based on the above method, the guide plates 5 are equidistantly distributed on the temperature guiding plate 4, and the cross-section of the middle part of the conveying pipe 7 is in a continuous "S" shape, which can ensure that the conveying pipe 7 in a continuous "S" shape can increase the area of ​​cold air dissipation.

[0036] like Figure 2As shown, in a preferred embodiment, based on the above method, the delivery pipes 7 are symmetrically distributed on the left and right sides of the bottom box 1. The delivery pipes 7 correspond one-to-one with the pump body 8 through the support box 6, which can ensure that the delivery pipes 7 on both sides can conveniently provide heat dissipation protection for both sides of the thermal imaging monitoring body 11.

[0037] like Figure 5 As shown, in a preferred embodiment, based on the above method, the turntable 13 is further fixedly connected to the center of one side of the threaded rod 14, and one end face of the connecting frame 15 is in contact with the inner side of the support box 6, which can ensure that the connecting frame 15 can be supported and moved by the contact with the inner side of the support box 6 when it moves.

[0038] like Figure 2 As shown, in a preferred embodiment, based on the above method, the card plates 16 are symmetrically distributed on the left and right sides of the positioning plate 12. The card plates 16 correspond one-to-one with the threaded rods 14 through the connecting frame 15. The threaded rods 14 are connected to the middle part of the connecting frame (15). The connecting frame 15 is limited and slidably connected in the support box 6, which can ensure that the card plates 16 on both sides are engaged in the positioning plate 12 and can be limited and fixed.

[0039] Specifically, the high-efficiency heat dissipation mechanism originally used in thermal imaging monitoring equipment, when in use: combined with Figures 1-5 When cooling the thermal imaging monitoring body 11, liquid can be added to the bottom box 1 through the feed pipe 2. The cooler 3 is turned on and the temperature is cooled by the temperature guide plate 4. The pump body 8 can transport the liquid through the delivery pipe 7. The delivery pipe 7 can emit cold air when transporting the liquid. The delivery pipe 7 transports the liquid back to the bottom box 1. When the other end of the delivery pipe 7 is sucking up the liquid, the liquid that has just been transported can be guided by the guide plate 5. The liquid can be transported in an "S" shape, increasing the time that the liquid stays in the bottom box 1, so as to achieve sufficient cooling and facilitate the transportation and emission of cold air. With the help of the cooling fan 10, the air can be mixed with cold air for sufficient heat dissipation and cooling, avoiding the high temperature from affecting the operation of the thermal imaging monitoring body 11. When the cooling fan 10 is transporting air, it can be filtered and protected by the filter screen 9 on the support box 6 to prevent dust and impurities from affecting the cooling fan 10.

[0040] When the thermal imaging monitoring body 11 needs to be installed for connection, the thermal imaging monitoring body 11 can be placed on the bottom box 1, the rotating disc 13 on the two side support boxes 6 is rotated, the rotating disc 13 drives the threaded rod 14 to rotate, the threaded rod 14 can drive the meshed connecting frame 15 to move outward, when the connecting frame 15 moves, the installed clamping plate 16 can be inserted into the positioning plate 12, the thermal imaging monitoring body 11 is limited and fixed, the situation of falling off and shaking is avoided, and when subsequent disassembly is needed, only the threaded rod 14 on the two sides needs to be driven to rotate in the reverse direction, the clamping plate 16 can be taken out from the positioning plate 12 for disassembly, the installation and disassembly efficiency is improved, and the thermal imaging monitoring body 11 used is of a type (Hikvision P20Max).

[0041] The above embodiments are only used to illustrate the present application and are not limited to the technical solutions described in the present application. Although the present application has been described in detail with reference to the above embodiments, the present application is not limited to the above specific embodiments, and any modification or equivalent replacement of the present application is allowed. Any technical solution and improvement within the spirit and scope of the present application is covered by the claims of the present application.

Claims

1. A high-efficiency heat dissipation mechanism for thermal imaging monitoring equipment, comprising a bottom box (1), characterized in that, The bottom box (1) is fixedly connected with a material pipe (2), a refrigeration device (3) is installed on the bottom box (1), a temperature guide plate (4) is installed on the refrigeration device (3), a flow guide plate (5) is fixedly connected on the temperature guide plate (4), a supporting box (6) is fixedly connected on the bottom box (1), a conveying pipe (7) is fixedly connected on the bottom box (1), a pump body (8) is installed on the conveying pipe (7), a filter screen (9) is fixedly connected on the supporting box (6), a heat dissipation fan (10) is arranged in the supporting box (6), a thermal imaging monitoring body (11) is arranged on the bottom box (1), a positioning plate (12) is fixedly connected on the thermal imaging monitoring body (11), a threaded rod (14) is rotatably connected on the supporting box (6), a rotating disc (13) is fixedly connected on the threaded rod (14), a connecting frame (15) is threadedly connected on the threaded rod (14), and a clamping plate (16) is fixedly connected on the connecting frame (15).

2. The efficient heat dissipation mechanism for thermal imaging monitoring equipment according to claim 1, wherein, The flow guide plates (5) are equidistantly distributed on the temperature guide plate (4), and the middle cross section of the conveying pipe (7) is continuously "S" shaped.

3. The efficient heat dissipation mechanism for thermal imaging monitoring device according to claim 1, wherein, The conveying pipes (7) are symmetrically distributed on the left and right sides of the bottom box (1), and the conveying pipes (7) correspond one by one to the pump bodies (8) through the supporting boxes (6).

4. The efficient heat dissipation mechanism for thermal imaging monitoring equipment according to claim 1, wherein, The rotating disc (13) is fixedly connected on one side of the center of the threaded rod (14), and one end surface of the connecting frame (15) is in close contact with the inner surface of the supporting box (6).

5. The efficient heat dissipation mechanism for thermal imaging monitoring device according to claim 1, wherein, The clamping plates (16) are symmetrically distributed on the left and right sides of the positioning plate (12), and the clamping plates (16) correspond one by one to the threaded rods (14) through the connecting frames (15).

6. A high-efficiency heat dissipation mechanism for a thermal imaging monitoring device according to claim 5, wherein, The threaded rod (14) is connected in the middle of the connecting frame (15), and the connecting frame (15) is limitingly and slidingly connected in the supporting box (6).