Complete machine layout structure of inverter

Abstract

The utility model discloses an inverter complete machine layout structure, which comprises a shell, the shell is composed of a first shell section and a second shell section which are distributed in a stepped manner in the height direction, the first shell section is arranged in a protruding manner relative to the second shell section, and the outer walls of the first shell section and the second shell section jointly define a first equipment accommodating part; a second equipment accommodating part is defined by the inner walls of the first shell section and the second shell section; the first functional assembly is mounted in the first equipment accommodating part, and the first functional assembly comprises a radiator assembly and an inductor; and the second functional assembly is mounted in the second equipment accommodating part.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and more specifically to an inverter overall layout structure. Background Technology

[0002] Currently, inverters generally adopt a single-layer or double-layer internal layout, with external heat sinks and inductors mostly laid flat at the bottom of the casing.

[0003] The internal double-layer layout can reduce the overall size and increase power density, but it also increases the complexity of production line assembly and makes later maintenance more difficult. The single-layer layout is more convenient for later maintenance, but the overall size is relatively large and the internal wiring is more complex. During the later operation of the inverter, the heat-generating components will affect the current carrying capacity of the lines and cause the lines to age, thus affecting the service life of the inverter.

[0004] Furthermore, the flat design of heat sinks and inductors inherently suffers from low bottom space utilization and increased overall system height. Common stacked layouts struggle to effectively balance size reduction, ease of maintenance, and improved space utilization. Utility Model Content

[0005] The purpose of this application is to provide an inverter overall layout structure to reduce the overall height of the inverter and improve the space utilization of the inverter housing.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: An inverter overall layout structure is provided, comprising: a housing, wherein the housing is composed of a first housing segment and a second housing segment arranged in a stepped manner in the height direction, the first housing segment protruding relative to the second housing segment, and the outer walls of the first housing segment and the second housing segment together forming a first equipment receiving portion, and the inner walls of the first housing segment and the second housing segment together forming a second equipment receiving portion; a first functional component, the first functional component being installed within the first equipment receiving portion, the first component including a heat sink assembly and an inductor; and a second functional component, the second functional component being installed within the second equipment receiving portion.

[0007] As a preferred embodiment, the first housing segment is positioned at a corner adjacent to the second housing segment, such that the first device receiving portion has an L-shaped structure; the heat sink assembly is disposed in the vertical portion of the L-shaped structure in the first device receiving portion, and the inductor is disposed in the horizontal portion of the L-shaped structure in the first device receiving portion, with the heat sink assembly and the inductor being disposed adjacent to each other.

[0008] As another preferred embodiment, the heat sink assembly includes a fan, heat dissipation fins, and an air duct plate; the fan is fixedly disposed at the top of the vertical part of the L-shaped structure in the first device housing, and the heat dissipation fins are disposed adjacent to the fan; wherein, the air duct plate covers the top of the heat dissipation fins, so that the fan, the heat dissipation fins, and the air duct plate together form an air duct extending along the vertical direction of the L-shaped structure in the first device housing.

[0009] In a further preferred embodiment, within the second equipment accommodating section, the installation space enclosed by the first housing segment is recessed relative to the installation space enclosed by the second housing segment, thereby making the second equipment accommodating section as a whole have a stepped distribution.

[0010] Further preferably, the second device receiving part is divided into a first chamber and a second chamber arranged side by side; the position of the first chamber corresponds to the vertical part of the L-shaped structure in the first device receiving part; the position of the second chamber corresponds to the horizontal part of the L-shaped structure in the first device receiving part.

[0011] Preferably, the second functional component includes a power board; wherein the power board is housed within the first cavity and disposed adjacent to the heat sink assembly in the first device housing.

[0012] Preferably, the second housing segment has a through hole on the housing wall near the power board, so that the heat sink assembly fits tightly against the power board.

[0013] Preferably, the second functional component includes a capacitor board and a motherboard assembly, the capacitor board and the motherboard assembly being housed within the second cavity, and the capacitor board and the motherboard assembly being stacked together along the height direction of the second cavity.

[0014] More preferably, the motherboard assembly includes a motherboard mounting plate and a motherboard, and the motherboard mounting plate is provided with a positioning support for overlapping with the motherboard.

[0015] Further preferably, the second housing section has a flange structure on the side near the opening of the second device receiving part.

[0016] Compared with the prior art, the beneficial effects of this application are as follows:

[0017] With the above layout, large-volume heat-generating components that were originally laid flat at the bottom of the casing or stacked inside can be placed in the external space shaped by the outer contour of the casing, realizing the three-dimensional partitioning of functional components. This achieves the overall miniaturization of the inverter's structural layout and the synergistic optimization of space utilization efficiency, which greatly improves the utilization rate of the installation space at the bottom of the casing and reduces the overall height of the unit.

[0018] Meanwhile, the external layout maximizes the use of the housing's installation space without affecting the overall heat dissipation, reducing the overall height of the machine, and facilitating the replacement and maintenance of the primary functional components set externally. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall layout of the inverter.

[0020] Figure 2 This is an exploded view of the first equipment housing in the overall layout of the inverter.

[0021] Figure 3 This is a schematic diagram of the structure of the first equipment housing and the first functional component in the overall layout of the inverter.

[0022] Figure 4 This is a top-view structural diagram of the first equipment housing and the first functional component in the overall layout of the inverter.

[0023] Figure 5 This is a schematic diagram of the structure of the first equipment compartment.

[0024] Figure 6 This is a top-down view of the structure of the first equipment housing.

[0025] Figure 7 This is a structural diagram of the inverter's overall layout from another perspective.

[0026] Figure 8 This is an exploded view of the overall layout of the inverter.

[0027] Figure 9 This is a structural schematic diagram of the second equipment housing and the second functional component.

[0028] In the diagram: 1. Overall layout of the inverter; 10. Housing; 11. First housing section; 12. Second housing section; 121. Through hole; 122. Flanged structure; 13. First equipment housing; 131. Vertical section; 132. Horizontal section; 14. Second equipment housing; 141. First chamber; 142. Second chamber; 20. First functional component; 21. Heat sink assembly; 211. Fan; 212. Heat sink fins; 213. Air duct plate; 22. Inductor; 30. Second functional component; 31. Power board; 32. Capacitor board; 33. Main board assembly; 331. Main board mounting plate; 332. Main board; 333. Positioning support; 40. Cover plate. Detailed Implementation

[0029] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0031] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0032] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0033] In a preferred embodiment, see Figures 1 to 9 This application provides an inverter overall layout structure 1, including: a housing 10, which is composed of a first housing segment 11 and a second housing segment 12 arranged in a stepped manner in the height direction. The first housing segment 11 protrudes relative to the second housing segment 12, thereby forming an asymmetrical and staggered stepped shape in three-dimensional space; the outer walls of the first housing segment 11 and the second housing segment 12 together form a first equipment receiving part 13, and the inner walls of the first housing segment 11 and the second housing segment 12 together form a second equipment receiving part 14; a first functional component 20, which is installed in the first equipment receiving part 13, and the first component includes a heat sink assembly 21 and an inductor 22; and a second functional component 30, which is installed in the second equipment receiving part 14.

[0034] Specifically, see Figures 1 to 3The height of the heat sink assembly 21 is less than the height of the top outer wall of the first housing section 11, and the width of the heat sink assembly 21 does not exceed the setting range of the outer wall of the second housing section 12. Similarly, there are two inductors 22 in the first equipment receiving part 13, namely PV inductor 22 and INV inductor 22. The height of both inductors 22 is less than the height of the top outer wall of the first housing section 11, and the width of the inductors 22 does not exceed the setting range of the outer wall of the second housing section 12, so as to ensure that the heat sink assembly 21 and the inductors 22 are always placed in the first equipment receiving part 13, thereby ensuring the integrity of the inverter overall layout structure 1 and avoiding the overall size of the unit being too large.

[0035] Therefore, through the above layout, the large-volume heat-generating components that were originally laid flat at the bottom of the housing 10 or stacked inside can be placed in the external space shaped by the outer contour of the housing 10, realizing the three-dimensional partitioning of functional components. This achieves the overall miniaturization of the inverter's structural layout and the synergistic optimization of space utilization efficiency, which greatly improves the utilization rate of the installation space at the bottom periphery of the housing 10, reduces the overall height, and also facilitates wiring design, reducing the complexity of wiring.

[0036] Secondly, the partitioned layout of the first device's storage space allows for independent maintenance of peripheral components such as the heat sink and inductor 22 without disassembling the core circuit area, greatly simplifying the maintenance process and achieving a balance between maintenance convenience and compact design.

[0037] Furthermore, the first housing segment 11 is positioned adjacent to a corner of the second housing segment 12, resulting in the first device receiving portion 13, which is formed by the outer walls of both segments, having an L-shaped structure. Within this L-shaped structure, the layout of the heat sink assembly 21 and the inductor 22 is as follows: the heat sink assembly 21 is installed in the vertical portion 131 of the L-shaped structure in the first device receiving portion 13, while the inductor 22 is located in the horizontal portion 132 of the L-shaped structure. Specifically, the heat sink assembly 21 and the inductor 22 are arranged adjacent to each other at the corner of the L-shaped structure, achieving a close spatial proximity and maximizing the use of the installation space at the bottom of the enclosure without affecting the overall heat dissipation.

[0038] Among them, the L-shaped structure layout of the first equipment housing 13 is a more efficient way to utilize corner space; this arrangement integrates the corner spaces on the adjacent sides of the outer side of the housing 10 into a continuous functional volume to accommodate the two main large-volume components: heat sink assembly 21 and inductor 22, thereby making the overall layout structure 1 of the inverter more compact and further reducing its volume.

[0039] Also see Figure 6The first receiving part of the L-shaped structure is further divided into vertical and horizontal parts 132, so that the heat sink assembly 21 and inductor 22 have a clearer position planning, realizing true modular and regional maintenance, and greatly improving the maintainability of the heat sink assembly 21 and inductor 22.

[0040] As another preferred option, see Figures 3 to 5 The heat sink assembly 21 includes a fan 211, heat sink fins 212, and a duct plate 213. The fan 211 is fixedly installed at the top of the vertical part 131 of the L-shaped structure in the first equipment housing 13. When the external fan 211 needs to be repaired or replaced, it can be operated more conveniently and quickly. It can be completed by simply disassembling the external fan 211 mounting plate. The heat sink fins 212 are arranged adjacent to the fan 211. The duct plate 213 covers the top of the heat sink fins 212, so that the fan 211, the heat sink fins 212, and the duct plate 213 together form a duct extending along the vertical direction of the L-shaped structure in the first equipment housing 13.

[0041] By adding an air duct plate 213, the airflow that might otherwise be scattered is organized into a directional air duct that is drawn in from the top fan 211 and runs vertically through the entire heat sink fin area 212. This ensures that the heat on the heat sink fins 212 can be carried away quickly and in a concentrated manner, thereby significantly improving the heat dissipation efficiency of the entire heat sink assembly 21 and providing reliable thermal protection for the high power density operation of the inverter.

[0042] Correspondingly, the heat sink and inductor 22, two heat-generating components, are arranged adjacent to each other at the corner of the L-shaped structure, which facilitates the unified planning of the heat dissipation airflow. Preferably, the first equipment housing 13 is equipped with a single fan 211, which can achieve efficient heat dissipation for both components simultaneously by a single fan 211, thereby improving the overall efficiency of the thermal management of the whole machine.

[0043] For further optimization, see Figures 7 to 9 Within the second equipment housing 14, the installation space enclosed by the first housing section 11 is set lower relative to the installation space enclosed by the second housing section 12, thereby making the second equipment housing 14 as a whole have a stepped distribution.

[0044] The second equipment receiving section 14 is divided into a first chamber 141 and a second chamber 142 arranged side by side; the position of the first chamber 141 corresponds to the vertical part 131 of the L-shaped structure in the first equipment receiving section 13; the position of the second chamber 142 corresponds to the horizontal part 132 of the L-shaped structure in the first equipment receiving section 13.

[0045] Specifically, based on the stepped shell 10 structure, this embodiment further defines the internal space structure of the second equipment receiving part 14. The second equipment receiving part 14 is enclosed by the inner walls of the first shell segment 11 and the second shell segment 12, and its internal space distribution corresponds to the external stepped shape. Specifically, the installation space enclosed by the first shell segment 11 is recessed relative to the installation space enclosed by the second shell segment 12, so that the second equipment receiving part 14 also presents a clear stepped distribution inside. More specifically, the second equipment receiving part 14 is divided into a first chamber 141 and a second chamber 142 arranged side by side. The position of the first chamber 141 corresponds to the vertical part 131 of the L-shaped structure in the first equipment receiving part 13, while the position of the second chamber 142 corresponds to the horizontal part 132 of the L-shaped structure in the first equipment receiving part 13. Thus, the second equipment receiving part 14 as a whole constitutes a double-sided space that precisely corresponds to the external L-shaped functional area.

[0046] The second functional component 30 includes a power board 31, a capacitor board 32, and a main board assembly 33. The power board 31 is preferably disposed in the first chamber 141 corresponding to the position of the external heat sink assembly 21. The power board 31 is disposed adjacent to the heat sink assembly 21 in the first device housing 13 to facilitate thermal management.

[0047] Furthermore, a through hole 121 is provided on the shell wall of the second housing section 12 near the power board 31, so that the heat sink assembly 21 is in close contact with the power board 31. Specifically, the IGBT of the power board 31, which generates the most heat, is in close contact with the heat sink fins 212 through the through hole 121. The external fan 211 is located at the end of the heat sink fins 212, and the heat generated by the IGBT is carried away by the flowing air to improve the heat dissipation effect of the heat sink assembly 21 on the power board 31.

[0048] Corresponding to the second chamber 142, a capacitor plate 32 and a main board assembly 33 can preferably be provided, with the main board assembly 33 and the capacitor plate 32 assembly stacked along the height direction of the second chamber 142, and the main board assembly 33 placed on top of the capacitor plate 32 assembly.

[0049] Therefore, the dual-chamber structure adopted in this application divides the space of the second equipment accommodating part 14 of the housing 10 into left and right parallel partitions, namely the first chamber 141 and the second chamber 142. It combines the advantages of the maintenance convenience of the single-layer layout and the space compactness of the dual-layer layout. The first chamber 141 and the second chamber 142 are arranged in a stepped layout, which makes the structure more compact, smaller in size and easier to install. At the same time, the stepped layout also facilitates the wiring design. Power lines and signal lines can be routed along different paths, and power devices such as inductors 22, transformers, and IGBTs are avoided, reducing the inverter failure rate and improving the inverter life.

[0050] Further preferred, the motherboard assembly 33 includes a motherboard mounting plate 331 and a motherboard 332. The motherboard mounting plate 331 is provided with a positioning support 333 to be stacked with the motherboard 332. The positioning support 333 is a hexagonal support column used to raise the motherboard 332. The motherboard mounting plate 331 is irregularly shaped to facilitate disassembly and removal.

[0051] Specifically, the motherboard 332 is laid flat on the right side of the power board 31 to avoid the IGBT from radiating high temperatures to the motherboard 332. The motherboard mounting plate 331 between the motherboard 332 and the PV inductor 22 and the INV inductor 22 can also significantly reduce the amount of high-temperature radiation from the inductor 22 to the motherboard 332, ensuring the stability and lifespan of the motherboard 332.

[0052] In a further preferred embodiment, a flange structure 122 is provided on the side of the second housing section 12 near the opening of the second equipment receiving part 14. A cover plate 40 is connected to the opening in cooperation with the flange structure 122. The flange structure 122 improves the overall strength of the housing 10 and can effectively resist the deformation tendency caused by installation stress, internal component weight or external compression, ensuring the stability of the opening size, thereby ensuring the robustness and durability of the whole structure.

[0053] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. An inverter unit layout structure characterized by comprising: The application relates to an inverter layout structure, comprising: a shell, which is composed of a first shell section and a second shell section in a stepped distribution in a height direction, the first shell section is arranged protruding relative to the second shell section, and the outer walls of the first shell section and the second shell section jointly enclose a first device accommodating part, and the inner walls of the first shell section and the second shell section jointly enclose a second device accommodating part; a first functional assembly installed in the first device accommodating part, the first assembly comprising a radiator assembly and an inductor; a second functional assembly installed in the second device accommodating part.

2. The inverter layout structure according to claim 1, wherein: the first shell section is arranged adjacent to a corner position of the second shell section, so that the first device accommodating part is in an L-shaped structure; the radiator assembly is arranged in a vertical part of the L-shaped structure in the first device accommodating part, the inductor is arranged in a horizontal part of the L-shaped structure in the first device accommodating part, and the radiator assembly and the inductor are arranged adjacent to each other.

3. The inverter layout structure according to claim 2, wherein: the radiator assembly comprises a fan, radiating fins and an air duct plate; the fan is fixedly arranged at a top end of the vertical part of the L-shaped structure in the first device accommodating part, and the radiating fins are arranged adjacent to the fan; the air duct plate is arranged on the top of the radiating fins, so that the fan, the radiating fins and the air duct plate jointly form an air duct extending along the vertical direction of the L-shaped structure in the first device accommodating part.

4. The inverter layout structure according to claim 2, wherein: in the second device accommodating part, the mounting space formed by the first shell section is arranged sunken relative to the mounting space formed by the second shell section, so that the second device accommodating part is in a stepped distribution as a whole.

5. The inverter layout structure according to claim 4, wherein: the second device accommodating part is divided into a first chamber and a second chamber which are parallel to each other; the first chamber is arranged at a position corresponding to the vertical part of the L-shaped structure in the first device accommodating part; the second chamber is arranged at a position corresponding to the horizontal part of the L-shaped structure in the first device accommodating part.

6. The inverter layout structure according to claim 5, wherein: the second functional assembly comprises a power board; the power board is accommodated in the first chamber and arranged adjacent to the radiator assembly in the first device accommodating part.

7. The inverter layout structure according to claim 6, wherein: a through hole is arranged on the shell wall of the second shell section close to the side of the power board, so that the radiator assembly and the power board are closely attached.

8. The inverter layout structure according to claim 5, wherein: the second functional assembly comprises a capacitor board and a main board assembly, the capacitor board and the main board assembly are accommodated in the second chamber, and the capacitor board and the main board assembly are arranged in a superimposed manner along the height direction of the second chamber.

9. The inverter complete layout structure according to claim 8, characterized in that, the mainboard assembly comprises a mainboard mounting plate and a mainboard, and the mainboard mounting plate is provided with a positioning support to be stacked with the mainboard.

10. The inverter complete layout structure according to any one of claims 1-9, characterized in that, the second housing section is provided with a flange structure near the opening side of the second device accommodating portion.

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