Positioning device for wafer laser polishing

Abstract

The utility model relates to a positioning device for wafer laser polishing. The positioning device comprises a table top and a disc body fixedly installed in the table top. The tray body is used for placing wafers, three groove bodies are formed in the tray body, the three groove bodies are uniformly distributed in the tray body, clamping plates are slidably mounted in the three groove bodies, the three clamping plates are used for fixing the wafers of different specifications, and a synchronous part used for synchronously driving the three clamping plates is mounted at the bottom of the tray body. A wafer is placed on the adsorption seat at the top of the disc body, firstly, the motor is started to drive the rotating seat to rotate, the rotating seat rotates to drive the three first rods to rotate so as to drive the three second rods to rotate, and the three second rods drive the three clamping plates to get close to one another to clamp and fix the wafer in three directions, so that compared with bidirectional clamping, fixing is firmer, and the clamping efficiency is improved. After the wafer is fixed by the three clamping plates, the centrifugal fan is started to extract air in the air pipe, the wafer is adsorbed on the adsorption seat, and secondary adsorption fixation is provided.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing equipment technical field, concretely is a kind of positioning device for wafer laser polishing. BACKGROUND

[0002] Wafer laser polishing is an important technology in semiconductor device manufacturing, which uses high-energy laser beams to precisely polish the wafer surface to achieve the required geometric parameters and surface quality. The principle of wafer laser polishing is mainly based on the interaction between laser and material. When high-energy laser beams are focused on the wafer surface, laser energy is absorbed by the material and converted into heat energy, causing local melting, evaporation or chemical changes of the material. By precisely controlling the power, focusing position and moving speed of the laser beam, precise polishing of the wafer surface can be achieved. In the prior art, the wafer is fixed in two directions during polishing, which lacks multi-directional fixation, resulting in insufficiently firm installation of the wafer and lack of multi-way fixation of the wafer.

[0003] For example, the authorized patent document with application number CN202322903129.0 discloses a wafer production device, especially a wafer positioning device, which includes a clamping jaw cylinder and further includes: positioning blocks symmetrically fixed on the clamping jaws of the clamping jaw cylinder, the positioning blocks are provided with clamping arc surfaces; a plurality of elastic blocks are fixed on the clamping arc surfaces, and each clamping arc surface has no less than two elastic blocks, the elastic blocks are oppositely arranged with the wafer; and a tray is arranged on the clamping jaw cylinder between the two positioning blocks for placing the wafer. The wafer positioning device provided by the utility model keeps the positioning blocks away from the wafer when the wafer is put in or taken out, effectively preventing the wafer from colliding with the positioning blocks, and positions the wafer through the elastic blocks when positioning the wafer, avoiding the wafer from being damaged by clamping.

[0004] The above-mentioned patent has the problem that the wafer is fixed in two directions during polishing, which lacks multi-directional fixation, resulting in insufficiently firm installation of the wafer. Therefore, we need to provide a positioning device for wafer laser polishing. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a positioning device for wafer laser polishing, which places the wafer on the adsorption seat on the top of the disc body. First, start the motor to drive the rotating seat to rotate, which drives the three first rods to rotate, thereby driving the three second rods to rotate. The three second rods drive the three clamping plates to approach each other to clamp and fix the wafer in three directions. Compared with two-way clamping, the fixation is more firm. After the wafer is fixed by the three clamping plates, start the centrifugal fan to extract the air in the air pipe, and adsorb the wafer on the adsorption seat to provide secondary adsorption fixation, solving the problem raised in the above background technology.

[0006] In order to achieve the above object, the utility model provides the following technical scheme: A positioning device for wafer laser polishing, comprising

[0007] The table top and the disc body fixedly installed in the table top;

[0008] The disc body is used for placing wafers, three groove bodies are arranged in the disc body, three clamping plates are slidably installed in the groove bodies, the three clamping plates are used for fixing wafers of different specifications, and a synchronous member for synchronously driving the three clamping plates is installed at the bottom of the disc body.

[0009] The synchronous member comprises a motor, the bottom of the table top is provided with a bottom plate, the motor is embedded in the bottom plate, the bottom plate is fixedly connected with the table top through four columns, the output end of the motor is provided with a rotating seat, three first rods are fixedly installed on the surface of the rotating seat, second rods are hingedly connected to the ends of the three first rods away from the rotating seat, and the three second rods are hingedly connected with the three clamping plates respectively.

[0010] Preferably, guiding plates are fixedly installed in the three groove bodies, and the surfaces of the guiding plates are slidably installed with the clamping plates.

[0011] Preferably, the side of the three clamping plates adjacent to each other is provided with an inclined surface, and a rubber layer pad is fixedly installed on the inclined surface of the surface of the three clamping plates.

[0012] Preferably, the utility model also comprises a suction accessory for secondary fixing of the wafer, the suction accessory comprises a cylinder embedded in the axis of the disc body, a gas pipe is communicated with one side of the cylinder, a centrifugal fan is communicated with one end of the gas pipe, a supporting plate is fixedly installed on the surface of the centrifugal fan, and the supporting plate is fixedly installed on one side of the table top.

[0013] Preferably, a suction seat is communicated with the top of the cylinder, and the suction seat is a rubber seat.

[0014] Preferably, the utility model also comprises a purification member, the purification member is used for adsorbing the gas generated in wafer laser polishing, the purification member comprises a fan device arranged on one side of the table top, an installation cylinder is communicated with one side of the fan device, a mounting cover with a filter core is screw-mounted on the back of the installation cylinder, and a protective net part is arranged on the surface of the mounting cover.

[0015] Preferably, a mounting frame is fixedly installed on one side of the table top, a threaded rod is rotatably installed in the mounting frame, a driving seat is screw-mounted on the surface of the threaded rod, the top of the driving seat is fixedly installed with the bottom of the installation cylinder, and a driving motor for rotating the threaded rod is embedded in the mounting frame.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] The utility model discloses the wafer is placed on the adsorption seat on the top of disc body, first start motor drive rotating seat rotation, rotating seat rotation drive three first pole rotation, thereby drive three second pole rotation, three second pole drive three clamping plates to each other close to the wafer and play three -direction clamping fixed, compared with two -way clamping, fixed more firm, when the wafer is fixed by three clamping plates, start centrifugal fan and remove the air in the air pipe, and the wafer is adsorbed on the adsorption seat, and provides secondary adsorption fixed. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the structure perspective diagram of the utility model;

[0019] Figure 2 It is the three -dimensional view of the utility model's synchronous piece;

[0020] Figure 3 It is the three -dimensional view of the utility model's suction accessory;

[0021] Figure 4 It is the three -dimensional view of the utility model's purification spare.

[0022] In the drawing: 1, mesa;2, disc body;3, groove body;4, clamping plate;5, synchronous piece;51, motor;52, rotating seat;53, first pole;54, second pole;6, bottom plate;7, guide plate;8, glue layer pad;9, suction accessory;91, cylinder;92, air pipe;93, centrifugal fan;94, support plate;10, adsorption seat;11, purification spare;111, fan ware;112, installation cylinder;113, installation cover;12, mounting bracket;13, threaded rod;14, drive seat;15, drive motor. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0024] Please refer to Figures 1-4 The utility model provides a kind of technical scheme: a kind of wafer laser polishing positioning device, comprising:

[0025] Mesa 1 and disc body 2 fixedly installed in mesa 1;

[0026] The disc body 2 is used for placing wafers, three grooves 3 are arranged in the disc body 2, the three grooves 3 are uniformly distributed in the disc body 2, and clamping plates 4 are slidingly installed in the three grooves 3, the three clamping plates 4 are used for fixing wafers of different specifications, and a synchronous part 5 for synchronous driving of the three clamping plates 4 is installed at the bottom of the disc body 2;

[0027] The synchronous part 5 comprises a motor 51, the bottom of the table 1 is provided with a bottom plate 6, the motor 51 is embedded in the bottom plate 6, and the bottom plate 6 is fixedly connected with the table 1 through four columns, the output end of the motor 51 is provided with a rotating seat 52, three first rods 53 are fixedly installed on the surface of the rotating seat 52, second rods 54 are hingedly connected to the ends, away from the rotating seat 52, of the three first rods 53, and the three second rods 54 are hingedly connected with the three clamping plates 4 respectively.

[0028] The three grooves 3 are fixedly provided with guide plates 7, and the guide plates 7 are slidingly installed on the surfaces of the clamping plates 4;

[0029] In this embodiment, the wafers are placed on the adsorption seats 10 at the top of the disc body 2, the motor 51 is started to drive the rotating seat 52 to rotate, the rotating seat 52 drives the three first rods 53 to rotate, thereby driving the three second rods 54 to rotate, the three second rods 54 drive the three clamping plates 4 to move close to each other to clamp and fix the wafers in three directions, compared with two-way clamping, the fixing is more firm, when the wafers are fixed by the three clamping plates 4, the centrifugal fan 93 is started to suck the air in the air pipe 92, thereby adsorbing the wafers on the adsorption seats 10 to provide secondary adsorption and fixation;

[0030] The surface of the cylinder 91 is provided with small air permeable holes, when the centrifugal fan 93 is started, air flow can enter, thereby avoiding that the internal air of the wafers cannot circulate after the top of the wafers is adsorbed, and the small air permeable holes do not affect the adsorption of the wafers.

[0031] The side, adjacent to the three clamping plates 4, is provided with a bevel, and the surface of the bevel of the three clamping plates 4 is fixedly provided with a rubber layer pad 8;

[0032] Specifically, the side, adjacent to the three clamping plates 4, is provided with a bevel, the clamping of the wafers is more fitted, and the surface of the bevel of the three clamping plates 4 is fixedly provided with a rubber layer pad 8, thereby having a protection effect on the clamping of the wafers and improving the friction.

[0033] Further comprising an adsorption part 9 for secondary fixation of the wafers, the adsorption part 9 comprises a cylinder 91 embedded in the axis of the disc body 2, the cylinder 91 is communicated with an air pipe 92 at one side, one end of the air pipe 92 is communicated with a centrifugal fan 93, the surface of the centrifugal fan 93 is fixedly provided with a supporting plate 94, and the supporting plate 94 is fixedly installed on one side of the table 1;

[0034] Further, the centrifugal fan 93 is started to suck the air in the air pipe 92, and the wafer is adsorbed on the adsorption seat 10, thereby providing secondary adsorption fixation.

[0035] The top of the cylinder 91 is communicated with the adsorption seat 10, and the adsorption seat 10 is arranged as a rubber seat.

[0036] It should be noted that the top of the cylinder 91 is communicated with the adsorption seat 10, and the top of the adsorption seat 10 is in close contact with the bottom of the wafer, and the adsorption seat 10 is arranged as a rubber seat, thereby being more closely attached to the wafer.

[0037] The purifying member 11 is further included, and the purifying member 11 is used for adsorbing the gas generated by laser polishing of the wafer, and the purifying member 11 includes the fan device 111 arranged on one side of the table top 1, one side of the fan device 111 is communicated with the mounting cylinder 112, the back surface of the mounting cylinder 112 is threadedly mounted with the mounting cover 113 provided with a filter core, and the surface of the mounting cover 113 is provided with a protective net part.

[0038] It should be noted that the smoke generated by the wafer during laser polishing floats around, and the smoke is adsorbed into the mounting cover 113 by starting the fan device 111, and the filter core is installed in the mounting cover 113, the filter core is an activated carbon filter core, the smoke is filtered and treated, thereby purifying the surrounding air, and the mounting cover 113 is threadedly mounted with the mounting cylinder 112, thereby facilitating dismounting of the mounting cover 113.

[0039] One side of the table top 1 is fixedly mounted with the mounting frame 12, the inside of the mounting frame 12 is rotatably mounted with the threaded rod 13, the surface of the threaded rod 13 is threadedly mounted with the driving seat 14, the top of the driving seat 14 is fixedly mounted with the bottom of the mounting cylinder 112, and the inside of the mounting frame 12 is embedded with the driving motor 15 for rotation of the threaded rod 13.

[0040] The driving motor 15 is started to drive the threaded rod 13 to rotate, thereby controlling the driving seat 14 to move horizontally in the mounting frame 12, and the driving seat 14 is moved, thereby improving the purification range.

[0041] The wafer is placed on the adsorption seat 10 on the top of the disc body 2, the motor 51 is first started to drive the rotating seat 52 to rotate, the rotating seat 52 drives the three first rods 53 to rotate, thereby driving the three second rods 54 to rotate, the three second rods 54 respectively drive the three clamping plates 4 to approach each other to clamp and fix the wafer in three directions, compared with two-way clamping, the fixation is more firm, and after the wafer is fixed by the three clamping plates 4, the centrifugal fan 93 is started to suck the air in the air pipe 92, and the wafer is adsorbed on the adsorption seat 10, thereby providing secondary adsorption fixation.

[0042] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for wafer laser polishing, characterized by, Include: The table (1) and the disc (2) fixedly installed in the table (1); The disc (2) is used for placing wafers, three grooves (3) are formed in the disc (2), the three grooves (3) are uniformly distributed in the disc (2), and the three grooves (3) are slidably connected with the clamping plates (4), the three clamping plates (4) are used for fixing different specifications of wafers, and the bottom of the disc (2) is provided with a synchronous part (5) for synchronous driving of the three clamping plates (4); Wherein, the synchronous part (5) includes a motor (51), the bottom of the table (1) is provided with a bottom plate (6), the motor (51) is embedded in the inside of the bottom plate (6), and the bottom plate (6) and the table (1) are fixedly connected through four columns, the output end of the motor (51) is provided with a rotating seat (52), the surface of the rotating seat (52) is fixedly provided with three first rods (53), the distal end of the three first rods (53) is hingedly connected with a second rod (54), and the three second rods (54) are respectively hingedly connected with the three clamping plates (4).

2. The positioning device for wafer laser polishing according to claim 1, wherein: Three grooves (3) are fixedly installed in the inside of the groove, the surface of the guide plate (7) is slidably connected with the inside of the clamping plate (4).

3. The positioning device for wafer laser polishing according to claim 2, wherein: The side of the three clamping plates (4) is provided with an inclined surface, and the surface of the inclined surface of the three clamping plates (4) is fixedly provided with a rubber layer pad (8).

4. The positioning device for wafer laser polishing of claim 1, wherein: It also includes a suction accessory (9) for secondary fixation of wafers, the suction accessory (9) includes a cylinder (91) embedded in the axis of the disc (2), one side of the cylinder (91) is communicated with an air pipe (92), one end of the air pipe (92) is communicated with a centrifugal fan (93), the surface of the centrifugal fan (93) is fixedly provided with a supporting plate (94), and the supporting plate (94) is fixedly installed on one side of the table (1).

5. The positioning device for wafer laser polishing according to claim 4, wherein: The top of the cylinder (91) is communicated with a suction seat (10), and the suction seat (10) is provided as a rubber seat.

6. The positioning device for wafer laser polishing of claim 1, wherein: It also includes a purification part (11), which is used for adsorbing the gas generated by laser polishing of wafers, the purification part (11) includes a fan device (111) arranged on one side of the table (1), one side of the fan device (111) is communicated with a mounting cylinder (112), the back of the mounting cylinder (112) is screwedly provided with a mounting cover (113) with a filter core, and the surface of the mounting cover (113) is provided with a protective net part.

7. The positioning device for wafer laser polishing of claim 6, wherein: One side of the table (1) is fixedly provided with a mounting rack (12), a threaded rod (13) is rotatably installed in the inside of the mounting rack (12), the surface of the threaded rod (13) is screwedly provided with a driving seat (14), the top of the driving seat (14) is fixedly connected with the bottom of the mounting cylinder (112), and the inside of the mounting rack (12) is embedded with a driving motor (15) for rotation of the threaded rod (13).

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