Multilayer circuit board positioning structure and sensor adopting same

Abstract

The utility model discloses a multilayer circuit board positioning structure and a sensor employing the same, the multilayer circuit board positioning structure comprises a cylindrical housing, the inner wall of the cylindrical housing is provided with a plurality of step bosses, the step bosses are used for positioning and placing circuit boards, and the step bosses are used for positioning and placing the circuit boards. And the inner diameter of the step boss positioned in the cylindrical shell is gradually increased from bottom to top. The sensor adopting the multilayer circuit board positioning structure comprises a filler neck, a pressure core body, a positioning structure for mounting a circuit board, a shell and an electric connector, the pressure core body is mounted in a core body pressure sensing cavity of the filler neck, the positioning structure is fixed on the peripheral wall of the core body pressure sensing cavity, and the shell is fixed on the peripheral wall of the filler neck. An electric connector is installed at the end of the shell and connected with the circuit board through a wire. The equipment provided by the utility model has the advantages of few parts, low processing difficulty and high space utilization rate, can utilize the limited space as much as possible, and increases the layout space of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically a multi-layer circuit board positioning structure and a sensor using the same. Background Technology

[0002] Because the integrated sensors on the market have fewer functions, they only need to collect, amplify, process and transmit data from the pressure core. As a result, there are fewer components on the circuit board and the sensor products are relatively small in size.

[0003] Most current sensors have three evenly distributed through holes around the circuit board, which are then fixedly connected via threaded holes machined on a ring bracket. However, because the machining of the threaded holes requires certain axial and radial structural space, and the screw fixing also occupies part of the circuit board space, this design scheme is not very efficient in terms of circuit board space utilization. Sensor products that can meet the above simple requirements become unsustainable when faced with stringent customer requirements for size and operating conditions. For example, customer conditions such as unstable input power supply, the need for electromagnetic shielding design, high sensor accuracy requirements, and extremely small sensor mounting dimensions place higher demands on the number of components. Even with the most reasonable board layout, it is necessary to increase the circuit board space under the current conditions. The traditional ring bracket screw fixing design can only fix one circuit board. Adding ring brackets or increasing the number of circuit boards by screw posts can easily lead to poor product insulation and also require a larger axial dimension in the design.

[0004] Therefore, it is necessary to design a structure that increases the utilization rate of the internal space of the sensor and the area of ​​the circuit board. Utility Model Content

[0005] The purpose of this invention is to address the problems existing in the prior art by providing a multi-layer circuit board positioning structure that can increase the utilization rate of the internal space of the sensor and the circuit board layout area, as well as a sensor using the same.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A multi-layer circuit board positioning structure is characterized in that: the positioning structure includes a cylindrical shell, and the inner wall of the cylindrical shell is provided with a plurality of stepped protrusions, which are used to position and place circuit boards, and the inner diameter of the stepped protrusions located in the cylindrical shell gradually increases from bottom to top.

[0008] The positioning structure also includes support columns for supporting the circuit board, which are located in the middle of the cylindrical housing.

[0009] The outer wall of the support column is also provided with several stepped protrusions. The stepped protrusions on the support column correspond one-to-one with the stepped protrusions on the inner wall of the cylindrical shell to jointly support the same circuit board.

[0010] The top of the support column is provided with an external thread, which is connected to a locking nut to lock the uppermost circuit board located in the inner cavity of the positioning structure.

[0011] The bottom of the positioning structure is provided with a hollow base, so that the inner cavity of the cylindrical shell is an open cavity; and the middle part of the hollow base serves as a support for the support column.

[0012] A sensor employing a multi-layer circuit board positioning structure includes a connector, a pressure core, a positioning structure for mounting the circuit board, a housing, and an electrical connector. The pressure core is installed inside the pressure-sensing cavity of the connector, the positioning structure is fixed to the outer peripheral wall of the pressure-sensing cavity, and the housing is fixed to the outer peripheral wall of the connector. An electrical connector is installed at the end of the housing, and the electrical connector is connected to the circuit board via a wire.

[0013] The pressure core is welded into the pressure sensing cavity of the core, and a circuit board is plugged into the signal output terminal of the pressure core.

[0014] The outer wall of the core pressure-sensing cavity is provided with a support boss, and one end of the positioning structure, which is sleeved on the outside of the core pressure-sensing cavity, is welded to the support boss.

[0015] The connector is provided with a pressure inlet and a housing boss on the outer wall of the connector. One end of the housing, which is fitted outside the positioning structure, is welded to the housing boss, and the other end is welded with an electrical connector.

[0016] Insulating rubber pads are provided between the circuit boards arranged on the stepped protrusions of the positioning structure, and the insulating rubber pads are fitted onto the corresponding outer walls of the support columns.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] The multi-layer circuit board positioning structure provided by this utility model can meet the requirements of different component quantities and sizes by controlling the gap and number of stepped bosses supporting the circuit board, while compressing the space used as much as possible and improving space utilization.

[0019] The sensor provided by this invention uses an insulating rubber pad with a certain compressibility, which can provide a certain buffering capacity while fixing the circuit board, thereby improving the protection capability of the circuit board in vibration environments; it can effectively reduce the requirements for the circuit board's external dimensions under the same working conditions.

[0020] The sensor provided by this utility model improves the layout space of the circuit board, making better use of every inch of space inside the product, while ensuring that the internal circuit board is firmly and reliably fixed. It can meet more diverse customer requirements in a limited space, such as circuit filtering, reverse connection protection, surge protection and functional implementation. Attached Figure Description

[0021] Appendix Figure 1 A schematic diagram of the multilayer circuit board positioning structure provided by this utility model;

[0022] Appendix Figure 2 A cross-sectional schematic diagram of the multilayer circuit board positioning structure provided by this utility model;

[0023] Appendix Figure 3 A cross-sectional schematic diagram of the sensor with a multi-layer circuit board positioning structure provided by this utility model.

[0024] Wherein: 1—connector nozzle; 11—pressure inlet; 12—support boss; 13—outer shell boss; 2—pressure core; 3—positioning structure; 30—cylindrical shell; 31—hollowed-out base; 32—stepped boss; 321—first-level stepped boss; 322—second-level stepped boss; 323—third-level stepped boss; 33—support column; 34—external thread; 35—locking nut; 4—circuit board; 5—insulating rubber pad; 6—outer shell; 7—electrical connector. Detailed Implementation

[0025] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0026] The terms “a,” “one,” “the,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended meaning of inclusion and that other elements / components / etc. may exist in addition to the listed elements / components / etc.

[0027] like Figure 1-2As shown: A multi-layer circuit board positioning structure 3 includes a cylindrical shell 30. The inner wall of the cylindrical shell 30 is provided with a plurality of stepped protrusions 32. The stepped protrusions 32 are used to position and place the circuit board 4. The inner diameter of the stepped protrusions 32 located in the cylindrical shell 30 gradually increases from bottom to top. Furthermore, the positioning structure 3 also includes a support column 33. The support column 33 for supporting the circuit board 4 is located in the middle of the cylindrical shell 30. A plurality of stepped protrusions 32 are also provided on the outer wall of the support column 33. The stepped protrusions 32 on the support column 33 correspond one-to-one with the stepped protrusions 32 on the inner wall of the cylindrical shell 30 to jointly support the same circuit board 4.

[0028] To improve the stability of the circuit board 4, an insulating rubber pad 5 can be set between the circuit boards 4 and fitted onto the support column 33. An external thread 34 is provided on the top of the support column 33, and the external thread 34 is connected to the locking nut 35 to lock the uppermost circuit board 4 located in the inner cavity of the positioning structure 3.

[0029] Furthermore, a hollow base 31 is provided at the bottom of the positioning structure 3, making the inner cavity of the cylindrical shell 30 an open cavity, and the middle part of the hollow base 31 serves as a support for the support column 33. The hollow base 31 facilitates support and wire passage, reduces the weight of the positioning structure 3, and improves the heat dissipation performance of the positioning structure 3.

[0030] The multi-layer circuit board positioning structure is a key part of the technical solution of this application. The positioning structure 3 is cylindrical in shape. One end of the positioning structure 3 is designed with a circular groove for connecting with the core pressure-sensing cavity of the sensor by laser welding. The inner cavity is designed with multi-level circular stepped protrusions 32. The gap of the circuit board 4 after installation is controlled by adjusting the spacing of the stepped protrusions 32, ensuring that the components have sufficient installation space. At the same time, the stepped protrusions 32 can provide support and restrict the freedom of the circuit board 4. The support column 33 in the middle part is designed with stepped protrusions 32, which can further position the bottom circuit board 4 and ensure that the circuit boards 4 do not contact each other. The top of the support column 33 is designed with external threads 34 for locking. The snowflake-shaped hollow base 31 can reduce the weight of the product while ensuring the support strength.

[0031] In fact, the positioning structure 3, circuit board 4, insulating rubber pad 5, and locking nut 35 can be presented as a single unit. Circuit board 4 is an important part of the sensor, responsible for signal processing and transmission; the insulating rubber pad 5 is placed between the circuit boards 4. After the spacing of the positioning structure 3 is set, the outer dimensions of the insulating rubber pad 5 are reconfirmed, providing support for the middle part of the circuit board 4. At the same time, the compressibility of the insulating rubber pad 5 can play a good buffering role, improving the product's protection capability under vibration and other working conditions; the locking nut 35 is used to fix the uppermost circuit board 4, and at the same time, it applies pressure to the insulating rubber pad 5 between the circuit boards 4, causing the insulating rubber pad 5 to deform, thereby improving the protection capability under vibration and other working conditions.

[0032] like Figure 3 As shown: A sensor employing a multi-layer circuit board positioning structure includes a connector 1, a pressure core 2, a positioning structure 3 for mounting a circuit board 4, a housing 6, and an electrical connector 7. The pressure core 2 is installed within the pressure-sensing cavity of the connector 1. The positioning structure 3 is fixed to the outer peripheral wall of the pressure-sensing cavity, and the housing 6 is fixed to the outer peripheral wall of the connector 1. An electrical connector 7 is installed at the end of the housing 6, and the electrical connector 7 is connected to the circuit board 4 via a wire. The pressure core 2 is soldered into the pressure-sensing cavity, and the signal output end of the pressure core 2 is plugged into the circuit board 4. An insulating rubber pad 5 is provided between the circuit boards 4 arranged on the stepped boss 32 of the positioning structure 3, and the insulating rubber pad 5 is fitted onto the corresponding outer wall of the support column 33.

[0033] Many components within the sensor are fixed together by laser welding. For example, a support boss 12 is provided on the outer wall of the core pressure-sensing cavity, and one end of the positioning structure 3, which is fitted outside the core pressure-sensing cavity, is welded to the support boss 12. A pressure inlet 11 is provided on the connector 1, and a housing boss 13 is provided on the outer wall of the connector 1. One end of the housing 6, which is fitted outside the positioning structure 3, is welded to the housing boss 13, and an electrical connector 7 is welded to the other end. Example

[0034] like Figure 1-2 The multi-layer circuit board positioning structure shown includes a cylindrical shell 30, a hollow base 31, and a support column 33 located in the middle of the cylindrical shell 30. Three-level stepped protrusions 32 are provided on the cylindrical shell 30 and the support column 33 respectively. The inner diameter of the first-level stepped protrusion 321 is smaller than the inner diameter of the second-level stepped protrusion 322, and the inner diameter of the second-level stepped protrusion 322 is smaller than the inner diameter of the third-level stepped protrusion 323. The stepped protrusions 32 on the support column 33 correspond one-to-one with the stepped protrusions 32 on the inner wall of the cylindrical shell 30 to jointly support the same circuit board 4.

[0035] like Figure 3As shown: A sensor employing a multi-layer circuit board positioning structure includes a connector 1, a pressure core 2, a positioning structure 3 for mounting a circuit board 4, a housing 6, and an electrical connector 7. The outer surface of the connector 1 is machined with a hexagonal facet of 24mm to facilitate sensor installation, and an M12 external thread is machined as the mounting thread. The pressure core 2 is welded into the pressure-sensing cavity of the connector 1 to convert pressure signals into electrical signals. The positioning structure 3 is connected to the connector 1 by laser welding. The housing 6 is also laser welded to the connector 1. The components of the positioning structure 3 are protected, and threaded mounting holes for the electrical connector 7 are provided. The electrical connector 7, inserted into the threaded mounting holes, is fixed to the housing 6 with screws and connected to the circuit board 4 by wires to power the entire sensor and provide signal output.

[0036] The equipment provided by this utility model has the advantages of fewer parts, lower processing difficulty, and higher space utilization, which can make the most of the limited space and increase the layout space of the circuit board 4.

[0037] In this embodiment of the invention, the term "multiple" refers to two or more, unless otherwise explicitly defined. The terms "install," "connect," and "fix" should be interpreted broadly. For example, "connect" can mean a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention based on the specific circumstances.

[0038] In the description of the embodiments of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific direction or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0039] In this specification, the terms "an embodiment," "a preferred embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The above embodiments are only for illustrating the technical concept of this utility model and should not be construed as limiting the scope of protection of this utility model. Any modifications made to the technical solution based on the technical concept proposed by this utility model shall fall within the scope of protection of this utility model. Technologies not covered by this utility model can be implemented by existing technologies.

Claims

1. A multi-layer circuit board positioning structure, characterized by: The positioning structure (3) comprises a cylindrical shell (30), a plurality of stepped bosses (32) are arranged on the inner wall of the cylindrical shell (30), the stepped bosses (32) are used for positioning and placing the circuit board (4), and the inner diameters of the stepped bosses (32) located in the cylindrical shell (30) gradually increase from bottom to top.

2. The multilayer circuit board positioning structure according to claim 1, characterized by: The positioning structure (3) further comprises a support column (33), and the support column (33) used for supporting the circuit board (4) is located in the middle part of the cylindrical shell (30).

3. The multi-layered circuit board positioning structure according to claim 2, characterized by: The outer wall of the support column (33) is also provided with a plurality of stepped bosses (32), the stepped bosses (32) on the support column (33) correspond to the stepped bosses (32) on the inner wall of the cylindrical shell (30) one by one, so as to jointly support the same circuit board (4).

4. The multi-layered circuit board positioning structure according to claim 2, characterized by: The top of the support column (33) is provided with an external thread (34), the external thread (34) is connected with a locking nut (35), so as to lock the uppermost circuit board (4) in the inner cavity of the positioning structure (3).

5. The multilayer circuit board positioning structure according to claim 1, characterized by: The bottom of the positioning structure (3) is provided with a hollow base (31), so that the inner cavity of the cylindrical shell (30) is an open cavity, and the middle part of the hollow base (31) serves as a support base of the support column (33).

6. A sensor employing the multi-layered circuit board positioning structure according to any one of claims 1 to 5, characterized by: The sensor comprises a connecting nozzle (1), a pressure core (2), a positioning structure (3) used for mounting a circuit board (4), an outer shell (6) and an electric connector (7), the pressure core (2) is mounted in a core pressure sensing cavity of the connecting nozzle (1), the positioning structure (3) is fixed on the outer peripheral wall of the core pressure sensing cavity, and the outer shell (6) is fixed on the outer peripheral wall of the connecting nozzle (1), the end of the outer shell (6) is provided with the electric connector (7), and the electric connector (7) is connected with the circuit board (4) through a wire.

7. The sensor of claim 6, wherein: The pressure core (2) is welded in the core pressure sensing cavity, and a signal output end of the pressure core (2) is inserted with the circuit board (4).

8. The sensor of claim 6, wherein: A support boss (12) is arranged on the outer wall of the core pressure sensing cavity, and one end of the positioning structure (3) sleeved outside the core pressure sensing cavity is welded on the support boss (12).

9. The sensor of claim 6, wherein: The connecting nozzle (1) is provided with a pressure inlet (11), and an outer shell boss (13) is arranged on the outer wall of the connecting nozzle (1), one end of the outer shell (6) sleeved outside the positioning structure (3) is welded on the outer shell boss (13), and the other end is welded with the electric connector (7).

10. The sensor of claim 6, wherein: Insulating rubber pads (5) are arranged between the circuit boards (4) arranged on the stepped bosses (32) of the positioning structure (3), and the insulating rubber pads (5) are sleeved on the corresponding outer walls of the support columns (33).

Images