Power module

Abstract

The embodiment of the utility model discloses a power module. The power module comprises a second substrate, at least one power module and a limiting structure. The power module comprises a first substrate, a power device, a plastic package body and a signal terminal, the power device is located on the first surface of the substrate, the plastic package body wraps the first substrate and the power device, the plastic package body comprises a first side edge and a second side edge which are opposite and a third side edge and a fourth side edge which are opposite, and the first side edge is perpendicular to the third side edge. The signal terminal is located on the first side edge of the plastic package body and electrically connected with the power device in the plastic package body, and the root of the signal terminal extends out of the plastic package body. Furthermore, the limiting structure covers the root part of the signal terminal to limit the displacement of the signal terminal. Therefore, the power module can prevent the roots of the signal terminals from being broken under the vibration load.

Description

[0001] This application claims priority to Chinese Patent Application No. 202423000617.1, filed on December 5, 2024, entitled “Power Module”, the entire or partial content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The utility model relates to the packaging technical field especially relates to a power module. BACKGROUND

[0003] With the progress of power electronics technology, power modules have developed rapidly, and the complex application scenarios of power modules have put forward higher requirements for the packaging of power modules. In the application environment of new energy vehicles, the complex vibration environment puts forward higher anti-vibration requirements for power modules. Among them, the root of the signal terminal of the power module is the weak point in vibration, and the root fracture of the signal terminal is also a common failure item after vibration test. Therefore, it is urgent to design a power module. SUMMARY

[0004] Therefore, the utility model discloses a kind of power modules, by being provided with limit structure to cover signal terminal, to limit the displacement of signal terminal, to avoid the root fracture of signal terminal.

[0005] The utility model embodiment provides a kind of power module, comprising: second substrate;At least one power module, the power module is located on the second substrate;And limit structure;Wherein, the power module includes: first substrate;Power device, is located in the first surface of the first substrate;Plastic package, covers the first substrate and the power device, the plastic package includes opposite first side and second side and opposite third side and fourth side, the first side and the third side are perpendicular;And signal terminal, is located in the first side of the plastic package, the signal terminal is connected with the power device in the plastic package, the root of the signal terminal is by the plastic package and stretches out;The limit structure covers the root of the signal terminal to limit the displacement of the signal terminal.

[0006] In some embodiments, the power module further includes: a first power terminal located on the first side of the plastic package, the first power terminal being electrically connected to the power device in the plastic package;And a second power terminal located on the second side of the plastic package, the second power terminal being electrically connected to the power device in the plastic package.

[0007] In some embodiments, the power module further comprises an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating layer having a distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

[0008] In some embodiments, the limiting structure comprises an insulating glue covering the root of the signal terminal.

[0009] In some embodiments, the insulating glue is solidified at the root of the signal terminal.

[0010] In some embodiments, the power module further comprises an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating glue being adhered to the insulating layer.

[0011] In some embodiments, the insulating glue is adhered to the second substrate.

[0012] In some embodiments, the insulating glue has a comparative tracking index (CTI) greater than or equal to 400 volts.

[0013] In some embodiments, the insulating glue has a temperature resistance greater than or equal to 100 degrees Celsius.

[0014] In some embodiments, the power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of each of the power modules.

[0015] In some embodiments, the power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of the power modules in the same row.

[0016] In some embodiments, the limiting structure fully covers the root of the signal terminal.

[0017] In some embodiments, the limiting structure partially covers the root of the signal terminal.

[0018] The utility model embodiment provides a kind of power module, the power module includes second substrate, at least one power module and limiting structure.Wherein, power module includes first substrate, power device, plastic package and signal terminal, power device is located the first surface of substrate, plastic package covers first substrate and power device, plastic package includes opposite first side and second side and opposite third side and fourth side, first side and third side are perpendicular, signal terminal is located the first side of plastic package and is electrically connected with power device in plastic package, the root of signal terminal is stretched out by plastic package inside.Further, the root of signal terminal is covered by limiting structure to limit the displacement of signal terminal.Therefore, the root of power module can prevent the breakage of signal terminal under vibration load. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects, features and advantages of the present application will become more apparent from the following description of the preferred embodiments of the present application taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 It is the schematic diagram of the first power module provided by the utility model embodiment;

[0021] Figure 2 It is the schematic diagram of the power module provided by the utility model embodiment;

[0022] Figure 3 It is the use state schematic diagram of a second substrate provided by the utility model embodiment;

[0023] Figure 4 It is the schematic diagram of the second power module provided by the utility model embodiment;

[0024] Figure 5 It is the schematic diagram of the third power module provided by the utility model embodiment.

[0025] Explanation of the drawings:

[0026] 11-second substrate;12-insulating layer;2-power module;21-plastic package;22-signal terminal;23-first power end;24-second power end;25-first substrate;26-power device;27-interconnection layer;28-interconnection part;3-limiting structure;31-insulating glue. DETAILED DESCRIPTION

[0027] The present application is described based on the embodiments below, but the present application is not limited to these embodiments only. In the following detailed description of the present application, some specific details are described in detail. The present application can also be completely understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0028] Furthermore, those skilled in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0029] Unless specifically stated otherwise, and as can be apparent from the disclosure, use of terms such as "installing", "connected", "connecting", "coupled", "fixed", "attached", "mounting", "connecting" or "accessing" or the like, means that there is either a direct connection between them or an indirect connection between them through other devices.

[0030] For ease of description, spatially relative terms such as "inner", "outer", "beneath", "below", "lower", "above", "upper", and the like, can be used herein for the purpose of describing the example embodiment of the device as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then the elements described as being "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.

[0031] Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including, but not limited to".

[0032] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for the purpose of description and are not to be construed as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0033] Figure 1 is a schematic view of a first power module provided by an embodiment of the present application, as shown in the figure, the power module comprises a second substrate 11, at least one power module 2 and a limiting structure 3. Optionally, the second substrate 11 is provided as a metal plate. Specifically, Figure 1 is a schematic view of a power module provided by an embodiment of the present application, as shown in the figure, the power module comprises a second substrate 11, at least one power module 2 and a limiting structure 3. Optionally, the second substrate 11 is provided as a metal plate. Specifically, Figure 2 is a schematic view of a power module provided by an embodiment of the present application, as shown in the figure, the power module comprises a second substrate 11, at least one power module 2 and a limiting structure 3. Optionally, the second substrate 11 is provided as a metal plate. Specifically, Figure 2As shown in the figure, the power module 2 is located on the second substrate 11 and comprises a first substrate 25, a power device 26, a plastic package 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnection layer 27 and an interconnection part 28, the power device 26 is located on a first surface of the first substrate 25, the plastic package 21 covers the first substrate 25 and the power device 26, the plastic package 21 comprises opposite first and third side edges and opposite second and fourth side edges, the first and third side edges are perpendicular, the first power terminal 23 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, the second power terminal 24 is located on the second side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, and the signal terminal 22 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21. It should be noted that the interconnection layer 27 is a chip interconnection layer, the power device 26 is arranged on the first substrate 25 through the interconnection layer 27, and the interconnection part 28 is applied to the top chip interconnection. Further, the root of the signal terminal 22 is stretched out of the plastic package 21, and the limiting structure 3 covers the root of the signal terminal 22 to limit the displacement of the signal terminal 22, so that the root of the signal terminal 22 is prevented from being broken due to the displacement of the circuit board.

[0034] Figure 3 is a use state schematic view of the second substrate provided by the embodiment of the utility model, like Figure 3 As shown in the figure, the power module 2 is located on the second substrate 11 and comprises a first substrate 25, a power device 26, a plastic package 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnection layer 27 and an interconnection part 28, the power device 26 is located on a first surface of the first substrate 25, the plastic package 21 covers the first substrate 25 and the power device 26, the plastic package 21 comprises opposite first and third side edges and opposite second and fourth side edges, the first and third side edges are perpendicular, the first power terminal 23 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, the second power terminal 24 is located on the second side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, and the signal terminal 22 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21. It should be noted that the interconnection layer 27 is a chip interconnection layer, the power device 26 is arranged on the first substrate 25 through the interconnection layer 27, and the interconnection part 28 is applied to the top chip interconnection. Further, the root of the signal terminal 22 is stretched out of the plastic package 21, and the limiting structure 3 covers the root of the signal terminal 22 to limit the displacement of the signal terminal 22, so that the root of the signal terminal 22 is prevented from being broken due to the displacement of the circuit board.

[0035] In an embodiment, the insulating layer 12 is provided as an FR-4 (glass fiber reinforced epoxy resin laminated material) insulating layer or a PI (polyimide) insulating layer. It should be noted that the FR-4 insulating layer has good mechanical strength and electrical performance. It should be noted that the PI insulating layer has excellent high-temperature resistance, electrical insulation and mechanical strength.

[0036] As Figure 1 As shown in the figure, in an embodiment, the limiting structure 3 comprises an insulating adhesive 31. Specifically, the insulating adhesive 31 covers the root of the signal terminal 22, so that the displacement of the signal terminal 22 in the vibration environment can be limited, and thus the root of the signal terminal 22 can be prevented from being broken. Further, the insulating adhesive 31 is solidified on the root of the signal terminal 22 to ensure the limiting effect on the signal terminal 22. Alternatively, asFigure 1 As shown in the drawings, each power module 2 has two or more signal terminals 22, and an insulating adhesive 31 is applied to the root of each signal terminal 22 to avoid breakage of any signal terminal 22 due to vibration. Optionally, the insulating adhesive 31 is applied to the root of the signal terminal 22 by dispensing. It should be noted that the dispensing of the insulating adhesive 31 by the dispensing equipment can accurately control the flow and position of the adhesive, which helps to improve product quality and production efficiency.

[0037] In an embodiment, the insulating adhesive 31 is bonded to the insulating layer 12. It is easy to understand that the insulating adhesive 31 has good adhesion to the insulating material, so as to enhance the bonding strength between the insulating adhesive 31 and the insulating layer 12, thereby ensuring the limiting effect of the insulating adhesive 31 on the root of the signal terminal 22.

[0038] In an embodiment, the insulating adhesive 31 is bonded to the second substrate 11. That is, in the case where the second substrate 11 is not provided with the insulating layer 12, the insulating adhesive 31 can also achieve the insulating function and the limiting function of the signal terminal 22 by being bonded to the second substrate 11.

[0039] It is easy to understand that the insulating adhesive 31 can protect the power module 2 from current leakage or short circuit, which helps to improve product quality and safety performance. Optionally, the insulating adhesive 31 includes epoxy adhesive, pressure-sensitive adhesive, UV-curable adhesive or other adhesive.

[0040] In an embodiment, the insulating adhesive 31 has a CTI (Comparative Tracking Index) value greater than or equal to 400 volts. It should be noted that the CTI value refers to the highest voltage value that the surface of a solid insulating material can withstand without forming a leakage trace under the combined action of an electric field and an electrolyte. That is, the CTI value is an index for evaluating the ability of the insulating material to resist arc strike, and the higher the CTI value, the higher the electrical tracking resistance of the insulating material, the better the insulation, and the higher the safety performance. Therefore, the insulating adhesive 31 helps to improve product quality and safety performance.

[0041] In an embodiment, the insulating adhesive 31 is a heat-resistant adhesive. It should be noted that the insulating adhesive 31 can withstand a temperature greater than or equal to the upper limit of the temperature that the signal terminal 22 can reach. Optionally, the temperature resistance of the insulating adhesive 31 is greater than or equal to 100 degrees Celsius. That is, the insulating adhesive 31 can maintain its physical and chemical properties unchanged at high temperatures, thereby ensuring the bonding strength and stability, and effectively preventing the root of the signal terminal 22 from breaking due to deterioration of the insulating adhesive 31.

[0042] Figure 4is a second power module provided by the embodiment of the utility model, and the schematic diagram is as shown in the figure, Figure 4 As shown in the figure, in an embodiment, the power module comprises a plurality of power modules 2, all the power modules 2 are arranged on the second substrate 11 in the same direction, and the limiting structure 3 covers the root of the signal terminal 22 of each power module 2, that is, the root of the signal terminal 22 of each power module 2 is covered by an insulating adhesive 31 respectively.

[0043] As an optional embodiment, the power module comprises a plurality of power modules 2, all the power modules 2 are arranged on the second substrate 11 in the same direction, and the limiting structure 3 covers the root of the signal terminal 22 of the power module 2 in the same row, that is, the root of the signal terminal 22 of the power module 2 in the same row is covered by an insulating adhesive 31.

[0044] As shown in the figure, Figure 4 In an embodiment, the limiting structure 3 fully covers the root of the signal terminal 22, that is, the insulating adhesive 31 fully covers the root of the signal terminal 22.

[0045] Figure 5 is a third power module provided by the embodiment of the utility model, and the schematic diagram is as shown in the figure, Figure 5 In an embodiment, the limiting structure 3 semi-covers the root of the signal terminal 22, that is, the insulating adhesive 31 covers part of the root of the signal terminal 22 and exposes part of the root of the signal terminal 22.

[0046] The embodiment of the utility model provides a kind of power module, and the power module includes second substrate, at least one power module and limiting structure. Among them, power module includes first substrate, power device, plastic package and signal terminal, power device is located in the first surface of substrate, plastic package covers first substrate and power device, plastic package includes opposite first side and second side and opposite third side and fourth side, first side and third side are perpendicular, signal terminal is located in the first side of plastic package and is electrically connected with power device in plastic package, the root of signal terminal is stretched out from inside plastic package.Further, limiting structure covers the root of signal terminal to limit the displacement of signal terminal.Therefore, the root of power module can prevent the breakage of signal terminal under vibration load.

[0047] The above only is the preferred embodiment of the application, and is not used to limit the application, for the person skilled in the art, the application can have various modifications and changes.Any modification, equivalent replacement, improvement etc.that is made within the spirit and principle of the application should be included in the protection scope of the application.

Claims

1. A power module, characterized by Comprising: a second substrate; at least one power module, the power module being located on the second substrate; and a limiting structure; wherein the power module comprises: a first substrate; a power device, the power device being located on a first surface of the first substrate; a plastic package, the plastic package covering the first substrate and the power device, the plastic package comprising opposite first and third sides and opposite second and fourth sides, the first and third sides being perpendicular; and a signal terminal, the signal terminal being located on the first side of the plastic package, the signal terminal being electrically connected to the power device in the plastic package, a root of the signal terminal being extended out of the plastic package; the limiting structure covering the root of the signal terminal to limit displacement of the signal terminal. The power module further comprises:

2. The power module of claim 1, wherein, a first power terminal, the first power terminal being located on the first side of the plastic package, the first power terminal being electrically connected to the power device in the plastic package; and a second power terminal, the second power terminal being located on the second side of the plastic package, the second power terminal being electrically connected to the power device in the plastic package. Further comprising an insulating layer, the insulating layer being located between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating layer having a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

3. The power module of claim 2, wherein, The limiting structure comprises:

4. The power module of claim 1, wherein, an insulating gel, the insulating gel covering the root of the signal terminal. The insulating gel is solidified on the root of the signal terminal.

5. The power module of claim 4, wherein, Further comprising an insulating layer, the insulating layer being located between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating gel being bonded to the insulating layer.

6. The power module of claim 4, wherein, The insulating gel is bonded to the second substrate.

7. The power module of claim 4, wherein, The insulating gel has a comparative tracking index (CTI) greater than or equal to 400 volts.

8. The power module of claim 4, wherein, The insulating gel has a temperature resistance greater than or equal to 100 degrees Celsius.

9. The power module of claim 4, wherein, The power module comprises a plurality of the power modules, all the power modules being arranged in the same direction on the second substrate, the limiting structure covering the root of the signal terminal of each of the power modules.

10. The power module of any one of claims 1-9, wherein, The power module comprises a plurality of the power modules, all the power modules being arranged in the same direction on the second substrate, the limiting structure covering the root of the signal terminal of the power modules in the same row.

11. The power module of any one of claims 1-9, wherein, The limiting structure fully covers the root of the signal terminal.

12. The power module of claim 1, wherein, The limiting structure semi-covers the root of the signal terminal.

13. The power module of claim 1, wherein, ​

Images