Optical full-automatic detection equipment for flatness of sapphire wafer
By designing a fully automated optical inspection device for the flatness of sapphire wafers, and using a combination of clamping components and auxiliary components, the device enables zoned inspection of wafers, solving the problem of insufficient inspection accuracy in existing technologies and improving the comprehensiveness and efficiency of inspection.
Patent Information
- Application Number
- CN202520379018.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-03-05
AI Technical Summary
Existing methods for detecting the flatness of sapphire wafers have limitations. While the center position is accurately detected, the peripheral areas are not, resulting in insufficient overall detection accuracy.
A fully automated optical inspection device for the flatness of sapphire wafers was designed. It employs clamping components and auxiliary components. The first gear and the first rack are meshed together to drive the inspection stage to move, realizing the inspection of the wafer in sections. The use of multiple clamping blocks improves the inspection accuracy and efficiency.
It enables comprehensive testing of wafers, improves testing accuracy and efficiency, and ensures the comprehensiveness and accuracy of testing.
Smart Images
Figure CN223741526U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of flatness detection technology, especially relates to a sapphire wafer flatness optical full-automatic detection equipment. BACKGROUND
[0002] Sapphire wafer needs to pass repeated mechanical and chemical processing in the production process, and needs to detect the flatness of wafer after processing, and the wafer meeting the flatness is packaged, and the wafer not meeting the flatness needs to be polished, and in the prior art, the wafer is placed below the equipment, the center position of the wafer is accurately detected in the detection, but the wafer does not move, and deviation exists in the detection of the periphery of the center, so that the flatness detection of the whole wafer exists error. UTILITY MODEL CONTENT
[0003] Based on the above background, the utility model aims at providing a sapphire wafer flatness optical full-automatic detection equipment.
[0004] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0005] A sapphire wafer flatness optical full-automatic detection equipment, including the workbench, one side of the workbench is equipped with display screen and control platform;
[0006] The workbench top is equipped with support, the support is equipped with detector, and the detector, display screen and control platform are electrically connected;
[0007] The detection table is slidably arranged on the workbench;
[0008] The first recess is formed in the workbench, the guiding frame is arranged in the first recess, the guiding frame is U-shaped and is provided with a first gear rack on the inner side, the first gear is rotatably arranged on the bottom of the detection table, and the first gear is meshed with the first gear rack;
[0009] The detection table is provided with a clamping assembly for clamping and fixing the side surface of the wafer;
[0010] The detection table is provided with an auxiliary assembly on both sides for assisting the clamping assembly to clamp and center the wafer.
[0011] Through the above technical scheme, after the clamping assembly clamps the wafer, the first gear is controlled to rotate and move around the inner side of the guiding frame under the meshing effect, so as to drive the detection table to move, and in the process of moving the detection table, the flatness of one side of the wafer can be detected first, and then the other side is detected, so that the detection of the wafer is more comprehensive, and the overall detection accuracy is improved.
[0012] Further, the guiding frame is provided with a guiding groove on the top;
[0013] The detection table is provided with a guide column which is slidingly arranged in a guide groove.
[0014] Through the above technical scheme, the guide groove plays a guiding and limiting role on the guide column, so as to ensure that the first gear can be engaged with the first rack through rotation along the inner wall of the guide frame, thereby driving the detection table to move.
[0015] Further, a motor groove is formed in the detection table, and a motor is fixedly arranged in the motor groove. An output end of the motor is connected with a rotating shaft, and the bottom of the rotating shaft is fixedly connected with the first gear.
[0016] The motor is electrically connected with the control table.
[0017] Through the above technical scheme, the motor drives the first gear to rotate, thereby controlling the U-shaped movement of the top of the detection table.
[0018] Further, second grooves are formed on both sides of the detection table.
[0019] The clamping assembly comprises first sliders, two first sliders are symmetrically slidingly arranged at both ends of the top of the detection table, the first slider is U-shaped and slidingly arranged at both ends of the second groove;
[0020] Uniformly arranged clamping blocks are arranged on the opposite side of the two first sliders, and springs are connected between the clamping blocks and the first sliders.
[0021] The side of the clamping block away from the first slider is arc-shaped.
[0022] Through the above technical scheme, by sliding the first slider, the clamping blocks are driven to move, the side of the wafer can be clamped, and a plurality of clamping blocks are arranged, a plurality of wafers can be clamped, and a plurality of wafers can be detected at the same time, thereby improving the detection efficiency.
[0023] Further, a telescopic column is arranged in the spring, and the two ends of the telescopic column are respectively connected with the first slider and the clamping block.
[0024] Through the above technical scheme, the clamping stability of the clamping block is improved.
[0025] Further, the auxiliary assembly comprises a second gear and a second rack, the second gear is rotatably arranged in the second groove, and two second racks are arranged on the upper and lower sides of the second gear and are in meshing connection with the second gear.
[0026] The two second racks are slidingly arranged in the second groove, and the two second racks are respectively connected with the first sliders at both ends of the second groove.
[0027] Through the technical scheme, one of the first sliders is slid, the second gear is driven to rotate through the second rack connected with the first slider, another second rack is driven to move, and another first slider is driven to move, so that the two first sliders are synchronously moved to center and clamp the wafer.
[0028] Further, third grooves are formed on the upper and lower sides in the second groove.
[0029] Limiting blocks are arranged on the opposite sides of the two second racks, and the limiting blocks are slidably arranged in the corresponding third grooves.
[0030] Through the technical scheme, the stability of the movement of the second rack is improved.
[0031] Further, a threaded hole is formed on one side of the detection table, and a screw rod is threadedly connected in the threaded hole.
[0032] A push rod is arranged on the side surface of one of the first sliders, the push rod is L-shaped, one end of the push rod is sleeved with one end of the screw rod, and the push rod is rotatably connected with the screw rod.
[0033] Through the technical scheme, the screw rod is rotated to enter the threaded hole along the axial direction, so that the push rod is driven to move along the axial direction, the first slider connected with the push rod is driven to move, and the other first slider is synchronously driven to move through the auxiliary assembly.
[0034] Further, a fixing plate is arranged on the screw rod, and the fixing plate abuts against the side surface of the push rod to prevent the push rod from sliding on the screw rod.
[0035] The utility model has the following beneficial effects:
[0036] 1. After the clamping assembly clamps the wafer, the first gear is controlled to rotate, and moves around the inner side of the guide frame under the meshing effect, so as to drive the detection table to move. During the movement of the detection table, the flatness of one side of the wafer can be detected first, and then the other side is detected, so that the detection of the wafer is more comprehensive, and the overall detection accuracy is improved.
[0037] 2. A plurality of clamping blocks are arranged on the first slider, so that a plurality of wafers can be clamped and detected at the same time, and the detection efficiency is improved. DRAWINGS
[0038] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings from the structures shown in the drawings without creating creative labor.
[0039] Figure 1 It is a three-dimensional structure schematic view of the utility model;
[0040] Figure 2 It is a three-dimensional structure schematic view of the utility model's workbench;
[0041] Figure 3 It is a three-dimensional structure schematic view of the utility model's guide frame;
[0042] Figure 4 It is a three-dimensional structure schematic view of the utility model's detection table's partial section;
[0043] Figure 5 It is a three-dimensional structure schematic view of the utility model's detection table;
[0044] Figure 6 It is a front structure schematic view of the utility model's auxiliary assembly and clamping assembly.
[0045] Wherein: 1. workbench;11. display screen;12. control console;13. support;14. detector;15. first recess;16. second recess;17. third recess;18. screw;19. fixed sheet;
[0046] 2. guide frame;21. first rack;22. first gear;23. guide groove;
[0047] 3. detection table;31. guide column;32. motor slot;33. motor;34. rotating shaft;
[0048] 41. first slider;42. clamping block;43. spring;44. telescopic column;45. push rod;
[0049] 51. second gear;52. second rack;53. limit block. DETAILED DESCRIPTION
[0050] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0051] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the utility model are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directionality indications also change accordingly.
[0052] In addition, the description such as "first", "second" in the utility model is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one feature. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not in the protection scope required by the utility model.
[0053] As shown in Figures 1-6 A sapphire wafer flatness optical full-automatic detection equipment, including workbench 1, one side of workbench 1 is equipped with display screen 11 and control cabinet 12;Workbench 1 top is equipped with support 13, support 13 is equipped with detector 14, and detector 14, display screen 11 and control cabinet 12 are electrically connected;Workbench 1 is equipped with detection table 3 sliding;Workbench 1 is equipped with first recess 15, first recess 15 is equipped with guide frame 2, guide frame 2 is U-shaped and is equipped with first rack 21 in the inside, detection table 3 bottom is rotatably equipped with first gear 22, first gear 22 is engagedly connected with first rack 21;Guide frame 2 top is equipped with guide groove 23;Detection table 3 bottom is equipped with guide column 31, guide column 31 is equipped in guide groove 23 sliding;Detection table 3 is equipped with motor groove 32, motor groove 32 is fixedly equipped with motor 33, the output end of motor 33 is connected with rotating shaft 34, the bottom end of rotating shaft 34 is fixedly connected with first gear 22;Motor 33 and control cabinet 12 are electrically connected;Detection table 3 is equipped with clamping assembly, and the side surface of wafer is clamped and fixed;Detection table 3 both sides are equipped with auxiliary assembly, for assisting clamping assembly to center clamping.
[0054] Wafer is placed on detection table 3, clamping assembly clamps the side surface of wafer, control cabinet 12 controls motor 33 to rotate, to drive first gear 22 to rotate, through the meshing effect of first gear 22 and first rack 21, first gear 22 rotates while moving along first rack 21 under the guidance of guide column 31, to drive detection table 3 to move, one half of wafer passes through the below of detector 14, to detect the flatness of one half of wafer, when first gear 22 moves to the first rack 21 of the other end of guide frame 2, the other half of wafer passes through the below of detector 14, to complete the surface flatness detection of wafer, through zoned detection, detector 14 can better detect wafer surface coverage, improve detection accuracy.
[0055] Specifically, the two sides of the detection table 3 are provided with second grooves 16; the clamping assembly comprises first sliders 41, the two first sliders 41 are symmetrically and slidingly arranged at the two ends of the top of the detection table 3, the first slider 41 is U-shaped and slidingly arranged at the two ends of the second groove 16; the opposite sides of the two first sliders 41 are uniformly and arranged with clamping blocks 42, the clamping block 42 is connected with the first slider 41 through a spring 43; the side of the clamping block 42 away from the first slider 41 is arc-shaped; the inner side of the spring 43 is provided with a telescopic column 44, the two ends of the telescopic column 44 are connected with the first slider 41 and the clamping block 42 respectively, the arc-shaped surface of the clamping block 42 better fits the side surface of the wafer, and the plurality of clamping blocks 42 can clamp a plurality of wafers, and the plurality of wafers are detected at the same time, so that the detection efficiency is improved.
[0056] Specifically, the auxiliary assembly comprises a second gear 51 and a second rack 52, the second gear 51 is rotationally arranged in the second groove 16, and the two second racks 52 are arranged on the upper and lower sides of the second gear 51 and are in meshing connection with the second gear 51; the two second racks 52 are slidingly arranged in the second groove 16, and the two second racks 52 are correspondingly connected with the first sliders 41 at the two ends of the second groove 16; the upper and lower sides of the second groove 16 are both provided with third grooves 17; the opposite sides of the two second racks 52 are provided with limiting blocks 53, the limiting blocks 53 are slidingly arranged in the corresponding third grooves 17, one side of the detection table 3 is provided with a threaded hole, and a screw rod 18 is threadedly connected in the threaded hole; the side surface of one of the first sliders 41 is provided with a push rod 45, the push rod 45 is L-shaped and one end of the push rod 45 is sleeved on one end of the screw rod 18, the push rod 45 is rotationally connected with the screw rod 18, the screw rod 18 is provided with a fixing piece 19, the fixing piece 19 abuts against the side surface of the push rod 45, so as to avoid the push rod 45 from sliding on the screw rod 18.
[0057] Rotating the screw rod 18 along the axial direction into the threaded hole, so as to drive the push rod 45 to move along the axial direction, push the first slider 41 connected with the push rod 45 to move, drive the second gear 51 to rotate through the second rack 52 connected therewith, so as to drive the other second rack 52 to move, drive the other first slider 41 to move, realize the synchronous movement of the two first sliders 41, and clamp the wafer.
[0058] The utility model discloses a work principle: put wafer to detection platform 3, rotate screw rod 18 along the axial direction into the thread hole, to move along the axial direction with push rod 45, promote the first slider 41 of being connected with push rod 45 and move, through the second rack 52 of being connected with it and move the second gear 51 rotation of driving, to move another second rack 52, drive another first slider 41 and move, realize two first slider 41 synchronous movement, the one side of the arc surface of both sides's clamping block 42 is from both sides to the clamping of wafer, the console 12 control motor 33 rotation, to drive the rotation of first gear 22, through the meshing effect of first gear 22 and first rack 21, first gear 22 is in autorotation, under the guidance of guide column 31, along first rack 21 and move, to drive detection platform 3 and move, and the half edge of wafer is through the below of detector 14, and the half edge of wafer is detected, when first gear 22 moves to the first rack 21 of guiding frame 2 another end, and the other half edge of wafer is through the below of detector 14, to complete the detection of wafer surface flatness, through the detection of subarea, can make detector 14 better to the detection of wafer surface coverage, improve the detection accuracy.
[0059] Of course, the above description is not a limitation of the utility model, the utility model also does not limit to the above example, the change, the modification, the addition or the replacement of the technical personnel in the utility model's essential range of the technical field should also belong to the protection range of the utility model.
Claims
1. A full-automatic optical detection device for flatness of sapphire wafer, comprising a workbench (1), one side of the workbench (1) is provided with a display screen (11) and a control console (12), characterized in that: The workbench (1) is provided with a support (13) on the top, the support (13) is provided with a detector (14), and the detector (14), a display screen (11) and a control console (12) are electrically connected; The detection table (3) is slidably arranged on the workbench (1); The workbench (1) is provided with a first groove (15), the first groove (15) is provided with a guide frame (2), the guide frame (2) is U-shaped and provided with a first rack (21) on the inner side, and the bottom of the detection table (3) is rotatably provided with a first gear (22), and the first gear (22) is in meshing connection with the first rack (21); The detection table (3) is provided with a clamping assembly for clamping and fixing the side of the wafer; The detection table (3) is provided with an auxiliary assembly on both sides for assisting the clamping assembly to clamp and center the wafer.
2. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 1, characterized in that: The top of the guide frame (2) is provided with a guide groove (23); The bottom of the detection table (3) is provided with a guide column (31), and the guide column (31) is slidably arranged in the guide groove (23).
3. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 1, characterized in that: The detection table (3) is provided with a motor groove (32), the motor groove (32) is fixedly provided with a motor (33), the output end of the motor (33) is connected with a rotating shaft (34), and the bottom of the rotating shaft (34) is fixedly connected with the first gear (22); The motor (33) is electrically connected with the control console (12).
4. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 1, characterized in that: The detection table (3) is provided with a second groove (16) on both sides; The clamping assembly comprises a first sliding block (41), two first sliding blocks (41) are symmetrically and slidably arranged at both ends of the top of the detection table (3), the first sliding block (41) is U-shaped and slidably arranged at both ends in the second groove (16); Two first sliding blocks (41) are uniformly arranged with clamping blocks (42) on the opposite sides, and springs (43) are connected between the clamping blocks (42) and the first sliding blocks (41); The side of the clamping block (42) away from the first sliding block (41) is arc-shaped.
5. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 4, characterized in that: The inner side of the spring (43) is provided with a telescopic column (44), and the two ends of the telescopic column (44) are respectively connected with the first sliding block (41) and the clamping block (42).
6. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 5, characterized in that: The auxiliary assembly comprises a second gear (51) and a second rack (52), the second gear (51) is rotatably arranged in the second groove (16), two second racks (52) are respectively arranged on the upper and lower sides of the second gear (51) and are in meshing connection with the second gear (51); Two second racks (52) are slidably arranged in the second groove (16), and two second racks (52) are respectively connected with the first sliding blocks (41) at both ends in the second groove (16).
7. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 6, characterized in that: The upper and lower sides of the second groove (16) are provided with third grooves (17); The side of the second rack (52) away from the second rack (52) is provided with a limiting block (53), and the limiting block (53) is slidably arranged in the corresponding third groove (17).
8. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 7, characterized in that: One side of the detection table (3) is provided with a threaded hole, and a screw rod (18) is threadedly connected in the threaded hole; One side of the first slider (41) is provided with a push rod (45), the push rod (45) is L-shaped and one end is sleeved on one end of the screw rod (18), and the push rod (45) is rotationally connected with the screw rod (18).
9. The optical full-automatic detecting device for flatness of sapphire wafer according to claim 8, characterized in that: The screw rod (18) is provided with a fixing sheet (19), and the fixing sheet (19) abuts against the side of the push rod (45).