Electromagnetic shielding packaging structure

Abstract

The utility model relates to an electromagnetic shielding packaging structure which comprises a lead frame, the lead frame comprises a base island area and a pin area located on the periphery of the base island area, the pin area comprises a first pin and a second pin bent upwards, the first pin is provided with a first platform, the second pin is provided with a second platform, and the first platform and the second platform are oppositely arranged. The second platform is higher than the first platform; the chip is positioned on the surface of the base island area; a bonding wire is bonded between the surface of the chip and the first platform of the lead frame to realize electrical connection; the plastic package structure covers the lead frame, the chip and the bonding wires; and the electromagnetic shielding cover is positioned on the surface of the plastic package structure and is electrically connected with the exposed second platform of the second pin. According to the electromagnetic shielding packaging structure, a traditional metal shielding cover is not needed, and the thickness of the electromagnetic shielding cover can be very thin, so that the overall electromagnetic shielding packaging structure is relatively small in thickness and relatively low in cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, in particular to an electromagnetic shielding packaging structure. BACKGROUND

[0002] With the vigorous development of the electronic industry, most electronic products are developing towards the goal of miniaturization and high speed, especially the development of the communication industry has universally applied communication devices in various electronic products. However, the above-mentioned electronic products need to use high-frequency radio frequency chips, and the radio frequency chips may be adjacent to digital integrated circuits, digital signal processors or baseband chips, causing electromagnetic interference problems, so electromagnetic shielding treatment is necessary.

[0003] At present, the measures to suppress electromagnetic interference of multi-mode products generally use metal shielding cover to suppress electromagnetic interference during chip packaging. If electromagnetic shielding is required for the traditional frame type packaging structure, a metal shielding cover needs to be attached after plastic packaging, resulting in a relatively thick overall package size, a complex process of attaching the metal cover, and a high cost. SUMMARY

[0004] The technical problem to be solved by the present application is to provide an electromagnetic shielding packaging structure to prevent interference between the electromagnetic shielding cover and the lead wire electrically connected to the chip, and to avoid using a traditional metal shielding cover, thereby reducing the thickness and cost.

[0005] To this end, an embodiment of the present application provides an electromagnetic shielding packaging structure, comprising:

[0006] A lead frame, the lead frame comprising a base island region and a pin region located around the base island region, the pin region comprising a first pin and a second pin bent upward, the first pin having a first platform, the second pin having a second platform, the second platform being higher than the first platform;

[0007] A chip located on the surface of the base island region;

[0008] A wire bond is bonded between the surface of the chip and the first platform of the lead frame to achieve electrical connection;

[0009] A plastic packaging structure covering the lead frame, the chip and the wire bond, and the upper surface of the plastic packaging structure exposing the second platform of the second pin, and the lower surface of the plastic packaging structure exposing the bottom surface of the first pin;

[0010] An electromagnetic shielding cover located on the surface of the plastic packaging structure, the electromagnetic shielding cover being electrically connected to the exposed second platform of the second pin, and the electromagnetic shielding cover and the second pin serving as an electromagnetic shielding structure for the chip.

[0011] As an optional embodiment, the second pin comprises a first stepped bend and a second stepped bend, one end of the first stepped bend is connected with the lead frame pin area body structure, and the stepped plane of the first stepped bend is higher than the first platform of the first pin; the second stepped bend is connected with the other end of the first stepped bend, and the stepped plane of the second stepped bend serves as the second platform and is higher than the stepped plane of the first stepped bend.

[0012] As an optional embodiment, the second pin comprises a first stepped bend and a second vertical bend, one end of the first stepped bend is connected with the lead frame pin area body structure, and the stepped plane of the first stepped bend is higher than the first platform of the first pin; the second vertical bend is connected with the other end of the first stepped bend, and the top surface of the second vertical bend serves as the second platform and is higher than the stepped plane of the first stepped bend.

[0013] As an optional embodiment, the stepped plane of the first stepped bend is lower than the chip surface.

[0014] As an optional embodiment, part of the stepped plane of the first stepped bend is located in the cutting area corresponding to the discrete chip package structure, so that the second pin and the first pin of the cut discrete chip package structure are electrically isolated, and the back surface of the discrete chip package structure does not expose the second pin.

[0015] As an optional embodiment, the first pin and the second pin are arranged in a spaced manner.

[0016] As an optional embodiment, the lead frame is formed by a stamping process.

[0017] As an optional embodiment, the pin area further comprises a third pin, the third pin is electrically grounded, the third pin is exposed on the upper surface of the plastic package structure, and the electromagnetic shielding cover is electrically connected with the exposed third pin to realize electrical grounding of the electromagnetic shielding structure.

[0018] As an optional embodiment, the third pin comprises a third platform, a fourth platform, and a connecting portion connecting the third platform and the fourth platform, and the fourth platform is higher than the third platform.

[0019] As an optional embodiment, the projection of the third platform and the fourth platform on the plane where the lead frame is located does not overlap or partially overlaps.

[0020] As an optional embodiment, a wire is bonded between the chip surface and the third platform of the third pin to realize electrical grounding of the chip.

[0021] As an optional embodiment, the fourth platform of the third pin is electrically connected with the second platform of the second pin through an electromagnetic shielding cover.

[0022] As an optional embodiment, the electromagnetic shielding cover is an electromagnetic shielding plate or an electromagnetic shielding cover, and the electromagnetic shielding cover comprises a top shielding plate and a side shielding cover located at the edge of the top shielding plate.

[0023] As an optional embodiment, the side shielding cover is connected with the outer side of the upwardly bent second pin to achieve electrical connection.

[0024] As an optional embodiment, the second platform of part or all of the second pin located at one side of the base island region is an integral whole.

[0025] As an optional embodiment, the surface of part or all of the second platform of the second pin is provided with a pin reinforcing rib, the pin reinforcing rib is exposed on the upper surface of the plastic sealing structure, and the electromagnetic shielding cover is bonded on the surface of the pin reinforcing rib.

[0026] As an optional embodiment, the pin reinforcing rib is fixed on the surface of the second platform of the second pin through a bonding or adhesive process, or the pin reinforcing rib is integrally formed with the lead frame.

[0027] The technical scheme of the present application has the following advantages:

[0028] The electromagnetic shielding packaging structure disclosed in the foregoing application comprises a lead frame, a chip, a bonding wire, a plastic sealing structure and an electromagnetic shielding cover, the pin area of the lead frame comprises a first pin and a second pin bent upward, the first pin has a first platform, the second pin has a second platform, the second platform is higher than the first platform, and the upper surface of the plastic sealing structure covering the lead frame, the chip and the bonding wire exposes the second platform of the second pin; the electromagnetic shielding cover located on the surface of the plastic sealing structure is electrically connected with the exposed second platform of the second pin, and the electromagnetic shielding cover and the second pin serve as an electromagnetic shielding structure of the chip. Since the second pin of the lead frame bent upward serves as the electromagnetic shielding structure of the chip together with the electromagnetic shielding cover, the height of the second pin is controllable, and a traditional metal shielding cover is not needed, the thickness of the electromagnetic shielding cover can be very thin, so that the electromagnetic shielding packaging structure has a small thickness and low cost.

[0029] The second pin bent upward and the electromagnetic shielding cover serve as the electromagnetic shielding structure of the chip, which not only forms electromagnetic shielding above the chip, but also forms electromagnetic shielding above the side of the chip (the second pin as part of the electromagnetic shielding structure covers the top, the side above and the side of the chip), and the electromagnetic shielding effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 This is a cross-sectional schematic diagram of an embodiment of an electromagnetic shielding encapsulation structure;

[0031] Figure 2 This is a top view schematic diagram of an embodiment of the lead frame of an electromagnetic shielding encapsulation structure;

[0032] Figure 3 yes Figure 2 A side view of the lead frame structure;

[0033] Figure 4 This is a side view of the structure of the first and second pins in one embodiment;

[0034] Figure 5 This is a side view of the first and second pins in another embodiment;

[0035] Figure 6 This is a side view of the third pin structure in another embodiment;

[0036] Figure 7 This is a cross-sectional schematic diagram of an electromagnetic shielding packaging structure according to another embodiment;

[0037] Figure 8 yes Figure 2 A schematic diagram of bonding wires on the lead frame;

[0038] Figure 9 yes Figure 2 A top view of the electromagnetic shielding package structure corresponding to the bonding wires and electromagnetic shielding cover on the lead frame.

[0039] Figure 10 This is a cross-sectional schematic diagram of an electromagnetic shielding packaging structure according to another embodiment;

[0040] Figure 11 This is a top view of another embodiment of a lead frame with pin reinforcing ribs;

[0041] Figure 12 This is a cross-sectional schematic diagram of an electromagnetic shielding package structure with pin reinforcing ribs according to another embodiment. Detailed Implementation

[0042] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the structure should include three-dimensional spatial dimensions of length, width, and depth.

[0043] The application provides an electromagnetic shielding packaging structure.

[0044] First, referring to Figures 1-6 , the electromagnetic shielding packaging structure comprises:

[0045] A lead frame 100, which comprises a base island region 10 and a pin region around the base island region, the pin region comprising a first pin 20, a second pin 30 bent upwards and a third pin 40, the first pin 20 having a first platform 201, the second pin 30 having a second platform 301, and the third pin 40 comprising a third platform 402 and a fourth platform 401, the second platform 301 and the fourth platform 401 being higher than the first platform 201 and the third platform 402;

[0046] A chip 15 on the surface of the base island region 10;

[0047] A wire 23 is bonded between the surface of the chip 15 and the first platform of the first pin of the lead frame to realize electrical connection;

[0048] A plastic packaging structure 50 covering the lead frame 100, the chip 15 and the wire 23, and the upper surface of the plastic packaging structure 50 exposing the second platform 201 of the second pin 30 and the fourth platform 401 of the third pin 40;

[0049] An electromagnetic shielding cover 60 on the surface of the plastic packaging structure 50, the electromagnetic shielding cover 60 being electrically connected to the exposed second platform 301 of the second pin 30 and the fourth platform 401 of the third pin 40, and the electromagnetic shielding cover 60 and the second pin 30 serving as an electromagnetic shielding structure for the chip.

[0050] Specifically, refer to Figure 2 and Figure 3 , Figure 2 is a top view structural schematic diagram of an embodiment of a lead frame of an electromagnetic shielding packaging structure, Figure 3 is Figure 2 a side view structural schematic diagram of the lead frame of

[0051] The lead frame 100 comprises a base island region 10 and a pin region around the base island region, the base island region 10 being connected to the pin region through connecting parts at four corners, the pin region comprising a first pin 20 and a second pin 30 bent upwards, in the embodiment, the pin region is located around the base island region, and the second pin 30 of the corresponding pin region is also located around the base island region, the electromagnetic shielding cover being arranged on the surface of the plastic packaging structure (above the chip), and the electromagnetic shielding cover and the second pin around the base island region being used to realize electromagnetic shielding in four directions of the top surface and the side surface of the chip.

[0052] In other embodiments, the pin region can also be located only on both sides of the base island region, and the second pins 30 of the pin region are also located only on both sides of the base island region. The electromagnetic shielding cover is arranged on the surface of the plastic package structure (above the chip), and the electromagnetic shielding cover and the second pins on both sides are used to achieve electromagnetic shielding in two directions of the top surface and the side surface of the chip.

[0053] In the embodiment, please refer to Figure 2 , the pin region includes the first pins 20, the second pins 30 bent upward, the third pins 40, and a pin region main structure 28. The pin region main structure 28 is connected to the first pins 20, the second pins 30, and the third pins 40 respectively and is arranged separately from the first pins 20, the second pins 30, and the third pins 40. The first pins 20, the second pins 30, and the third pins 40 are arranged on one side of the pin region main structure close to the base island region. When the electromagnetic shielding package structure is cut along the cutting line 27 to form a discrete chip package structure, the pin region main structure and part of the first pins, part of the second pins, and part of the third pins are cut off, and the remaining first pins, second pins, and third pins are arranged separately.

[0054] In the embodiment, please refer to Figure 1 and Figure 9 , the bottom surface of the first pins 20 is flush with the bottom surface of the base island region 10 of the lead frame. The chip 15 on the surface of the base island region 10 and the first platform of the first pins 20 of the lead frame are bonded with a wire 23. In the subsequent process, the first pins 20 are partially cut to serve as the chip pins of the finally formed discrete chip package structure. In the embodiment, the chip 15 is a high-frequency radio frequency chip. In other embodiments, the chip can also be other chips or devices that need electromagnetic shielding.

[0055] In the embodiment, the first pins and the second pins bent upward are arranged separately. On the one hand, the second pins 30 are uniformly arranged around the electromagnetic shielding package structure. The second pins bent upward can serve as part of the electromagnetic shielding structure, and the uniformly arranged second pins shield the side surface of the chip, so that the final electromagnetic shielding effect is better.

[0056] In the embodiment, the number of the first pins and the second pins bent upward can be adjusted as needed. For example, one first pin and one second pin are arranged separately, or multiple first pins and one second pin are arranged separately, or multiple first pins and multiple second pins are arranged separately, etc.

[0057] In the embodiment, please refer to Figure 1 , Figure 3 ,Figure 4 and Figure 10 The upwardly bent second pin 30 comprises a first stepped bending part 31 and a second stepped bending part 32. One end of the first stepped bending part 31 is connected with the pin area main body structure, and the stepped plane of the first stepped bending part 31 is higher than the first platform of the first pin. The second stepped bending part 32 is connected with the other end of the first stepped bending part 31. The stepped plane of the second stepped bending part 32 serves as a second platform 301 of the second pin 30 and is higher than the stepped plane of the first stepped bending part 31. The second platform 301 serves as a connecting point of the electromagnetic shielding cover. Since the second platform 301 of the second stepped bending part 32 is higher than the stepped plane of the first stepped bending part 31 and the first platform 201 of the first pin 20, the electromagnetic shielding cover 60 on the top surface of the second pin 30 is higher than the chip 15 and the corresponding bonding wire 23, thereby achieving electromagnetic shielding of the chip, and the electromagnetic shielding cover 60 and the bonding wire 23 do not interfere with each other.

[0058] In the embodiment, please refer to Figure 3 and Figure 6 The lead frame 100 further comprises a third pin 40. The fourth platform 401 of the third pin 40 has the same height as the second platform 301 of the second pin 30. The third pin 40 comprises a third platform 402, a fourth platform 401, and a connecting part 403 connecting the third platform and the fourth platform. The fourth platform is higher than the third platform. The projections of the third platform and the fourth platform on the plane where the lead frame is located are adjacent and do not overlap. The second platform 301 of the second pin 30 and the fourth platform 401 of the third pin 40 are exposed on the upper surface of the plastic package structure. The electromagnetic shielding cover is electrically connected with the exposed second platform 301 and fourth platform 401 at the same time. The third pin 40 serves as a grounding end of the electromagnetic shielding structure. The back surface of the cut discrete chip package structure exposes the third pin 40. The third pin 40 is electrically grounded, thereby achieving electrical grounding of the electromagnetic shielding structure.

[0059] In the embodiment, the third pin 40 also serves as a common grounding end of the cut discrete chip package structure. The chip 15 is electrically connected with the third platform 402 of the third pin 40 through the bonding wire 23, thereby achieving electrical grounding of the chip grounding end.

[0060] In other embodiments, one or more of the first pins serve as chip grounding ends. The chip grounding end and the electromagnetic shielding structure grounding end of the discrete chip package structure are separated.

[0061] In the embodiment, the third platform 402 of the third pin 40 and the fourth platform 401 are adjacent and do not overlap in the projection on the plane where the lead frame is located. In other embodiments, the fourth platform 401 is partially above the third platform 402, so that the third platform 402 of the third pin and the fourth platform 401 can also partially overlap in the projection on the plane where the lead frame is located.

[0062] In the embodiment, the partial area of the stepped plane of the first stepped bending part 31 is located in the cutting area (outside the cutting line 27) corresponding to the discrete chip package structure, so that the second pin 30 and the first pin 20 of the discrete chip package structure after cutting are electrically isolated, and the back of the discrete chip package structure does not expose the second pin 30, that is, the back of the discrete chip package structure only exposes the first pin 20 and the third pin, and the first pin and the third pin are used as the chip pins of the discrete chip package structure.

[0063] In an embodiment, the stepped plane of the first stepped bending part of the second pin 30 is lower than the chip surface, and the upwardly bent second pin itself can be part of the electromagnetic shielding structure, so that the electromagnetic shielding structure including the second pin is above the chip, on the side of the chip and on the side surface of the chip, so that the final electromagnetic shielding effect is better.

[0064] In other embodiments, the stepped plane of the first stepped bending part of the second pin can also be higher than or equal to the chip surface.

[0065] In other embodiments, the stepped bottom surface of the first stepped bending part of the second pin can also be lower than the surface of the base island area of the lead frame 100, as long as the back of the discrete chip package structure after cutting does not expose the first stepped bending part of the second pin.

[0066] In another embodiment, please refer to Figure 5 and Figure 7 The second pin 30 includes a first stepped bending part 31' and a second vertical bending part 32'. One end of the first stepped bending part 31' is connected with the main structure of the pin area of the lead frame, and the stepped plane of the first stepped bending part 31' is higher than the first platform 201 of the first pin 20. The second vertical bending part 32' is connected with the other end of the first stepped bending part 31', and the top surface of the second vertical bending part 32' serves as the second platform 301. The surface of the plastic package structure 50 exposes the second platform 301, the electromagnetic shielding cover 60 located on the surface of the plastic package structure 50 contacts the second platform 301, the second platform 301 serves as the connection point of the electromagnetic shielding cover 60, realizes the electrical connection between the second pin 30 and the electromagnetic shielding cover 60, and the second pin 30 and the electromagnetic shielding cover 60 as a whole serve as the electromagnetic shielding structure.

[0067] In another embodiment, please refer to Figure 5 and Figure 8 When the electromagnetic shielding cover 60 is an electromagnetic shielding cover, the electromagnetic shielding cover includes a top shielding plate and a side shielding cover located at the edge of the top shielding plate, the size of the top shielding plate is consistent with the area surrounded by the second pin, the side shielding cover is in contact with the outer side wall of the second vertical bending part of the second pin, and the top surface (second platform 301) of the second vertical bending part is in contact with the top shielding plate, thereby realizing the electrical connection between the second pin 30 and the electromagnetic shielding cover 60.

[0068] In the embodiment, the lead frame 100 is formed by a metal stamping process, that is, the first pin, the upwardly bent second pin, and the third pin are formed by a stamping process. In other embodiments, the lead frame can also be formed by other suitable processes, such as a metal casting process.

[0069] In an embodiment, the material of the lead frame 100 is a copper alloy or a ferro-nickel alloy. In a specific embodiment, the copper alloy can be a copper-iron alloy, a copper-nickel-silicon alloy, a copper-chromium alloy, or a copper-nickel-tin alloy. The lead frame 100 has good thermal and electrical conductivity, low thermal expansion coefficient, sufficient strength, and high deformation resistance.

[0070] In the embodiment, the material of the plastic sealing layer 50 can be epoxy resin, polyimide resin, benzocyclobutene resin, or polybenzoxazole resin, and the forming process can be injection molding or transfer molding.

[0071] The plastic sealing layer 50 covers the lead frame 100, the chip 15, and the bonding wire 23, and exposes the second platform 301 of the second pin 30 and the fourth platform 401 of the third pin, so that the electromagnetic shielding cover 60 located on the surface of the plastic sealing layer 50 is in contact with the second pin 30 and the third pin 40, realizing the electrical connection between the second pin 30, the third pin 40, and the electromagnetic shielding cover, and the whole serves as an electromagnetic shielding structure.

[0072] Although the upwardly bent second pin and the third pin have a certain deformation resistance, the second pin and the third pin may be bent during the plastic sealing process. In order to improve the structural strength, the second platform of part or all of the second pin located on one side of the base island region is an integral whole. As an optional embodiment, please refer to Figures 11-12The surface of the second platform 301 of the second pin 30 and the surface of the fourth platform 401 of the third pin 40 on the same side have a pin reinforcing rib 35, so that the structure of the second pin 30 and the third pin 40 is more stable and firm, the pin reinforcing rib 35 is exposed on the upper surface of the plastic package structure, and the electromagnetic shielding cover 60 is electrically connected with the exposed pin reinforcing rib 35, so that the second platform 301 of the second pin 30 and the fourth platform 401 of the third pin 40 are electrically connected with the electromagnetic shielding cover 60 at the same time.

[0073] In the embodiment, the material of the pin reinforcing rib 35 is the same as that of the lead frame, and in other embodiments, the material of the pin reinforcing rib 35 can be different from that of the lead frame, for example, a metal strip, which has certain conductive performance and is suitable for the electromagnetic shielding structure.

[0074] In the embodiment, the pin reinforcing rib 35 is fixed on the surface of the second platform 301 of the second pin 30 and the fourth platform 401 of the third pin 40 through a bonding or bonding process, and in other embodiments, the pin reinforcing rib can be integrally formed with the lead frame.

[0075] In the embodiment, each pin reinforcing rib is connected with all the second pins and the third pins on one side, and in other embodiments, each pin reinforcing rib can be connected with part of the second pins on one side, or the pin reinforcing ribs are integrally connected to form a pin reinforcing ring in the shape of a square ring.

[0076] In an embodiment, the electromagnetic shielding cover 60 is an electromagnetic shielding plate, and the electromagnetic shielding plate is a metal shielding plate. The second pin in the embodiment is part of the side shielding of the electromagnetic shielding packaging structure, the metal shielding plate does not need other structures, and the thickness can be controlled to be very small, so that the thickness of the final electromagnetic shielding packaging structure is small, and the electromagnetic shielding performance is good.

[0077] In another embodiment, the electromagnetic shielding cover 60 is an electromagnetic shielding cover, which includes a top shielding plate and a side shielding cover located at the edge of the top shielding plate. The size of the top shielding plate is consistent with the area surrounded by the second pin. The side shielding cover is in contact with the outer side wall of the second vertical bending part or the second stepped bending part of the second pin, so that the second pin 30 is electrically connected with the electromagnetic shielding cover 60, and the electromagnetic shielding cover can better shield the side of the chip.

[0078] In the embodiment, the height of the side shielding cover can be equal to the height of the second vertical bending part or the second stepped bending part of the second pin, or the height of the side shielding cover can be less than the height of the second vertical bending part or the second stepped bending part of the second pin.

[0079] Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical solutions of the present application shall fall within the protection scope of the technical solutions of the present application.

Claims

1. An electromagnetic shielded package structure, characterized by, The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure.

2. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure.

3. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure.

4. The electromagnetic shield package structure according to claim 2 or 3, characterized in that, The application relates to a discrete chip package structure.

5. The electromagnetic shield package structure according to claim 2 or 3, wherein, The application relates to a discrete chip package structure.

6. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure.

7. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure.

8. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure.

9. The electromagnetic shield package structure of claim 8, wherein, The application relates to a discrete chip package structure.

10. The electromagnetic shield package structure of claim 9, wherein, The application relates to a discrete chip package structure.

11. The electromagnetic shield package structure of claim 9, wherein, The application relates to a discrete chip package structure.

12. The electromagnetic shield package structure of claim 9, wherein, The application relates to a discrete chip package structure.

13. The electromagnetic shield package structure of claim 1, wherein, The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. 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The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package structure. The application relates to a discrete chip package 14. The electromagnetic shield package structure of claim 13, wherein, The side shielding cover is connected with the outer side of the upwardly bent second pin to achieve electrical connection.

15. The electromagnetic shield package structure of claim 1, wherein, The second platform of part or all of the second pins located on one side of the base island region is an integral whole.

16. The electromagnetic shield package structure of claim 15, wherein, The second platform surface of part or all of the second pins has pin reinforcing ribs, and the pin reinforcing ribs are exposed on the upper surface of the plastic package structure, and the electromagnetic shielding cover is bonded to the surface of the pin reinforcing ribs.

17. The electromagnetic shield package structure of claim 16, wherein, The pin reinforcing ribs are fixed on the second platform surface of the second pins by a bonding or adhesive process, or the pin reinforcing ribs are integrally formed with the lead frame.

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