Signal adapter and signal transmission system

Abstract

The utility model relates to the technical field of electrical connection, and discloses a signal adapter and a signal transmission system.The signal adapter comprises a main body part, a first butt joint part and a second butt joint part, the main body part is of a plate-shaped structure, and a conductive structure is arranged in the main body part. The first butt joint part and the second butt joint part are arranged at the two ends of the main body part and are connected with the conductive structure to form a signal transmission path. The signal adapter can be connected with the power board through the first butt joint part and the second butt joint part, the main body part is made to be vertical relative to the power board in the working state, a three-dimensional transmission path located outside the power board is formed, intersection of the signal transmission path in the power board can be avoided, and the signal transmission efficiency is improved. Interference and instability caused by signal crossing are reduced, and stable transmission of signals is ensured.

Description

Technical Field

[0001] This application relates to the field of electrical connection technology, and further to a signal adapter and signal transmission system. Background Technology

[0002] With the increasing demand for miniaturization of servo drives, the limited area of ​​the power board hinders the layout of the AC input and UVW output paths within the power board, causing certain problems. In this case, due to the limited power board area, the signal transmission paths of the AC input and UVW output paths intersect during wiring, leading to signal transmission interference and other issues, thus affecting the performance and stability of the servo drive. Utility Model Content

[0003] To address the aforementioned technical problems, the purpose of this application is to provide a signal adapter and a signal transmission system that can effectively solve the problems in the prior art, ensure normal signal transmission, and reduce signal interference.

[0004] To achieve the above objectives, this application provides a signal adapter for signal transmission within a servo driver, comprising:

[0005] The main body has a plate-like structure, and a conductive structure is provided inside the main body.

[0006] The first docking portion and the second docking portion are respectively disposed at both ends of the main body portion along the length direction;

[0007] The first docking part and the second docking part are respectively connected to the conductive structure to form a signal transmission path; in the working state, the first docking part and the second docking part can dock to the power board in the servo driver, so that the main body is in an upright state relative to the power board.

[0008] In some embodiments, the first docking portion and the second docking portion protrude outward from the body of the main body, and solder pads are provided on the protruding portions of the first docking portion and the second docking portion respectively, so as to solder and fix the signal adapter to the power board in the servo driver.

[0009] The first docking portion and the second docking portion are located on the same side of the main body, and their outward convex directions are the same.

[0010] In some embodiments, the first docking part includes at least three input ports, adapted for three-phase AC input; the second docking part includes at least three output ports, adapted for three-phase AC output;

[0011] The input ports and the output ports are respectively connected one-to-one and are connected through the corresponding conductive structures to form at least three signal transmission paths.

[0012] In some embodiments, the main body includes a single-layer circuit board, and the conductive structure includes multiple conductive traces located on the circuit board, with each conductive trace having an output port and an input port respectively connected at both ends.

[0013] In some embodiments, at least a portion of the main body is formed by pressing together at least two layers of circuit boards, each layer of the circuit board having at least one conductive trace to collectively form the conductive structure, and each of the conductive traces having an output port and an input port respectively connected at both ends, thereby forming at least three signal transmission paths.

[0014] In some embodiments, the first mating portion and the second mating portion are each provided with a first via, which is used to transmit signals between the circuit boards on different layers.

[0015] In some embodiments, the signal adapter further includes a magnetic component disposed on the outer periphery of the main body for suppressing electromagnetic interference.

[0016] Another aspect of this application also provides a signal transmission system, comprising:

[0017] Such as the signal adapters mentioned above;

[0018] A transmission substrate, wherein the signal adapter is connected to the transmission substrate;

[0019] Both the first electrical module and the second electrical module are disposed on the transmission substrate, so that the signal output from the first electrical module can be transmitted to the second electrical module through the signal adapter.

[0020] In some embodiments, the transmission substrate is provided with a first connection end and a second connection end, the first connection end being matched and connected to the first mating portion, and the second connection end being matched and connected to the second mating portion, so as to connect the signal adapter to the transmission substrate;

[0021] The first electrical module is connected to the first docking part through the first connecting end, and the second electrical module is connected to the second docking part through the second connecting end.

[0022] In some embodiments, the transmission substrate is a power board within a servo driver, and the power board has a multilayer board structure;

[0023] Both the first connection end and the second connection end include a soldering position and a second via on the power board. The second via is used for signal transmission within the multilayer board structure, and the soldering position is used for soldering connection between the power board and the signal adapter.

[0024] And / or, the first electrical module is a power conversion module within the servo driver, and the second electrical module is a three-phase AC output module within the servo driver.

[0025] Compared with the prior art, the signal adapter and signal transmission system provided in this application have the following advantages:

[0026] By setting a conductive structure inside the main body of the signal adapter and connecting it to the power board through the first and second docking parts, a signal transmission path is effectively formed. In the working state, the two ends of the signal adapter are docked to the power board, making the main body stand upright relative to the power board, forming a three-dimensional wiring method, ensuring that the signal can be smoothly transmitted from the input end to the output end, and avoiding interference problems caused by signal path crossing. Attached Figure Description

[0027] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0028] Figure 1 This is a diagram of the internal structure of a servo driver in the prior art;

[0029] Figure 2 This is a schematic diagram of the structure of a signal adapter in one embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the structure of a single-layer circuit board in one embodiment of this application;

[0031] Figure 4 This is an exploded structural diagram of a body part in one embodiment of this application when it is a double-layer circuit board;

[0032] Figure 5 This is a schematic diagram of the structure of the transmission substrate in one embodiment of this application;

[0033] Figure 6 This is a schematic diagram of the structure of a signal adapter not mounted on the transmission substrate in one embodiment of this application;

[0034] Figure 7 This is a schematic diagram of the structure of the signal adapter installed on the transmission substrate in one embodiment of this application;

[0035] Figure 8 yes Figure 7A structural diagram from another perspective.

[0036] Reference numerals: Signal adapter 1; Main body 11; Conductive structure 110; Conductive trace 1101; First mating part 12; Second mating part 13; Solder pad 140; First via 150; Transmission substrate 2; First connection end 21; Second connection end 22; Soldering position 230; Second via 240; Mating groove 250; First electrical module 3; Second electrical module 4; Three-phase AC input module 5; Circuit board 6. Detailed Implementation

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0038] To keep the drawings concise, each drawing only schematically shows the parts relevant to the application; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" can mean not only "only one" but also "more than one."

[0039] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0040] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] In the design of modern servo drives, the increasing demand for miniaturization often limits the area of ​​the power board, posing challenges to signal transmission and power distribution design. Within a servo drive, signal transmission typically requires precise wiring and connections to functional modules. However, the limited power board area makes wiring very compact, easily leading to signal transmission path intersections. This not only affects design flexibility and reliability but may also interfere with the normal operation of the servo drive.

[0044] Specifically, such as Figure 1 As shown, in the prior art, the miniaturization trend of servo drives leads to insufficient power board area. Furthermore, due to the layout characteristics of servo drives, the internal AC input path L1 and UVW output path L2 will have a crossover area D, which may cause signal transmission interference, signal attenuation, and system instability. Especially in multi-layer power board structures, the crossover of signal transmission lines can bring high levels of electromagnetic interference, affecting the normal operation of the system.

[0045] Based on the above problems, this application can provide a relatively suitable solution, such as... Figure 7 As shown, by setting up signal adapter 1, the signal transmission path is optimized to avoid the intersection of AC input path L1 and UVW output path L2. Signal adapter 1 is soldered to the power board, forming a signal transmission channel on the outside of the power board. The signal is transmitted through the conductive structure inside the signal adapter 1, ensuring signal stability and accuracy.

[0046] In one embodiment, refer to the appendix to the specification. Figure 2 and Figure 8 The signal adapter 1 mainly includes a main body 11, a first docking part 12, and a second docking part 13.

[0047] Please refer to the attached document. Figure 3 and Figure 4 The first docking portion 12 and the second docking portion 13 are respectively disposed at intervals along the length direction at both ends of the main body portion 11. A conductive structure 110 is provided inside the main body portion 11. The first docking portion 12 and the second docking portion 13 are respectively connected to the conductive structure 110 to form a signal transmission path. In the working state, the first docking portion 12 and the second docking portion 13 can be connected to the power board, so that the main body portion 11 can transmit signals through the signal transmission path when it is in an upright state.

[0048] In this embodiment, the first docking part 12 and the second docking part 13 are connected by the conductive structure 110 inside the main body 11, so that the signal can be transmitted from one end of the power board (main body 11) to the other end. By optimizing the signal transmission path, the stability and efficiency of signal transmission can be guaranteed, and the performance of the entire servo drive system can be improved.

[0049] It should be noted that, in the working state, the main body 11 of the signal adapter 1 is vertically connected to the power board. This vertical layout can make the most of the three-dimensional space of the power board and effectively solve the problem of insufficient planar space. By arranging it vertically, the signal adapter 1 can not only improve the space utilization rate, but also avoid unreasonable layout or component obstruction caused by limited planar space.

[0050] Furthermore, the arrangement of the signal adapter 1 in this embodiment makes the component layout on the power board more reasonable, reduces the coverage area of ​​the signal adapter 1 relative to the power board, and avoids the situation where heat cannot be dissipated due to the signal adapter 1 blocking it, thus greatly reducing the impact of the signal adapter 1 on heat dissipation. In addition, in actual production, the spacing and layout between the first docking part 12 and the second docking part 13 can be optimized according to the design requirements of the power board, making the connection more stable and reliable.

[0051] In this application, the main body 11 of the signal adapter 1 is generally set as a plate-shaped structure. This design has high regularity and is easy to install and fix to the power board. In addition, the plate-shaped structure occupies less planar space relative to the power board after being erected, and will not significantly increase the additional space burden.

[0052] In one embodiment, based on the above embodiment, the first docking portion 12 and the second docking portion 13 protrude outward from the body of the main body portion 11, and a solder pad 140 is provided on the protruding portion for soldering and fixing the signal adapter 1 to the power board.

[0053] By providing solder pads 140 on the protruding portions of the mating parts, the soldering position of the signal adapter 1 is clearly defined, avoiding problems such as difficult soldering and unclear soldering positions. This is because the first mating part 12 and the second mating part 13, through their outwardly protruding structures, provide a larger contact surface, which helps the signal adapter 1 maintain higher stability when connected to the power board. In summary, through the configuration in this embodiment, the connection between the signal adapter 1 and the power board is more stable, the soldering process is more efficient, soldering errors and instability are reduced, thereby improving the overall quality of the soldering process.

[0054] More specifically, the first docking part 12 and the second docking part 13 of the signal adapter 1 are located on the same side of the main body 11, and the two protrusion directions are the same. The signal adapter 1 can maintain a simple structure in space, avoid unnecessary space occupation, and enable the signal adapter 1 to not only better adapt to the layout of the power board, but also effectively avoid interference from other components.

[0055] It should be noted that, in this application, the shapes of the protruding portions of the first mating portion 12 and the second mating portion 13 can be designed according to actual needs, such as being rectangular, elliptical, circular, or other suitable shapes. The specific protruding shape is not specifically limited, but rather selected based on the actual layout of the power board and the welding requirements.

[0056] In practical applications, the shape of the protruding portion can be optimized according to space requirements, welding processes, and signal transmission needs. For example, a rectangular protruding portion has a larger contact surface, which is suitable for applications requiring strong fixing force; an elliptical protruding portion may have better space adaptability in some cases; regardless of the shape, the protruding portion should be ensured to have sufficient strength and stability to securely connect to the power board via the pad 140 and effectively transmit signals.

[0057] Furthermore, the first docking part 12 of the signal adapter 1 includes at least three input ports adapted to receive three-phase AC input signals; the second docking part 13 includes at least three output ports adapted to output three-phase AC signals. The input ports of the first docking part 12 and the output ports of the second docking part 13 are respectively connected through the conductive structure 110, thereby forming at least three signal transmission paths.

[0058] Understandably, by setting input and output ports on the signal adapter 1, the signal is directly guided from the input port to the output port through the conductive structure 110, reducing unnecessary intermediate links and making signal transmission more direct and efficient. This simplified design not only reduces system complexity but also effectively saves cost and space, improving the overall performance of the servo drive system.

[0059] Generally, the first docking part 12 includes three input ports and the second docking part 13 includes three output ports, as shown in the attached figure. However, in some multi-port applications, multiple outputs or multiple inputs may be required. In this case, the input-output correspondence is still used to ensure that each input signal can be accurately and clearly transmitted to the corresponding output port, so as to realize the simultaneous transmission of multi-channel signals.

[0060] Additionally, it should be noted that the concepts of "input" and "output" for input and output ports in this application refer to the signal adapter 1 itself, not the input and output of the servo driver. Inside the signal adapter 1, the input port receives signals from other modules of the servo driver, while the output port transmits signals to the next module via the conductive structure 110. Therefore, signal input and output are defined relative to the direction of action of the signal adapter 1, not the input and output of the entire servo driver system.

[0061] In one embodiment, the main body 11 includes a single-layer circuit board 6 on which multiple conductive traces 1101 are arranged, that is, the aforementioned conductive structure 110 includes multiple conductive traces 1101. Each conductive trace 1101 has an input port and an output port respectively connected at its two ends, thereby realizing signal transmission and conversion.

[0062] Specifically, in the conventional configuration of three output ports to three input ports, the signal adapter 1 has three conductive traces 1101, each trace connecting one input port to one output port. In this layout, the three conductive traces 1101 correspond to the paths of the three-phase AC input signal and the output signal, respectively.

[0063] In this embodiment, a single-layer circuit board design is used, along with a reasonable layout of conductive traces 1101, which can effectively save space, improve design flexibility, simplify manufacturing process, reduce costs, and meet the requirements of modern servo drives for miniaturization and high integration.

[0064] In another embodiment, at least a portion of the main body 11 is formed by pressing together at least two layers of circuit boards 6. Each layer of circuit board 6 has at least one conductive trace 1101. A conductive structure 110 is formed by multiple conductive traces 1101, and each conductive trace 1101 is connected to an input port and an output port at both ends to form a signal transmission path.

[0065] Specifically, if two-layer circuit boards 6 are used, two conductive traces 1101 are set on one layer of circuit board 6, and one conductive trace 1101 is set on the other layer of circuit board 6. By pressing these circuit boards 6 together, a conductive path connecting all input ports and output ports is formed.

[0066] When using a multi-layer circuit board 6, the principle remains the same: by properly arranging the conductive traces 1101, multiple signal transmission paths are achieved, and it is ensured that the two ends of each conductive trace 1101 can be connected to the input port and the output port respectively.

[0067] In some embodiments, the main body 11 is constructed using a four-layer circuit board 6 stacked and crimped. In this case, the middle two layers are dedicated to conductive traces 1101 for signal conduction, while the surface layer does not have conductive traces 1101 to enhance insulation. In this way, signal transmission can be guaranteed while increasing the insulation performance of the circuit and reducing the risk of electrical interference and short circuits.

[0068] In some embodiments, for higher current or more complex signal transmission requirements, a six-layer circuit board 6 can be designed. For example, each signal path can use two layers of conductive traces 1101 to further increase the current carrying capacity and improve the stability and efficiency of signal transmission.

[0069] Understandably, in this embodiment, each end of the conductive trace 1101 on each layer of circuit board 6 corresponds to a corresponding input port and output port. By crimping, the conductive traces 1101 of different layers are integrated to ultimately achieve multiple signal transmission paths. Through multi-layer design, signal paths can be arranged more flexibly and space can be used more effectively, especially when the signal adapter 1 needs to support more ports and complex transmission structures.

[0070] Compared to single-layer circuit board designs, multi-layer designs offer higher integration and can accommodate more complex signal transmission requirements. For example, multiple input / output ports can be effectively connected through conductive traces 1101 at different levels, thus accommodating the needs of more functional modules. Furthermore, engineers can flexibly adjust the number of layers on the circuit board 6 to meet the design requirements of servo drivers with different sizes and functionalities.

[0071] In general, when there are few signal transmission paths and high cost requirements, a single-layer design can be used in applications. Conversely, when there is a certain budget and the signal transmission paths are more complex, a multi-layer design can be used. By setting conductive traces 1101 between different layers, the space of the circuit board 6 can be utilized more fully, and signal interference can be effectively reduced, and the stability and reliability of signal transmission can be improved.

[0072] It should be noted that in current circuit board designs, copper foil is generally used as the conductive material, especially in the conductive structure 110 of the signal transmission path. Copper foil not only has good conductivity and is relatively inexpensive, but it is also easy to process into the required conductive traces 1101, and it has strong oxidation resistance, enabling long-term stable signal transmission.

[0073] In one embodiment, based on the above, such as Figure 2 As shown, the first mating portion 12 and the second mating portion 13 are respectively provided with first vias 150, enabling signal conduction and transmission between different layers of the circuit board 6. Through these vias, the signal path of the circuit board 6 can smoothly extend from one layer to another, realizing vertical signal transmission. In other words, the protruding portions of the first mating portion 12 and the second mating portion 13 establish electrical connections with the circuit boards 6 on different layers through the first vias 150, thereby forming a signal transmission channel.

[0074] Specifically, the first via 150 is disposed in the connection area between the conductive path of each protruding portion and the circuit board 6. In this way, the signal can be transmitted through the first via 150 along the multi-layer structure formed by the circuit board 6 to the corresponding input port or output port. Through the first via 150, the signal transmission path is effectively extended, thereby breaking the limitation of a single-layer circuit board.

[0075] In practical design, the size, location, and number of the first via 150 should be reasonably selected according to the circuit design requirements. The size of the via must ensure that it can effectively transmit signals without causing signal attenuation or distortion; usually, the first via 150 can be a common through-hole or a micro through-hole, and the via specifications can be adjusted according to the increase in the number of layers of the circuit board 6 and the design complexity.

[0076] In some embodiments, the signal adapter 1 further includes a magnetic component (not shown in the figures). The magnetic component is disposed on the outer periphery of the main body 11 and is used to suppress electromagnetic interference. In other words, the magnetic component absorbs and attenuates high-frequency electromagnetic waves through the magnetic properties of its material, thereby effectively reducing the impact of electromagnetic interference on signal transmission quality. The magnetic component can be a magnetic ring or other similar structural form, such as a split-design magnetic ring, so that the magnetic ring can be fixed to the outside of the main body 11 by a dedicated mounting clip to ensure its stability and effectiveness.

[0077] Understandably, the magnetic ring or other magnetic components can be detachable, allowing for maintenance or replacement as needed, thus increasing the flexibility of the signal adapter 1. Furthermore, in some implementations, the shape or related structure of the main body 11 can be adjusted, forming local protrusions, grooves, or mounting bases on the outer side of the main body 11 to better accommodate the magnetic components. For example, the edge of the main body 11 can be provided with a U-shaped or C-shaped structure, allowing the magnetic components to fit tightly and be fixed to the signal adapter 1.

[0078] It should be noted that mounting slots are pre-designed on the power board so that after the signal adapter 1 is soldered to the power board, the magnetic components can be partially or completely embedded in the mounting slots of the power board. This helps to reduce the overall size of the servo driver and avoids affecting the overall layout due to the additional thickness of the magnetic components.

[0079] In one embodiment, refer to the appendix to the specification. Figure 7 and Figure 8 According to another aspect of this application, this application further provides a signal transmission system, which mainly includes the signal adapter 1, transmission substrate 2, first electrical module 3 and second electrical module 4 mentioned above. The signal adapter 1 is connected to the transmission substrate 2, and the first electrical module 3 and the second electrical module 4 are both disposed on the transmission substrate 2, so that the signal output from the first electrical module 3 can be transmitted to the second electrical module 4 through the signal adapter 1.

[0080] Among them, the signal adapter 1, as the core component of signal transmission, continues the previous design concept. The signal adapter 1 is arranged vertically on the transmission substrate 2 to realize the transmission of multi-channel signals without occupying a large amount of planar space.

[0081] The first electrical module 3 and the second electrical module 4 can be key components in the servo driver. These modules are connected to the signal adapter 1 via conductive paths on the transmission substrate 2, thereby achieving efficient signal transmission. The signal adapter 1 in this application ensures the transmission of signals between electrical modules, meeting the requirements for high-frequency signals and high-power transmission without affecting the overall performance of the system.

[0082] Based on the above, such as Figure 6 As shown, the transmission substrate 2 is provided with a first connection end 21 and a second connection end 22, which are respectively matched and connected to the first docking part 12 and the second docking part 13 of the signal adapter 1, thereby realizing the connection between the signal adapter 1 and the transmission substrate 2.

[0083] Specifically, the first connecting end 21 is connected to the first mating part 12 of the signal adapter 1, and the second connecting end 22 is connected to the second mating part 13 of the signal adapter 1, forming an electrical and mechanical connection between the signal adapter 1 and the transmission substrate 2. With this design, the signal adapter 1 can be securely fixed to the transmission substrate 2 and maintain a reliable signal transmission path. The signal can be transmitted from the first electrical module 3 to the signal adapter 1 through the first mating part 12. Since a signal transmission path is formed within the signal adapter 1, the signal will then be transmitted to the second electrical module 4 through the second mating part 13, thereby completing the signal transmission and processing.

[0084] In practical applications, the first connection end 21 and the second connection end 22 can be optimized according to the design requirements of the transmission substrate 2. For example, the connection ends can adopt various connection methods such as welding, plugging, or snap-fit ​​to adapt to different production process requirements.

[0085] In some embodiments, the transmission substrate 2 is a power board within the servo driver. The power board has a multi-layer board structure. It is understood that due to the trend of miniaturization of servo drivers, the area of ​​the power board is usually limited. In order to make effective use of space, a multi-layer board structure can realize complex signal transmission functions within a limited area and can provide stronger electrical isolation and better heat dissipation performance.

[0086] Furthermore, such as Figure 5 and Figure 6 As shown, both the first connection terminal 21 and the second connection terminal 22 include a soldering position 230 and a second via 240 on the power board. The soldering position 230 is used for soldering the signal adapter 1 to the power board, ensuring that the signal adapter 1 is securely connected to the power board and can transmit signals stably. The second via 240 is used for signal transmission within the multilayer board structure. Through the second via 240, the signal can be effectively transmitted within the multilayer board structure, avoiding complex external connection cables and reducing system interference and signal attenuation.

[0087] In addition, in some embodiments, the first connection end 21 and the second connection end 22 further include a mating groove 250 disposed on the power board. The shape, outline and number of the mating groove 250 are adapted to the shape, outline and number of the protruding part of the mating part mentioned above, thereby ensuring a stable connection between the signal adapter 1 and the power board.

[0088] Optionally, in this application, the first electrical module 3 is a power conversion module within the servo driver, which is mainly responsible for converting DC voltage into a voltage signal suitable for three-phase AC output; the second electrical module 4 is a three-phase AC output module within the servo driver, mainly used to provide drive current to drive the motor or other loads. Through the design of the signal adapter 1, the signal can be effectively transmitted from the power conversion module to the three-phase AC output module, achieving efficient and stable power control.

[0089] Specifically, as explained above and in the accompanying instructions... Figure 1 As servo drives become increasingly miniaturized, the area of ​​power boards is becoming more and more limited. At the same time, due to the internal layout characteristics of servo drives, the AC input path L1 and the UVW output path L2 have an intersection area D on the power board, which can lead to signal transmission interference, signal attenuation, and system instability. Especially in multi-layer power board structures, the intersecting signal lines may cause strong electromagnetic interference, thus affecting the normal operation of the servo drive.

[0090] For a comprehensive overview of this article, please refer to the appendix. Figures 6 to 8 In the signal transmission system provided in this application, the signal is first transmitted from the three-phase AC input module 5 (input terminal) to the power conversion module (first electrical module 3) via AC input path L1. In the power conversion module, the signal is converted into a voltage form suitable for output (e.g., a three-phase AC voltage signal). After passing through the power conversion module, the signal is transmitted via output path A to the first mating part 12 of the signal adapter 1. At this time, the conductive structure 110 inside the signal adapter 1 serves as the signal transmission mechanism, ensuring that the signal is transmitted from the first mating part 12 to the second mating part 13, and from the second mating part 13 of the signal adapter 1 to the output path B, and then to the three-phase AC output module (second electrical module 4) for final output. Thus, through the design of the signal adapter 1, and by utilizing an external adapter, the signal transmission paths within the power board no longer intersect, ensuring clear signal transmission within the system without mutual interference.

[0091] Thus, the signal adapter 1 in this application integrates multiple signal transmission channels onto the same power board, effectively avoiding the intersection of different signal paths within the power board and ensuring the stability and efficiency of the signal during transmission.

[0092] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A signal adapter, comprising: A signal transfer device for use in a servo driver, comprising: a main body portion in a plate-like structure, an interior of the main body portion being provided with a conductive structure; a first interface portion and a second interface portion, both being spaced apart along a length direction at two ends of the main body portion; wherein the first interface portion and the second interface portion are connected with the conductive structure respectively to form a signal transmission path; in a working state, the first interface portion and the second interface portion can be docked to a power board in the servo driver, so that the main body portion is in a vertical state relative to the power board.

2. The signal transfer device according to claim 1, wherein: the first interface portion and the second interface portion each protrude outward from a body of the main body portion, and a solder pad is correspondingly provided on a protruding part of each of the first interface portion and the second interface portion, so as to solder and fix the signal transfer device to the power board in the servo driver; wherein the first interface portion and the second interface portion are located on a same side of the main body portion, and the protruding directions of the first interface portion and the second interface portion are the same.

3. The signal transfer device according to claim 1, wherein: the first interface portion comprises at least three input ports adapted for three-phase alternating current input; and the second interface portion comprises at least three output ports adapted for three-phase alternating current output; the input ports and the output ports are one-to-one corresponding respectively, and are conducted through the corresponding conductive structure to form at least three signal transmission paths.

4. The signal transfer device according to claim 3, wherein: the main body portion comprises a single-layer circuit board, and the conductive structure comprises a plurality of conductive traces on the circuit board, two ends of each of the conductive traces being correspondingly conducted to one of the output ports and one of the input ports respectively.

5. The signal transfer device according to claim 3, wherein: at least part of the structure of the main body portion is formed by pressing at least two layers of circuit boards, each of the circuit boards has at least one conductive trace to form the conductive structure together, and two ends of each of the conductive traces are correspondingly conducted to one of the output ports and one of the input ports respectively, so as to form at least three signal transmission paths.

6. The signal transfer device according to claim 5, wherein: the first interface portion and the second interface portion are respectively provided with a first via for transmitting signals between different layers of the circuit boards through the first via.

7. The signal transfer device according to any one of claims 1-6, further comprising: a magnetic component provided on an outer periphery of the main body portion for suppressing electromagnetic interference.

8. A signal transmission system, characterized by 8. A signal transmission system, comprising: the signal transfer device according to any one of claims 1-7; a transmission substrate, the signal transfer device being connected to the transmission substrate; a first electrical module and a second electrical module, both being provided on the transmission substrate, so that signals output from the first electrical module can be transmitted to the second electrical module through the signal transfer device.

9. The signal transmission system according to claim 8, wherein: The transmission substrate is provided with a first connecting end and a second connecting end, the first connecting end is matched and connected with the first connecting part, and the second connecting end is matched and connected with the second connecting part, so as to connect the signal adapter to the transmission substrate. The first electrical module is connected with the first connecting part through the first connecting end, and the second electrical module is connected with the second connecting part through the second connecting end.

10. The signal transmission system according to claim 9, characterized in that, The transmission substrate is a power board in a servo driver, and the power board is a multi-layer board structure. The first connecting end and the second connecting end each include a welding site and a second via hole, the second via hole is used for signal transmission in the multi-layer board structure, and the welding site is used for welding connection between the power board and the signal adapter. And / or, the first electrical module is a power conversion module in a servo driver, and the second electrical module is a three-phase alternating current output module in a servo driver.

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