Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of display. The electronic equipment comprises a display panel, a buffer layer, a conductive heat dissipation adhesive layer and a frame body, the display panel is provided with a display surface and a back surface opposite to the display surface; the buffer layer is connected with the back surface of the display panel; the conductive heat dissipation adhesive layer is adhered to one side, deviating from the display panel, of the buffer layer; and one side, deviating from the display panel, of the conductive heat dissipation adhesive layer is bonded with the frame body. The buffer layer and the conductive heat dissipation adhesive layer are arranged between the display panel and the frame body, the buffer layer can achieve a buffer effect on the display panel, the conductive heat dissipation adhesive layer can achieve a heat dissipation effect, and therefore graphite sheets do not need to be arranged between the buffer layer and the frame body, and the conductive heat dissipation adhesive layer can achieve a conductive effect; the buffer layer can be electrically connected with the frame body after being bonded to form a grounding environment, so that a copper foil does not need to be arranged between the buffer layer and the frame body. The electronic equipment is simple in overall structure, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a buffer protection structure and a display module. BACKGROUND

[0002] With the development of display technology, the demand and application range of electronic devices are continuously expanding. Common electronic devices include mobile phones, televisions, tablet computers, notebook computers and displays, etc.

[0003] An electronic device generally includes a display module and a frame (also commonly referred to as a middle frame or front shell). The display module can be protected from the side by the frame. The display module generally includes a display panel and a buffer protection structure between the back of the display panel and the frame, which generally has the effect of buffering, heat dissipation or electrical conduction.

[0004] The current buffer protection structure generally includes a foam layer, a copper foil and a graphite sheet, which respectively have the effects of buffering, electrical conduction and heat dissipation. Special design is generally required for the connection between the copper foil and the frame, and the connection between the graphite sheet and the frame, resulting in a complex overall structure of the electronic device and high cost. INNOVATION CONTENT

[0005] The present application provides an electronic device. The problem of complex structure of the existing electronic device can be solved.

[0006] In one aspect, an electronic device is provided, including: a display panel, a buffer layer, an electrically conductive and heat-dissipating adhesive layer, and a frame.

[0007] The display panel has a display surface and a back surface opposite to the display surface.

[0008] The buffer layer is connected to the back surface of the display panel.

[0009] The electrically conductive and heat-dissipating adhesive layer is bonded to a side of the buffer layer away from the display panel.

[0010] The side of the electrically conductive and heat-dissipating adhesive layer away from the display panel is bonded to the frame.

[0011] Optionally, the electrically conductive and heat-dissipating adhesive layer includes electrically conductive adhesive and heat-conducting particles mixed in the electrically conductive adhesive.

[0012] Optionally, the heat-conducting particles include at least one of graphite particles and metal particles.

[0013] Optionally, in a direction perpendicular to the back surface, the thickness of the buffer layer is greater than the thickness of the electrically conductive and heat-dissipating adhesive layer.

[0014] Optionally, the electronic device further comprises an elastic film layer; the elastic film layer is located between the buffer layer and the conductive heat-dissipation adhesive layer, and one side of the elastic film layer is connected with the buffer layer, and the other side is bonded with the conductive heat-dissipation adhesive layer.

[0015] The elastic modulus of the elastic film layer is greater than the elastic modulus of the buffer layer.

[0016] Optionally, in the direction perpendicular to the back surface, the thickness of the elastic film layer is less than the thickness of the buffer layer.

[0017] Optionally, the frame body comprises a metal frame and an oxidation layer attached to the surface of the metal frame; the area of the oxidation layer covered by the conductive heat-dissipation adhesive layer has at least one hollow area, and the conductive heat-dissipation adhesive layer is electrically connected with the metal frame through the at least one hollow area.

[0018] Optionally, the electronic device further comprises at least one conductive adhesive block, and the at least one conductive adhesive block corresponds to the at least one hollow area one by one; one side of each conductive adhesive block is electrically connected with the metal frame in the corresponding hollow area, and the other side is electrically connected with the conductive heat-dissipation adhesive layer.

[0019] The resistivity of the conductive adhesive block is less than or equal to the resistivity of the conductive heat-dissipation adhesive layer.

[0020] Optionally, the frame body comprises a bottom plate and a side plate fixedly connected with the outer edge of the bottom plate; one side of the conductive heat-dissipation adhesive layer away from the buffer layer is bonded with the bottom plate.

[0021] Optionally, the part of the bottom plate bonded with the conductive heat-dissipation adhesive layer comprises a first bottom plate part and a second bottom plate part, and the first bottom plate part is closer to the side plate than the second bottom plate part.

[0022] The distance between the first bottom plate part and the back surface of the display panel is less than the distance between the second bottom plate part and the back surface of the display panel.

[0023] The technical scheme provided by the embodiments of the present application has the following beneficial effects:

[0024] By setting the buffer layer and the conductive heat dissipation adhesive layer between the display panel and the frame, the buffer layer can achieve the buffering effect on the display panel, and the conductive heat dissipation adhesive layer can be bonded on one side of the buffer layer, which can realize the heat dissipation effect on one side, so that the graphite sheet does not need to be set between the buffer layer and the frame, and the conductive heat dissipation adhesive layer can realize the conductive effect on the other side, and can realize the electrical connection after being bonded with the frame to form a grounding environment, so that the copper foil does not need to be set between the buffer layer and the frame. In this way, the electronic device does not need to be specially designed for the connection of the copper foil and the frame and the connection of the graphite sheet and the frame, so that the overall structure of the electronic device is simple, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is a structural schematic diagram of a common electronic device at present;

[0027] Figure 2 is a structural schematic diagram of another common electronic device at present;

[0028] Figure 3 is a structural schematic diagram of an electronic device provided by the embodiment of the present application;

[0029] Figure 4 is a structural schematic diagram of an elastic film layer of an electronic device provided by the embodiment of the present application;

[0030] Figure 5 is a structural schematic diagram of a buffer protection structure provided by the embodiment of the present application;

[0031] Figure 6 is a top view of a frame of an electronic device provided by the embodiment of the present application;

[0032] Figure 7 is a structural schematic diagram of a conductive adhesive block of an electronic device provided by the embodiment of the present application;

[0033] Figure 8 is a structural schematic diagram of a frame of an electronic device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the embodiments of the present application in combination with the drawings.

[0035] Please refer toFigure 1 With Figure 2 , Figure 1 is a structural schematic diagram of a common electronic device, Figure 2 is a structural schematic diagram of another common electronic device. The electronic device 00 includes a display module and a frame 10. The display module can generally include a display panel 30 and a buffer protection structure between the back of the display panel 30 and the frame 10. The buffer protection structure can generally have the effects of buffering, heat dissipation, or electrical conduction.

[0036] For example, Figure 1 and Figure 2 As shown, a foam layer 20 and a graphite sheet 21 can be arranged between the display panel 30 and the frame 10. The foam layer 20 can protect the display panel 30, and the graphite sheet 21 can dissipate heat from the display panel 30. On the side of the display panel 30 facing away from the frame 10, the electronic device 00 can also be provided with a protective cover plate 40, which can protect the front of the display panel 30.

[0037] As shown, Figure 2 Some electronic devices 00 can be provided with a copper foil 22 between the foam layer 20 and the frame 10. The copper foil 22 has the effect of electrical conduction and can be electrically connected to the metal frame 10 to achieve grounding. Generally, the copper foil 22 is bonded to the foam layer 20. For example, in electronic devices 00 with radio frequency communication capabilities, such as mobile phones, grounding between the frame 10 and the copper foil 22 is required to address the problem of radio frequency desense caused by signal interference.

[0038] Currently, Figure 2 As shown, the electronic device 00 increases conductive foam 23 at the location where grounding is required, allowing the copper foil 22 on the back of the screen to conduct with the frame 10. Because the copper foil 22 is thin and soft, it is prone to deformation, which can cause appearance problems. Increasing the thickness of the copper foil 22 can increase costs and the thickness of the display module, which is not cost-effective.

[0039] In addition, in the position where the conductive foam 23 is grounded, in order to ensure the good grounding performance of the conductive foam 23, it is necessary to give the conductive foam 23 sufficient pre-pressing amount, which requires sinking in the corresponding position of the frame body 10. Due to the current demand for ultra-thin whole machine of electronic devices such as mobile phones, the thickness of the frame body 10 itself is not thick, and the local thickness of the frame body 10 at the sinking position of the conductive foam 23 is even thinner. In the case of mobile phone falling, etc., the frame body 10 is very easy to deform at this position, and the instantaneous impact force of the deformation of the frame body 10 extrudes the display panel 30, which can cause the display panel 30 to produce red and blue spots and other display defects. In addition, in electronic devices 00 using rigid OLED display panels, the gap between the display panel 30 and the frame body 10 is small, which is generally insufficient to arrange the conductive foam 23.

[0040] It can be seen that the existing electronic device 00 needs to be specially designed for the connection between the copper foil and the frame body, and the connection between the graphite sheet and the frame body, resulting in complex overall structure of the electronic device and high cost.

[0041] Please refer to Figure 3 , Figure 3 A structural schematic diagram of an electronic device provided by an embodiment of the present application, in the embodiment of the present application, the electronic device 000 can be: a mobile phone, a tablet computer, a television, an advertising machine, a display screen, a digital photo frame, a vehicle-mounted terminal, etc. Any product or component with display function. The electronic device 000 provided by the embodiment of the present application can include: a display panel 300, a buffer layer 210, a conductive heat dissipation adhesive layer 220 and a frame body 100.

[0042] The display panel 300 can have a display surface S1 and a back surface S2 opposite to the display surface S1. The display panel 300 can be located inside the frame body 100, and a protection cover plate 400 can be arranged on the display surface side of the display panel 300 to protect the display side of the display panel 300. In addition, in the case of integrating touch function in the display panel 300, the user can touch the protection cover plate 400 to realize the control of the electronic device 000. Here, the display panel 300 can be a rigid OLED display panel, and the thickness of the rigid OLED display panel is thicker than that of the flexible OLED display panel, and the space reserved between the rigid OLED display panel and the frame body 100 is smaller, so the technical problem is more prominent in the electronic device adopting the rigid OLED display panel.

[0043] The buffer layer 210 is connected with the back surface S2 of the display panel 300. Generally, the back surface S2 of the rigid OLED display panel is attached with the buffer layer on the whole, which is used to generate a certain pre-pressure on the edge area of the rigid OLED display panel and plays a buffering protection role on the display panel. In the embodiment of the present application, the buffer layer 210 of the electronic device 000 is elastic and can always be in a compressed state in the electronic device 000.

[0044] The conductive heat dissipation adhesive layer 220 is bonded with the side of the buffer layer 210 away from the display panel 300; and the side of the conductive heat dissipation adhesive layer 220 away from the display panel 300 is bonded with the frame 100. In the embodiment of the present application, the conductive heat dissipation adhesive layer 220 is an adhesive layer with conductive and heat dissipation effects. Therefore, by arranging the conductive heat dissipation adhesive layer 220 between the side of the buffer layer 210 away from the display panel 300 and the frame 100, the copper foil for conductive and the graphite sheet for heat dissipation can be omitted. Figure 2 In addition, the conductive heat dissipation adhesive layer 220 has bonding capacity and can be directly bonded with the frame 100, without the need to arrange the conductive foam 23 in the conductive layer 200 to be electrically connected with the frame 100, so that the grounding treatment can be achieved.

[0045] In summary, by arranging the buffer layer and the conductive heat dissipation adhesive layer between the display panel and the frame, the buffer layer can achieve the buffering effect on the display panel, the conductive heat dissipation adhesive layer can be bonded on one side of the buffer layer, which can achieve the heat dissipation effect on the one hand, so that the graphite sheet between the buffer layer and the frame can be omitted, and the conductive heat dissipation adhesive layer can achieve the conductive effect on the other hand, so that the copper foil between the buffer layer and the frame can be omitted. In this way, the electronic device does not need to be specially designed for the connection of the copper foil and the frame and the connection of the graphite sheet and the frame, so that the overall structure of the electronic device can be simple and the cost can be reduced.

[0046] In the embodiment of the present application, the conductive heat dissipation adhesive layer 220 can include conductive adhesive and heat-conducting particles mixed in the conductive adhesive.

[0047] The conductive adhesive is an adhesive with certain conductivity, which can connect various conductive materials together to form an electrical path between the connected materials. According to the types of conductive particles in the conductive adhesive, the conductive adhesive can be divided into silver-based conductive adhesive, gold-based conductive adhesive, copper-based conductive adhesive and carbon-based conductive adhesive, etc.

[0048] The heat-conducting particles can be made of materials with large heat conductivity, such as metal particles, carbon-based particles and ceramic particles, etc.

[0049] Exemplarily, metals are one of the best heat-conductive materials, especially silver, copper and gold, and the thermal conductivity of metal materials is generally high and can effectively transfer heat. Carbon-based materials also have excellent performance in heat conduction, especially graphite, graphene and carbon nanotubes.

[0050] In the embodiments of the present application, under the premise of using materials with good heat conduction effect, materials that can have electrical conductivity are further selected, and the heat-conducting particles can include at least one of graphite particles and metal particles.

[0051] Among them, the graphite particles can have better heat conduction performance than the metal, and the thermal conductivity of graphite can reach 500 W / m·K, which is better than the thermal conductivity of commonly used copper (thermal conductivity of about 400 W / m·K), and the cost is lower than that of copper. Moreover, the graphite material is relatively stable and not easy to oxidize, even if oxidation occurs, it will generate carbon dioxide and other gases. The metal is easy to oxidize when exposed to the atmosphere, and the oxidation layer has lower electrical conductivity and thermal conductivity than the metal.

[0052] As can be seen, in the case of using graphite particles to make the conductive heat dissipation adhesive layer 220, better electrical conductivity and heat dissipation effect than metal particles can be obtained, and the cost is also lower.

[0053] In the embodiments of the present application, in the direction perpendicular to the back surface S2 of the display panel 200, the thickness of the buffer layer 210 is greater than the thickness of the conductive heat dissipation adhesive layer 220.

[0054] In some implementable manners, the thickness of the buffer layer 210 can range from 0.4 mm to 0.6 mm, for example, the buffer layer 210 can include a foam layer. In the embodiments of the present application, unlike the foam layer 20 in the existing electronic device 00, the thickness of the buffer layer 210 in the embodiments of the present application is relatively thicker, and the elastic modulus is smaller (the texture is softer). The thickness of the foam layer 20 of the general electronic device 00 ranges from 0.2 mm to 0.3 mm, such as 0.28 mm. In the embodiments of the present application, when the display module is installed to the frame 100, the buffer layer 210 is in a compressed state, and the compression amount can be more than 50%, which can achieve a larger buffer range.

[0055] Exemplarily, as shown in Figure 1 The existing foam layer 20 is extruded by 0.02 mm when the display module is installed to the frame 10, which generates a unit force on the display panel 30, denoted as 1A; if an external force occurs (such as deformation of the frame causing extrusion), it is extruded by 0.04 (0.02+0.02) mm, which generates a 2A force on the display panel 30.

[0056] As shown in Figure 3As shown, the buffer layer 210 of the present application is compressed by 0.2 mm when the display module is installed in the frame 100, and exerts a force of 1A on the display panel 300. If an external force is applied, the buffer layer 210 is compressed by 0.22 (0.2+0.02) mm, and exerts a force of 1.1A on the display panel 300.

[0057] It can be seen that the buffer layer 210 with greater thickness and smaller elastic modulus can achieve better buffering and protection effect. It should be noted that the above compression amount and force values are only illustrative and do not represent the actual situation of the electronic device 000 of the present application.

[0058] Please refer to Figure 4 , Figure 4 The structure of the elastic film layer of the electronic device provided in the present application is shown in the figure. In the present application, the electronic device 000 can further include an elastic film layer 230. The elastic film layer 230 is located between the buffer layer 210 and the conductive heat dissipation adhesive layer 220, and one side of the elastic film layer 230 is connected with the buffer layer 210, and the other side is bonded with the conductive heat dissipation adhesive layer 220. The elastic modulus of the elastic film layer 230 is greater than that of the buffer layer 210.

[0059] When the back surface S2 of the display panel 300 is compressed, the elastic film layer 230 can be compressed together with the buffer layer 210 and elastically deformed, and can return to the original state when the external force disappears. The conductive heat dissipation adhesive layer 220 can be composed of high-concentration graphite particles / powder and viscoelastic conductive adhesive. When the buffer layer 210 is deformed under stress, the conductive heat dissipation adhesive layer 220 locally stretches together with the elastic film layer 230, but does not break. After the stress on the buffer layer 210 disappears, the conductive heat dissipation adhesive layer 220 can also gradually recover under the action of the elastic film layer 230.

[0060] In some possible implementations, the thickness of the elastic film layer 230 in the direction perpendicular to the back surface S2 of the display panel 300 is less than the thickness of the buffer layer 210. The elastic film layer 230 achieves the above technical effects without relying on the thickness of the elastic film layer 230, but relies on the high elasticity of the elastic film layer 230. Therefore, the thickness of the elastic film layer 230 can be as thin as possible, for example, 1 / 10-1 / 5 of the thickness of the buffer layer 210.

[0061] In the production process of the existing electronic device 00, the buffer protection structure is generally used as an independent material, which can include a foam layer, a foam layer + copper foil, and such independent materials are usually made by die cutting process.

[0062] In the embodiment of the present application, the buffer layer 210, the elastic film layer 230 and the conductive heat dissipation adhesive layer 220 can be collectively defined as the buffer protection structure 200, that is, the buffer protection structure 200 of the embodiment of the present application includes the buffer layer 210, the elastic film layer 230 and the conductive heat dissipation adhesive layer 220. Please refer to Figure 5 , Figure 5 is a structural schematic diagram of a buffer protection structure provided in the embodiment of the present application.

[0063] In some possible implementation manners, the side of the buffer layer 210 away from the conductive heat dissipation adhesive layer 220 is bonded with a bonding adhesive layer 250, and a release film 260 is covered on the surface of the bonding adhesive layer 250, wherein the bonding force between the release film 260 and the bonding adhesive layer 250 is less than the bonding force between the bonding adhesive layer and the buffer layer 210. The buffer layer 210 can be bonded to the back surface S2 of the display panel 300 through the bonding adhesive layer 250.

[0064] The side of the conductive heat dissipation adhesive layer 220 away from the buffer layer 210 can be bonded with a protective film 240, and the bonding force between the protective film 240 and the conductive heat dissipation adhesive layer 220 is less than the bonding force between the conductive heat dissipation adhesive layer 220 and the buffer layer 210 or the bonding force between the conductive heat dissipation adhesive layer 220 and the elastic film layer 230 (if any).

[0065] The control of the bonding force of the structural layer can ensure that the release film 260 and the protective film 240 are removed smoothly and the bonding adhesive layer 250 and the conductive heat dissipation adhesive layer 220 are not damaged.

[0066] At this time, the buffer protection structure 200 with the release film 260 and the protective film 240 can be used as an independent material. After removing the release film 260, the buffer protection structure 200 is bonded to the back surface S2 of the display panel 300 through the bonding adhesive layer 250, and after removing the protective film 240, the buffer protection structure 200 is bonded to the frame 100 through the conductive heat dissipation adhesive layer 220.

[0067] Please refer to Figure 6 and Figure 7 , Figure 6 is a top view of a frame of an electronic device provided in the embodiment of the present application, Figure 7 is a structural schematic diagram of a conductive adhesive block of an electronic device provided in the embodiment of the present application. In the embodiment of the present application, the frame 100 can include a metal frame and an oxidation layer attached to the surface of the metal frame; the area of the oxidation layer covered by the conductive heat dissipation adhesive layer 220 can have at least one hollow area 101, and the conductive heat dissipation adhesive layer 220 is electrically connected to the metal frame through the at least one hollow area 101.

[0068] For example, electronic devices such as mobile phones need to be set up a radio frequency antenna, and the existing mobile phones mostly use a metal frame as an antenna for communication. In the production process of the electronic device 000, the surface of the metal frame 100 will generally react with the atmosphere, forming an oxide film on the surface, which will affect the conductivity between the conductive heat dissipation adhesive layer 220 and the metal frame, affecting the grounding effect. Therefore, in the embodiment of the present application, the oxide layer on the surface of the frame 100 is treated to form a hollow area 101, and the metal frame and the conductive heat dissipation adhesive layer 220 ensure good conductivity between them. Among them, the frame 100 can be treated by laser, or it can be polished with a polishing tool, or the oxide film can be removed by chemical reagents.

[0069] In some possible implementations, the electronic device 000 can further include at least one conductive adhesive block 500, the at least one conductive adhesive block 500 corresponding to the at least one hollow area 101 one-to-one; one side of each conductive adhesive block 500 is electrically connected to the metal frame in the corresponding hollow area 101, and the other side is electrically connected to the conductive heat dissipation adhesive layer 220; wherein the resistivity of the conductive adhesive block 500 is less than or equal to the resistivity of the conductive heat dissipation adhesive layer 220.

[0070] The conductive adhesive block 500 with smaller resistivity can enhance the electrical connection between the metal frame and the conductive heat dissipation adhesive layer 220, and ensure the grounding performance between the metal frame and the conductive heat dissipation adhesive layer 220.

[0071] Please refer to Figure 8 , Figure 8 The structure schematic diagram of the frame of the electronic device provided in the embodiment of the present application. In the embodiment of the present application, the frame 100 can include a bottom plate 110 and a side plate 120 fixedly connected to the outer edge of the bottom plate 110; the side of the conductive heat dissipation adhesive layer 220 away from the buffer layer 210 is bonded to the bottom plate 110.

[0072] The part of the bottom plate 110 bonded to the conductive heat dissipation adhesive layer 220 can include a first bottom plate part 102 and a second bottom plate part 103, the first bottom plate part 102 being closer to the side plate 120 than the second bottom plate part 103.

[0073] Among them, the distance between the first bottom plate part 102 and the back surface S2 of the display panel 300 is less than the distance between the second bottom plate part 103 and the back surface S2 of the display panel 300.

[0074] After the display panel 300 is assembled into the frame 100, the buffer layer 210 has a certain interference amount with the frame 100. The interference amount around the display panel 300 is slightly larger, about 0.05-0.1 mm, and the interference amount in the inside is smaller, about 0.01-0.04 mm. The larger interference amount around the display panel 300 is located in the edge area of the display panel 300, which can be used to reduce the risk of screen breakage. For example, the height difference between the first bottom plate 102 and the second bottom plate 103 can be 0.01-0.09 mm.

[0075] As shown in FIG. 1, the side plate 120 can have a stepped portion 121 near the side of the display panel 300. The stepped portion 121 can be used to mount a protective cover plate 400. An adhesive or other structure can be provided between the stepped portion 121 and the protective cover plate 400. In the case of a mobile phone or tablet computer, the protective cover plate 400 can be a transparent glass cover plate or a plastic cover plate. In addition, an adhesive layer, such as a transparent adhesive layer, can be provided between the display panel 300 and the protective cover plate 400. Figure 3 Figure 8 As shown in FIG. 1, the side plate 120 can have a stepped portion 121 near the side of the display panel 300. The stepped portion 121 can be used to mount a protective cover plate 400. An adhesive or other structure can be provided between the stepped portion 121 and the protective cover plate 400. In the case of a mobile phone or tablet computer, the protective cover plate 400 can be a transparent glass cover plate or a plastic cover plate. In addition, an adhesive layer, such as a transparent adhesive layer, can be provided between the display panel 300 and the protective cover plate 400.

[0076] In summary, by providing a buffer layer and a conductive heat dissipation adhesive layer between the display panel and the frame, the buffer layer can provide a buffering effect for the display panel, and the conductive heat dissipation adhesive layer can be bonded on one side of the buffer layer. On the one hand, the conductive heat dissipation adhesive layer can achieve heat dissipation, so that a graphite sheet does not need to be provided between the buffer layer and the frame. On the other hand, the conductive heat dissipation adhesive layer can achieve electrical conduction, and can be electrically connected to the frame after being bonded to the frame to form a grounding environment, so that a copper foil does not need to be provided between the buffer layer and the frame. In this way, the electronic device does not need to be specially designed for the connection of the copper foil and the frame and the connection of the graphite sheet and the frame, so that the overall structure of the electronic device is simple and the cost is reduced.

[0077] The above description is only optional embodiments of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.​

Claims

1. An electronic device, comprising: The electronic device (000) comprises a display panel (300), a buffer layer (210), a conductive heat-dissipation adhesive layer (220) and a frame (100). The display panel (300) has a display surface and a back surface opposite to the display surface. The buffer layer (210) is connected to the back surface of the display panel (300). The conductive heat-dissipation adhesive layer (220) is bonded to a side of the buffer layer (210) away from the display panel (300). The side of the conductive heat-dissipation adhesive layer (220) away from the display panel (300) is bonded to the frame (100). The conductive heat-dissipation adhesive layer (220) comprises conductive adhesive and heat-conducting particles mixed in the conductive adhesive.

2. The electronic device of claim 1, wherein, The heat-conducting particles comprise at least one of graphite particles and metal particles.

3. The electronic device of claim 2, wherein, In a direction perpendicular to the back surface, the thickness of the buffer layer (210) is greater than the thickness of the conductive heat-dissipation adhesive layer (220).

4. The electronic device of claim 1, wherein, The electronic device (000) further comprises an elastic film layer (230); the elastic film layer (230) is located between the buffer layer (210) and the conductive heat-dissipation adhesive layer (220), and one side of the elastic film layer (230) is connected to the buffer layer (210) and the other side is bonded to the conductive heat-dissipation adhesive layer (220).

5. The electronic device of any of claims 1-4, wherein, The elastic modulus of the elastic film layer (230) is greater than the elastic modulus of the buffer layer (210). In a direction perpendicular to the back surface, the thickness of the elastic film layer (230) is less than the thickness of the buffer layer (210).

6. The electronic device of claim 5, wherein, The frame (100) comprises a metal frame and an oxide layer attached to the surface of the metal frame; the area of the oxide layer covered by the conductive heat-dissipation adhesive layer (220) has at least one hollow area (101), and the conductive heat-dissipation adhesive layer (220) is electrically connected to the metal frame through the at least one hollow area (101).

7. The electronic device of any of claims 1-4, wherein, The electronic device (000) further comprises at least one conductive adhesive block (500) corresponding to the at least one hollow area (101); one side of each conductive adhesive block (500) is electrically connected to the metal frame in the corresponding hollow area (101), and the other side is electrically connected to the conductive heat-dissipation adhesive layer (220).

8. The electronic device of claim 7, wherein, The resistivity of the conductive adhesive block (500) is less than or equal to the resistivity of the conductive heat-dissipation adhesive layer (220). The frame (100) comprises a bottom plate (110) and a side plate (120) fixedly connected to the outer edge of the bottom plate (110); the side of the conductive heat-dissipation adhesive layer (220) away from the buffer layer (210) is bonded to the bottom plate (110).

9. The electronic device of any of claims 1-4, wherein, The part of the bottom plate (110) bonded to the conductive heat-dissipation adhesive layer (220) comprises a first bottom plate part (102) and a second bottom plate part (103), and the first bottom plate part (102) is closer to the side plate (120) than the second bottom plate part (103).

10. The electronic device of claim 9, wherein, ​ The distance between the first bottom plate part (102) and the back of the display panel (300) is less than the distance between the second bottom plate part (103) and the back of the display panel (300).

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